公开(公告)号：US06316291B1

公开(公告)日：2001-11-13

申请号：US09293838

申请日：1999-04-19

Applicant: Patrick O. Weber

Inventor： Patrick O. Weber

IPC: H01L2148

CPC classification number: H01L21/568 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/48 ,  H01L2224/16237 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/025 ,  H05K3/4046 ,  H05K2201/09118 ,  H05K2201/10234 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2924/00012

Abstract: A semiconductor device package includes a carrier substrate molded of a non-laminate material. A plurality of conductive metal balls are molded within the non-laminate carrier substrate to provide an electrical connection between opposite sides of the substrate. The conductive metal balls provide conductive columns through the substrate for electrically connecting a chip mounted on one side of the substrate to solder balls on an opposite side of the substrate for mounting the package on a printed circuit board. The conductive columns eliminate the need for via holes which are used in known packages. The package with conductive columns provides a more compact, more precise, and lower cost package which is less susceptible to moisture damage than the known packages employing via holes.

Abstract translation: 半导体器件封装包括由非层压材料模制的载体衬底。 多层导电金属球在非层压载体衬底内模制，以在衬底的相对侧之间提供电连接。 导电金属球通过基板提供导电柱，用于将安装在基板的一侧上的芯片与衬底的相对侧上的焊球电连接，以将封装安装在印刷电路板上。 导电柱消除了对已知封装中使用的通孔的需要。 具有导电柱的封装提供了比采用通孔的已知封装更紧凑，更精确和更低成本的封装，其不易受水分损伤。

公开(公告)号：US06283358B1

公开(公告)日：2001-09-04

申请号：US09650304

申请日：2000-08-29

Applicant: Michael Ball

Inventor： Michael Ball

IPC: B23K3524

CPC classification number: B23K35/0244 ,  B23K3/0623 ,  B23K2101/40 ,  H01L24/11 ,  H01L24/13 ,  H01L24/742 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11003 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/11823 ,  H01L2224/11849 ,  H01L2224/13124 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13166 ,  H01L2224/1329 ,  H01L2224/13324 ,  H01L2224/13355 ,  H01L2224/13357 ,  H01L2224/1336 ,  H01L2224/13366 ,  H01L2224/13561 ,  H01L2224/13611 ,  H01L2224/13616 ,  H01L2224/1379 ,  H01L2224/13839 ,  H01L2224/13844 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/81024 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3478 ,  H05K2201/0215 ,  H05K2201/083 ,  H05K2201/10234 ,  H05K2203/041 ,  H05K2203/104 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A method and system for forming contacts on semiconductor components, such as wafers, dice and packages, are provided. The method employs magnets to align and hold ferromagnetic balls on bonding sites of a component substrate. The system includes a holder for holding the component substrate, and magnets on the holder aligned with bonding sites on the component. The system also includes a ball placement mechanism for placing the ferromagnetic balls on the bonding sites, and a bonding mechanism, such as an oven, or a focused energy source, for bonding the ferromagnetic balls to the bonding sites. The ferromagnetic balls can be provided as a ferromagnetic core having an outer solder layer, as a solid ferromagnetic material with a conductive adhesive outer layer, or as ferromagnetic particles embedded in a bondable matrix material. An alternate embodiment system includes a focused magnetic source for dynamically aligning the ferromagnetic balls to the bonding sites.

Abstract translation: 提供了一种用于在半导体部件上形成接触的方法和系统，例如晶片，芯片和封装。 该方法采用磁体来对准和保持组件衬底的结合位置上的铁磁性球。 该系统包括用于保持组件衬底的保持器，并且保持器上的磁体与构件上的结合位置对准。 该系统还包括用于将铁磁球放置在接合位置上的球放置机构，以及用于将铁磁球结合到接合位置的接合机构，例如烘箱或聚焦能量源。 铁磁球可以作为具有外部焊料层的铁磁芯提供，作为具有导电粘合剂外层的固体铁磁材料，或者作为嵌入可结合基质材料中的铁磁性颗粒。 替代实施例系统包括用于将铁磁球动态对准到结合位置的聚焦磁源。

