公开(公告)号：US06712261B2

公开(公告)日：2004-03-30

申请号：US10102129

申请日：2002-03-20

Applicant: Richard R. Hall ,  How T. Lin ,  Christopher J. Majka ,  Matthew F. Seward ,  Ronald V. Smith

Inventor： Richard R. Hall ,  How T. Lin ,  Christopher J. Majka ,  Matthew F. Seward ,  Ronald V. Smith

IPC: B23K3102

CPC classification number: H01L21/486 ,  B23K1/20 ,  H05K3/4046 ,  H05K2201/10234 ,  H05K2201/10287

Abstract: An arrangement and method for the insertion the leading end of a length of a metallic element into a through hole which is formed in a substrate, and for heat deforming the inserted leading portion of the metallic element into a predetermined configuration prior to severing therefrom the remaining length of the metallic element.

Abstract translation: 一种用于将金属元件的长度的前端插入到形成在基板中的通孔中并且用于在将金属元件的插入的前导部分从其中切断之前将插入的前导部分变形为预定构造的布置和方法 金属元件的长度。

公开(公告)号：US06630631B1

公开(公告)日：2003-10-07

申请号：US10108219

申请日：2002-03-27

Applicant: Terrance J. Dishongh ,  Carolyn R. McCormick

Inventor： Terrance J. Dishongh ,  Carolyn R. McCormick

IPC: H05K111

CPC classification number: H05K1/113 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K3/0094 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/429 ,  H05K2201/09545 ,  H05K2201/0959 ,  H05K2201/10234 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A first signal routing layer may be formed on a first surface of a printed circuit board (PCB). An array of interconnections may formed on the first surface of the PCB, the array of interconnections comprising at least one padless via formed within the PCB, the at least one padless via extending from the first signal routing layer to at least one conductive plane and/or a second signal routing layer. The at least one padless via may be in electrical contact with the at least one conductive plane and/or a conductive trace on the second signal routing layer. A component may be attached to the PCB, with a solder interconnection between the at least one padless via and a contact pad on a bottom surface of the component. The component may be, for example, an electronic component such as a ball grid array (BGA) component or a leadless surface mount component.

Abstract translation: 第一信号布线层可以形成在印刷电路板（PCB）的第一表面上。 互连阵列可以形成在PCB的第一表面上，互连阵列包括形成在PCB内的至少一个无衬垫通孔，从第一信号布线层延伸到至少一个导电平面的至少一个无衬垫通孔和/ 或第二信号路由层。 所述至少一个无衬垫通孔可以与所述至少一个导电平面和/或所述第二信号布线层上的导电迹线电接触。 组件可以附接到PCB，其中焊料互连在该至少一个无衬垫通孔和该部件的底部表面上的接触焊盘之间。 组件可以是例如电子部件，例如球栅阵列（BGA）部件或无引线表面安装部件。

公开(公告)号：US20030178471A1

公开(公告)日：2003-09-25

申请号：US10102129

申请日：2002-03-20

Applicant: International Business Machines Corporation

Inventor： Richard R. Hall ,  How T. Lin ,  Christopher J. Majka ,  Matthew F. Seward ,  Ronald V. Smith

IPC: B23K001/20 ,  B23K020/14 ,  B23K035/12

CPC classification number: H01L21/486 ,  B23K1/20 ,  H05K3/4046 ,  H05K2201/10234 ,  H05K2201/10287

Abstract: An arrangement and method for the insertion the leading end of a length of a metallic element into a through hole which is formed in a substrate, and for heat deforming the inserted leading portion of the metallic element into a predetermined configuration prior to severing therefrom the remaining length of the metallic element.

