Abstract:
In a memory module, a gap filler for eliminating an air gap may be formed on an end of a PCB where a tab may be formed. The gap filler may be formed on a surface of a socket receiving the memory module. A grease may be coated on the tab to provide a heat conduction path away from the memory module.
Abstract:
In order to simplify an electrical connection device for injection devices, to make them more reliable and to simplify their installation, it is proposed that the electrical connection device has a printed circuit board (1) with printed circuit board tracks (3) arranged thereon, and the printed circuit board tracks (3) lead from a connector area to a respective coil, whereby the coils on the printed circuit board (1) are conductively arranged, and the printed circuit board, the connector area and the coils are injection-molded with plastic as a single piece and produce a structural unit.
Abstract:
Methods of manufacturing optical transceiver modules using lead frame connectors that connect optical sub-assemblies to printed circuit boards. The lead frame connectors include a conductive lead structure that is encased in an insert injection molded plastic casing. The lead frame connector is aligned with the leads that protrude from the back end of the corresponding optical sub-assembly (OSA). The leads pass through corresponding holes in the lead frame connector and are soldered to the conductors of the lead frame assembly. Once the soldering has been performed, the combined OSA and lead frame connector becomes a surface mount device that can then be mounted to the PCB. Assembling an optical transceiver using the lead frame connectors is generally less expensive and more reliable compared to the use of conventional flexible printed circuit board connectors.
Abstract:
A low form-factor transceiver system appropriate for long-reach optical communications is presented. In accordance with the present invention, an electronic interface to a receiver optical sub assembly (ROSA) and a transmitter optical sub assembly (TOSA) is arranged on a multi-layer board to electrically isolate the transmitter and receiver portions from a high-voltage power supply, which is utilized to provide bias voltages to optical detectors in the ROSA. In some embodiments of the invention, the high-voltage power supply is arranged on a top layer while the transmitter and receiver are arranged on a bottom layer in a split-ground arrangement. Layers between the top layer and the bottom layer include at least one ground plane and provide vias for electrical connections.
Abstract:
A receiver (2) includes tuner units (1) and (3), and a circuit board (21). The tuner unit (1) includes a connector (11), a tuner board (12), and a housing (13) for accommodating them. The tuner board (12) is positioned within the limit of a height dimension L perpendicular to the direction of connection (depicted by an arrow P) of the connector (11). In addition, a recess (141B) is formed in the housing (13), in which the circuit board (21) disposed on the recess (141B) is also positioned within the limit of the height dimension L perpendicular to the direction of connection (depicted by an arrow P) of the connector (11).
Abstract:
An electric heating device as supplemental heating for motor vehicles includes as the heating elements power transistors directly mounted on the printed circuit board. For efficient removal of the dissipation heat from the power transistors the latter are in direct contact on their underside with a cooling element via openings in the printed circuit board. In order to simplify manufacture, the cooling elements are formed in two pieces: the heat conducting disk with a small thermal mass insertable into the opening of the printed circuit board, and the cooling body which can be connected to that heat-conducting element.
Abstract:
A mechanism and method are provided for assembling a printed circuit board having a first surface, a second surface and an edge. The printed circuit board may include at least one female member to receive a corresponding male member. The mechanism may include an extension board having an edge to couple to the edge of the printed circuit board. The extension board may include a male member to extend from the edge of the extension board and to couple to the at least one male member so as to couple the extension board to the printed circuit board.
Abstract:
A wireless transceiver for a keyless entry system of an automotive vehicle includes: a circuit board having a circuit part disposed thereon; and a resin mold for molding the circuit board. The resin mold molds both of the circuit board and the circuit part, and the resin mold has a card shape. The resin mold has no connection portion of a casing so that the transceiver has high water resistance and high impact resistance.
Abstract:
An electrical connector for use in a power module includes a first end portion for forming an electrical connection with a substrate, a second end portion, and a compliant portion situated between the first end portion and the second end portion. The compliant portion includes a compressed position and a decompressed position. The first end portion is configured for forming an electrical connection with a substrate if the compliant portion is in the compressed position.
Abstract:
A printed circuit board (PCB) has a plurality of electromagnetic interference (EMI) reducing circuits, which reduce electromagnetic waves emitted from the PCB, and a plurality of switching devices, such as MOS transistors, relays and DIP switches, to enable and disable the EMI reducing circuits. The EMI reducing circuits connected between border portions of a voltage and a ground layers in the PCB include at least a capacitor. A combination of the EMI reducing circuits which gives a minimum amount of electromagnetic waves emitted from an apparatus including the PCB is selected as a suitable combination of EMI reducing circuits. An information processing apparatus having the printed circuit boards has means for selecting a combination of the EMI reducing circuits which allow the minimum EMI emitted for the apparatus.