公开(公告)号：US06720651B2

公开(公告)日：2004-04-13

申请号：US10036385

申请日：2002-01-07

Applicant: Morio Gaku ,  Nobuyuki Ikeguchi ,  Nobuyuki Yamane

Inventor： Morio Gaku ,  Nobuyuki Ikeguchi ,  Nobuyuki Yamane

IPC: H01L2310

CPC classification number: H01L23/13 ,  H01L23/3677 ,  H01L24/48 ,  H01L2224/32188 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K1/0204 ,  H05K1/056 ,  H05K3/06 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A semiconductor plastic package excellent in heat diffusibility and free of moisture absorption, is structured by fixing a semiconductor chip on one surface of a printed circuit board, connecting a semiconductor circuit conductor to a signal propagation circuit conductor formed on a printed circuit board surface in the vicinity thereof by wire bonding, at least connecting the signal propagation circuit conductor on the printed circuit board surface to a signal propagation circuit conductor formed on the other surface of the printed circuit board or a connecting conductor pad of a solder ball with a through-hole conductor, and encapsulating the semiconductor chip with a resin. The printed circuit board has a metal sheet of nearly the same size as the printed circuit board and is nearly in the center in the thickness direction of the printed circuit board. The metal sheet is insulated from front and reverse circuit conductors with a heat-resistant resin composition, and the metal sheet is provided with a clearance hole having a diameter greater than a diameter of each of at least two through holes. The through-holes are provided in the clearance hole, and a through-hole or through-holes are insulated from the metal sheet with a resin composition, with at least one through-hole being connected to the metal sheet. One surface of the metal sheet is provided with at least one protrusion portion which is of the same size as the semiconductor chip and exposed on a surface, and the semiconductor chip is fixed on the protrusion portion.

Abstract translation: 通过将半导体芯片固定在印刷电路板的一个表面上，将半导体电路导体连接到形成在印刷电路板表面上的信号传播电路导体，将散热性和吸湿性优异的半导体塑料封装 通过引线接合，至少将印刷电路板表面上的信号传播电路导体连接到形成在印刷电路板的另一个表面上的信号传播电路导体或具有通孔的焊球的连接导体焊盘 导体，并用树脂封装半导体芯片。 印刷电路板具有与印刷电路板几乎相同尺寸的金属片，并且几乎在印刷电路板的厚度方向上的中心。 该金属板与具有耐热树脂组合物的正反电路导体绝缘，并且该金属板设置有直径大于至少两个通孔中的每一个的直径的间隙孔。 通孔设置在间隙孔中，并且通孔或通孔与金属板与树脂组合物绝缘，至少一个通孔连接到金属片。 金属片的一个表面设置有与半导体芯片尺寸相同并且暴露在表面上的至少一个突起部分，并且半导体芯片固定在突出部分上。

公开(公告)号：US06653572B2

公开(公告)日：2003-11-25

申请号：US09779691

申请日：2001-02-07

Applicant: Masayuki Ishiwa ,  Kenji Iizuka ,  Takeshi Nishimura

Inventor： Masayuki Ishiwa ,  Kenji Iizuka ,  Takeshi Nishimura

IPC: H05K100

CPC classification number: H05K1/144 ,  H05K1/056 ,  H05K3/28 ,  H05K3/4641 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/2036 ,  H05K2203/167

Abstract: A multilayer circuit board formed by integrally laminating a plurality of printed wiring boards in a multilayer structure so as to provide air gaps therebetween. An insulating layer is formed on each of both surfaces of a metal core substrate having through-hole forming apertures and a printed wiring layer is formed on the each insulating layer. Metal projections integrally formed on the metal core substrate serve as bonding electrodes between the adjacent wiring boards in the multilayer structure. The width of the air gap provided between the adjacent wiring boards is determined by the height of the metal projections.

公开(公告)号：US20030174469A1

公开(公告)日：2003-09-18

申请号：US10099787

申请日：2002-03-15

Inventor： Robert C. Morelock

IPC: H05K007/20

CPC classification number: H05K1/0204 ,  H01L2924/0002 ,  H05K7/20436 ,  H05K2201/09054 ,  H05K2201/10166 ,  H01L2924/00

Abstract: An electronic assembly 10 is provided, including a substrate 12 having a first side 14, a second side 16, and at least one opening 18, and a power device 20 mounted on said first side 14, positioned over said at least one opening 18, and in thermal communication with said at least one power device 20 through the at least one opening 18.

