公开(公告)号：US20140154425A1

公开(公告)日：2014-06-05

申请号：US14115903

申请日：2012-05-04

Applicant: Hermann Neuhaus-Steinmetz ,  Uwe Schümann ,  Arne Koops ,  Thomas Schubert ,  Olga Kirpicenok ,  Kirstin Weiland ,  Dennis Perlbach ,  Sarah Reich

Inventor： Hermann Neuhaus-Steinmetz ,  Uwe Schümann ,  Arne Koops ,  Thomas Schubert ,  Olga Kirpicenok ,  Kirstin Weiland ,  Dennis Perlbach ,  Sarah Reich

IPC: C09J5/00

CPC classification number: C09J5/00 ,  C09J5/02 ,  C09J7/10 ,  C09J133/08 ,  C09J2201/134 ,  C09J2433/00 ,  C09J2433/008

Abstract: Method for increasing the adhesive power of a pressure-sensitive adhesive layer having an upper and a lower surface, wherein at least one surface of the pressure-sensitive adhesive layer is subjected to a physical process, said physical process being selected from among the group comprising corona discharge, dielectric barrier discharge, preliminary flame treatment, or plasma treatment.

Abstract translation: 提高具有上表面和下表面的压敏粘合剂层的粘合力的方法，其中压敏粘合剂层的至少一个表面经受物理过程，所述物理过程选自： 电晕放电，电介质阻挡放电，预火焰处理或等离子体处理。

公开(公告)号：US20140127503A1

公开(公告)日：2014-05-08

申请号：US14130108

申请日：2012-05-29

Applicant: Mitsuyoshi Shirai ,  Eriko Funatsu ,  Hidetoshi Maikawa

Inventor： Mitsuyoshi Shirai ,  Eriko Funatsu ,  Hidetoshi Maikawa

IPC: C09J7/02

CPC classification number: C09J7/38 ,  C09J7/22 ,  C09J7/24 ,  C09J133/14 ,  C09J2201/134 ,  C09J2433/00 ,  C09J2433/006 ,  Y10T428/2848

Abstract: The present invention provides a multi-layered PSA article having higher interlayer adhesive strength. The multi-layered PSA article of the present invention comprises a PSA layer (A) formed from a PSA composition (a) comprising an acrylic polymer (a) as a primary component, a PSA layer (B) formed from a PSA composition (b) comprising an acrylic polymer (b) as a primary component, and an intermediate layer (C) placed between the PSA layer (A) and the PSA layer (B), wherein the PSA composition (a) and the PSA composition (b) individually further comprise a compound having per molecule two or more functional groups that are capable of reacting with active hydrogen, and the intermediate layer (C) is formed from an intermediate layer composition (c) comprising a polymer (c) obtained by polymerizing a monomer composition (c) comprising a monomer having an active hydrogen.

Abstract translation: 本发明提供具有较高层间粘合强度的多层PSA制品。 本发明的多层PSA制品包括由包含丙烯酸类聚合物（a）作为主要成分的PSA组合物（a）形成的粘合剂层（A），由粘合剂组合物（b）形成的粘合剂层（B） ）和作为主要成分的丙烯酸类聚合物（b）和位于粘合剂层（A）和粘合剂层（B）之间的中间层（C），其中，粘合剂组合物（a）和粘合剂组合物（b） 分别进一步包含具有每分子两个或更多个能够与活性氢反应的官能团的化合物，并且中间层（C）由包含通过聚合单体获得的聚合物（c）的中间层组合物（c）形成， 组合物（c）包含具有活性氢的单体。

公开(公告)号：US20140079926A1

公开(公告)日：2014-03-20

申请号：US14088237

申请日：2013-11-22

Applicant: LG CHEM, LTD.

Inventor： Jong Rok JEON ,  Se Woo YANG ,  Joon Hyung KIM ,  Yong Sung GOO ,  Suk Ky CHANG

IPC: C09J7/02

CPC classification number: C09J7/0207 ,  C09J4/00 ,  C09J7/00 ,  C09J7/10 ,  C09J7/24 ,  C09J7/38 ,  C09J133/08 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2433/00 ,  C09J2475/006 ,  Y10T428/24942

Abstract: The present application relates to a method of preparing a pressure-sensitive adhesive product and the pressure-sensitive adhesive product. According to the present application, the pressure-sensitive adhesive product having different physical properties on both surfaces, for example, having different peeling strengths on both surfaces, or having a structure in which a pressure-sensitive adhesive and a support are sequentially formed may be efficiently provided.

