公开(公告)号：US08309857B2

公开(公告)日：2012-11-13

申请号：US12875184

申请日：2010-09-03

Applicant: Masaki Goto ,  Akihiko Takeda ,  Kazuaki Nakamura

Inventor： Masaki Goto ,  Akihiko Takeda ,  Kazuaki Nakamura

IPC: H05K1/09

CPC classification number: H05K3/06 ,  H01L51/442 ,  H05K1/095 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2203/121 ,  Y02E10/549 ,  Y02P70/521 ,  Y10T29/4921 ,  Y10T29/49211 ,  Y10T428/12063

Abstract: Disclosed is a method of manufacturing a pattern electrode which excels in electroconductivity, transparency and etching property and a pattern electrode, the method comprising a step of applying a metal particle containing solution onto a substrate to form a conductive layer, a step of pattern printing a metal particle removing solution on a portion of the conductive layer, which is to be removed, and a step of washing the resulting printed material, whereby the portion of the conductive layer on which the metal particle removing solution has been printed is removed to form a non-conductive portion.

Abstract translation: 公开了一种制造导电性，透明性和蚀刻性优异的图形电极的方法以及图案电极，所述方法包括将含金属颗粒的溶液涂布在基板上以形成导电层的步骤，图案印刷步骤 将要除去的导电层的一部分上的金属颗粒去除溶液和洗涤所得印刷材料的步骤，从而去除已经印刷有金属颗粒去除溶液的导电层的部分以形成 非导电部分。

公开(公告)号：US20120266770A1

公开(公告)日：2012-10-25

申请号：US13474933

申请日：2012-05-18

Applicant: Gabriel L. Smith ,  Sarah Bedair

Inventor： Gabriel L. Smith ,  Sarah Bedair

IPC: F42B3/13 ,  C06C9/00 ,  F42C15/34 ,  B05D5/00 ,  B82Y30/00 ,  B82Y40/00

CPC classification number: H05K1/16 ,  B82Y30/00 ,  H05K3/1258 ,  H05K2201/0257 ,  H05K2201/086 ,  H05K2201/09909 ,  H05K2203/105

Abstract: A method of forming a device on a substrate comprising creating a depository and at least one attached capillary; the depository being of millimeter scale; providing a liquid containing particles in the range 1 nanometer to 1 millimeter; depositing into the depository the liquid containing particles which flows into at least one capillary by capillary action; evaporating the liquid such that the particles form an agglomerate beginning at the end of the at least one capillary with a substantially uniform distribution of the particles within the agglomerate; which is used to form a device. A microelectronic integrated circuit device comprising a substrate; a depository coupled to said substrate, the depository being formed by at least one wall adjacent to the substrate; at least one capillary channel coupled to at least one depository that is formed by walls adapted to be filled with a liquid (by capillary action) comprising nanoparticles.

Abstract translation: 一种在衬底上形成器件的方法，包括形成存储器和至少一个连接的毛细管; 存储器为毫米级; 提供含有1纳米至1毫米范围内的颗粒的液体; 通过毛细管作用将含有流入至少一个毛细管的含有液体的液体沉积到储存器中; 蒸发液体，使得颗粒形成从至少一个毛细管的末端开始的附聚物，其中颗粒在附聚物内具有基本均匀的分布; 用于形成设备。 一种微电子集成电路器件，包括衬底; 耦合到所述衬底的沉积物，所述沉积物由与所述衬底相邻的至少一个壁形成; 至少一个毛细管通道，其耦合到至少一个储存器，所述至少一个储存器由适于填充有包含纳米颗粒的液体（通过毛细管作用）的壁形成。

公开(公告)号：US20120214008A1

公开(公告)日：2012-08-23

申请号：US13406081

申请日：2012-02-27

Applicant: Praveen Bhimaraj ,  Omar J. Bchir

Inventor： Praveen Bhimaraj ,  Omar J. Bchir

IPC: B32B15/08 ,  C08K3/10 ,  C08K3/22 ,  C08K3/36 ,  C08K3/34 ,  C08L77/10 ,  C08K3/04 ,  B82Y30/00

CPC classification number: C08J5/005 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B27/28 ,  B32B27/281 ,  B32B2264/10 ,  B32B2457/00 ,  B32B2605/00 ,  B32B2605/18 ,  B82Y30/00 ,  C08J2379/04 ,  C08K3/346 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0257 ,  Y10T428/1157 ,  Y10T428/31681 ,  C08L79/04

Abstract: A composition includes a bismaleimide triazine (BT) compound with a nanoclay composited therewith. A mounting substrate includes polymer compound with a nanoclay composited therewith to form a core for the mounting substrate. A process includes melt blending a polymer such as BT with a nanoclay and forming a core. A process includes dissolving a monomer such as BT with a nanoclay and forming a core. A system includes a nanoclay dispersed in a polymer matrix and a microelectronic device mounted on the mounting substrate that includes the nanoclay dispersed in the polymer matrix.

