公开(公告)号：US08705905B2

公开(公告)日：2014-04-22

申请号：US12675884

申请日：2008-09-11

Applicant: Gregor Langer ,  Johannes Stahr

Inventor： Gregor Langer ,  Johannes Stahr

IPC: G02B6/12

CPC classification number: G02B6/43 ,  G02B6/138 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/4691 ,  H05K2201/09127

Abstract: The invention relates to a printed circuit board element (10), comprising at least one flexible printed circuit board part (12) and at least one rigid printed circuit board part (11A, 11C; 34, 35; 37) having a component (17), which is accommodated in a cavity (14) and with a light-emitting or light-receiving part (17) projects over the edge (18) of the cavity (14), wherein the flexible printed circuit board part (12) has a flexible layer (15′) made of an optical, photo-polymerizable material (15), in which an optical fiber (15) is structured in alignment with the light-emitting or light-receiving part (17) of the optoelectronic component (17) by way of radiation.

Abstract translation: 本发明涉及一种印刷电路板元件（10），其包括至少一个柔性印刷电路板部分（12）和至少一个刚性印刷电路板部分（11A，11C; 34,35,37），其具有部件（17 ），其容纳在空腔（14）中并且发光或光接收部分（17）突出在空腔（14）的边缘（18）上方，其中柔性印刷电路板部件（12）具有 由光学可光聚合材料（15）制成的柔性层（15'），其中光纤（15）被构造成与光电子部件的发光或光接收部分（17）对准 17）通过辐射。

公开(公告)号：US20140103119A1

公开(公告)日：2014-04-17

申请号：US14108216

申请日：2013-12-16

Applicant: Neology

Inventor： Paul Elizondo ,  John Azevedo

IPC: G06Q10/08 ,  G06K19/07

CPC classification number: G06K7/10475 ,  G06K7/0008 ,  G06K7/10029 ,  G06K7/10039 ,  G06K19/0723 ,  G06K19/07796 ,  G06K19/07798 ,  G06Q10/08 ,  H04J3/0641 ,  H05K1/02 ,  H05K1/0266 ,  H05K1/0268 ,  H05K1/142 ,  H05K3/30 ,  H05K2201/0909 ,  H05K2201/09127

Abstract: A breakaway RFID tag is configured such that it comprises part of a Printed Circuit Board Assembly (PCB). Thus, the breakaway RFID tag can be used to track the PCB as it migrates through a manufacturing process. In one embodiment, the REID tag can be assembled first and then used to track the PCB as it is populated with components and installed into larger assemblies and ultimately into the end device. Once the PCB is installed into a larger assembly or the end device, the breakaway RFID tag is configured such that it can be broken off and attached to the outside of the larger assembly or end device.

Abstract translation: 分离的RFID标签被配置为使得其包括印刷电路板组件（PCB）的一部分。 因此，分离的RFID标签可以用于在通过制造过程迁移时跟踪PCB。 在一个实施例中，可以首先组装REID标签，然后用于跟踪PCB，因为它被填充有组件并安装到更大的组件中并且最终进入终端设备。 一旦PCB被安装到更大的组件或终端设备中，分离的RFID标签被配置成使得它可以被分解并且附接到较大组件或终端设备的外部。

公开(公告)号：US08685196B2

公开(公告)日：2014-04-01

申请号：US13145651

申请日：2010-01-22

Applicant: Günther Weichslberger ,  Johannes Stahr ,  Markus Leitgeb ,  Andreas Zluc ,  Gerald Weidinger

Inventor： Günther Weichslberger ,  Johannes Stahr ,  Markus Leitgeb ,  Andreas Zluc ,  Gerald Weidinger

IPC: B29C65/18 ,  B32B37/26 ,  B32B38/10 ,  B32B38/14

CPC classification number: H05K3/4688 ,  H05K1/0298 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4691 ,  H05K3/4697 ,  H05K2201/09127 ,  Y10T29/49124 ,  Y10T156/1066 ,  Y10T156/1195

Abstract: In a method for producing a multilayer printed circuit board from a plurality of conducting or conductive and non-conducting or insulating layers or plies to be connected to each other, in particular to be pressed together, wherein after connecting at least partially planar layers at least a partial region (11) thereof is removed, and wherein in order to prevent adherence of the partial region (11) to be removed a material (8) preventing adhesion is applied in accordance with the partial region to be removed onto a layer (9) which adjoins the partial region to be removed, it is provided that the material (8) preventing adhesion is formed by a mixture comprising a release agent on the basis of at least one metal soap, preferably the fatty acid salts of Al, Mg, Ca, Na and Zn, a binding agent, and a solvent, whereby a partial region to be removed can be removed easily and reliably after appropriate treatment and/or processing steps of the multilayer printed circuit board. In addition, an adhesion prevention material and a use of the method in connection with the production of a multilayer printed circuit board (1) are provided.

