公开(公告)号：US20150217994A1

公开(公告)日：2015-08-06

申请号：US14687835

申请日：2015-04-15

Applicant: Infineon Technologies AG

Inventor： Franz-Peter Kalz ,  Horst Theuss ,  Bernhard Winkler ,  Khalil Hosseini ,  Joachim Mahler ,  Manfred Mengel

IPC: B81B7/02 ,  G01L19/02 ,  B81B3/00 ,  G01L1/18

CPC classification number: B81B7/02 ,  B81B3/0021 ,  B81B3/0072 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81C2203/0154 ,  G01L1/18 ,  G01L9/0072 ,  G01L19/0092 ,  G01L19/02

Abstract: Micromechanical semiconductor sensing device comprises a micromechanical sensing structure being configured to yield an electrical sensing signal, and a piezoresistive sensing device provided in the micromechanical sensing structure, said piezoresistive sensing device being arranged to sense a mechanical stress disturbing the electrical sensing signal and being configured to yield an electrical disturbance signal based on the sensed mechanical stress disturbing the electrical sensing signal.

Abstract translation: 微机械半导体感测装置包括被配置为产生电感测信号的微机械感测结构和设置在微机械感测结构中的压阻感测装置，所述压阻感测装置被布置成感测扰动电感测信号的机械应力，并被配置为 基于感测到的电感测信号的机械应力产生电干扰信号。

公开(公告)号：US20150214297A1

公开(公告)日：2015-07-30

申请号：US14166880

申请日：2014-01-29

Applicant: Infineon Technologies AG

Inventor： Volker Strutz ,  Horst Theuss ,  Chee Voon Tan ,  Hui Teng Wang

IPC: H01L29/06

CPC classification number: H01L29/0649 ,  H01L24/32 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2224/45099

Abstract: An electronic array may include a first electronic component which has a first operation voltage, a second electronic component which has a second operation voltage, wherein the second operation voltage is different from the first operation voltage and wherein the first electronic component and the second electronic component are arranged over each other, an isolation layer between the first electronic component and the second electronic component, wherein the isolation layer electrically isolates the first electronic component from the second electronic component, at least one connection layer formed at least partially between the isolation layer and the first electronic component or between the isolation layer and the second electronic component, wherein the connection layer includes a first portion and a second portion, wherein the first portion and the second portion each extend from the corresponding electronic component to the isolation layer, wherein the first portion includes an electrically isolating material which fixes the isolation layer to the corresponding electronic component and wherein the second portion includes an electrically conductive material which electrically couples the corresponding electronic component to the isolation layer.

Abstract translation: 电子阵列可以包括具有第一操作电压的第一电子部件，具有第二操作电压的第二电子部件，其中第二操作电压不同于第一操作电压，并且其中第一电子部件和第二电子部件 在第一电子部件和第二电子部件之间布置有隔离层，其中隔离层将第一电子部件与第二电子部件电隔离，至少一个连接层至少部分地形成在隔离层和 所述第一电子部件或所述隔离层和所述第二电子部件之间，其中所述连接层包括第一部分和第二部分，其中所述第一部分和所述第二部分各自从相应的电子部件延伸到所述隔离层，其中， 第一部分包括a n隔离材料，其将隔离层固定到相应的电子部件，并且其中第二部分包括将相应的电子部件电耦合到隔离层的导电材料。

公开(公告)号：US09070615B2

公开(公告)日：2015-06-30

申请号：US14289512

申请日：2014-05-28

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Guenther Ruhl ,  Horst Theuss ,  Irmgard Escher-Poeppel

IPC: H01L29/06 ,  H01L29/16 ,  G01N27/12 ,  H01L23/31 ,  H01L21/56 ,  H01L23/28 ,  H01L23/29 ,  H01L23/00 ,  G01N33/00

CPC classification number: H01L29/1606 ,  G01N27/127 ,  G01N33/0059 ,  H01L21/561 ,  H01L21/568 ,  H01L23/28 ,  H01L23/293 ,  H01L23/3135 ,  H01L23/315 ,  H01L23/49562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/48 ,  H01L24/49 ,  H01L24/94 ,  H01L24/96 ,  H01L2224/02379 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24011 ,  H01L2224/24105 ,  H01L2224/24226 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/11 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A graphene layer is generated on a substrate. A plastic material is deposited on the graphene layer to at least partially cover the graphene layer. The substrate is separated into at least two substrate pieces.

