公开(公告)号：US09241401B2

公开(公告)日：2016-01-19

申请号：US13166626

申请日：2011-06-22

Applicant: John O. Renn ,  William G. Reed ,  Bradley B. Larsen

Inventor： John O. Renn ,  William G. Reed ,  Bradley B. Larsen

IPC: B60Q1/06 ,  H05K1/02 ,  F21V19/00 ,  F21V7/04 ,  F21V29/77 ,  F21W131/103 ,  F21Y101/02 ,  F21Y103/02 ,  F21Y111/00 ,  H05K3/00 ,  F21S8/08 ,  F21V7/00 ,  F21V13/02

CPC classification number: H05K1/0278 ,  F21S8/08 ,  F21V7/0058 ,  F21V7/041 ,  F21V13/02 ,  F21V19/0035 ,  F21V19/0055 ,  F21V29/777 ,  F21W2131/103 ,  F21Y2103/33 ,  F21Y2107/20 ,  F21Y2107/30 ,  F21Y2115/10 ,  H05K1/0203 ,  H05K3/0061 ,  H05K2201/09018 ,  H05K2201/09027 ,  H05K2201/10106 ,  H05K2201/10409 ,  Y10T29/49124

Abstract: An illumination device comprises a circuit board that carries solid-state light sources and a heat transfer structure to which the circuit board is intimately physically coupled such that the circuit board is curved along at least one of a longitudinal dimension or a lateral dimension thereof. Such may allow less fasteners to be used than would otherwise be possible, while maintaining close contact over a large portion of the surface area. Some embodiments may employ a clamp, for example a peripheral clamp such as a cover or bezel clamp.

Abstract translation: 照明装置包括承载固态光源的电路板和电路板紧密物理耦合的传热结构，使得电路板沿其纵向尺寸或横向尺寸中的至少一个弯曲。 这样可以允许比否则可能使用更少的紧固件，同时在表面区域的大部分上保持紧密接触。 一些实施例可以使用夹具，例如外围夹具，例如盖或挡板夹。

公开(公告)号：US20150373832A1

公开(公告)日：2015-12-24

申请号：US14744469

申请日：2015-06-19

Applicant: Taiwan Green Point Enterprises Co., Ltd.

Inventor： Pen-Yi LIAO ,  Hung-San PAN ,  Yu-Cheng CHEN ,  Hui-Ching CHUANG ,  Wen-Chia TSAI

IPC: H05K1/02 ,  H05K3/10

CPC classification number: H05K3/0061 ,  H05K1/0203 ,  H05K1/0284 ,  H05K3/185 ,  H05K2201/09018 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2203/0709 ,  Y10T29/49156

Abstract: A circuit-and-heat-dissipation assembly includes: a heat sink including a heat absorbing base and a heat dissipating element, the heat absorbing base having a circuit-forming surface and an element-forming surface, the heat dissipating element protruding from the element-forming surface for dissipating heat conducted from the heat absorbing base into an ambient environment; an insulator layer formed on the circuit-forming surface; and a patterned circuit formed on the insulator layer.

Abstract translation: 电路和散热组件包括：散热器，其包括吸热基座和散热元件，所述吸热基座具有电路形成表面和元件形成表面，所述散热元件从所述元件突出 形成表面，用于将从吸热基底传导到周围环境的热量散发; 形成在电路形成表面上的绝缘体层; 以及形成在绝缘体层上的图案电路。

公开(公告)号：US20150342077A1

公开(公告)日：2015-11-26

申请号：US14282248

申请日：2014-05-20

Applicant: The Boeing Company

Inventor： Hardik Dalal ,  Jeffrey Lynn Duce ,  Yelina Rosillo ,  Brent A. Robbins ,  Breana K. Merriweather

IPC: H05K7/06 ,  C23C4/08 ,  C23C4/00 ,  C23C4/12

CPC classification number: H05K7/06 ,  B64D45/00 ,  B64F5/00 ,  C23C4/01 ,  C23C4/08 ,  C23C4/134 ,  H05K1/0284 ,  H05K3/14 ,  H05K3/388 ,  H05K3/4673 ,  H05K2201/09018 ,  H05K2201/0999 ,  H05K2203/0528 ,  H05K2203/095 ,  H05K2203/1344

Abstract: A method for manufacturing a composite part. Layers of composite material are cured to form the composite part. A primer is depicted on a surface of the composite part. A group of conductive elements is deposited on the primer to form an electronic device on the primer.

