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    GLASS WAFER ASSEMBLY
    132.
    发明申请
    GLASS WAFER ASSEMBLY 有权
    玻璃组件

    公开(公告)号：US20150353348A1

    公开(公告)日：2015-12-10

    申请号：US14718408

    申请日：2015-05-21

    Applicant: RF Micro Devices, Inc.

    Inventor： Jan Edward Vandemeer ,  Jonathan Hale Hammond

    IPC: B81B7/00

    CPC classification number: B81B7/0006 ,  B81B2201/014 ,  B81B2207/092 ,  B81B2207/095 ,  B81B2207/096 ,  B81C1/00269 ,  B81C1/00301 ,  B81C2203/0109 ,  B81C2203/035 ,  H01L2224/48137

    Abstract: A glass wafer assembly is disclosed. In one aspect, the glass wafer assembly comprises a first glass wafer and a second glass wafer that are bonded by a conductive sealing ring. The conductive sealing ring defines a substantially hermetically sealed cavity between the first glass wafer and the second glass wafer. In another aspect, the first glass wafer and the second glass wafer each comprise a plurality of conductive through glass vias (TGVs). At least one active device is disposed in the substantially hermetically sealed cavity and can be electrically coupled to a conductive TGV in the first glass wafer and a conductive TGV in the second glass wafer to enable flexible electrical routing through the glass wafer assembly without wire bonding and over molding. As a result, it is possible to reduce footprint and height while improving radio frequency (RF) performance of the glass wafer assembly.

    Abstract translation: 公开了一种玻璃晶片组件。 在一个方面，玻璃晶片组件包括通过导电密封环结合的第一玻璃晶片和第二玻璃晶片。 导电密封环在第一玻璃晶片和第二玻璃晶片之间限定基本上气密的空腔。 在另一方面，第一玻璃晶片和第二玻璃晶片各自包括多个导电透玻璃通孔（TGV）。 至少一个有源器件设置在基本上气密密封的空腔中，并且可以电耦合到第一玻璃晶片中的导电TGV和第二玻璃晶片中的导电TGV，以使得能够通过玻璃晶片组件的柔性电路径而不引线接合， 超模塑。 结果，可以在改善玻璃晶片组件的射频（RF）性能的同时减小占地面积和高度。

    Micro Normally-Closed Structure and Method for Manufacturing the Same
    133.
    发明申请
    Micro Normally-Closed Structure and Method for Manufacturing the Same 审中-公开
    微型常闭结构及其制造方法

    公开(公告)号：US20150287556A1

    公开(公告)日：2015-10-08

    申请号：US14676089

    申请日：2015-04-01

    Applicant: National Tsing Hua University

    Inventor： Wei-Cheng LAI ,  Weileun FANG

    IPC: H01H11/00 ,  H01H50/28

    CPC classification number: B81B3/0056 ,  B81B2201/014 ,  B81C2203/032 ,  H01H1/0036 ,  Y10T29/49105

    Abstract: The present invention relates to a micro normally-closed structure, which is manufactured by a MEMS process and used as a MEMS component. The structure includes a base and a fixed contact; and a flexible arm including a first end and a movable contact, wherein the first end is electrically connecting to the base, and remaining a normally closed electrically conducting state between the movable contact and the fix end.

    Abstract translation: 本发明涉及通过MEMS工艺制造并用作MEMS部件的微常闭闭结构。 该结构包括基座和固定触点; 以及包括第一端和可动触头的柔性臂，其中所述第一端电连接到所述基座，并且在所述可动触头和所述固定端之间保持常闭导电状态。

    INFRARED SENSOR DESIGN USING AN EPOXY FILM AS AN INFRARED ABSORPTION LAYER
    134.
    发明申请
    INFRARED SENSOR DESIGN USING AN EPOXY FILM AS AN INFRARED ABSORPTION LAYER 审中-公开
    使用环氧膜作为红外吸收层的红外传感器设计

    公开(公告)号：US20150246810A1

    公开(公告)日：2015-09-03

    申请号：US14712403

    申请日：2015-05-14

    Applicant: Texas Instruments Incorporated

    Inventor： Ricky Alan JACKSON ,  Walter Baker MEINEL ,  Kalin Valeriev LAZAROV ,  Brian E. GOODLIN

    IPC: B81C1/00

    CPC classification number: B81B7/0019 ,  B81B2201/014 ,  B81C1/0038 ,  B81C1/00523 ,  B81C1/0069 ,  B81C1/00801 ,  H01L27/144

    Abstract: A MEMS IR sensor, with a cavity in a substrate underlapping an overlying layer and a temperature sensing component disposed in the overlying layer over the cavity, may be formed by forming an IR-absorbing sealing layer on the overlying layer so as to cover access holes to the cavity. The sealing layer is may include a photosensitive material, and the sealing layer may be patterned using a photolithographic process to form an IR-absorbing seal. Alternately, the sealing layer may be patterned using a mask and etch process to form the IR-absorbing seal.

    Abstract translation: 可以通过在覆盖层上形成IR吸收密封层来形成MEMS IR传感器，该MEMS红外传感器在衬底上覆盖覆盖层的空腔和设置在空腔上的上覆层中的温度感测部件，以便覆盖通路孔 到空腔。 密封层可以包括感光材料，并且可以使用光刻工艺对密封层进行图案化以形成IR吸收密封。 或者，可以使用掩模和蚀刻工艺对密封层进行图案化以形成IR吸收密封。

    Capacitive switch, apparatus for transceiving signal, and manufacturing method thereof
    135.
    发明授权
    Capacitive switch, apparatus for transceiving signal, and manufacturing method thereof 有权
    电容开关，收发信号装置及其制造方法

    公开(公告)号：US08907720B2

    公开(公告)日：2014-12-09

    申请号：US14144095

    申请日：2013-12-30

    Applicant: Huawei Device Co., Ltd.

