公开(公告)号：US06239386B1

公开(公告)日：2001-05-29

申请号：US08695642

申请日：1996-08-12

Applicant: Thomas H. DiStefano ,  John W. Smith ,  Konstantine N. Karavakis ,  Zlata Kovac ,  Joseph Fjelstad

Inventor： Thomas H. DiStefano ,  John W. Smith ,  Konstantine N. Karavakis ,  Zlata Kovac ,  Joseph Fjelstad

IPC: H01R909

CPC classification number: H01R13/2414 ,  H01R12/714 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/445 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0382 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts expand radially and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material carried on the contacts themselves.

公开(公告)号：US6143639A

公开(公告)日：2000-11-07

申请号：US429877

申请日：1999-10-29

Applicant: Curtis M. Medlen ,  Mark E. Tuttle

Inventor： Curtis M. Medlen ,  Mark E. Tuttle

IPC: B23K20/02 ,  B23K20/16 ,  H01L21/60 ,  H05K3/32 ,  H01L21/50 ,  H01L21/44 ,  H01L23/48 ,  B23K20/00 ,  B23K20/12

CPC classification number: H01L24/12 ,  B23K20/02 ,  B23K20/16 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H05K3/321 ,  B23K2201/38 ,  B23K2201/42 ,  H01L2224/13099 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/30105 ,  H05K2201/0382 ,  H05K2201/10674 ,  H05K2201/10984 ,  H05K2201/10992

Abstract: Methods of forming electrically conductive interconnections and electrically interconnected substrates are described. In one implementation, a first substrate having an outer surface is provided and a layer of material is formed thereover. Openings are formed within the layer of material and conductive masses are formed within the openings. A second substrate having conductive interconnect surfaces is provided. The conductive interconnect surfaces are then contacted with the conductive masses and deformed thereby. In one aspect, the interconnect surfaces are deformed in part by portions of the layer of material proximate the conductive masses. In another aspect, the layer of material is removed and the interconnect surfaces are deformed by the conductive masses themselves.

公开(公告)号：US6092282A

公开(公告)日：2000-07-25

申请号：US332542

申请日：1999-06-14

Applicant: Joseph A. Roberts

Inventor： Joseph A. Roberts

IPC: H05K3/04 ,  H05K3/46 ,  H01K3/22

CPC classification number: H05K3/045 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2203/063 ,  H05K3/4647 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49158

Abstract: Methods of facilitating commercial production of supported conductive networks without the use of hazardous chemicals including using heat flowable adhesive in the formation of the networks, providing contact pads exposed through a dielectric substrate which supports a conductive network, using the thickness of a conductor supporting dielectric layer to space the conductors and providing conductor and waste material cross-sections trapezoidal in shape in a non-planar pattern during manufacture of the networks.

Abstract translation: 促进支撑导电网络的商业生产的方法，不使用危险化学品，包括在网络形成中使用热可流动的粘合剂，通过支撑介质层的导体的厚度提供通过介电基板暴露的接触焊盘， 以在网络的制造过程中间隔导体并且以非平面图案形状提供梯形形状的导体和废料横截面。

公开(公告)号：US6022611A

公开(公告)日：2000-02-08

申请号：US862856

申请日：1997-05-23

Applicant: Shizuo Sakurai ,  Shinji Araki ,  Sakae Shinkawa ,  Tadahiko Nakagaki

Inventor： Shizuo Sakurai ,  Shinji Araki ,  Sakae Shinkawa ,  Tadahiko Nakagaki

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/40 ,  B32B3/00 ,  B32B23/02

CPC classification number: H05K3/4069 ,  H05K3/005 ,  H05K3/0055 ,  H05K2201/0382 ,  H05K2203/0195 ,  H05K2203/0346 ,  H05K2203/1453 ,  H05K2203/1572 ,  Y10T428/24777 ,  Y10T428/24917

Abstract: A circuit board capable of accomplishing an increase in current capacity and therefore a reduction in resistance of a through-hole conductive section each formed by filling a conductive paste in each of through-holes formed in a paper base insulating substrate by punching. A punching pin is thrust into the paper base insulating substrate provided on front and rear surfaces thereof with copper foil lands from a side of the front surface, resulting in the through-holes being formed. A drawing pin is inserted into each of the through-holes from a side of the rear surface of the insulating substrate through a rear opening of the through-hole, to thereby curve an inner peripheral portion of the rear copper foil land toward an interior of the through-hole and cut off any swell in the through-hole. The through-holes each are filled with the conductive paste, followed by curing the paste, so that the through-hole conductive section is formed for electrically connecting copper foil lands to each other.