Abstract translation: 组合物包含与其组合的纳米粘土的双马来酰亚胺三嗪（BT）化合物。 安装基板包括具有与其复合的纳米粘土以形成用于安装基板的芯的聚合物化合物。 一种方法包括将诸如BT的聚合物与纳米粘土熔融共混并形成核心。 一种方法包括用纳米粘土将单体例如BT溶解并形成核心。 系统包括分散在聚合物基质中的纳米粘土和安装在安装基底上的微电子器件，其包括分散在聚合物基质中的纳米粘土。

公开(公告)号：US20120100374A1

公开(公告)日：2012-04-26

申请号：US13335846

申请日：2011-12-22

Applicant: Alfred A. ZINN

Inventor： Alfred A. ZINN

IPC: B32B5/16 ,  B23K1/20 ,  B23K26/22 ,  B22F9/16 ,  B05D5/12 ,  B82Y40/00 ,  B82Y30/00

CPC classification number: C23C24/08 ,  B22F1/0018 ,  B22F1/0062 ,  B22F1/025 ,  B22F9/24 ,  B82Y30/00 ,  H05K1/097 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2203/107 ,  Y10S977/777 ,  Y10T428/12028 ,  Y10T428/12049 ,  Y10T428/12181 ,  Y10T428/2991

Abstract: A composition may have metal nanoparticles having a diameter of 20 nanometers or less and have a fusion temperature of less than about 220° C. A method of fabricating the metal nanoparticles may include preparing a solvent, adding a precursor with a metal to the solvent, adding a first surfactant, mixing in a reducing agent, and adding in a second surfactant to stop nanoparticle formation. Copper and/or aluminum nanoparticle compositions formed may be used for lead-free soldering of electronic components to circuit boards. A composition may include nanoparticles, which may have a copper nanocore, an amorphous aluminum shell and an organic surfactant coating. A composition may have copper or aluminum nanoparticles. About 30-50% of the copper or aluminum nanoparticles may have a diameter of 20 nanometers or less, and the remaining 70-50% of the copper or aluminum nanoparticles may have a diameter greater than 20 nanometers.

Abstract translation: 组合物可以具有直径为20纳米或更小并且具有小于约220℃的熔融温度的金属纳米颗粒。制备金属纳米颗粒的方法可包括制备溶剂，向溶剂中加入前体与金属， 加入第一表面活性剂，在还原剂中混合，并加入第二表面活性剂以阻止纳米颗粒的形成。 形成的铜和/或铝纳米颗粒组合物可用于将电子部件无铅焊接到电路板。 组合物可以包括可以具有铜纳米孔，无定形铝壳和有机表面活性剂涂层的纳米颗粒。 组合物可以具有铜或铝纳米颗粒。 大约30-50％的铜或铝纳米颗粒可以具有20纳米或更小的直径，剩余的70-50％的铜或铝纳米颗粒可以具有大于20纳米的直径。

公开(公告)号：US20110318484A1

公开(公告)日：2011-12-29

申请号：US13227566

申请日：2011-09-08

Applicant: Ken ASADA ,  Fumiaki KIKUI

Inventor： Ken ASADA ,  Fumiaki KIKUI

IPC: B05D7/00 ,  B05D3/00 ,  B05D1/18 ,  B82Y30/00

CPC classification number: B22F1/02 ,  B23K35/02 ,  B23K35/0244 ,  B23K35/3006 ,  B23K35/40 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/10 ,  H01L24/13 ,  H01L24/48 ,  H01L2224/13 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/13639 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01016 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15182 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/10234 ,  Y02P70/613 ,  Y10T428/12181 ,  Y10T428/2991 ,  Y10T428/2998 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A silver-coated ball 10 according to the present invention includes: a spherical core 1; and a coating layer 2 including silver superfine particles, which is arranged so as to surround the core 1. The silver superfine particles included in the coating layer 2 have a mean particle size of 1 nm to 50 nm.