Abstract translation: 在基板上产生石​​墨烯层。 在石墨烯层上沉积塑料材料以至少部分地覆盖石墨烯层。 将基板分成至少两个基片。

公开(公告)号：US20150170987A1

公开(公告)日：2015-06-18

申请号：US14132296

申请日：2013-12-18

Applicant: Infineon Technologies AG

Inventor： Thomas Mueller ,  Horst Theuss

IPC: H01L23/31 ,  H01L21/56

CPC classification number: H01L23/3114 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3157 ,  H01L2224/11 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method includes arranging multiple semiconductor chips over a first carrier and depositing a first material layer over surfaces of the multiple semiconductor chips, wherein depositing the first material layer includes a vapor deposition, and wherein the first material layer includes at least one of an organic material and a polymer.

Abstract translation: 一种方法包括在第一载体上布置多个半导体芯片并在多个半导体芯片的表面上沉积第一材料层，其中沉积第一材料层包括气相沉积，并且其中第一材料层包括有机材料 和聚合物。

公开(公告)号：US20150132614A1

公开(公告)日：2015-05-14

申请号：US14077362

申请日：2013-11-12

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Jochen Dangelmaier ,  Franz Michael Darrer ,  Thomas Müller ,  Mathias Vaupel ,  Manfred Fries ,  Günther Ruhl ,  Horst Theuss

IPC: H01M10/48

CPC classification number: H01M10/48 ,  H01M10/0525 ,  H01M10/486 ,  H04Q9/00 ,  H04Q2209/40 ,  H04Q2209/823 ,  Y02T10/7011

Abstract: A sensor arrangement according to an embodiment comprises a transmitter to be arranged inside a battery cell and to transmit a signal based on at least one sensed operational parameter of the battery cell wirelessly.

Abstract translation: 根据实施例的传感器装置包括要布置在电池单元内的发射器，并且基于无线地基于电池单元的至少一个感测的操作参数发送信号。

公开(公告)号：US20150101395A1

公开(公告)日：2015-04-16

申请号：US14052959

申请日：2013-10-14

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Alfons Dehe ,  Stefan Kolb ,  Horst Theuss

IPC: G01N29/24

CPC classification number: G01N29/2425 ,  G01N21/1702 ,  G01N29/2418 ,  G01N29/30 ,  G01N2021/1704 ,  G01N2291/021

Abstract: A photoacoustic gas sensor device for analyzing gas includes an emitter module and a pressure-sensitive module. The emitter module is arranged on a carrier substrate and emits light pulses. The pressure-sensitive module is arranged on the carrier substrate within a reference gas volume. The reference gas volume is separated from a volume intended to be filled with a gas to be analyzed. Further, the pressure-sensitive module generates a sensor signal indicating information on an acoustic wave caused by light pulses emitted by the emitter module interacting with a reference gas within the reference gas volume. Additionally, the emitter module is arranged so that light pulses emitted by the emitter module reach the reference gas volume after crossing the volume intended to be filled with the gas to be analyzed.

Abstract translation: 用于分析气体的光声气体传感器装置包括发射器模块和压敏模块。 发射器模块布置在载体衬底上并发射光脉冲。 压敏模块布置在载体基板上的参考气体体积内。 将参考气体体积与要被分析的气体填充的体积分离。 此外，压敏模块产生传感器信号，该传感器信号指示由与参考气体体积内的参考气体相互作用的发射器模块发射的光脉冲引起的声波信息。 此外，发射器模块被布置成使得发射器模块发射的光脉冲在穿过要被分析的气体填充的体积之后达到参考气体体积。

公开(公告)号：US20150028436A1

公开(公告)日：2015-01-29

申请号：US14515304

申请日：2014-10-15

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Edward Fuergut ,  Horst Theuss ,  Rainer Leuschner

IPC: B81B7/00 ,  B81B3/00

CPC classification number: B81B7/0041 ,  B81B3/0021 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81C1/00253 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/181 ,  H04R19/005 ,  H04R31/006 ,  H04R2201/003 ,  H01L2924/00

Abstract: A system and a method for forming a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device includes a MEMS device having a first main surface with a first area along a first direction and a second direction, a membrane disposed on the first main surface of the MEMS device and a backplate adjacent to the membrane. The packaged MEMS device further includes an encapsulation material that encapsulates the MEMS device and that defines a back volume, the back volume having a second area along the first direction and the second direction, wherein the first area is smaller than the second area.