Abstract translation: 一种电路板，其能够实现电流容量的增加，从而降低通孔冲击导电部件的电阻，所述通孔导电部件通过在形成在纸基绝缘基板中的每个通孔中填充导电膏而形成。 冲压销从其前表面的背面被设置在纸基绝缘基板上，铜箔焊盘从前表面的一侧引入，形成通孔。 通过贯通孔的后开口，从绝缘基板的背面的一侧将贯穿孔插入到每个通孔中，从而使后铜箔接地的内周部向内侧弯曲 通孔，并切断通孔中的任何膨胀。 通孔中填充有导电膏，然后固化该糊状物，从而形成通孔导电部分，以将铜箔焊盘彼此电连接。

公开(公告)号：US5980270A

公开(公告)日：1999-11-09

申请号：US753539

申请日：1996-11-26

Applicant: Joseph Fjelstad ,  Thomas H. DiStefano ,  John W. Smith

Inventor： Joseph Fjelstad ,  Thomas H. DiStefano ,  John W. Smith

IPC: H01R33/76 ,  B23K1/19 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/48 ,  H01L21/60 ,  H01L23/32 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10 ,  H01R9/09

CPC classification number: H05K7/1084 ,  G01R1/0466 ,  G01R1/07357 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01R12/52 ,  H01R12/57 ,  H01R12/58 ,  H01R12/7076 ,  H01R12/714 ,  H01R13/2407 ,  H01R13/2464 ,  H01R13/2485 ,  H05K3/326 ,  H05K3/3436 ,  H05K7/1069 ,  G01R1/06711 ,  G01R1/06733 ,  G01R1/06738 ,  G01R1/06744 ,  G01R3/00 ,  H01L2224/13109 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/8114 ,  H01L2224/81899 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/351 ,  H01R4/028 ,  H05K1/118 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  H05K3/3431 ,  H05K3/4092 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49179

Abstract: A method of making a solder connection. An element bearing a solder mass is forcibly engaged with another element bearing a resilient metallic contact so that the contact wipes the surface of the solder mass and so that the contact is deformed and bears against the wiped surface. While the contact is in its deformed condition, the contact and solder mass are brought to an elevated bonding temperature sufficient to soften the solder, so that the contact penetrates into the solder mass under the influence of its own resilience. The contact bonds with the pure solder inside the solder mass, so that the effective bonding can be achieved even without flux.

Abstract translation: 制造焊接连接的方法。 带有焊料块的元件被强制地与另一个带有弹性金属接触件的元件接合，使得接触件擦拭焊料块的表面，并使触头变形并且抵靠擦拭表面。 当接触处于其变形状态时，接触和焊料质量达到足以软化焊料的升高的粘合温度，使得接触在其自身弹性的影响下渗透到焊料块中。 触点与焊料中的纯焊料接合，从而即使没有焊剂也可以实现有效的接合。

公开(公告)号：US5651180A

公开(公告)日：1997-07-29

申请号：US518735

申请日：1995-08-24

Applicant: Richard P. Himmel ,  Raymond Brown

Inventor： Richard P. Himmel ,  Raymond Brown

IPC: H01L21/48 ,  H01L23/367 ,  H01L23/498 ,  H01L23/538 ,  H05K1/03 ,  H05K3/40 ,  H01R43/16

CPC classification number: H01L23/49827 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/3677 ,  H01L23/5383 ,  H05K3/4046 ,  H01L2224/16 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/0382 ,  H05K2201/10234 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49224

Abstract: The present invention provides a method and apparatus for metallizing vias in co-fired ceramic green tape. A vacuum operated pick and place anvil comprising a porous block is used to pick up conductor balls from a bed. Air pressure is used to create a vacuum which pulls the conductor balls to the porous block. A stencil having openings is placed on a contact surface of the anvil, thereby permitting only one conductor ball to attach to each opening in the stencil. With the conductor balls attached to the anvil, the anvil is lowered onto the green tape. Next the anvil pushes the conductor balls into the tape until the conductor balls break through the opposite side of the tape. The anvil is retracted leaving the conductor balls lodged in the tape. It is possible to provide a green tape with pre-formed vias so that forcing the conductor balls into the tape is a simpler task. The locations of the openings in the stencil determines the location of the vias or must correspond to the vias in a tape having pre-formed vias. If the conductor balls protrude from any surface of the tape, the anvil or similar device can be used to flatten the protrusion. In alternative embodiments, the present invention conductor balls can be substituted with a material having a high thermal conductivity, or a high dielectric constant, or to include ferrite.