公开(公告)号：US06278180B1

公开(公告)日：2001-08-21

申请号：US09066876

申请日：1998-04-28

Applicant: Kiyoshi Mizushima ,  Makoto Aoki ,  Satoshi Ikeda ,  Noriyuki Tanagi

Inventor： Kiyoshi Mizushima ,  Makoto Aoki ,  Satoshi Ikeda ,  Noriyuki Tanagi

IPC: H01L2312

CPC classification number: H01L24/81 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05022 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/3436 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/041 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A ball-grid-array-type semiconductor device comprising a package substrate constituted with a ceramic wiring board having a semiconductor chip mounting portion on the principal plane and electrodes arranged like an array on the back, a semiconductor chip secured to the principal plane of the package substrate, connection means for electrically connecting the electrodes of the semiconductor chip with the wiring of the wiring board, a sealing body provided for the principal plane side of the wiring board and made of an insulating resin to cover the semiconductor chip and the connection means, a pedestal layer made of low-fusion-point solder and formed on the electrodes, and a metallic ball secured onto the pedestal layer; wherein a buffering layer made of high-fusion-point solder which covers the entire surface of the electrodes and whose margin extends up to a predetermined length on the back of the package substrate is formed on the electrodes and the pedestal layer is formed on the buffering layer.

Abstract translation: 一种球栅阵列型半导体器件，包括：由在主平面上具有半导体芯片安装部分的陶瓷布线板和背面排列成阵列的电极构成的封装基板，固定在该主体上的主平面的半导体芯片 封装基板，用于将半导体芯片的电极与布线板的布线电连接的连接装置，设置在布线板的主平面侧并由绝缘树脂制成以覆盖半导体芯片和连接装置的密封体 由低熔点焊料制成并形成在电极上的基座层和固定在基座层上的金属球; 其特征在于，在所述电极上形成有由覆盖所述电极的整个表面并且其边缘在所述封装基板的背面延伸至预定长度的高熔点焊料制成的缓冲层，并且所述基座层形成在所述缓冲 层。

公开(公告)号：US06271111B1

公开(公告)日：2001-08-07

申请号：US09030567

申请日：1998-02-25

Applicant: Shaji Farooq ,  Suryanarayana Kaja ,  Li Wang

Inventor： Shaji Farooq ,  Suryanarayana Kaja ,  Li Wang

IPC: H01L2144

CPC classification number: H01L24/12 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/49816 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H05K3/3436 ,  H05K2201/10234 ,  Y02P70/613

Abstract: The present invention relates generally to high density pluggable connector array and process thereof. More particularly, the invention encompasses a structure comprising high density pluggable connector arrays. A process for making such types of high density pluggable connector arrays is also disclosed.

Abstract translation: 本发明一般涉及高密度可插拔连接器阵列及其工艺。 更具体地，本发明包括包括高密度可插拔连接器阵列的结构。 还公开了制造这种类型的高密度可插拔连接器阵列的方法。

公开(公告)号：US6077380A

公开(公告)日：2000-06-20

申请号：US37252

申请日：1998-03-09

Applicant: Donald J. Hayes ,  Mary W. Hartnett

Inventor： Donald J. Hayes ,  Mary W. Hartnett

IPC: B01J2/00 ,  B22F1/00 ,  B22F1/02 ,  B22F9/14 ,  B23K3/06 ,  B23K35/02 ,  C23C4/12 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/498 ,  H05K3/10 ,  H05K3/32 ,  H05K3/34 ,  H05K3/30

CPC classification number: H01L24/12 ,  B01J2/006 ,  B22F1/0048 ,  B22F1/02 ,  B22F9/14 ,  B23K3/0607 ,  B23K3/0623 ,  B23K35/0244 ,  C23C4/123 ,  H01L21/4846 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/29 ,  H01L24/83 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/3457 ,  B23K2201/40 ,  B23K35/025 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/29101 ,  H01L2224/293 ,  H01L2224/29399 ,  H01L2224/29499 ,  H01L2224/73203 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L24/81 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0781 ,  H05K2201/0218 ,  H05K2201/0379 ,  H05K2201/10234 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/013 ,  H05K2203/041 ,  H05K2203/0425 ,  H05K3/102 ,  Y02P70/613 ,  Y10T29/4913

Abstract: Solid spheres of substantially uniform size and shape and coated with a lower temperature melting material are formed for use in interconnect arrays, solder pastes, Z-axis conduction adhesives, etc. Drops of two materials are merged in flight forming a coating of the lower melting temperature material on the drop of higher melting temperature material.

