公开(公告)号：US20170328552A1

公开(公告)日：2017-11-16

申请号：US15592645

申请日：2017-05-11

Applicant: Taiwan Green Point Enterprises Co., Ltd.

Inventor： Chia-Tai CHEN ,  Sheng-Hung YI ,  Pen-Yi LIAO

IPC: F21V29/74 ,  F21V29/89 ,  F21V23/00 ,  F21V27/02 ,  F21V23/02 ,  F21Y2115/10

CPC classification number: F21V29/745 ,  F21V23/001 ,  F21V23/02 ,  F21V27/02 ,  F21V29/74 ,  F21V29/89 ,  F21Y2115/10 ,  H05K3/366 ,  H05K2201/09027 ,  H05K2201/10106 ,  H05K2201/10287

Abstract: An illumination device includes a circuit board, a lamp seat, primary and secondary circuits, multiple conductive wires and at least one light-emitting element. The lamp seat includes a light exiting mount region. The primary circuit is disposed on the circuit board. The secondary circuit is disposed at the light exiting mount region. The conductive wires electrically connect the primary and secondary circuits. The light-emitting element is disposed at the light exiting mount region and is electrically connected to the secondary circuit. Another illumination device is also provided, which includes a circuit board, a lamp seat, primary and secondary circuits, multiple conductive wires and at least one light-emitting element.

公开(公告)号：US20170328544A1

公开(公告)日：2017-11-16

申请号：US15155187

申请日：2016-05-16

Applicant: GE Lighting Solutions, LLC

Inventor： Jacint GERGELY ,  Istvan Gyork SZILAGYI ,  Zoltan SEJPES

IPC: F21V19/00 ,  F21S4/28 ,  H05K1/18

CPC classification number: F21V19/004 ,  F21S4/28 ,  F21V15/01 ,  F21Y2101/00 ,  F21Y2103/10 ,  F21Y2113/00 ,  F21Y2115/10 ,  H05K1/181 ,  H05K2201/10106

Abstract: The specification and drawings present a new lighting/housing fixture comprising a plate/housing plate having multiple snapping clips for holding/assembling LED boards/modules in luminaires/LED light fixtures. The assembly can be made without any fasteners (such as rivets, screws, embossed fasteners, etc.), adhesives or any additional materials. This may be achieved by forming a housing plate comprising a plurality of snapping clips, made from one plate using, e.g., a sheet metal. The snapping clips are able to hold the LED boards in place, using snapped claws, as tight as conventional methods (e.g., using fasteners, rivets, etc.). In addition, the described housing fixture can simplify the assembling procedure, and reduce cost, manpower and maintenance compared to the conventional methods.

公开(公告)号：US20170328531A1

公开(公告)日：2017-11-16

申请号：US15520041

申请日：2015-09-30

Applicant: ZKW Group GmbH

Inventor： Emanuel WEBER ,  Thomas GRUBER

IPC: F21S8/10 ,  H05B33/08

CPC classification number: F21S41/192 ,  F21S41/141 ,  F21S41/143 ,  F21S41/663 ,  F21Y2105/10 ,  F21Y2105/12 ,  F21Y2115/10 ,  F21Y2115/30 ,  H05B33/0815 ,  H05B33/083 ,  H05B33/0848 ,  H05K1/111 ,  H05K2201/09227 ,  H05K2201/10106 ,  H05K2201/10522 ,  Y02P70/611

Abstract: A printed circuit board (1) with multiple electronic components (2, 2′, 2″, 2″′, 2″″) arranged on it in at least one group (G1, G2, G3), each of the electronic components (2, 2′, 2″, 2″′, 2″″) having a first and a second electrical component contact surface (3′, 3″) facing the printed circuit board (1), the component contact surfaces (3′, 3″) being connected with corresponding printed circuit board contact surfaces (6, 7, 8) arranged on the printed circuit board (1), successive electronic components (2, 2′, 2″, 2′″, 2″″) being connected in series to form a string, the string having a wave-shaped course, the electronic components (2, 2′, 2″, 2″′, 2″″) of the string being arranged on the printed circuit board (1) in the form of a matrix with at least two rows (Z1, Z2, Z3) and at least two columns (S1, . . . , S6), and the string alternately running up and down along columns (S1, . . . , S6) that are arranged next to one another.

公开(公告)号：US09816691B2

公开(公告)日：2017-11-14

申请号：US15228924

申请日：2016-08-04

Applicant: LedEngin, Inc.