Abstract translation: 在多层印刷电路板的制造方法中，多层印刷电路板由多个导电或不导电或不导电或绝缘层或层组成，以彼此连接，特别是被压在一起，其中至少部分平面的层至少连接 去除其部分区域（11），并且其中为了防止待除去的部分区域（11）的粘附，根据待除去的部分区域（9）施加防止粘附的材料（8）（9） ），其邻接待移除的部分区域，条件是防止粘附的材料（8）由包含基于至少一种金属皂的脱模剂的混合物形成，优选由Al，Mg的脂肪酸盐， Ca，Na和Zn，粘合剂和溶剂，由此在多层印刷电路板的适当处理和/或加工步骤之后，可以容易且可靠地除去待除去的部分区域。 另外，提供了一种防粘连材料和与制造多层印刷电路板（1）相关的方法的使用。

公开(公告)号：US08680973B2

公开(公告)日：2014-03-25

申请号：US11766749

申请日：2007-06-21

Applicant: James Robert Kruest ,  Gary Bann

Inventor： James Robert Kruest ,  Gary Bann

IPC: G08C19/16

CPC classification number: G06K7/10475 ,  G06K7/0008 ,  G06K7/10029 ,  G06K7/10039 ,  G06K19/0723 ,  G06K19/07796 ,  G06K19/07798 ,  G06Q10/08 ,  H04J3/0641 ,  H05K1/02 ,  H05K1/0266 ,  H05K1/0268 ,  H05K1/142 ,  H05K3/30 ,  H05K2201/0909 ,  H05K2201/09127

Abstract: RFID tags are used for many purpose including tracking. RFID interrogators are used to retrieve information from tags. In many applications, a plurality of RFID interrogators are required. Synchronization between interrogators in the same theatre of operation is critical to ensure that their broadcasts do not interfere with each other. In fixed RFID interrogator applications, RFID interrogators can be wired together allowing a channel to synchronize the transmissions of the RFID interrogators. Methods described herein can ensure that synchronization is maintained in the event of the failure of a synchronizing master. Furthermore, additional methods for synchronizing RFID interrogators in wireless applications are described allowing synchronization in the absence of wired connections between interrogators.

Abstract translation: RFID标签用于许多目的，包括跟踪。 RFID询问器用于从标签中检索信息。 在许多应用中，需要多个RFID询问器。 同一操作剧场中的询问器之间的同步至关重要，以确保他们的广播不会相互干扰。 在固定的RFID询问器应用中，RFID询问器可以连接在一起，允许信道同步RFID询问器的传输。 本文描述的方法可以确保在同步主机故障的情况下维持同步。 此外，描述了用于在无线应用中同步RFID询问器的附加方法，允许在询问器之间没有有线连接的情况下进行同步。

公开(公告)号：US20130276969A1

公开(公告)日：2013-10-24

申请号：US13919711

申请日：2013-06-17

Applicant: Unimicron Technology Corp.

Inventor： Chen-Chuan Chang

IPC: B32B38/10

CPC classification number: B32B38/10 ,  H05K3/4623 ,  H05K3/4652 ,  H05K3/4697 ,  H05K2201/0355 ,  H05K2201/09127 ,  H05K2203/107 ,  Y10T156/1052

Abstract: A manufacturing method of a circuit board comprises the following steps. Firstly, provide a first core layer, a second core material layer, and a central dielectric material layer. Secondly, press the first core layer, the second core material layer, and the central dielectric material layer to form a composite circuit structure. Thirdly, removing a portion of the central dielectric material layer located at a periphery of a pre-removing area and a portion of the second core material layer located at the periphery of the pre-removing area. Finally, remove a portion of the central dielectric material layer located within the pre-removing area and a portion of the second core material layer located within the pre-removing area to form a central dielectric layer and a second core layer.