Abstract translation: 提供电子组件10，其包括具有第一侧14，第二侧16和至少一个开口18的基板12和安装在位于所述至少一个开口18上的所述第一侧14上的动力装置20， 并且通过所述至少一个开口18与所述至少一个动力装置20热连通。

公开(公告)号：US06376908B1

公开(公告)日：2002-04-23

申请号：US09207115

申请日：1998-12-08

Applicant: Morio Gaku ,  Nobuyuki Ikeguchi ,  Nobuyuki Yamane

Inventor： Morio Gaku ,  Nobuyuki Ikeguchi ,  Nobuyuki Yamane

IPC: H01L2310

CPC classification number: H01L23/13 ,  H01L23/3677 ,  H01L24/48 ,  H01L2224/32188 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K1/0204 ,  H05K1/056 ,  H05K3/06 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A semiconductor plastic package excellent in heat diffusibility and free of moisture absorption, is structured by fixing a semiconductor chip on one surface of a printed circuit board, connecting a semiconductor circuit conductor to a signal propagation circuit conductor formed on a printed circuit board surface in the vicinity thereof by wire bonding, at least connecting the signal propagation circuit conductor on the printed circuit board surface to a signal propagation circuit conductor formed on the other surface of the printed circuit board or a connecting conductor pad of a solder ball with a through-hole conductor, and encapsulating the semiconductor chip with a resin. The printed circuit board has a metal sheet of nearly the same size as the printed circuit board and is nearly in the center in the thickness direction of the printed circuit board. The metal sheet is insulated from front and reverse circuit conductors with a heat-resistant resin composition, and the metal sheet is provided with a clearance hole having a diameter greater than a diameter of each of at least two through holes. The through-holes are provided in the clearance hole, and a through-hole or through-holes are insulated from the metal sheet with a resin composition, with at least one through-hole being connected to the metal sheet. One surface of the metal sheet is provided with at least one protrusion portion which is of the same size as the semiconductor chip and exposed on a surface, and the semiconductor chip is fixed on the protrusion portion.

Abstract translation: 通过将半导体芯片固定在印刷电路板的一个表面上，将半导体电路导体连接到形成在印刷电路板表面上的信号传播电路导体，将散热性和吸湿性优异的半导体塑料封装 通过引线接合，至少将印刷电路板表面上的信号传播电路导体连接到形成在印刷电路板的另一个表面上的信号传播电路导体或具有通孔的焊球的连接导体焊盘 导体，并用树脂封装半导体芯片。 印刷电路板具有与印刷电路板几乎相同尺寸的金属片，并且几乎在印刷电路板的厚度方向上的中心。 该金属板与具有耐热树脂组合物的正反电路导体绝缘，并且该金属板设置有直径大于至少两个通孔中的每一个的直径的间隙孔。 通孔设置在间隙孔中，并且通孔或通孔与金属板与树脂组合物绝缘，至少一个通孔连接到金属片。 金属片的一个表面设置有与半导体芯片尺寸相同并且暴露在表面上的至少一个突起部分，并且半导体芯片固定在突出部分上。

公开(公告)号：US06347038B1

公开(公告)日：2002-02-12

申请号：US09667886

申请日：2000-09-22

Applicant: Marc Duarte ,  Jean-Marc Nicolaï ,  Adrian Prajescu

Inventor： Marc Duarte ,  Jean-Marc Nicolaï ,  Adrian Prajescu

IPC: H05K720

CPC classification number: H05K7/2049 ,  H05K1/0206 ,  H05K3/0061 ,  H05K3/3447 ,  H05K2201/0209 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/10598

Abstract: The assembly has a metal sole plate forming a heat sink carrying a printed circuit card. The sole plate includes bearing surfaces which project slightly beyond the rest of the sole plate. The printed circuit is supported on these bearing surfaces and they include fixing means which interact with supplementary means of the printed circuit card to fix the printed circuit card onto the sole plate. A thermally conducting and electrically insulating material is interposed between the said card and the sole plate. The printed circuit card and the sole plate exert compression stress on the thermally conducting and electrically insulating material.