Inventor： Xiantao Yan

IPC: H01L25/075 ,  H01L33/64 ,  H05K1/02 ,  H05K1/03 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  F21V19/00 ,  H01L33/08 ,  H01L33/48 ,  F21K9/90 ,  F21V5/00 ,  F21V5/04 ,  F21V23/00 ,  F21V29/70 ,  F21V9/16 ,  F21V21/14 ,  H01L33/58 ,  H05K3/46 ,  F21Y101/00 ,  F21Y105/10 ,  F21Y115/10

CPC classification number: F21V19/003 ,  F21K9/90 ,  F21V5/007 ,  F21V5/04 ,  F21V9/30 ,  F21V21/14 ,  F21V23/005 ,  F21V29/70 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/08 ,  H01L33/48 ,  H01L33/58 ,  H01L33/647 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/0278 ,  H05K1/0283 ,  H05K1/0306 ,  H05K1/144 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/0097 ,  H05K3/4626 ,  H05K3/4688 ,  H05K2201/042 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09263 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2203/0143 ,  H05K2203/171 ,  H01L2924/00

Abstract: A flexible sheet of light-emitting diode (LED) light emitters includes a support substrate having a thermally conductive material. The flexible sheet of LED light emitters also has an LED emitter sheet overlying the support substrate, and the LED emitter sheet including a plurality of LED light emitters. The flexible sheet of LED light emitters also has a flexible circuit sheet overlying the LED emitter sheet, and a phosphor sheet overlying the flexible circuit sheet. The phosphor sheet includes a wave-length converting material. The flexible sheet of LED light emitters also has a lens sheet overlying the phosphor sheet. The lens sheet includes a plurality of lenses.

公开(公告)号：US09810379B2

公开(公告)日：2017-11-07

申请号：US15229218

申请日：2016-08-05

Applicant: Cree, Inc.

Inventor： Christopher P. Hussell ,  John Adam Edmond ,  Gerald H. Negley ,  Curt Progl ,  Mark Edmond ,  Praneet Athalye ,  Charles M. Swoboda ,  Antony Paul van de Ven ,  Paul Kenneth Pickard ,  Bart P. Reier ,  James Michael Lay ,  Peter E. Lopez

IPC: F21V19/00 ,  F21K9/232 ,  F21V29/77 ,  F21V7/00 ,  F21V21/00 ,  F21V29/00 ,  F21V23/06 ,  F21V29/70 ,  F21V29/503 ,  F21K9/238 ,  H05K1/05 ,  F21Y101/00 ,  F21Y115/10 ,  F21Y107/30 ,  F21Y107/40

CPC classification number: F21K9/232 ,  F21K9/238 ,  F21V7/00 ,  F21V19/003 ,  F21V19/004 ,  F21V21/00 ,  F21V23/06 ,  F21V29/004 ,  F21V29/503 ,  F21V29/70 ,  F21V29/773 ,  F21V29/777 ,  F21Y2101/00 ,  F21Y2107/30 ,  F21Y2107/40 ,  F21Y2115/10 ,  H05K1/05 ,  H05K2201/10106 ,  Y10T29/49826

Abstract: A lamp has an optically transmissive enclosure and a base. A tower extends from the base into the enclosure and supports an LED assembly in the enclosure. The LED assembly comprises a plurality of LEDs operable to emit light when energized through an electrical path from the base. The tower and the LED assembly are arranged such that the plurality of LEDs are disposed about the periphery of the tower in a band and face outwardly toward the enclosure to create a source of the light that appears as a glowing filament. The tower forms part of a heat sink that transmits heat from the LED assembly to the ambient environment. The LED assembly has a three-dimensional shape. An electrical interconnect connects a conductor to the heat sink where the conductor is in the electrical path between the LED assembly and the base.

公开(公告)号：US20170316721A1

公开(公告)日：2017-11-02

申请号：US15632322

申请日：2017-06-24

Applicant: Shenzhen Gem Led Photoelectric Technology. Ltd

Inventor： Fuqiang HUANG

IPC: G09F9/33 ,  H05K3/30 ,  H05K3/32

CPC classification number: G09F9/33 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/32 ,  H05K2201/041 ,  H05K2201/10106 ,  H05K2201/10128

Abstract: Disclosed are an LED (Light Emitting Diode) display module and a method of fabricating the LED display module. Lamp beads in the LED display module are fixed to the surface of a linearly arranged lamp bead plate, the lamp bead plate is fixed to a driving PCB (Printed Circuit Board), the surface of the lamp bead plate is perpendicular to the surface of the driving PCB, the surface of the driving PCB is perpendicular to the surface of a glass plate, and a fixed member is fixed on a frame. The transparent glass plate with high transparency is employed as a mounting body and the driving PCB is transversely disposed on the glass plate, so that shielding of light by the driving PCB can be remarkably reduced and the transparency of the LED display module is improved.