Abstract translation: 一种用于将金属元件的长度的前端插入到形成在基板中的通孔中并且用于在将金属元件的插入的前导部分从其中切断之前将插入的前导部分变形为预定构造的布置和方法 金属元件的长度。

公开(公告)号：US20030155652A1

公开(公告)日：2003-08-21

申请号：US10302254

申请日：2002-11-22

Inventor： Kensho Murata ,  Mutsumi Masumoto ,  Kenji Masumoto

IPC: H01L023/48

CPC classification number: H01L21/56 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/0508 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/11334 ,  H01L2224/131 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/10234 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2224/13099

Abstract: Improve the productivity and cost for the manufacturing of a semiconductor device referred to as a wafer level CSP. The manufacturing method for a semiconductor device related to this invention contains each of the processes that form a wiring (18) for the purpose of electrically connecting each electrode pad (10a) and external connecting terminals on top of a wafer (10) on which semiconductor elements are formed, connect conductive balls that are preformed by a separate process on top of this, and next, cover the above-mentioned wafer with a resin (32) such that the upper portion of the conductive supporting posts (30) are exposed. In a later process, solder balls (34) are arranged as external connecting terminals on the upper portion of the conductive supporting posts, and in the final process, semiconductor elements are formed by dicing the above-mentioned wafer along the boundary lines of the above-mentioned semiconductor elements.

公开(公告)号：US20030151902A1

公开(公告)日：2003-08-14

申请号：US10329557

申请日：2002-12-27

Applicant: Achilles Corporation

Inventor： Teruyoshi Kageyama ,  Shinya Okino ,  Mamoru Ito

IPC: H05K001/00

CPC classification number: G11B5/4853 ,  G11B5/40 ,  H05K1/0259 ,  H05K1/0393 ,  H05K1/056 ,  H05K3/28 ,  H05K3/328 ,  H05K2201/0329 ,  H05K2201/10234 ,  H05K2203/0285

Abstract: A flexible printed circuit board of the present invention directly relays connecting portions of a magnetic head placed on a suspension to connecting portions of a base end of a carriage arm in a head suspension assembly of a magnetic disk apparatus. The flexible printed circuit board includes a laminate composed of at least a base layer, a plurality of conductive circuits formed on the base layer, a cover layer covering the conductive circuits, and a conductive polymer layer formed in the insulating material portion in the surface of the laminate. The flexible printed circuit board includes a stainless layer below the base layer or on a lower side of the conductive polymer layer on the base layer side. More preferably, in the magnetic head connecting portion, the cover layer is not formed, and on the base layer in the magnetic head connecting portion, a conductive polymer layer is formed, whereas on the plurality of conductive circuits in the magnetic head connecting portion, the conductive polymer layer is not present or is substantially absent, if any, to such a degree as to allow the magnetic head to be electrically connected to the conductive circuits.

Abstract translation: 本发明的柔性印刷电路板将放置在悬架上的磁头的连接部分直接中继到磁盘装置的磁头悬挂组件中的托架臂的基端的连接部分。 柔性印刷电路板包括由至少基底层，形成在基底层上的多个导电电路，覆盖导电电路的覆盖层和形成在绝缘材料部分中的导电聚合物层组成的叠层体 层压板。 柔性印刷电路板包括在基底层下方的不锈钢层或基底层侧上的导电聚合物层的下侧。 更优选地，在磁头连接部分中，没有形成覆盖层，并且在磁头连接部分的基底层上形成导电聚合物层，而在磁头连接部分的多个导电电路上， 导电聚合物层不存在或基本上不存在（如果有的话）到允许磁头电连接到导电电路的程度。