Abstract translation: 电路板的制造方法包括以下步骤。 首先，提供第一芯层，第二芯材料层和中心电介质材料层。 其次，按压第一芯层，第二芯材料层和中心电介质材料层以形成复合电路结构。 第三，去除位于预除去区域的周边的中央电介质材料层的一部分和位于预除去区域周边的第二芯材料层的一部分。 最后，去除位于预除去区域内的中心电介质材料层的一部分和位于预去除区域内的第二芯材料层的一部分以形成中心电介质层和第二芯层。

公开(公告)号：US20130228804A1

公开(公告)日：2013-09-05

申请号：US13781095

申请日：2013-02-28

Applicant: LEDENGIN, INC.

Inventor： Xiantao YAN

IPC: H01L33/08 ,  H01L33/48 ,  H01L33/58

CPC classification number: F21V19/003 ,  F21K9/90 ,  F21V5/007 ,  F21V5/04 ,  F21V9/30 ,  F21V21/14 ,  F21V23/005 ,  F21V29/70 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/08 ,  H01L33/48 ,  H01L33/58 ,  H01L33/647 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/0278 ,  H05K1/0283 ,  H05K1/0306 ,  H05K1/144 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/0097 ,  H05K3/4626 ,  H05K3/4688 ,  H05K2201/042 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09263 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2203/0143 ,  H05K2203/171 ,  H01L2924/00

Abstract: A method for forming a flexible sheet of LED light emitters includes forming a micro lens sheet having a plurality of micro lenses, forming a phosphor sheet including a wave-length converting material, forming a flexible circuit sheet, forming a ceramic substrate sheet including a plurality of LED light emitters, and forming a support substrate including a thermally conductive material. The method also includes attaching the above sheets to form a stack including, from top to bottom, the micro lens sheet, the phosphor sheet, the flexible circuit sheet, the ceramic substrate sheet, and the support substrate.

Abstract translation: 一种用于形成LED发光体的柔性片的方法包括：形成具有多个微透镜的微透镜片，形成包括波长转换材料的荧光体片，形成柔性电路片，形成包括多个微透镜的陶瓷基片; 的LED发光体，并且形成包括导热材料的支撑基板。 该方法还包括连接上述片材以形成从顶部到底部的微透镜片，荧光片，柔性电路片，陶瓷基片和支撑基片的叠层。

公开(公告)号：US20130127488A1

公开(公告)日：2013-05-23

申请号：US13739917

申请日：2013-01-11

Applicant: Apple Inc.

Inventor： Michael Rosenblatt ,  W. Bryson Gardner, JR. ,  Amir Salehi ,  Tony Aghazarian

IPC: G01R1/04

CPC classification number: G01R1/0408 ,  G01R31/2818 ,  H05K1/0268 ,  H05K3/0052 ,  H05K3/403 ,  H05K2201/09127 ,  H05K2201/09181

Abstract: Circuit boards are provided that include a functional portion and at least one removable test point portion. The removable test point portion may include test points which are accessed to verify whether the functional portion is operating properly or whether installed electronic components are electrically coupled to the board. If multiple boards are manufactured together on a single panel (in which the individual boards are broken off), the test points can be placed on bridges (e.g., removable portions) that connect the individual boards together during manufacturing and testing. Configurable test boards are also provided that can be adjusted to accommodate circuit boards of different size and electrical testing requirements. Methods and systems for testing these circuit boards are also provided.

Abstract translation: 提供了包括功能部分和至少一个可拆卸测试点部分的电路板。 可拆卸测试点部分可以包括被访问以验证功能部分是否正常操作或者是否安装的电子部件电耦合到板的测试点。 如果在单个面板（其中单独的电路板被断开）中一起制造多个电路板，则测试点可以放置在在制造和测试期间将各个电路板连接在一起的桥接器（例如，可拆卸部分）上。 还提供了可配置的测试板，可以调整以适应不同尺寸和电气测试要求的电路板。 还提供了用于测试这些电路板的方法和系统。