Abstract translation: 本申请涉及制备压敏粘合剂产品和压敏粘合剂产品的方法。 根据本申请，在两面上具有不同物理性质的粘合剂产品，例如在两个表面上具有不同的剥离强度，或具有其中压敏粘合剂和载体依次形成的结构可以是 有效提供。

公开(公告)号：US20140044957A1

公开(公告)日：2014-02-13

申请号：US14113254

申请日：2012-07-06

Applicant: Takamasa Hirayama ,  Daisuke Shimokawa

Inventor： Takamasa Hirayama ,  Daisuke Shimokawa

IPC: C09J7/02

CPC classification number: C09J7/38 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2205/11 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/68 ,  H01L23/293 ,  H01L23/3114 ,  H01L24/97 ,  H01L2924/0002 ,  Y10T428/254 ,  H01L2924/00012

Abstract: A simplified production method for a chip-shaped electronic component such as a semiconductor chip is provided.The production method of the present invention includes: attaching a pressure-sensitive adhesive sheet to a substrate, the pressure-sensitive adhesive sheet including a base, a thermally expandable pressure-sensitive adhesive layer containing thermally expandable microspheres provided on one surface of the base, and a dielectric layer including a weak pressure-sensitive adhesive layer and an adhesive layer provided on another surface of the base in this order from a side of the base, so that the thermally expandable pressure-sensitive adhesive layer is placed on a side of the substrate; attaching and fixing a plurality of chip-shaped electronic components to a surface of the pressure-sensitive adhesive sheet on a side of the adhesive layer so that electrode surfaces of the plurality of chip-shaped electronic components are placed on the side of the adhesive layer; covering an entire surface of the plurality of chip-shaped electronic components excluding fixed surfaces with a protective substance to obtain an encapsulated body including the plurality of chip-shaped electronic components; subjecting the pressure-sensitive adhesive sheet to heating treatment to cause the thermally expandable microspheres in the thermally expandable pressure-sensitive adhesive layer to expand to decrease an adhesion of the thermally expandable pressure-sensitive adhesive layer and peeling the thermally expandable pressure-sensitive adhesive layer from the substrate; peeling the weak pressure-sensitive adhesive layer from the adhesive layer to obtain a laminate of the adhesive layer and the encapsulated body; and cutting the laminate between the plurality of chip-shaped electronic components to separate individual chip-shaped electronic components.

Abstract translation: 提供了诸如半导体芯片的芯片形电子部件的简化制造方法。 本发明的制造方法包括：将压敏粘合片粘贴在基材上，所述粘合片包括基材，含有设置在基材的一个表面上的可热膨胀性微球的热膨胀性压敏粘合剂层， 以及包含弱压敏粘合剂层和介电层的介电层，该介电层从基体的一侧依次设置在基体的另一个表面上，使得可热膨胀的压敏粘合剂层位于基底的一侧 基质; 将多个芯片状电子部件附着并固定在粘合剂层一侧的粘合片的表面，使得多个芯片状电子部件的电极表面位于粘合层的一侧 ; 用保护物质覆盖除了固定表面的多个芯片形电子部件的整个表面，以获得包括多个芯片形电子部件的封装体; 对压敏粘合片进行加热处理，使热膨胀性压敏粘合剂层中的热膨胀性微球膨胀，降低热膨胀性粘合剂层的粘合性，剥离热膨胀性粘合剂层 从底物; 从粘合剂层剥离弱粘合剂层，得到粘合剂层和包封体的层压体; 并且切割多个芯片形电子部件之间的层压体以分离各个芯片形电子部件。

公开(公告)号：US20130240141A1

公开(公告)日：2013-09-19

申请号：US13418751

申请日：2012-03-13

Applicant: Kazuki SOEJIMA ,  Shinji HOSHINO ,  Takamasa HIRAYAMA ,  Kazuyuki KIUCHI

Inventor： Kazuki SOEJIMA ,  Shinji HOSHINO ,  Takamasa HIRAYAMA ,  Kazuyuki KIUCHI

IPC: C09J5/00

CPC classification number: H01L21/568 ,  C09J5/06 ,  C09J7/38 ,  C09J2201/134 ,  C09J2203/326 ,  C09J2205/11 ,  C09J2205/302 ,  C09J2483/00 ,  H01L21/6836 ,  H01L24/19 ,  H01L24/96 ,  H01L2221/68327 ,  H01L2224/24137 ,  H01L2924/181 ,  H01L2924/00

Abstract: The present invention provides a heat-resistant pressure-sensitive adhesive tape for the production of a semiconductor device, including a base material layer and a pressure-sensitive adhesive layer formed on each side of the base material layer, in which at least the pressure-sensitive adhesive layer at a side on which a semiconductor chip is to be encapsulated with a resin contains a silicone pressure-sensitive adhesive. The heat-resistant pressure-sensitive adhesive tape is used for temporarily fixing a chip in a method for producing a substrateless semiconductor package which does not use a metal lead frame.