Abstract translation: 一种复合部件的制造方法。 复合材料层固化形成复合材料。 在复合部件的表面上示出了底漆。 一组导电元件沉积在引物上以在引物上形成电子器件。

公开(公告)号：US20150223332A1

公开(公告)日：2015-08-06

申请号：US14416116

申请日：2013-08-23

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Tomohiro Nishida ,  Seiji Mori ,  Makoto Wakazono

IPC: H05K1/11

CPC classification number: H05K1/11 ,  H01L21/563 ,  H01L23/12 ,  H01L23/13 ,  H01L23/145 ,  H01L23/49894 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/1161 ,  H01L2224/131 ,  H01L2224/13113 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/32237 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81385 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/83385 ,  H01L2224/8385 ,  H01L2924/3512 ,  H01L2924/3841 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09018 ,  H05K2201/10977 ,  H05K2203/0594 ,  H05K2203/0597 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/014

Abstract: In a wiring substrate, formation of voids due to underfill filling failure is suppressed. A wiring substrate includes an insulating base layer, an insulating layer laminated on the base layer, and an electrically conductive connection terminal projecting from the insulating layer inside an opening. The insulating layer has a first surface with an opening, and a second surface located within the opening and being concave toward the base layer in relation to the first surface. The second surface extends from the first surface to the connection terminal inside the opening. On a cut surface which is a flat surface extending along a lamination direction in which the insulating layer is laminated on the base layer, an angle which is larger than 0° but smaller than 90° is formed between a normal line extending from an arbitrary point on the second surface toward the outside of the insulating layer and a parallel line extending from the arbitrary point toward the connection terminal in parallel to the first surface.

Abstract translation: 在布线基板中，由于底部填充不充分而形成空隙被抑制。 布线基板包括绝缘基底层，层叠在基底层上的绝缘层和从开口内的绝缘层突出的导电连接端子。 绝缘层具有带有开口的第一表面和位于开口内的第二表面，并且相对于第一表面朝向基底层凹陷。 第二表面从开口内的第一表面延伸到连接端。 在沿绝缘层层叠在基层上的层叠方向延伸的平坦面的切割面上，在从任意点延伸的法线之间形成大于0°但小于90°的角度 在所述第二表面上朝向所述绝缘层的外侧，以及从所述任意点朝向所述连接端子平行于所述第一表面延伸的平行线。

公开(公告)号：US20150053663A1

公开(公告)日：2015-02-26

申请号：US14465235

申请日：2014-08-21

Applicant: AIRBUS OPERATIONS LIMITED

Inventor： Nebojsa SAKOTA ,  Andrew MCVEY

IPC: H05K1/03 ,  H05B3/00 ,  H05K1/02 ,  B64C1/00 ,  H01B19/04

CPC classification number: H01B19/04 ,  B64C1/12 ,  B64D15/12 ,  H05B3/12 ,  H05B3/145 ,  H05B3/267 ,  H05B2203/013 ,  H05B2203/014 ,  H05B2214/02 ,  H05K1/0212 ,  H05K1/0284 ,  H05K2201/09018 ,  H05K2203/1115

Abstract: A panel for an aircraft is disclosed. The panel has a body with an integral conductor for the transmission of electrical power and/or signals therethrough.