Abstract translation: 形成具有基本均匀的尺寸和形状并且涂覆有较低温度熔融材料的固体球，用于互连阵列，焊膏，Z轴导电粘合剂等。两种材料的滴在飞行中合并形成较低熔化的涂层 温度较高的材料在较高熔点的材料下降。

公开(公告)号：US6043990A

公开(公告)日：2000-03-28

申请号：US871085

申请日：1997-06-09

Applicant: Morgan T. Johnson ,  David R. Ekstrom

Inventor： Morgan T. Johnson ,  David R. Ekstrom

IPC: H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  B23K31/02 ,  B23K37/04 ,  H05K1/11

CPC classification number: H05K3/368 ,  H05K3/3436 ,  H05K1/144 ,  H05K2201/09145 ,  H05K2201/0949 ,  H05K2201/10234 ,  H05K2201/10992 ,  H05K2203/0165 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/167 ,  Y02P70/613

Abstract: A multiple circuit board package employing solder balls and method and apparatus for fabricating same is described. Two or more printed circuit boards and a plurality of electronic devices are joined together using solder balls. Alternatively, three or more printed circuit boards are joined together using the solder balls. A novel and improved solder ball connection is disclosed, along with a fixture for aligning and fixing the disposition of the pads and the solder balls during a heating cycle in which the circuit boards are placed under pressure while the solder balls are re-flowed for making an electrical connection.

Abstract translation: 描述了使用焊球的多重电路板封装及其制造方法和装置。 使用焊球将两个或多个印刷电路板和多个电子装置连接在一起。 或者，使用焊球将三个或更多个印刷电路板连接在一起。 公开了一种新颖且改进的焊球连接，以及用于在加热循环期间对准和固定焊盘和焊球的布置的固定装置，其中电路板被放置在压力下，同时焊球被重新流动以制造 电气连接。

公开(公告)号：US5950072A

公开(公告)日：1999-09-07

申请号：US900674

申请日：1997-07-25

Applicant: Daniel G. Queyssac

Inventor： Daniel G. Queyssac

IPC: H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H05K3/32 ,  H05K3/34 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L23/49816 ,  H01L23/3107 ,  H01L23/3675 ,  H05K3/325 ,  H05K3/3436 ,  H01L2224/48091 ,  H05K2201/0129 ,  H05K2201/10234 ,  H05K2201/10992 ,  H05K3/321 ,  Y02P70/613

Abstract: An integrated circuit package had leadless solderballs attached to the substrate with a conductive thermoplastic adhesive. The leadless solderballs are preferably made with a copper-nickel-gold alloy. The conductive thermoplastic is preferably of the silver fill type. The integrated circuit package is placed in a frame and held to the printed circuit board with a clamp or with a screw.

Abstract translation: 集成电路封装具有导电热塑性粘合剂将无引线焊球附着到基板上。 无引线焊球优选由铜 - 镍 - 金合金制成。 导电性热塑性材料优选为银填充型。 集成电路封装放置在框架中，并用夹具或螺丝固定在印刷电路板上。

公开(公告)号：US5849609A

公开(公告)日：1998-12-15

申请号：US579691

申请日：1995-12-28

Applicant: Heung Sup Chun

Inventor： Heung Sup Chun

IPC: H01L21/60 ,  H01L23/12 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H01L23/498 ,  H05K3/34 ,  H01L21/44

CPC classification number: H01L23/3128 ,  H01L23/4951 ,  H01L23/49827 ,  H05K3/3436 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K2201/10234 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K3/3431 ,  Y02P70/613

Abstract: An improved semiconductor package includes an insulating film carrying conductive balls disposed between a substrate and a printed circuit board. The conductive balls mounted in the insulating film are precisely connected to lower surfaces of conductive patterns formed at the substrate and pads of the printed circuit board. A method for mounting the improved semiconductor package on the printed circuit board includes aligning a package having a plurality of exposed electrical connect terminals with upper surfaces of a plurality of conductive balls formed in an insulating film, aligning lower surfaces of the conductive balls with a plurality of pads formed on the printed circuit board, and electrically connecting the exposed electrical connect terminals, the ends of the conductive balls and the pads of the printed circuit board by a reflow process.

Abstract translation: 改进的半导体封装包括承载设置在基板和印刷电路板之间的导电球的绝缘膜。 安装在绝缘膜中的导电球精确地连接到形成在印刷电路板的基板和焊盘处的导电图案的下表面。 将改进的半导体封装安装在印刷电路板上的方法包括将具有多个暴露的电连接端子的封装与形成在绝缘膜中的多个导电球的上表面对准，将导电球的下表面与多个 形成在印刷电路板上的焊盘，并且通过回流工艺将暴露的电连接端子，导电球的端部和印刷电路板的焊盘电连接。

公开(公告)号：US5675889A

公开(公告)日：1997-10-14

申请号：US474343

申请日：1995-06-07

Applicant: John Acocella ,  Donald Ray Banks ,  Joseph Angelo Benenati ,  Thomas Caulfield ,  John Saunders Corbin, Jr. ,  Karl Grant Hoebener ,  David P. Watson

