公开(公告)号：US20210018360A1

公开(公告)日：2021-01-21

申请号：US16585409

申请日：2019-09-27

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Jin-Wei You ,  Cheng-Kai Chang

IPC: G01J1/02 ,  H04B3/32

Abstract: The present disclosure provides an electronic packaging structure. A photonic die is disposed on an electronic package, and an optical guide die is not disposed on the electronic package. As the optical guide die malfunctions, only the optical guide die, rather than the whole electronic package and the photonic die, which may still function well, needs to be replaced. Therefore, the replacement cost is reduced, and the lifespan of the electronic packaging structure is increased. The present disclosure also provides a method for manufacturing the electronic packaging structure.

公开(公告)号：US10895498B2

公开(公告)日：2021-01-19

申请号：US16946168

申请日：2020-06-08

Applicant: View, Inc.

Inventor： Erich R. Klawuhn ,  Douglas S. Silkwood ,  Jason Zedlitz ,  Stephen C. Brown ,  Dhairya Shrivastava

IPC: G01J1/02 ,  E06B9/24 ,  G01J1/42 ,  G01W1/12 ,  E06B9/68

Abstract: Certain aspects pertain to a combination sensor comprising a set of physical sensors facing different directions proximate a structure, and configured to measure solar radiation in different directions. The combination sensor also comprises a virtual facade-aligned sensor configured to determine a combi-sensor value at a facade of the structure based on solar radiation readings from the set of physical sensors.

公开(公告)号：US10823610B2

公开(公告)日：2020-11-03

申请号：US16026476

申请日：2018-07-03

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Takamitsu Kitamura ,  Hideki Yagi

IPC: G02B6/43 ,  H01L31/105 ,  G01J1/44 ,  G01J1/42 ,  H01L31/0232 ,  H01L31/0304 ,  H01L31/109 ,  H01L31/18 ,  H01L31/0352 ,  G01J1/04 ,  G01J1/02 ,  G01J9/02 ,  G02B6/12

Abstract: A method for fabricating a light receiving device includes: preparing a first substrate product which includes a semiconductor region having a common semiconductor layer, a first semiconductor laminate for a photodiode, a second semiconductor laminate for a waveguide, and a butt-joint between the first semiconductor laminate and the second semiconductor laminate, the first laminate and the second semiconductor laminate being disposed on the common semiconductor layer; etching the first substrate product with a first mask to form a second substrate product having a photodiode mesa structure produced from the first semiconductor laminate and a preliminary mesa structure produced from the second semiconductor laminate; etching the second substrate product with the first mask and a second mask, formed on the photodiode mesa structure; to produce a waveguide mesa structure from the preliminary mesa structure, and the waveguide mesa structure having a height larger than that of the preliminary mesa structure.

公开(公告)号：US10823606B2

公开(公告)日：2020-11-03

申请号：US16078514

申请日：2017-02-22

Applicant: Vishay Semiconductor GmbH

Inventor： Daniel Burger ,  Sascha Kuhn ,  Peter Mühleck

IPC: G01J1/02 ,  G01S7/497 ,  G01S7/481 ,  G01S17/04

Abstract: An optoelectronic apparatus is provided that has at least one optoelectronic transmitter and at least one optoelectronic receiver. The optoelectronic apparatus furthermore has a storage device having at least one non-volatile memory that is adapted to store an individual data set. A data interface is furthermore provided that is adapted to at least partly read the individual data set out of the non-volatile memory of the storage device.

公开(公告)号：US10809130B2

公开(公告)日：2020-10-20

申请号：US16383872

申请日：2019-04-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takuya Nagamori ,  Tomonori Otake

IPC: G01J5/02 ,  G01J5/34 ,  G01J1/46 ,  H04B10/58 ,  G01J1/02

Abstract: An infrared detection circuit includes an infrared sensor element, detects infrared rays and outputs a detection signal to an external detection circuit. The infrared detection circuit includes an impedance element connected between a ground of the infrared sensor element and a ground of the external detection circuit and including at least one of resistivity and inductivity. The impedance element blocks noise from outside. The ground of the infrared sensor element is connected to the impedance element via a ground of an internal substrate of the infrared detection circuit.