Abstract translation: 组件具有形成载有印刷电路卡的散热器的金属底板。 底板包括稍微超出底板的其余部分的轴承表面。 印刷电路支撑在这些支承表面上，它们包括与印刷电路卡的辅助装置相互作用以将印刷电路卡固定在底板上的固定装置。 导热和电绝缘材料插在所述卡和底板之间。 印刷电路卡和底板在导热和电绝缘材料上施加压缩应力。

公开(公告)号：US6097089A

公开(公告)日：2000-08-01

申请号：US237840

申请日：1999-01-27

Applicant: Morio Gaku ,  Nobuyuki Ikeguchi ,  Toshihiko Kobayashi

Inventor： Morio Gaku ,  Nobuyuki Ikeguchi ,  Toshihiko Kobayashi

IPC: H01L21/48 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H05K1/02 ,  H05K1/05 ,  H05K1/00 ,  H01L23/12 ,  H01L23/52 ,  H05K1/14

CPC classification number: H01L21/486 ,  H01L21/481 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/32 ,  H05K1/0204 ,  H05K1/0206 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/10158 ,  H01L2924/12042 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K1/056 ,  H05K2201/0355 ,  H05K2201/09054 ,  H05K2201/09827 ,  H05K2203/0369

Abstract: There is provided a semiconductor plastic package in the form in which at least one semiconductor chip is mounted on a small-sized printed wiring board, a metal plate for the above package and a method of producing a copper-clad board for the above package. More particularly, there is provided a semiconductor plastic package suitable for relatively high-watt, multi-terminal and high-density semiconductor plastic packages such as a microprocessor, a micro-controller, ASIC and graphic, and a method of producing the same.

Abstract translation: 提供了一种半导体塑料封装，其中至少一个半导体芯片安装在小型印刷线路板，用于上述封装的金属板和用于制造用于上述封装的铜包覆板的方法中。 更具体地，提供了适用于诸如微处理器，微控制器，ASIC和图形的相对高瓦特，多端子和高密度半导体塑料封装的半导体塑料封装及其制造方法。

公开(公告)号：US6094344A

公开(公告)日：2000-07-25

申请号：US433209

申请日：1999-11-04

Applicant: Tsuyoshi Nakagawa ,  Yasushi Neho ,  Naoyuki Sakamoto ,  Shigeo Ohashi ,  Yoshito Ohmura ,  Yukiko Iwama ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Susumu Iwai ,  Hitoshi Matsushima

Inventor： Tsuyoshi Nakagawa ,  Yasushi Neho ,  Naoyuki Sakamoto ,  Shigeo Ohashi ,  Yoshito Ohmura ,  Yukiko Iwama ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Susumu Iwai ,  Hitoshi Matsushima

IPC: G06F1/20 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H05K7/20

CPC classification number: G06F1/203 ,  H05K1/141 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/182 ,  H05K2201/066 ,  H05K2201/09054 ,  H05K2201/09072 ,  H05K3/368

Abstract: A personal computer including a bottomed case, a keyboard, a top cover forming with said keyboard, an upper face covering said bottomed case, and a heat dissipation structure disposed between the upper face and the bottomed case. The heat dissipation structure includes a printed circuit board having a current consuming device mounted thereon, a first heat dissipation plate disposed under the keyboard, and a first heat conductive block coupled to the first heat dissipation plate and the printed circuit board. The heat conductive block conducts heat generated by the current consuming device to the first heat dissipation plate. The heat dissipation structure further includes a second heat dissipation plate disposed on the bottomed case, and a second heat conductive block coupled to the second heat dissipation plate and the printed board, wherein the second heat conductive block conducts the heat generated by the current consuming device to the second heat dissipation plate.

Abstract translation: 一种个人计算机，包括底壳，键盘，用所述键盘形成的顶盖，覆盖所述有底壳体的上表面，以及设置在所述上​​表面和所述有底壳体之间的散热结构。 散热结构包括其上安装有电流消耗装置的印刷电路板，设置在键盘下方的第一散热板和耦合到第一散热板和印刷电路板的第一导热块。 导热块将由电流消耗装置产生的热量传导到第一散热板。 散热结构还包括设置在有底壳体上的第二散热板和耦合到第二散热板和印刷板的第二导热块，其中第二导热块传导由电流消耗装置产生的热量 到第二散热板。

公开(公告)号：US5920458A

公开(公告)日：1999-07-06

申请号：US864980

申请日：1997-05-28

Applicant: Kaveh Azar

Inventor： Kaveh Azar

IPC: H01L23/367 ,  H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K2201/064 ,  H05K2201/09054 ,  H05K2201/09581 ,  H05K2201/10689

Abstract: An arrangement for cooling a heat dissipating circuit element mounted to a first side of a printed circuit board. A heat dissipation member is mounted to the other side of the circuit board and a thermally conductive post secured to the heat dissipation member extends through an aperture through the circuit board and into thermal contact with the circuit element.