Abstract translation: 本发明提供一种用于制造半导体器件的耐热粘合带，其包括在基材层的每一侧上形成的基材层和压敏粘合剂层，其中， 在其上用树脂封装半导体芯片的一侧的粘合剂层包含硅氧烷压敏粘合剂。 耐热粘合带用于在不使用金属引线框架的无基板半导体封装的制造方法中临时固定芯片。

公开(公告)号：US20130196142A1

公开(公告)日：2013-08-01

申请号：US13748974

申请日：2013-01-24

Applicant: NITTO DENKO CORPORATION

Inventor： Kenichi YAMAMOTO ,  Akiko TAKAHASHI

IPC: C09J7/02

CPC classification number: C09J7/38 ,  C09J7/22 ,  C09J7/385 ,  C09J2201/134 ,  C09J2201/622 ,  Y10T428/249983 ,  Y10T428/2891

Abstract: Provided is a double-faced PSA sheet comprising a first PSA layer formed of a first PSA composition comprising an acrylic polymer PA as a base polymer and a second PSA layer formed of a second PSA composition comprising an acrylic polymer PB as a base polymer provided respectively on a first face and a second face of a substrate. The weight average molecular weights MwA and MwB of the dried THF-soluble portions of the first and the second PSA compositions satisfy the next inequalities: MwA≧80×104; MwB

Abstract translation: 提供一种双面粘合片，其包括由包含作为基础聚合物的丙烯酸类聚合物PA和由分别提供的作为基础聚合物的丙烯酸类聚合物PB的第二粘合剂组合物形成的第二粘合剂层的第一粘合剂组合物形成的第一粘合剂层 在基板的第一面和第二面上。 第一和第二PSA组合物的干燥THF可溶部分的重均分子量MwA和MwB满足下列不等式：MwA> = 80×104; MwB <80×104; （MwA-MwB）≥10×104。

公开(公告)号：US08490356B2

公开(公告)日：2013-07-23

申请号：US13664045

申请日：2012-10-30

Applicant: Custom Building Products, Inc.

Inventor： Steven L. Taylor ,  Norman C. Tracy ,  Charles R. Cornman ,  John W. McMullen ,  Thomas R. Peck

IPC: E04B1/00 ,  E04C1/00

CPC classification number: E04F13/0887 ,  C09J7/38 ,  C09J2201/128 ,  C09J2201/134 ,  C09J2201/28 ,  C09J2201/36 ,  C09J2201/40 ,  E04F15/02155 ,  E04F15/02188 ,  E04F15/187

Abstract: The installation system and method for installing an architectural covering material to a substrate surface utilizes an adhesive mat having layers of adhesive and release layers arranged to allow the covering material to be initially positioned, and later repositioned to be permanently set. The adhesive mat includes a planar carrier member, one or more adhesive layers on at least one planar side of the planar carrier member, and at least one release layer of material removably covering the one or more adhesive layers. In one form, the adhesive mat includes a carrier sheet, first and second adhesive layers on opposing planar sides of the carrier sheet, and first and second release layers of material removably covering the two adhesive layers.

Abstract translation: 用于将建筑覆盖材料安装到基底表面的安装系统和方法利用具有布置成允许覆盖材料被初始定位并且随后重新定位以永久设置的粘合剂层和释放层的粘合剂垫。 粘合垫包括平面载体构件，在平面载体构件的至少一个平面侧上的一个或多个粘合剂层和至少一个可移除地覆盖该一个或多个粘合剂层的材料释放层。 在一种形式中，粘合剂垫包括载体片，载体片的相对平面侧上的第一和第二粘合剂层，以及可移除地覆盖两个粘合剂层的材料的第一和第二释放层。

公开(公告)号：US20130127038A1

公开(公告)日：2013-05-23

申请号：US13679113

申请日：2012-11-16

Applicant: Youn Jo KO ,  Jin Kyu KIM ,  Dong Seon UH ,  Kil Yong LEE ,  Jang Hyun CHO