    Inventor： Xiong Yang ,  Bocheng Cao ,  Lei Wang

    IPC: H01L25/00 ,  H01H21/18 ,  H01H11/00

    CPC classification number: B81B3/0072 ,  B81B3/001 ,  B81B2201/014 ,  B81B2201/018 ,  H01G5/16 ,  H01H59/0009

    Abstract: A capacitive switch includes: a first conductive cantilever, a second conductive cantilever, a substrate, a coplanar waveguide arranged on the substrate, the coplanar waveguide includes a first conductor configured to transmit an electrical signal, a second conductor and a third conductor are arranged as ground wires on two sides of the first conductor; an insulation medium layer is arranged on the first conductor, a conducting layer is arranged on the insulation medium layer; the first conductive cantilever is connected to the second conductor by using a first fixed end, the second conductive cantilever is connected to the third conductor by using a second fixed end; when a direct-current signal is transmitted on the capacitive switch, a first free end of the first conductive cantilever and a second free end of the second conductive cantilever contact the conducting layer.

    Abstract translation: 电容开关包括：第一导电悬臂，第二导电悬臂，衬底，布置在衬底上的共面波导，共面波导包括被配置为传输电信号的第一导体，第二导​​体和第三导体被布置为 第一导体两侧接地线; 绝缘介质层布置在第一导体上，导电层设置在绝缘介质层上; 第一导电悬臂通过使用第一固定端连接到第二导体，第二导​​电悬臂通过使用第二固定端连接到第三导体; 当在电容性开关上传输直流信号时，第一导电悬臂的第一自由端和第二导电悬臂的第二自由端接触导电层。

    Horizontal coplanar switches and methods of manufacture
    136.
    发明授权
    Horizontal coplanar switches and methods of manufacture 有权
    水平共面开关及其制造方法

    公开(公告)号：US08878315B2

    公开(公告)日：2014-11-04

    申请号：US13768235

    申请日：2013-02-15

    Applicant: International Business Machines Corporation

    Inventor： Felix P. Anderson ,  Thomas L. McDevitt ,  Anthony K. Stamper

    IPC: H01L29/84 ,  B81C1/00 ,  H01H59/00 ,  G06F17/50

    CPC classification number: H01H59/00 ,  B81B2201/014 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/00182 ,  B81C2201/0107 ,  G06F17/5068

    Abstract: A MEMS structure and methods of manufacture. The method includes forming a sacrificial metal layer at a same level as a wiring layer, in a first dielectric material. The method further includes forming a metal switch at a same level as another wiring layer, in a second dielectric material. The method further includes providing at least one vent to expose the sacrificial metal layer. The method further includes removing the sacrificial metal layer to form a planar cavity, suspending the metal switch. The method further includes capping the at least one vent to hermetically seal the planar cavity.

    Abstract translation: MEMS结构及制造方法。 该方法包括在第一电介质材料中形成与布线层相同水平的牺牲金属层。 该方法还包括在第二电介质材料中形成与另一布线层相同水平的金属开关。 该方法还包括提供至少一个通风口以暴露牺牲金属层。 该方法还包括去除牺牲金属层以形成平坦的空腔，使金属开关悬挂。 该方法还包括加盖至少一个通气口以气密地密封平面腔。

    Thermally neutral anchor configuration for an electromechanical actuator
    139.
    发明授权
    Thermally neutral anchor configuration for an electromechanical actuator 有权
    机电式致动器的热中性锚固构造

    公开(公告)号：US08680955B1

    公开(公告)日：2014-03-25

    申请号：US12710195

    申请日：2010-02-22

    Applicant: Jonathan Hale Hammond

    Inventor： Jonathan Hale Hammond

    IPC: H01H51/22

    CPC classification number: B81B7/0019 ,  B81B2201/014 ,  H01H59/0009 ,  H01H2001/0084 ,  Y10T29/49105

    Abstract: A micro-electromechanical systems (MEMS) switch having a thermally neutral anchor configuration is provided. The MEMS switch includes a substrate onto which a first conductive pad and a second conductive pad are formed. A first conductive pad anchor is coupled to the first conductive pad and a second conductive anchor spaced from the first conductive anchor is also coupled to the first conductive pad. A conductive cantilever beam has a first end portion that is situated between and coupled to the first and second conductive anchors. Moreover, the conductive cantilever beam has a second end portion that is suspended over the second conductive pad, and a middle portion between the first end portion and the second end portion. The MEMS switch also includes a conductive actuator plate formed on the substrate at a location beneath the middle portion of the conductive cantilever beam and between the first and second conductive pads.

    Abstract translation: 提供具有热中性锚定构造的微机电系统（MEMS）开关。 MEMS开关包括其上形成有第一导电焊盘和第二导电焊盘的基板。 第一导电垫锚固件耦合到第一导电焊盘，并且与第一导电锚固件间隔开的第二导电锚固体也耦合到第一导电焊盘。 导电悬臂梁具有位于第一和第二导电锚之间并且耦合到第一和第二导电锚的第一端部。 此外，导电悬臂梁具有悬挂在第二导电垫上的第二端部和在第一端部和第二端部之间的中间部分。 MEMS开关还包括在导电悬臂梁的中间部分下方以及第一和第二导电焊盘之间的位置处形成在基板上的导电致动器板。

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