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公开(公告)号：US4883435A
公开(公告)日：1989-11-28
申请号：US129715
申请日：1987-12-07
Applicant: Jack Seidler
Inventor： Jack Seidler
CPC classification number: H01R12/57 , H01R43/16 , H05K3/3405 , H01R43/0256 , H05K2201/10386 , H05K2201/10984 , Y10T29/49149
Abstract: A solder-bearing terminal or lead for attachment to a receptacle in a substrate or to the surface of a substrate, wherein a discrete mass of solder is mechanically held by the terminal or lead in close proximity to the substrate receptacle or surface in position to be melted for connecting the terminal to the substrate with an electrical and mechanical bond, the terminal or lead providing an unobstructed flow for the melted solder to the substrate.
Abstract translation: 用于连接到基板或基板表面中的插座的焊料轴承端子或引线，其中离散质量的焊料被端子或引线机械地保持在靠近基板插座或表面的位置，以使其位于 熔化，用于通过电和机械结合将端子连接到基板，端子或引线为熔化的焊料提供无阻碍的流向基板。
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公开(公告)号：US4780098A
公开(公告)日：1988-10-25
申请号：US87084
申请日：1987-08-19
Applicant: Jack Seidler
Inventor： Jack Seidler
CPC classification number: H01R12/57 , H01R4/02 , H01R43/16 , H05K3/3405 , H01R2107/00 , H01R24/60 , H01R43/02 , H05K2201/10386 , H05K2201/10424 , H05K2201/10984 , H05K2203/162 , Y10S439/933
Abstract: A conductive lead for connection to a first conductive area of a device having two opposed surfaces with a conductive area comprises an elongated conductive body formed from a substantially flat strip of a resilient material. The conductive body has a pair of opposite arms adapted to engage the opposed device surfaces resiliently. A non-conductive element is held by one arm and is adapted to engage the other surface of the device to insulate the lead from the other surface. The conductive area of the other surface is insulated by the lead and the non-conductive element from the conductive area of the first surface.
Abstract translation: 用于连接到具有导电区域的具有两个相对表面的器件的第一导电区域的导电引线包括由基本上平坦的弹性材料带形成的细长导电体。 导电体具有一对相对的臂，适于弹性地与相对的装置表面接合。 非导电元件由一个臂保持并且适于接合该装置的另一个表面以将该导线与另一个表面绝缘。 另一个表面的导电区域被引线和非导电元件从第一表面的导电区域绝缘。
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公开(公告)号：US4752244A
公开(公告)日：1988-06-21
申请号：US66280
申请日：1987-06-25
Applicant: Virgil F. Kuhl , Lamar Q. Williams , Kenneth M. Wasko , William B. Mullen, III
Inventor： Virgil F. Kuhl , Lamar Q. Williams , Kenneth M. Wasko , William B. Mullen, III
CPC classification number: H01R12/82 , H05K3/3405 , H05K2201/10386
Abstract: An electrical interconnect pin, particularly suitable for attachment to the edge of a flexible printed circuit board or "flex circuit", has an edge clip with an opening that can be temporarily enlarged to facilitate the attachment of the pin to the edge of a circuit board. The pin includes an elongated shank with a rectangular cross section and two substantially identical clips attached to opposite sides of the shank. To attach the pin to a printed circuit board, the pin is placed on a flat surface with the shank parallel to the surface. A force is then applied to the shank just below the clips and perpendicular to the surface. This force opens up the edge clip and the edge of the printed circuit board is then inserted into the opening of the edge clip. After the force is removed, the edge clip clamps down on the circuit board, temporarily attaching the pin to the board. The pins can then be permanently affixed to the board by soldering.
Abstract translation: 特别适合于连接到柔性印刷电路板或“柔性电路”的边缘的电互连针具有带有开口的边缘夹，该开口可被暂时扩大，以便于将销连接到电路板的边缘 。 销包括具有矩形横截面的细长柄和附接到柄的相对侧的两个基本相同的夹。 为了将引脚连接到印刷电路板，引脚被放置在平坦的表面上，柄与平面平行。 然后将力施加到夹子正下方并垂直于表面的柄。 该力打开边缘夹，然后将印刷电路板的边缘插入边缘夹的开口中。 在力被去除之后，边缘夹子夹紧在电路板上，暂时将销钉连接到电路板上。 然后可以通过焊接将引脚永久固定在电路板上。
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公开(公告)号：US4738627A
公开(公告)日：1988-04-19
申请号：US26742
申请日：1987-03-17
Applicant: Jack Seidler
Inventor： Jack Seidler
CPC classification number: H01R12/57 , H05K3/3405 , H01R13/112 , H01R4/02 , H01R43/16 , H05K2201/10386 , H05K2201/10984
Abstract: An edge clip for attachment to a contact pad on a substrate includes a pair of spaced-apart spring fingers, adapted to receive the edge of the substrate therebetween. One or both of the fingers may at least partially encircle and support a mass of solder. The fingers are joined to the body portion with a folded connecting portion integral with the body between its ends, and one or more folded end portions, aligned with the connecting portion, can be supported from carrier rails at one or both ends during manufacture.