Abstract translation: 公开了一种用于形成封装的MEMS器件的系统和方法。 在一个实施例中，封装的MEMS器件包括具有第一主表面的MEMS器件，第一主表面具有沿着第一方向的第一区域和第二方向，设置在MEMS器件的第一主表面上的膜和邻近膜的背板。 封装的MEMS器件还包括封装MEMS器件并且限定后部体积的封装材料，后部体积具有沿第一方向和第二方向的第二区域，其中第一区域小于第二区域。

公开(公告)号：US20150004451A1

公开(公告)日：2015-01-01

申请号：US14311489

申请日：2014-06-23

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Jochen Dangelmaier ,  Manfred Fries ,  Juergen Hoegerl ,  Georg Meyer-Berg ,  Thomas Mueller ,  Guenther Ruhl ,  Horst Theuss ,  Mathias Vaupel

IPC: G01R31/36 ,  H01M10/48

CPC classification number: H01M10/48 ,  G01R31/3689 ,  H01M6/505 ,  H01M10/488

Abstract: An apparatus for determining a state of a rechargeable battery or of a battery has a sensor device and an evaluation device. The sensor device brings about an interaction between an optical signal and a part of the rechargeable battery or of the battery, which part indicates optically acquirable information about a state of the rechargeable battery or of the battery, and detects an optical signal caused by the interaction. The sensor device furthermore provides a detection signal having information about the detected optical signal. The evaluation device determines information about a state of the rechargeable battery or of the battery on the basis of the information of the detection signal. Furthermore, the evaluation device provides a state signal having the information about the determined state.

Abstract translation: 用于确定可再充电电池或电池的状态的装置具有传感器装置和评估装置。 该传感器装置引起光信号与可再充电电池或电池的一部分之间的相互作用，该部分指示关于可再充电电池或电池的状态的光学上可获取的信息，并检测由相互作用引起的光信号 。 传感器装置还提供具有关于检测到的光信号的信息的检测信号。 评估装置基于检测信号的信息来确定关于可再充电电池或电池的状态的信息。 此外，评估装置提供具有关于所确定的状态的信息的状态信号。

公开(公告)号：US20130277864A1

公开(公告)日：2013-10-24

申请号：US13920759

申请日：2013-06-18

Applicant: Infineon Technologies AG

Inventor： Horst Theuss ,  Albert Auburger ,  Jochen Dangelmaier ,  Josef Hirtreiter

IPC: H01L23/498

CPC classification number: H01L23/4985 ,  H01L21/4832 ,  H01L21/561 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49582 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T29/49224 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method for producing a component and device including a component is disclosed. A basic substrate having paper as substrate material is provided, at least one integrated circuit is applied to the basic substrate, the at least one integrated circuit applied on the basic substrate is enveloped with an encapsulant, and at least parts of the basic substrate are removed from the at least one enveloped integrated circuit.

Abstract translation: 公开了一种用于制造包括部件的部件和装置的方法。 提供了具有纸作为基底材料的基本基底，至少一个集成电路施加到基底衬底上，施加在基底衬底上的至少一个集成电路用封装材料包住，至少部分碱性衬底被去除 从所述至少一个包络集成电路。

公开(公告)号：US12228728B2

公开(公告)日：2025-02-18

申请号：US17659749

申请日：2022-04-19

Applicant: Infineon Technologies AG

Inventor： Horst Theuss ,  Klaus Elian ,  Cyrus Ghahremani

IPC: G02B26/08 ,  G02B7/182 ,  G02B26/10 ,  G02B27/14

Abstract: One example implementation of a mirror system comprises a carrier, and a first chip package arranged on a surface of the carrier and comprising a first MEMS mirror. Furthermore, the mirror system comprises a second chip package arranged on the surface of the carrier and comprising a second MEMS mirror. The mirror system furthermore comprises a reflective element arranged over the surface of the carrier and above the first chip package and the second chip package in such a way that a radiation that is incident in the mirror system and is reflected by the first MEMS mirror in the direction of the reflective element is reflected by the reflective element in the direction of the second MEMS mirror.