公开(公告)号：US20200319022A1

公开(公告)日：2020-10-08

申请号：US16373437

申请日：2019-04-02

Applicant: Waymo LLC

Inventor： Chen David Lu ,  Matthew Thomas Daniel Rinehart ,  Joshua Chia Fong Wang ,  Michael Shagam

IPC: G01J1/02 ,  G01J1/04 ,  G01J1/44 ,  H04N5/335

Abstract: Methods, systems, and apparatus, for a stray-light testing station. In one aspect, the stray-light testing station includes an illumination assembly including a spatially extended light source and one or more optical elements arranged to direct a beam of light from the spatially extended light source along an optical path to an optical receiver assembly including a lens receptacle configured to receive a lens module and position the lens module in the optical path downstream from the parabolic mirror so that the lens module focuses the beam of light from the spatially extended light source to an image plane, and a moveable frame supporting the optical receiver assembly including one or more adjustable alignment stages to position the optical receiver assembly relative to the illumination assembly such that the optical path of the illumination assembly is within a field of view of the optical receiver assembly.

公开(公告)号：US10798797B1

公开(公告)日：2020-10-06

申请号：US15470167

申请日：2017-03-27

Applicant: Douglas Lighting Controls, Inc.

Inventor： Rob Mahaffey ,  John Cavacuiti ,  Wilson Tse ,  Glen Tracey ,  Jon Schmidt

IPC: H05B47/175 ,  H05B47/19 ,  G01J5/04 ,  F21S8/02 ,  H05B47/11 ,  G01J1/02 ,  H05B47/105

Abstract: A sensor assembly may be mounted in a ceiling used with an associated light fixture. The sensor assembly may include a body including a sensor end and a blade end opposite the sensor end. A sensor may be disposed on the body nearer the sensor end than the blade end. A cutting blade may be disposed on the body nearer the blade end than the sensor end. The cutting blade may be configured to cut an opening in the ceiling. At least one retainer protrusion may be disposed on the body between the sensor and the cutting blade. The at least one retainer protrusion may be configured to retain the sensor assembly in the opening of the ceiling.

公开(公告)号：US20200313031A1

公开(公告)日：2020-10-01

申请号：US16756025

申请日：2018-10-15

Applicant: ams AG

Inventor： Gregor TOSCHKOFF ,  Thomas BODNER ,  Franz SCHRANK ,  Miklos LABODI ,  Joerg SIEGERT ,  Martin SCHREMS

IPC: H01L31/18 ,  G01J1/04 ,  G01J1/02 ,  H01L31/0216 ,  H01L31/02 ,  H01L31/0203

Abstract: A method for manufacturing an optical sensor is provided. The method comprises providing an optical sensor arrangement which comprises at least two optical sensor elements on a carrier, where the optical sensor arrangement comprises a light entrance surface at the side of the optical sensor elements facing away from the carrier. The method further comprises forming a trench between two optical sensor elements in a vertical direction which is perpendicular to the main plane of extension of the carrier, where the trench extends from the light entrance surface of the sensor arrangement at least to the carrier. Moreover, the method comprises coating the trench with an opaque material, forming electrical contacts for the at least two optical sensor elements on a back side of the carrier facing away from the optical sensor elements, and forming at least one optical sensor by dicing the optical sensor arrangement along the trench. Each optical sensor comprises an optical sensor element, and the light entrance surface is free of electrical contacts and at least partially free of the opaque material above the optical sensor elements. Furthermore, an optical sensor is provided.

公开(公告)号：US20200292379A1

公开(公告)日：2020-09-17

申请号：US16888238

申请日：2020-05-29

Applicant: Mitsubishi Electric Corporation

Inventor： Yasuo NAKAJIMA

IPC: G01J1/02 ,  C25D5/12 ,  C25D5/48 ,  C25D7/08 ,  C25D3/48 ,  C25D3/12 ,  C25D5/02 ,  H01L31/107 ,  H01L21/66 ,  H01L31/0224

Abstract: According to the present invention, a method for manufacturing a rear surface incident type light receiving device including a substrate, a light receiving unit formed on a surface of the substrate and an electrode formed on the light receiving unit and electrically connected to the light receiving unit includes a first step of performing, after formation of a part of the electrode, a characteristic inspection of the rear surface incident type light receiving device by applying a probe to a part of the electrode and a second step of reducing an area of the electrode in a plan view.

公开(公告)号：US10760992B2

公开(公告)日：2020-09-01

申请号：US15440247

申请日：2017-02-23

Applicant: FUJIKURA LTD.

Inventor： Masahiro Kashiwagi

IPC: G01M11/00 ,  H01S3/067 ,  H01S3/00 ,  G01J1/02 ,  G02B6/42 ,  H01S3/13 ,  H01S3/131

Abstract: An optical power monitor device includes a first optical fiber, including a core and a cladding surrounding the core and being at least one of an incidence-side optical fiber and a launch-side optical fiber connected to each other at a connection point, which is constituted by a curve portion and a linear portion between the curve portion and the connection point, a low refractive index layer that is provided in at least a portion of the linear portion on an outer side of the cladding and has a refractive index lower than a refractive index of the cladding, and a first optical detector that is provided at a position close to at least the curve portion.