公开(公告)号：US09803846B2

公开(公告)日：2017-10-31

申请号：US14605388

申请日：2015-01-26

Applicant: PARAGON SEMICONDUCTOR LIGHTING TECHNOLOGY CO., LTD.

Inventor： Chia-Tin Chung

IPC: F21S4/00 ,  F21V29/50 ,  H05K1/02

CPC classification number: F21V29/50 ,  H05K1/0206 ,  H05K1/0207 ,  H05K2201/09027 ,  H05K2201/10106

Abstract: A circuit substrate for carrying at least one light-emitting diode and a light-emitting structure for providing illumination are disclosed. The circuit substrate includes an insulation base layer, a conductive heat-dissipating layer, an insulation covering layer, a conductive circuit structure and a conductive through structure. The conductive heat-dissipating layer is disposed on the insulation base layer. The insulation covering layer is disposed on the conductive heat-dissipating layer. The conductive circuit structure includes a first electrode conductive layer and a second electrode conductive layer that are disposed on the insulation covering layer. The conductive through structure passes through the insulation covering layer and is connected between the conductive heat-dissipating layer and one of the first electrode conductive layer and the second electrode conductive layer. One of the first electrode conductive layer and the second electrode conductive layer is electrically connected to the conductive heat-dissipating layer through the conductive body.

公开(公告)号：US09799814B2

公开(公告)日：2017-10-24

申请号：US15170193

申请日：2016-06-01

Applicant: Roccor, LLC

Inventor： William Francis ,  Michael Hulse

IPC: H01L33/64 ,  F21V29/00 ,  H05K3/00 ,  H01L33/62

CPC classification number: H01L33/648 ,  F21V29/00 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0066 ,  H01L2933/0075 ,  H05K3/0058 ,  H05K3/0061 ,  H05K2201/10106 ,  H01L2924/00014

Abstract: Methods and systems for thermal management of one or more LEDs are disclosed. One or more LEDs may be coupled with an external layer of a thermal ground plane according to some embodiments described herein. For example, the one or more LEDs may be electrically coupled with a circuit carrier with one or more electrically conductive traces etched therein prior to coupling with the thermal ground plane. The thermal ground plane may be charged with a working fluid and/or hermetically sealed after being coupled with the LED.

公开(公告)号：US20170301878A1

公开(公告)日：2017-10-19

申请号：US15638735

申请日：2017-06-30

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Kyuhan BAE ,  Jeungsoo KIM ,  Eunju SHIN ,  Jeongseok OH

IPC: H01L51/52 ,  H05K5/00 ,  H05K1/02 ,  H01L51/00 ,  H05K7/20

CPC classification number: H01L51/529 ,  G02F1/133308 ,  G02F1/133385 ,  G02F2001/133311 ,  G02F2201/503 ,  G06F1/1637 ,  G06F1/20 ,  H01L51/0096 ,  H01L51/524 ,  H01L51/5284 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/181 ,  H05K5/0017 ,  H05K7/20963 ,  H05K2201/10106

Abstract: A display apparatus includes a display panel including a display surface that displays an image and a rear surface that faces the display surface, a cover panel attached to the rear surface of the display panel, the cover panel including a center portion and an edge portion surrounding the center portion, the center portion having a thickness greater than a thickness of the edge portion, and a reinforcing member in an overlapping relationship with the edge portion of the cover panel, the reinforcing member facing the display panel such that the cover panel is between the reinforcing member and the display panel.

公开(公告)号：US09781840B2

公开(公告)日：2017-10-03

申请号：US14938191

申请日：2015-11-11

Applicant: IBIDEN CO., LTD.

Inventor： Naoyuki Nagaya ,  Kiyotaka Tsukada

IPC: H05K1/03 ,  H05K3/34 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K3/341 ,  H05K1/0206 ,  H05K3/005 ,  H05K2201/09072 ,  H05K2201/091 ,  H05K2201/10106 ,  H05K2201/10416 ,  Y02P70/613

Abstract: A substrate for mounting an electronic component includes a base material including insulating resin, a first conductor layer formed on first surface of the material, a second conductor layer formed on second surface of the material, and a metal block inserted into a hole penetrating through the first conductor, material and second conductor such that the metal block is fitted in the hole. The material has a bent portion in contact with the metal block in the hole such that the bent portion is bending toward the second conductor, the metal block has surface on first conductor side such that the surface has an outer peripheral portion having a curved-surface shape, and the hole has a first fitting inlet on the first conductor layer side and a second fitting inlet on second conductor side and that the metal block is positioned in contact with the second fitting inlet.