Abstract translation: 根据本发明的镀银球10包括：球形芯1; 以及包含银超细颗粒的涂层2，其被布置为围绕芯体1。包覆在涂层2中的银超微粒的平均粒径为1nm〜50nm。

公开(公告)号：US08071160B2

公开(公告)日：2011-12-06

申请号：US12115874

申请日：2008-05-06

Applicant: Jeffrey D. Chinn ,  Robert W. Ashurst ,  Adam N. Anderson

Inventor： Jeffrey D. Chinn ,  Robert W. Ashurst ,  Adam N. Anderson

IPC: B05D5/12 ,  H05K3/00 ,  C23C16/00

CPC classification number: H05K3/284 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0257 ,  H05K2201/09872 ,  Y10T428/24355 ,  Y10T428/24364 ,  Y10T428/24372 ,  Y10T428/24388 ,  Y10T428/24405 ,  Y10T428/24413 ,  Y10T428/24421 ,  Y10T428/269 ,  Y10T428/2839 ,  H01L2924/00

Abstract: A method of forming a film is provided. Nanoparticles are deposited on a surface of a substrate using a liquid deposition process. The nanoparticles are linked to each other and to the surface using linker molecules. A coating having a surface energy of less than 70 dyne/cm is deposited over the film to form a coated film. The coated film has an RMS surface roughness of 25 nm to 500 nm, a film coverage of 25% to 60%, a surface energy of less than 70 dyne/cm; and a durability of 10 to 5000 microNewtons. Depending on the particular environment in which the film is to be used, a durability of 10 to 500 microNewtons may be preferred. A film thickness 3 to 100 times the RMS surface roughness of the film is preferred.

Abstract translation: 提供了一种形成膜的方法。 使用液体沉积工艺将纳米颗粒沉积在基底的表面上。 使用接头分子将纳米颗粒彼此连接并连接到表面。 表面能小于70达因/厘米的涂层沉积在膜上以形成涂膜。 涂膜的RMS表面粗糙度为25nm至500nm，膜覆盖率为25％至60％，表面能小于70达因/厘米; 耐久性为10至5000微瓦。 根据使用薄膜的具体环境，可以优选10至500微瓦的耐久性。 膜的厚度为膜的RMS表面粗糙度的3〜100倍是优选的。

公开(公告)号：US07902639B2

公开(公告)日：2011-03-08

申请号：US11280986

申请日：2005-11-16

Applicant: Philip E. Garrou ,  Michael R. Knapp ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Michael A. Spaid

Inventor： Philip E. Garrou ,  Michael R. Knapp ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Michael A. Spaid

IPC: H01L29/40

CPC classification number: C23C18/1608 ,  B82Y10/00 ,  B82Y30/00 ,  C23C18/1639 ,  C23C18/1692 ,  C23C18/1879 ,  C23C18/1889 ,  C23C18/206 ,  C23C18/208 ,  C23C18/30 ,  G02F1/136204 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/105 ,  H05K3/12 ,  H05K3/389 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/086 ,  H05K2203/0545 ,  H05K2203/122

Abstract: Improved methods and articles providing conformal coatings for a variety of devices including electronic, semiconductor, and liquid crystal display devices. Peptide formulations which bind to nanoparticles and substrates, including substrates with trenches and vias, to provide conformal coverage as a seed layer. The seed layer can be further enhanced with use of metallic films deposited on the seed layer. Seed layers can be characterized by AFM measurements and improved seed layers provide for better enhancement layers including lower resistivity in the enhancement layer. Peptides can be identified by phage display.

Abstract translation: 改进的方法和制品为包括电子，半导体和液晶显示装置的各种装置提供保形涂层。 结合纳米颗粒和底物的肽制剂，包括具有沟槽和通孔的底物，以提供作为种子层的保形覆盖。 通过使用沉积在种子层上的金属膜可进一步增强籽晶层。 可以通过AFM测量来表征种子层，并且改进的种子层提供包括增强层中较低电阻率的更好的增强层。 可以通过噬菌体展示来鉴定肽。