公开(公告)号：US06573609B2

公开(公告)日：2003-06-03

申请号：US09771412

申请日：2001-01-26

Applicant: Joseph Fjelstad ,  John Myers

Inventor： Joseph Fjelstad ,  John Myers

IPC: H01L2940

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/48 ,  H01L2224/05624 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/284 ,  H05K3/4084 ,  H05K2201/049 ,  H05K2201/10234 ,  H05K2201/10378 ,  H05K2201/10977 ,  H05K2203/041 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A connection component is provided. The connection component includes (1) a first interposer having a first surface to which a microelectronic may be mounted and a second surface opposite from the first surface, (2) a second interposer that is more flexible than the first interposer and that is disposed under the second surface of the rigid interposer, and (3) a plurality of conductive parts that may be positioned in the first and second interposers and that may be exposed at the first surface of the first interposer, a bottom surface of the second interposer, or both the first and bottom surfaces. The electrically conductive parts may include leads. A socket assembly or a microelectronic element such as semiconductor chip may be mounted onto the first surface of the rigid interposer. The connection component may be mounted onto a support substrate.

Abstract translation: 提供连接组件。 连接部件包括：（1）具有可安装微电子的第一表面的第一插入件和与第一表面相对的第二表面;（2）比第一插入件更柔性的第二插入件， 刚性插入件的第二表面，以及（3）可以位于第一和第二插入件中并且可以暴露在第一插入件的第一表面处的多个导电部件，第二插入件的底表面或 第一和第二表面。 导电部件可以包括引线。 插座组件或诸如半导体芯片的微电子元件可以安装在刚性插入件的第一表面上。 连接部件可以安装在支撑基板上。

公开(公告)号：US20030008434A1

公开(公告)日：2003-01-09

申请号：US10234880

申请日：2002-09-04

Inventor： Steven O. Dunford

IPC: H01L021/44 ,  H01L021/60

CPC classification number: H05K3/3442 ,  H05K2201/094 ,  H05K2201/10234 ,  H05K2201/10727 ,  H05K2201/10992 ,  H05K2201/2036 ,  H05K2203/041 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/49146

Abstract: A device and method for insuring the separation between a leadless chip carrier and printed wiring board, comprising aligning and attaching conductive pedestals to contact pads of either member and embedding the pedestals into the solder columns which are used to provide electrical connection. The conductive pedestals are comprised of an electrically conducting metal, solder, alloy or composite which will also provide thermal dissipation in selected designs.

公开(公告)号：US20020157248A1

公开(公告)日：2002-10-31

申请号：US10123290

申请日：2002-04-16

Inventor： Birger Karlsson ,  Lars-Anders Olofsson ,  Christer Olsson

IPC: H05K003/00 ,  B23P019/00

CPC classification number: H05K3/4046 ,  H05K2201/0382 ,  H05K2201/10234 ,  H05K2203/0195 ,  Y10T29/49147 ,  Y10T29/49151 ,  Y10T29/49153 ,  Y10T29/49165 ,  Y10T29/5327

Abstract: The present invention relates to a copper ball insertion machine, for integrating metal inserts in via holes provided through a printed circuit board (PCB), comprising a motor driven X-Y table (2) with the PCB on top. The X-Y table (2) is adjustable to position a selected via hole in a predetermined location aligned with a closable outlet opening (12) of a movable container (6) for metal inserts. The container is by means of a clamping cylinder (28) displaceable for clamping the part of the PCB adjacent said via hole against the working surface (2) of said X-Y table. By means of a pivoting cylinder (20) the container is rotatable for feeding one metal insert through the outlet opening (12) into said via hole. A stamp (30) is drivable by a hammer cylinder (40) for compressing said metal insert to shape and deform it into a tight fit with the via hole.

Abstract translation: 铜球插入机技术领域本发明涉及一种用于将通过印刷电路板（PCB）提供的通孔中的金属插入件集成在一起的铜球插入机，包括具有PCB顶部的电动机驱动的X-Y台（2）。 X-Y工作台（2）是可调节的，以将选定的通孔定位在与用于金属插入件的可移动容器（6）的可关闭出口（12）对准的预定位置。 该容器借助于可移动的夹紧缸（28），用于将邻近所述通孔的部分PCB夹紧在所述X-Y工作台的工作表面（2）上。 通过枢转圆筒（20），容器可旋转，以将一个金属插入件通过出口开口（12）进入所述通孔。 邮票（30）可以由锤筒（40）驱动，用于压缩所述金属插入件以使其形状变形成与通孔紧密配合。