Abstract translation: 本发明提供了一种用于在共烧陶瓷生胶带中金属化通孔的方法和装置。 使用包括多孔块的真空操作的拾取和放置砧座从床上拾取导体球。 空气压力用于产生将导体球拉到多孔块的真空。 具有开口的模板被放置在砧座的接触表面上，从而仅允许一个导体球附着在模板中的每个开口上。 将导体球连接到砧座上，将砧座下降到生胶带上。 接下来，砧将导体球推入带中，直到导体球穿过带的相对侧。 砧座被收回，使导体球落在带中。 可以提供具有预先形成的通孔的绿色带，使得将导体球强制进入带是更简单的任务。 模板中的开口的位置决定了通孔的位置，或者必须与具有预先形成的通孔的带中的通孔相对应。 如果导体球从带的任何表面突出，则可以使用砧座或类似装置使突起平坦化。 在替代实施例中，本发明的导体球可以用具有高导热性或高介电常数的材料代替，或者包括铁氧体。

公开(公告)号：US5632631A

公开(公告)日：1997-05-27

申请号：US306205

申请日：1994-09-14

Applicant: Joseph Fjelstad ,  John W. Smith ,  Thomas H. Distefano ,  James Zaccardi ,  A. Christian Walton

Inventor： Joseph Fjelstad ,  John W. Smith ,  Thomas H. Distefano ,  James Zaccardi ,  A. Christian Walton

IPC: B23K1/19 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H01R43/16 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10 ,  H01R9/09

CPC classification number: H05K7/1084 ,  G01R1/0466 ,  G01R1/06744 ,  G01R1/07357 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01R13/2485 ,  H05K3/326 ,  H05K3/3436 ,  H05K7/1069 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/06733 ,  G01R3/00 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/8114 ,  H01L2224/81385 ,  H01L2224/81899 ,  H01L24/81 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01R12/7076 ,  H05K1/118 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  H05K3/3431 ,  H05K3/4092 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49222 ,  Y10T29/49224

Abstract: Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.

Abstract translation: 诸如柔性的，片状的悬臂触点之类的微电子触点具有以规则图案设置的凹凸。 每个粗糙部分的尖端具有远离接触表面的尖端特征。 当配合的微电子元件与触点接合时，擦拭动作导致粗糙的尖锐特征刮擦配合元件，以便在触发和配合元件激活时提供有效的电互连以及可选的有效的冶金结合 接合材料。

公开(公告)号：US5615824A

公开(公告)日：1997-04-01

申请号：US410324

申请日：1995-03-24

Applicant: Joseph Fjelstad ,  Thomas H. DiStefano ,  John W. Smith

Inventor： Joseph Fjelstad ,  Thomas H. DiStefano ,  John W. Smith

IPC: H01R33/76 ,  B23K1/19 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/48 ,  H01L21/60 ,  H01L23/32 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10 ,  B23K1/00

CPC classification number: H05K7/1084 ,  G01R1/0466 ,  G01R1/07357 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01R12/52 ,  H01R12/57 ,  H01R12/58 ,  H01R12/7076 ,  H01R12/714 ,  H01R13/2407 ,  H01R13/2464 ,  H01R13/2485 ,  H05K3/326 ,  H05K3/3436 ,  H05K7/1069 ,  G01R1/06711 ,  G01R1/06733 ,  G01R1/06738 ,  G01R1/06744 ,  G01R3/00 ,  H01L2224/13109 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/8114 ,  H01L2224/81899 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/351 ,  H01R4/028 ,  H05K1/118 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  H05K3/3431 ,  H05K3/4092 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49179

Abstract: A method of making a solder connection. An element bearing a solder mass is forcibly engaged with another element bearing a resilient metallic contact so that the contact wipes the surface of the solder mass and so that the contact is deformed and bears against the wiped surface. While the contact is in its deformed condition, the contact and solder mass are brought to an elevated bonding temperature sufficient to soften the solder, so that the contact penetrates into the solder mass under the influence of its own resilience. The contact bonds with the pure solder inside the solder mass, so that the effective bonding can be achieved even without flux.