Abstract translation: 公开了一种飞机面板。 面板具有用于传输电力和/或信号的集成导体的主体。

公开(公告)号：US20150003028A1

公开(公告)日：2015-01-01

申请号：US14098685

申请日：2013-12-06

Applicant: FIH (Hong Kong) Limited

Inventor： CHWAN-HWA CHIANG ,  CHIEH-HSIANG WANG

IPC: H05K7/06 ,  H05K3/00

CPC classification number: H05K3/0014 ,  H04M1/0202 ,  H04M1/0262 ,  H04M1/0277 ,  H05K1/0284 ,  H05K1/162 ,  H05K3/4629 ,  H05K2201/09018 ,  H05K2201/0999

Abstract: A housing for an electronic device includes a ceramic base comprising ceramic material, at least one electronic element embedded in the ceramic base, and a buffer layer made of resin. The ceramic base includes an inner surface. The buffer layer is formed on the inner surface. A method for making the housing is also provided.

Abstract translation: 一种用于电子设备的外壳包括陶瓷基体，其包括陶瓷材料，至少一个嵌入陶瓷基底中的电子元件和由树脂制成的缓冲层。 陶瓷基座包括内表面。 缓冲层形成在内表面上。 还提供了制造壳体的方法。

公开(公告)号：US20140041921A1

公开(公告)日：2014-02-13

申请号：US13570365

申请日：2012-08-09

Applicant: Stephen Gonya ,  Kenn Twigg ,  Jim Patterson

Inventor： Stephen Gonya ,  Kenn Twigg ,  Jim Patterson

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/06 ,  H05K1/00

CPC classification number: H05K1/0298 ,  H05K1/0284 ,  H05K1/053 ,  H05K1/09 ,  H05K1/115 ,  H05K3/4644 ,  H05K2201/09018 ,  H05K2203/0315

Abstract: A method for making conformal non-planar multi-layer circuitry is described. The method can include providing a substrate having a non-planar surface and depositing a first conformal dielectric layer on the substrate, the first conformal dielectric layer conforming to the non-planar surface of the substrate and having a non-planar surface. The method can also include applying a first conformal circuitry layer on the first conformal dielectric layer. The method can include depositing a second conformal dielectric layer on the first conformal circuitry layer, the second conformal dielectric layer conforming to a non-planar surface of the first conformal circuitry layer, and applying a second conformal circuitry layer on the second conformal dielectric layer. Successive layers can be sequentially deposited. Microvias may provide electrical connections between circuit layers.

Abstract translation: 描述了制造共形非平面多层电路的方法。 该方法可以包括提供具有非平面表面的衬底和在衬底上沉积第一适形电介质层，第一保形电介质层与衬底的非平面表面一致并且具有非平面表面。 该方法还可以包括在第一保形电介质层上施加第一保形电路层。 该方法可以包括在第一共形电路层上沉积第二共形介电层，第二共形绝缘层与第一共形电路层的非平面表面一致，以及在第二共形介电层上施加第二共形电路层。 连续层可以顺序沉积。 微电极可以在电路层之间提供电连接。

公开(公告)号：US08377543B2

公开(公告)日：2013-02-19

申请号：US12514365

申请日：2007-10-09

Applicant: Toshinobu Ogatsu

Inventor： Toshinobu Ogatsu

IPC: B32B9/00

CPC classification number: H05K3/4688 ,  H05K1/0366 ,  H05K1/0393 ,  H05K3/4635 ,  H05K3/4691 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2201/0296 ,  H05K2201/09018 ,  H05K2203/302 ,  Y10T428/24917 ,  Y10T442/3065 ,  Y10T442/3195 ,  Y10T442/3236

Abstract: Provided is a multilayer-wired substrate for mobile electric equipment, wherein the multilayer-wired substrate is very strong, includes a larger elastically deformable region and a higher elasticity than those of the conventional structure, and can be curved. The multilayer-wired substrate is a multilayer-wired substrate including one or more insulating layers. At least one insulating layer of the substrate is made of a material in which the mechanical characteristic in an in-plane direction component exhibits anisotropy.