Abstract translation: 一种用于冷却安装到印刷电路板的第一侧的散热电路元件的装置。 散热构件安装到电路板的另一侧，并且固定到散热构件的导热柱延伸穿过电路板的孔并与电路元件热接触。

公开(公告)号：US5812375A

公开(公告)日：1998-09-22

申请号：US643511

申请日：1996-05-06

Applicant: Paul G. Casperson

Inventor： Paul G. Casperson

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K7/20

CPC classification number: H05K7/2049 ,  H05K1/0204 ,  H05K7/20436 ,  H05K7/205 ,  H05K1/189 ,  H05K2201/09054 ,  H05K2201/10166 ,  H05K3/4691

Abstract: An electronic assembly includes a flex-rigid circuit board having a flexible polyimide layer disposed on the upper side of a rigid substrate, conductive circuit paths formed within the substrate and on the polyimide layer, and a base for dissipating heat generated by electrical components mounted on the circuit board. The flex-rigid circuit board has a cavity therein extending from a lower electrical insulation layer through the rigid substrate to the upper polyimide layer. A heat-generating electrical component is mounted on the upper layer over the cavity in the circuit board. The base has a boss that protrudes into the cavity and contacts the upper polyimide layer such that heat from the electrical component is conducted through the upper polyimide layer and into the base. Cool electrical components requiring no heat sinking are mounted on the lower insulation layer and/or the upper polyimide layer. Thus, the electronic assembly allows for two-sided attachment of electrical components to the flex-rigid circuit board while providing selective heat sinking for only the heat-generating components.

Abstract translation: 电子组件包括柔性刚性电路板，其具有设置在刚性基板的上侧上的柔性聚酰亚胺层，形成在基板内和聚酰亚胺层上的导电电路路径，以及用于散发由安装在 电路板。 柔性电路板具有从下电绝缘层穿过刚性基底延伸到上聚酰亚胺层的空腔。 发电电气部件安装在电路板上的空腔上的上层。 底座具有突出到腔中并与上聚酰亚胺层接触的凸起，使得来自电气部件的热量通过上部聚酰亚胺层并进入基底。 不需要散热的冷电器件安装在下绝缘层和/或上聚酰亚胺层上。 因此，电子组件允许将电气部件双向连接到柔性刚性电路板，同时为仅发热部件提供选择性散热。

公开(公告)号：US5661647A

公开(公告)日：1997-08-26

申请号：US473411

申请日：1995-06-07

Applicant: Robert D. Washburn ,  Robert F. McClanahan ,  Andrew A. Shapiro ,  Ramona G. Pond ,  Gerald P. Chernicky ,  William J. Council ,  Earl H. Martin

Inventor： Robert D. Washburn ,  Robert F. McClanahan ,  Andrew A. Shapiro ,  Ramona G. Pond ,  Gerald P. Chernicky ,  William J. Council ,  Earl H. Martin

IPC: H02M3/00 ,  H03F3/19 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/16 ,  H05K1/18 ,  H05K3/40 ,  H02M1/00 ,  B32B9/00

CPC classification number: H02M3/00 ,  H03F3/19 ,  H05K1/0206 ,  H05K1/16 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/162 ,  H05K1/165 ,  H05K1/183 ,  H05K2201/0209 ,  H05K2201/09054 ,  H05K3/0061 ,  H05K3/4053 ,  Y10T428/24926

Abstract: Electronic VHF/UHF power conversion circuitry is manufactured using the benefits of low temperature co-fired ceramic substrates to provide interconnection between the discrete components of the power conversion circuit, and integrate various non-semiconductor devices into the body of the low temperature co-fired ceramic structure, such as resistors, capacitors, inductors and transformers. Use of a low temperature co-fired ceramic structure as a substrate on and within which VHF/UHF power conversion circuitry is formed allows selection of various conductive and resistive inks to precisely form interconnection circuitry and selected non-semiconductor components which improves the stability and reduces the cost of VHF/UHF power conversion circuits.

Abstract translation: 使用低温共烧陶瓷基板的优点制造电子VHF / UHF功率转换电路，以提供功率转换电路的分立组件之间的互连，并将各种非半导体器件集成到低温共烧的体内 陶瓷结构，如电阻，电容，电感和变压器。 使用低温共烧陶瓷结构作为其上形成VHF / UHF功率转换电路的基板，可以选择各种导电和电阻油墨，以精确地形成互连电路和选择的非半导体部件，从而提高稳定性和降低 VHF / UHF功率转换电路的成本。