公开(公告)号：US20110043987A1

公开(公告)日：2011-02-24

申请号：US12938759

申请日：2010-11-03

Applicant: Rabindra N. Das ,  John M. Lauffer ,  Voya R. Markovich

Inventor： Rabindra N. Das ,  John M. Lauffer ,  Voya R. Markovich

IPC: G06F1/16 ,  H05K7/00 ,  B82Y30/00

CPC classification number: H05K1/167 ,  H01G4/206 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H05K1/095 ,  H05K1/162 ,  H05K3/0023 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2203/1453 ,  Y10T29/49082 ,  Y10T29/49087 ,  Y10T29/49089 ,  Y10T29/49091 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/0401

Abstract: A method of making a circuitized substrate including a resistor comprised of material which includes a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ceramic component. The ceramic component may be a ferroelectric ceramic and/or a high surface area ceramic and/or a transparent oxide and/or a dope manganite. Alternatively, the material will include the polymer resin and nano-powders, with the nano-powders comprising at least one metal coated ceramic and/or at least one oxide coated metal component. An electrical assembly (substrate and at least one electrical component) and an information handling system (e.g., personal computer) utilizing such a circuitized substrate are also provided.

Abstract translation: 一种制造电路化基板的方法，包括由包括聚合物树脂的材料和包括至少一种金属组分和至少一种陶瓷组分的混合物的纳米粉末的量组成的电阻器。 陶瓷部件可以是铁电陶瓷和/或高表面积陶瓷和/或透明氧化物和/或掺杂亚锰酸盐。 或者，材料将包括聚合物树脂和纳米粉末，其中纳米粉末包含至少一种金属涂覆的陶瓷和/或至少一种氧化物涂覆的金属组分。 还提供了使用这种电路化基板的电气组件（基板和至少一个电气部件）以及信息处理系统（例如，个人计算机）。

公开(公告)号：US07814862B2

公开(公告)日：2010-10-19

申请号：US11432626

申请日：2006-05-12

Applicant: Alison Joan Lennon ,  Peter Kirkland Thomson ,  Nicolas Rowland Bingham

Inventor： Alison Joan Lennon ,  Peter Kirkland Thomson ,  Nicolas Rowland Bingham

IPC: B05C5/02

CPC classification number: H05K3/1283 ,  B41J3/407 ,  B41J11/002 ,  H05K1/095 ,  H05K3/125 ,  H05K2201/0257 ,  H05K2203/107

Abstract: A method and apparatus are described for forming a structure on a substrate. The structure may be a circuit element. The method uses a digital specification 910 for forming the structure, including specifications for printing and curing. The structure is printed (step 112) using a drop-on-demand printer 400, wherein the printing dispenses at least one material on the substrate 420 according to the digital specification 910. The structure is cured (step 130) by irradiating the dispensed material from one or more electromagnetic radiation sources 520, 525 in the printer 400, wherein curing parameters are specified by the digital specification 910 to obtain a desired electrical property when the structure is a circuit element. The curing specification may specify the intensity of the irradiation and the location of irradiation points in the print region.

Abstract translation: 描述了用于在基板上形成结构的方法和装置。 该结构可以是电路元件。 该方法使用数字规格910来形成结构，包括印刷和固化的规格。 使用按需打印机400打印结构（步骤112），其中打印根据数字规格910分配衬底420上的至少一种材料。通过照射分配的材料来固化结构（步骤130） 来自打印机400中的一个或多个电磁辐射源520,525，其中固化参数由数字规范910指定以在结构是电路元件时获得期望的电性能。 固化规格可以指定照射的强度和印刷区域中的照射点的位置。

公开(公告)号：US20100141376A1

公开(公告)日：2010-06-10

申请号：US12703701

申请日：2010-02-10

Applicant: Lex Kosowsky ,  Robert Fleming

Inventor： Lex Kosowsky ,  Robert Fleming

IPC: H01C7/10 ,  B05D5/12 ,  B32B15/04 ,  B32B9/00

CPC classification number: H01C7/1006 ,  B82Y10/00 ,  H01B1/22 ,  H01B1/24 ,  H01C7/105 ,  H01C17/0652 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/188 ,  H05K2201/0248 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0272 ,  H05K2201/0738 ,  H05K2203/0723 ,  H05K2203/105 ,  Y10S977/742 ,  Y10S977/779 ,  Y10T428/30 ,  Y10T428/31678

Abstract: One or more embodiments provide for a device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material on the device.

Abstract translation: 一个或多个实施例提供了一种使用具有半导体或导电材料的电压可切换介电材料的器件，该器件具有相对较高的纵横比，以便增强器件上的VSD材料的机械和电学特性。