Abstract translation: 用于连接到衬底上的接触焊盘的边缘夹具包括一对间隔开的弹簧指，适于在其间容纳衬底的边缘。 手指中的一个或两个可以至少部分地环绕并支撑大量焊料。 指状物在本体部分处与折叠的连接部分连接，该连接部分在其端部与主体成一体，并且在制造过程中一个或两个端部处的一个或多个与连接部分对准的折叠端部可以从承载轨道支撑。
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公开(公告)号：US4718863A
公开(公告)日：1988-01-12
申请号：US859105
申请日：1986-05-02
Applicant: Amir-Akbar Sadigh-Behzadi
Inventor： Amir-Akbar Sadigh-Behzadi
CPC classification number: H01R12/62 , H05K3/3405 , H01R12/721 , H05K1/118 , H05K2201/10356 , H05K2201/10386
Abstract: A flat multiconductor jumper cable comprises a plurality of elongate substantially parallel and transversely spaced conductors surrounded by a casing of insulation. At one or both ends of the jumper cable, exposed portions of the conductors are formed in a curved clipped portion for solder connection to an integrated circuit substrate. The conductors are preferably formed of a soft non-resilient material such as copper and the clip portion is provided to have a substantially circular cross-section. The clip portion, formed in a generally U-shaped configuration defines a pocket for receipt therein of the edge of a substrate having conductive pads on opposing surfaces. Upon soldering the clip portion to the conductive pads, solder fillets are formed in such a manner as to provide an enhanced electrical and mechanical joint.
Abstract translation: 扁平多导体跳线电缆包括多个细长的基本上平行且横向间隔开的导体，其被绝缘套管包围。 在跳线电缆的一端或两端，导体的暴露部分形成为弯曲限制部分，用于与集成电路基板焊接。 导体优选地由诸如铜的柔软非弹性材料形成，并且夹持部分设置成具有基本上圆形的横截面。 形成为大致U形构造的夹持部分限定了用于在其中接纳具有相对表面上的导电焊盘的衬底的边缘的凹穴。 在将夹子部分焊接到导电焊盘上时，焊接圆角以提供增强的电气和机械接头的方式形成。
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Patent Agency Ranking
公开(公告)号：US4688149A
公开(公告)日：1987-08-18
申请号：US912688
申请日：1986-09-26
Applicant: Nori Inoue , Yasuharu Moriai , Atushi Sakatani , Noriyuki Yoshida
Inventor： Nori Inoue , Yasuharu Moriai , Atushi Sakatani , Noriyuki Yoshida
CPC classification number: H05K3/4084 , H05K3/368 , H05K5/03 , H05K7/02 , H05K2201/0397 , H05K2201/10272 , H05K2201/10386 , H05K2201/10946 , H05K3/202 , H05K3/4092
Abstract: An electrical junction system for automotive internal wiring has a wiring board provided with branching conductors formed by a multiplicity of bus bars on an insulation plate, the branching conductors being adapted to be connected to electric wires in a wiring harness to form branching electric circuits. The electrical junction system has a printed circuit board detachably mounted on the wiring board, the printed circuit board generally or inclusively carrying a plurality of circuits incorporating a multiplicity of function parts which are used semi-permanently such as relays and associated control elements.
Abstract translation: 用于汽车内部布线的电连接系统具有布线板，其布置有由绝缘板上的多个母线形成的分支导体，该分支导体适于连接到线束中的电线以形成分支电路。 电连接系统具有可拆卸地安装在布线板上的印刷电路板，印刷电路板通常或包含多个电路的多个电路，多个电路结合了多个功能部件，这些功能部件是半永久性的，例如继电器和相关的控制元件。
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127.发明授权Method of soldering pins to printed circuit boards, and soldering bath for this method 失效将引脚焊接到印刷电路板的方法以及该方法的焊接浴
公开(公告)号：US4410127A
公开(公告)日：1983-10-18
申请号：US236359
申请日：1981-02-20
Applicant: Manfred Bodewig
Inventor： Manfred Bodewig
CPC classification number: H05K3/3405 , B23K3/0653 , B23K2201/42 , H01R43/02 , H05K2201/10386 , H05K2201/10924 , H05K3/0097 , H05K3/3468
Abstract: A method of soldering connection pins on carrier strips to printed circuit boards, notably to thick-film modules. Prior to soldering in a soldering bath, a printed circuit board is detachably connected to the connection pins. An endless carrier strip with the connection pins and printed circuit boards in the upright position is horizontally fed through liquid solder which flows off the components to be soldered at the surface. Solder which does not wet or connect the components flows away at the end of the predetermined soldering path, preferably in the transport direction of the parts, to a level below that of the carrier strip.