Abstract translation: 制造焊接连接的方法。 带有焊料块的元件被强制地与另一个带有弹性金属接触件的元件接合，使得接触件擦拭焊料块的表面，并使触头变形并且抵靠擦拭表面。 当接触处于其变形状态时，接触和焊料质量达到足以软化焊料的升高的粘合温度，使得接触在其自身弹性的影响下渗透到焊料块中。 触点与焊料中的纯焊料接合，从而即使没有焊剂也可以实现有效的接合。

公开(公告)号：US5600100A

公开(公告)日：1997-02-04

申请号：US244393

申请日：1994-08-15

Applicant: Marcel Andrei-Alexandru ,  Peter Fein ,  John M. Longney

Inventor： Marcel Andrei-Alexandru ,  Peter Fein ,  John M. Longney

IPC: B60R16/02 ,  B29C70/68 ,  B29C70/70 ,  B60R16/027 ,  B62D1/16 ,  H01B7/00 ,  H01H11/00 ,  H05K3/04 ,  H05K3/20 ,  H05K1/00

CPC classification number: H05K3/202 ,  B29C70/682 ,  B29C70/70 ,  H01H11/0056 ,  B29L2031/3061 ,  B29L2031/3443 ,  H05K2201/0382 ,  H05K2201/09118 ,  H05K2203/025 ,  H05K2203/175 ,  H05K3/045 ,  Y10T29/49126 ,  Y10T29/49156

Abstract: An electrical device with a punched plate embedded in a plastic plate is described. The punched-out conductive contact elements are still interconnected prior to the embedding operation for ease of manipulation of the plate. The link of the conductive contact elements is a U-shaped tab which, prior to the embedding operation, stands roughly perpendicular on the conductive contact elements and is cut after the manufacture of the plastic plate. This cutting operation of the conductive contact elements is possible without holes in the plastic plate.

Abstract translation: PCT No.PCT / EP92 / 02575 Sec。 371日期：1994年8月15日 102（e）日期1994年8月15日PCT 1991年11月10日PCT公布。 公开号WO93 / 10544 日期：1993年5月27日描述了一种具有埋在塑料板上的穿孔板的电气装置。 冲压的导电接触元件在嵌入操作之前仍然互连，以便于操纵板。 导电接触元件的连接是U形突片，其在嵌入操作之前大致垂直于导电接触元件并在塑料板的制造之后被切割。 导电接触元件的这种切割操作在塑料板中没有孔的情况下是可能的。

公开(公告)号：US5497545A

公开(公告)日：1996-03-12

申请号：US34372

申请日：1993-03-18

Applicant: Ryuji Watanabe ,  Osamu Miura ,  Kunio Miyazaki ,  Yukio Ookoshi ,  Akio Takahashi

Inventor： Ryuji Watanabe ,  Osamu Miura ,  Kunio Miyazaki ,  Yukio Ookoshi ,  Akio Takahashi

IPC: H01L21/60 ,  H01L21/48 ,  H01L21/58 ,  H01L23/12 ,  H01L23/538 ,  H01R12/51 ,  H05K3/32 ,  H05K3/40 ,  H05K3/46 ,  H05K3/36 ,  H01R9/09

CPC classification number: H05K3/4046 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/5384 ,  H01L23/5385 ,  H01R12/523 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2924/00013 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15312 ,  H05K2201/0382 ,  H05K2201/10234 ,  H05K2201/10287 ,  H05K2201/10416 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K3/328 ,  H05K3/4644 ,  Y10T29/49126 ,  Y10T29/49149 ,  Y10T29/49151

Abstract: A multi-layer wiring assembly including a stack of insulating layers, e.g. of polyimide, alternating with wiring patterns, typically of copper. To establish the circuit pattern, successive wiring patterns are connected to one another through the intervening insulating layers at predetermined locations, by metal stud connections. The studs are formed during assembly of the stack by wire-bonding a stud onto an underlying wiring pattern through a through-hole of the insulating layer above, and then stamping the exposed end of the wire-bonded stud to spread it into contact with the uppermost wiring pattern. The wire-bonded studs e.g. of Au, form strong bonds with the underlying conductor and are quick to apply in an automated process using a wire-bonding machine.

Abstract translation: 一种多层布线组件，包括一层绝缘层，例如 的聚酰亚胺，与布线图案交替，通常为铜。 为了建立电路图案，连续的布线图案通过金属螺柱连接在预定位置处通过中间绝缘层彼此连接。 通过将螺柱通过上面的绝缘层的通孔将螺柱线接合到下面的布线图案上，并且然后冲压引线接合的螺柱的暴露的端部以使其与 最上面的布线图案。 例如， 的Au与底层导体形成牢固的结合，并且使用引线接合机快速地应用于自动化过程中。