公开(公告)号：US20130048360A1

公开(公告)日：2013-02-28

申请号：US13497881

申请日：2010-09-24

Applicant: Stijn Vandebril

Inventor： Stijn Vandebril

IPC: B23K1/20 ,  H05K1/11

CPC classification number: H05K3/3436 ,  H01L2224/16225 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K1/0203 ,  H05K1/111 ,  H05K1/112 ,  H05K3/284 ,  H05K3/3494 ,  H05K2201/09063 ,  H05K2201/09127 ,  H05K2201/09472 ,  H05K2201/0969 ,  H05K2203/1178 ,  Y02P70/611 ,  Y02P70/613

Abstract: Method for providing a printed circuit board (16) with an electronic device (1), wherein the electronic device (1) having at least one external soldering pad (11) having a predetermined size for heat dissipation is soldered with the soldering pad (11) onto a printed circuit board substrate of the printed circuit board (16) such that the electronic device (1) is electrically connected to an electrical circuit provided on the printed circuit board substrate, wherein prior to soldering, one or more through holes (12) are provided in the printed circuit board in the area where the soldering pad (12) is to be soldered to the printed circuit board (16) such that the through hole is provided for allowing flux gasses resulting during soldering of the electronic device (1) to the printed circuit board to escape.

Abstract translation: 一种用于向电子设备（1）提供印刷电路板（16）的方法，其中具有至少一个具有预定尺寸用于散热的外部焊盘（11）的电子设备（1）用焊盘（11）焊接 ）印刷到印刷电路板（16）的印刷电路板基板上，使得电子器件（1）电连接到设置在印刷电路板基板上的电路，其中在焊接之前，一个或多个通孔（12 ）设置在要焊接到印刷电路板（16）的焊盘（12）的区域中的印刷电路板中，使得通孔被设置成允许在焊接电子设备（1）期间产生的通量气体 ）到印刷电路板上逃逸。

公开(公告)号：US20130044435A1

公开(公告)日：2013-02-21

申请号：US13497890

申请日：2010-09-24

Applicant: Stijn Vandebril

Inventor： Stijn Vandebril

IPC: H05K7/06 ,  H05K7/20

CPC classification number: H05K3/3436 ,  H01L2224/16225 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K1/0203 ,  H05K1/111 ,  H05K1/112 ,  H05K3/284 ,  H05K3/3494 ,  H05K2201/09063 ,  H05K2201/09127 ,  H05K2201/09472 ,  H05K2201/0969 ,  H05K2203/1178 ,  Y02P70/611 ,  Y02P70/613

Abstract: System in package including a substrate having a first external layer including a first conductive patterned layer and being externally accessible for electrically connecting the system in package to an external electric circuit and a second internal layer including a second conductive patterned layer and being covered by the first layer and electronic devices provided on the substrate and electrically connected to external contact pads of the first conductive patterned layer. The devices and the first and second conductive patterned layer being electrically connected to form an internal electric circuit electronically connected to the external electric circuit, the first and the second layer being adjacently positioned, the electronic devices being enclosed in an overmould compound. At least one of the devices is electrically connected to at least one hidden contact pad of the second conductive patterned layer which is accessible after removal of a removable strip of the first layer.

Abstract translation: 包括系统的包括具有包括第一导电图案化层的第一外部层并且可外部访问的衬底的衬底，用于将封装中的系统电连接到外部电路，以及包括第二导电图案层的第二内部层并且被第一 层和电子器件，其设置在基板上并电连接到第一导电图案化层的外部接触焊盘。 所述器件和第一和第二导电图案层电连接以形成电连接到外部电路的内部电路，第一和第二层相邻定位，电子器件封装在覆盖模制化合物中。 至少一个器件电连接到第二导电图案化层的至少一个隐藏的接触焊盘，该隐形接触焊盘在移除第一层的可移除带之后是可接近的。

公开(公告)号：US08362360B2

公开(公告)日：2013-01-29

申请号：US12929901

申请日：2011-02-23

Applicant: Toshiki Naito ,  Tetsuya Ohsawa ,  Kouji Kataoka

Inventor： Toshiki Naito ,  Tetsuya Ohsawa ,  Kouji Kataoka

IPC: H05K1/00

CPC classification number: H05K1/0269 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/225 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/0969 ,  H05K2201/09781 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/53022 ,  Y10T29/53026 ,  Y10T29/5303 ,  Y10T29/53035 ,  Y10T29/53039 ,  Y10T29/53043

Abstract: A wired circuit board assembly sheet has a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks. Each of the distinguishing marks has an indication portion for indicating a specified one of the wired circuit boards.