Inventor： Youn Jo KO ,  Jin Kyu KIM ,  Dong Seon UH ,  Kil Yong LEE ,  Jang Hyun CHO

IPC: H01L23/52

CPC classification number: H01L23/52 ,  C09J7/00 ,  C09J7/10 ,  C09J9/02 ,  C09J133/04 ,  C09J2201/134 ,  C09J2201/602 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2433/00 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2908 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29411 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/32225 ,  H01L2224/83851 ,  H01L2924/07802 ,  H01L2924/00014 ,  H01L2224/29399 ,  H01L2924/00

Abstract: A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including a conductive adhesive layer and an insulating adhesive layer stacked thereon, an amount of reactive monomers in the conductive adhesive layer being higher than an amount of reactive monomers in the insulating adhesive layer.

Abstract translation: 通过各向异性导电膜结合的半导体器件，各向异性导电膜包括导电粘合剂层和层叠在其上的绝缘粘合剂层，导电粘合剂层中的反应性单体的量高于绝缘粘合剂层中的反应性单体的量 。

公开(公告)号：US20130115388A1

公开(公告)日：2013-05-09

申请号：US13523278

申请日：2012-06-14

Applicant: Huang-Chi Tseng ,  Yao-Chang Wang ,  Wei-Jieh Lee

Inventor： Huang-Chi Tseng ,  Yao-Chang Wang ,  Wei-Jieh Lee

IPC: B32B3/30 ,  C09J7/02 ,  B32B1/06

CPC classification number: H02S30/10 ,  C09J7/22 ,  C09J2201/134 ,  C09J2203/322 ,  C09J2400/243 ,  Y10T428/13 ,  Y10T428/24521

Abstract: A tape structure is disclosed which includes a body and a first adhesive layer. The body has at least one linear notch formed in a top surface thereof. The first adhesive layer is disposed on the top surface of the body. The linear notch is parallel to a long axis of the body. The body has a bottom surface opposite to the top surface, and a plurality of the linear notches are formed in the top surface and the bottom surface of the body. The tape structure may further include a second adhesive layer disposed on the bottom surface of the body.

Abstract translation: 公开了一种带状结构，其包括主体和第一粘合剂层。 主体具有形成在其顶表面中的至少一个线性凹口。 第一粘合剂层设置在主体的顶表面上。 线性切口平行于主体的长轴。 主体具有与顶面相对的底面，并且在主体的顶面和底面形成多个线状凹口。 带结构还可以包括设置在主体的底表面上的第二粘合剂层。

公开(公告)号：US20120308784A1

公开(公告)日：2012-12-06

申请号：US13209404

申请日：2011-08-14

Applicant: Albert CHEN

Inventor： Albert CHEN

IPC: C09J7/02 ,  C09J109/06 ,  C09J115/00 ,  B32B7/12 ,  B32B3/10

CPC classification number: B32B7/12 ,  B32B27/08 ,  B32B27/302 ,  B32B2274/00 ,  B32B2307/412 ,  B32B2307/75 ,  C08K5/0016 ,  C08K5/01 ,  C08K5/02 ,  C09J7/10 ,  C09J7/381 ,  C09J109/06 ,  C09J153/02 ,  C09J2201/128 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2205/102 ,  C09J2423/046 ,  C09J2453/00 ,  C09J2467/006 ,  C09J2469/006 ,  Y10T428/24802 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/2878 ,  Y10T428/2883

Abstract: A flexible adhesive pad has a tacky elastomeric back layer made of a first naphthenic oil-impregnated thermoplastic rubber, an intermediary layer made of a polymer film permanently adhered to the elastomeric back layer by a first oil-based adhesive, and a tacky elastomeric front layer made of a second naphthenic oil-impregnated thermoplastic rubber adhered to the intermediary layer by a second oil-based adhesive. The front layer is transparent and the intermediary layer may has graphics or text viewable through the front layer that indicate a device that the front layer is intended to receive, and/or where on the front layer that device is intended to be received.

Abstract translation: 柔性粘合垫具有由第一环烷油浸渍的热塑性橡胶制成的粘性弹性体后层，由聚合物膜制成的中间层，其通过第一油性粘合剂永久地粘附到弹性体背层上，并且粘性弹性体前层 由通过第二油性粘合剂粘附到中间层的第二种环烷油浸渍的热塑性橡胶制成。 前层是透明的，并且中间层可以具有通过前层可见的图形或文本，其指示前层旨在接收的设备，和/或要在该设备被接收的前面层的哪个位置。