公开(公告)号：US20020145198A1

公开(公告)日：2002-10-10

申请号：US09826269

申请日：2001-04-04

Inventor： Kensho Murata ,  Mutsumi Masumoto ,  Kenji Masumoto

IPC: H01L023/48 ,  H01L023/52 ,  H01L029/40

CPC classification number: H05K3/3436 ,  H01L21/56 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05184 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/11334 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K2201/0379 ,  H05K2201/10234 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05664 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171

Abstract: Improve the productivity and cost for the manufacturing of a semiconductor device referred to as a wafer level CSP. The manufacturing method for a semiconductor device related to this invention contains each of the processes that form a wiring (18) for the purpose of electrically connecting each electrode pad (10a) and external connecting terminals on top of a wafer (10) on which semiconductor elements are formed, connect conductive balls that are preformed by a separate process on top of this, and next, cover the above-mentioned wafer with a resin (32) such that the upper portion of the conductive supporting posts (30) are exposed. In a later process, solder balls (34) are arranged as external connecting terminals on the upper portion of the conductive supporting posts, and in the final process, semiconductor elements are formed by dicing the above-mentioned wafer along the boundary lines of the above-mentioned semiconductor elements.

Abstract translation: 提高制造称为晶片级CSP的半导体器件的生产率和成本。 与本发明相关的半导体器件的制造方法包含形成布线（18）的每个工艺，其用于将每个电极焊盘（10a）和外部连接端子电连接到晶片（10）的顶部，其上半导体 形成元件，连接通过其上方分开的工艺预成型的导电球，接下来，用树脂（32）覆盖上述晶片，使得导电支撑柱（30）的上部被暴露。 在后面的处理中，焊球（34）被布置为导电支柱上部的外部连接端子，最后，通过沿着上述边界线对上述晶片进行切割而形成半导体元件 所述半导体元件。

公开(公告)号：US06444924B1

公开(公告)日：2002-09-03

申请号：US09359981

申请日：1999-07-23

Applicant: Naoto Ishida ,  Kouji Asano

Inventor： Naoto Ishida ,  Kouji Asano

IPC: H01R109

CPC classification number: H01L23/49827 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12033 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15312 ,  H01L2924/1532 ,  H05K3/308 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/09481 ,  H05K2201/10234 ,  H05K2201/10318 ,  H05K2201/10477 ,  H05K2201/10666 ,  H05K2201/10871 ,  Y02P70/613 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A printed wiring board has a circuit substrate 6 having a conductor circuit 5 and a through hole 60, and also has a joining pin 1 inserted into the through hole. The joining pin is manufactured by using a material unmelted at a heating temperature in joining the joining pin to an opposite party pad 81. The joining pin is constructed by a joining head portion 11 having a greater diameter than an opening diameter of the through hole. The joining pin forms a joining portion for joining and connection to the opposite party pad. The joining pin has a leg portion 12 having a diameter smaller than the through hole. The leg portion is inserted into the through hole and is joined to the through hole by a conductive material such as a soldering material 20, etc. In lieu of a joining pin, a joining ball approximately having a spherical shape can be joined to the through hole by the conductive material.

Abstract translation: 印刷电路板具有电路基板6，电路基板6具有导体电路5和通孔60，并且还具有插入到通孔中的接合销1。 接合销通过使用在加热温度下未熔化的材料来制造，该材料将接合销接合到相对方垫81.接合销由具有比通孔的开口直径更大的直径的接合头部11构成。 接合销形成用于接合和连接到对方垫的接合部分。 连接销具有直径比通孔小的腿部12。 腿部插入到通孔中，并且通过诸如焊接材料20等的导电材料接合到通孔。代替接合销，可以将大致具有球形的接合球接合到通孔 孔由导电材料制成。