Inventor： John Acocella ,  Donald Ray Banks ,  Joseph Angelo Benenati ,  Thomas Caulfield ,  John Saunders Corbin, Jr. ,  Karl Grant Hoebener ,  David P. Watson

IPC: B23K1/00 ,  H01L21/48 ,  H01L23/488 ,  H01L23/498 ,  H05K1/11 ,  H05K3/34 ,  H05K3/36 ,  H05K3/42

CPC classification number: B23K1/0008 ,  B23K1/0016 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H05K1/114 ,  H05K3/3436 ,  H05K3/3478 ,  B23K2201/36 ,  B23K2201/40 ,  B23K2201/42 ,  H01L2224/81191 ,  H01L2224/814 ,  H01L2924/00013 ,  H01L2924/09701 ,  H05K2201/0215 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0455 ,  H05K2203/082 ,  H05K3/3452 ,  H05K3/42 ,  H05K3/429 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144

Abstract: Two substrates are produced each with a planar, mirror-image matrix of metal contacts in a surface wiring layer. The substrates are positioned with the matrices in parallel confrontation which defines pairs of confronting contacts. A metal ball is positioned between each pair of contacts with a respective volume of joining material between the ball and each of the two respective contacts. The volumes of joining material are simultaneously melted to allow surface tension to align the substrates and to accurately center the balls between each respective pairs of contacts in a plane defines by the matrix of balls.

Abstract translation: 制造两个基板，每个基板在表面布线层中具有金属触点的平面的镜像矩阵。 衬底被定位成与平行对置的矩阵定义成对的面对的接触。 金属球被定位在每对触点之间，在球与两个相应的触头中的每一个之间具有相应体积的接合材料。 同时熔化接合材料的体积以允许表面张力对准衬底并且在由球的矩阵限定的平面中的每个相应的触头对之间精确地定位球。

公开(公告)号：US5409157A

公开(公告)日：1995-04-25

申请号：US207321

申请日：1994-03-07

Applicant: Voddarahalli K. Nagesh ,  Daniel J. Miller ,  Robert A. Schuchard ,  Jeffrey G. Hargis

Inventor： Voddarahalli K. Nagesh ,  Daniel J. Miller ,  Robert A. Schuchard ,  Jeffrey G. Hargis

IPC: H01L23/12 ,  B23K1/00 ,  H01L23/498 ,  H01R4/02 ,  H05K3/34 ,  H01L21/44 ,  H01L21/58

CPC classification number: B23K1/0016 ,  H01L23/49816 ,  H01R4/02 ,  H05K3/3436 ,  B23K2201/40 ,  H01L2224/11334 ,  H01L2924/00013 ,  H05K2201/10234 ,  H05K2201/10719 ,  H05K2201/10727 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0435 ,  Y02P70/613 ,  Y10T428/24826 ,  Y10T428/2982 ,  Y10T428/2991

Abstract: A composite transversely plastic interconnect for a microcarrier produces a carrier-to-substrate bond having low electrical resistance and high mechanical strength, significant bond height to mediate TCE mismatch between dissimilar carrier and substrate materials, and sufficient gap between the carrier and the substrate to permit effective post solder cleaning of the interconnect. A contact array consisting of solder balls is placed directly onto either of a carrier or a substrate interconnect surface with a stencil positioned to the chosen interconnect surface. The solder balls may have a selected melting temperature. Additionally, the solder balls may have a metallic coating, such as nickel or copper, or molten solder. The carrier and substrate are joined by mating an interconnect surface of each and applying heat. Solder paste may be applied to one of the interconnect surfaces to add additional height to the joint and compensate for lack of coplanarity between the carrier and the substrate.

Abstract translation: 用于微载体的复合横向塑料互连产生具有低电阻和高机械强度，显着的键高度以介导不同载体和衬底材料之间的TCE失配以及载体和衬底之间的足够间隙的载体与衬底粘合，以允许 有效的后焊料清洗互连。 由焊球组成的接触阵列直接放置在载体或衬底互连表面中的任一个上，并且模板位于所选择的互连表面。 焊球可具有选定的熔化温度。 此外，焊球可以具有诸如镍或铜的金属涂层或熔融焊料。 载体和基底通过配合每个的互连表面并施加热量来连接。 可以将焊膏施加到互连表面中的一个以增加接头的附加高度并补偿载体和基底之间的共面性的缺乏。