Abstract translation: 将载体条上的连接销焊接到印刷电路板，特别是厚膜模块的方法。 在焊接槽中焊接之前，印刷电路板可拆卸地连接到连接销。 具有直立位置的连接销和印刷电路板的环形载带被水平地馈送通过液体焊料，该液体焊料从表面上被焊接的部件流出。 未润湿或连接组件的焊料在预定焊接路径的端部优选在部件的输送方向上流动到低于载体条的水平。
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公开(公告)号：US4367910A
公开(公告)日：1983-01-11
申请号：US230907
申请日：1981-02-02
Applicant: Jack Seidler
Inventor： Jack Seidler
CPC classification number: H01R12/57 , H05K3/3405 , H01R13/112 , H01R4/02 , H01R43/16 , H05K2201/10386 , H05K2201/10984
Abstract: A mini-terminal clip for attachment to a circuit bearing chip wherein the clip is made from strip stock of normal gage by folding the body along a line or lines parallel to the body's length, the free end of the body beyond the fold or folds being slit to form two or three fingers of the same or different lengths, and the fingers then being bent as required to provide a gap adapted to receive the edge of the circuit bearing chip. The gap may face laterally, at a 90.degree. angle to the plane of the terminal body, or may be parallel to said plane, and one or more of the fingers may be provided with solder masses.
Abstract translation: 用于连接到电路轴承芯片的微型端子夹，其中夹子通过沿着与身体长度平行的线或线折叠身体而使正常量具的条状原料制成，身体的自由端超过折叠或折叠 缝合以形成相同或不同长度的两个或三个手指，然后手指根据需要弯曲以提供适于接收电路承载芯片的边缘的间隙。 间隙可以横向地与端子体的平面成90度角，或者可以平行于所述平面，并且一个或多个指状物可以设置有焊料块。
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129.发明授权Edge clip terminal for mounting thick film hybrid circuits in printed circuit boards 失效用于在印刷电路板中安装厚膜混合电路的边缘夹子端子
公开(公告)号：US4257668A
公开(公告)日：1981-03-24
申请号：US417
申请日：1979-01-02
Applicant: Paul R. Ellis, Jr.
Inventor： Paul R. Ellis, Jr.
CPC classification number: H05K3/3447 , H01R12/718 , H01R4/028 , H05K3/366 , H05K1/0306 , H05K2201/10386 , H05K2201/10848 , H05K2201/10871 , H05K2201/2036 , H05K2203/308 , H05K3/306 , H05K3/3468
Abstract: An improved edge clip terminal having a first diamond-shaped transition region connecting a plurality of tines, that clip over the edge of a substrate, to a first lead section and having a second diamond-shaped transition region connecting the first lead section to a second lead section. In an assembly, the second lead sections of a plurality of terminals are located in holes in a PC board with the second transition regions resting on the surface of the circuit board. The first lead sections are more narrow than the transition regions and of lengths that are sufficient for preventing solder wicking up them and into the areas of the tines during wave soldering of a circuit board so that a leaded substrate soldered into the circuit board may be tilted without damaging it. In an alternate embodiment of this invention, the lead portion of an edge clip terminal on a substrate has a pair of spaced apart transition regions in it. A first transition region and first length of lead space tines away from a second transition region in a hole in a circuit board for preventing solder wicking up the lead and tines during wave soldering so that the leaded substrate may be tilted without damaging it.
Abstract translation: 一种改进的边缘夹子端子，其具有连接多个尖端的第一菱形过渡区域，该多个尖端夹在衬底的边缘上，到第一引线部分，并且具有将第一引线部分连接到第二引线部分的第二菱形过渡区域 导线部分。 在组件中，多个端子的第二引线部分位于PC板中的孔中，其中第二过渡区域搁置在电路板的表面上。 第一引线部分比过渡区域和长度足够窄，足以防止焊料在电路板的波峰焊接过程中漏起并进入尖端区域，使得焊接到电路板中的引线基板可能倾斜 而不损坏它。 在本发明的替代实施例中，衬底上边缘夹子端子的引线部分在其中具有一对间隔开的过渡区域。 第一过渡区域和引线空间的第一长度离开电路板上的孔中的第二过渡区域，以防止在波峰焊接过程中焊锡引起铅尖和尖峰，使得引线基板可以倾斜而不损坏引线。
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公开(公告)号：US4203648A
公开(公告)日：1980-05-20
申请号：US935151
申请日：1978-08-23
Applicant: Jack Seidler
Inventor： Jack Seidler
CPC classification number: H01R12/57 , H01L21/4842 , H01L23/49811 , H01R43/0256 , H05K3/3405 , H01L2924/0002 , H05K2201/10386 , H05K2201/10984
Abstract: A terminal clip for attachment to a contact pad on a substrate having one or two individual masses of solder mechanically engaged with the clip in a position to be melted for bonding the clip to one or two surfaces of the contact pad.
Abstract translation: 一种端子夹，用于附接到衬底上的接触焊盘，其具有一个或两个单独的焊料块，其与夹子机械地接合在待熔化的位置中，用于将夹子接合到接触焊盘的一个或两个表面。
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