Abstract translation: 本发明提供一种移动电子设备用多层布线基板，其中多层布线基板非常坚固，包括比常规结构更大的弹性变形区域和更高的弹性，并且可以是弯曲的。 多层布线基板是包括一个或多个绝缘层的多层布线基板。 衬底的至少一个绝缘层由其中面内方向分量的机械特性表现出各向异性的材料制成。

公开(公告)号：US08154683B2

公开(公告)日：2012-04-10

申请号：US13130530

申请日：2009-11-26

Applicant: Kenji Yoneda ,  Kenji Miura

Inventor： Kenji Yoneda ,  Kenji Miura

IPC: G02F1/1335

CPC classification number: H05K1/189 ,  F21K9/00 ,  F21Y2115/10 ,  G01N21/8806 ,  G01N2201/0626 ,  H05K3/305 ,  H05K3/3442 ,  H05K3/3484 ,  H05K2201/09018 ,  H05K2201/10106 ,  H05K2201/10636 ,  H05K2203/0455 ,  Y02P70/611 ,  Y02P70/613

Abstract: The present invention relates to a method for easily manufacturing an illumination device in which a surface mount chip-type LED is used, and a wiring board is formed into a truncated conical or another shape. The method includes, in a flexible strip-like wiring board having a partial ring or a linear shape, providing a through-hole T for filling with solder paste S at a wiring end portion L to be connected with a terminal of an LED, temporarily fixing the LED with bond B onto the wiring board held in a plate-like state, filling the through-hole T with the solder paste S from a back surface of the wiring board, rounding the wiring board mounted with the LED into a truncated conical or cylindrical shape, and reflowing the wiring board in the rounded state to solder the LED.

Abstract translation: 本发明涉及容易制造其中使用表面贴装芯片型LED的照明装置的方法，并且布线板形成为截头圆锥形或其它形状。 该方法包括在具有部分环或线性形状的柔性条状布线板中，提供用于在与LED的端子连接的布线端部L处填充焊膏S的通孔T临时 用键B将LED固定在板状状态的布线板上，从布线板的背面向焊盘S填充通孔T，将安装有LED的布线板四舍五入为截头圆锥形 或圆柱形，并且在圆形状态下回流布线板以焊接LED。

公开(公告)号：US20120081849A1

公开(公告)日：2012-04-05

申请号：US13316557

申请日：2011-12-12

Applicant: Po-Wen HSIAO ,  Yuan-Chih Tsai ,  Ted-Hong Shinn

Inventor： Po-Wen HSIAO ,  Yuan-Chih Tsai ,  Ted-Hong Shinn

IPC: H05K7/00

CPC classification number: H05K1/189 ,  G02F1/133305 ,  G02F2001/133388 ,  G02F2201/54 ,  G09F9/301 ,  H05K1/0281 ,  H05K3/284 ,  H05K2201/09018 ,  H05K2201/10128 ,  H05K2201/10136

Abstract: A flexible display device includes a display panel and a plurality of curving-restricting structures. The display panel has a display surface and a bottom surface opposite thereto. The display surface has a visible region and an outer region surrounding the visible region. The curving-restricting structures is disposed on at least one of the outer region of the display surface and the bottom surface of the display panel. Each curving-restricting structure has a top surface and at least a slanted side wall. The top surfaces of adjacent curving-restricting structures are spaced with each other, and the slanted side walls of adjacent curving-restricting structures face each other. When the flexible display device are curved to a predetermined extent, adjacent curving-restricting structures may resist against with each other to prevent the display panel from being unduly curved to be damaged, and thus a use reliability of the flexible display device is improved.

Abstract translation: 柔性显示装置包括显示面板和多个弯曲限制结构。 显示面板具有显示面和与其相反的底面。 显示表面具有可见区域和围绕可见区域的外部区域。 弯曲限制结构设置在显示面的外部区域和显示面板的底面的至少一个上。 每个弯曲限制结构具有顶表面和至少一个倾斜的侧壁。 相邻的弯曲限制结构的顶面彼此间隔开，相邻弯曲限制结构的倾斜侧壁彼此面对。 当柔性显示装置弯曲到预定的程度时，相邻的弯曲限制结构可以彼此抵抗以防止显示面板被过度弯曲以致损坏，从而提高了柔性显示装置的使用可靠性。