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    METHOD OF REDUCING TEMPERATURE DIFFERENCE BETWEEN A PAIR OF SUBSTRATES AND FLUID REACTION DEVICE USING THE SAME
    143.
    发明申请
    METHOD OF REDUCING TEMPERATURE DIFFERENCE BETWEEN A PAIR OF SUBSTRATES AND FLUID REACTION DEVICE USING THE SAME 有权
    降低基板对流与使用其的流体反应装置之间的温度差异的方法

    公开(公告)号：US20080053647A1

    公开(公告)日：2008-03-06

    申请号：US11689640

    申请日：2007-03-22

    Applicant: Kak Namkoong ,  Su-hyeon Kim ,  Jin-tae Kim ,  Chin-sung Park ,  Young-sun Lee

    Inventor： Kak Namkoong ,  Su-hyeon Kim ,  Jin-tae Kim ,  Chin-sung Park ,  Young-sun Lee

    IPC: F28F7/00

    CPC classification number: B81B3/0081 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00822 ,  B01J2219/00873 ,  B01L3/5027 ,  B01L7/5255 ,  B01L2200/14 ,  B01L2200/147 ,  B01L2300/1805 ,  B01L2300/1827 ,  B81B2201/051 ,  F28F21/02 ,  F28F2013/006

    Abstract: A method of reducing a temperature difference between a high-temperature and a low-temperature substrate includes interposing a heat transfer facilitating layer which has a higher thermal conductivity than air and can hold particles between the substrates, and maintaining close contact between the high-temperature substrate, the heat transfer facilitating layer, and the low-temperature substrate, wherein formation of an air layer can be at least substantially prevented between the high-temperature substrate and the heat transfer facilitating layer, and between the low-temperature substrate and the heat transfer facilitating layer. A fluid reaction device includes a microfluidic reaction chip which accommodates a fluid, a heater, and a heat transfer facilitating layer which is interposed between the microfluidic reaction chip and the heater, the heat transfer facilitating layer has a higher thermal conductivity than air and can hold particles, wherein formation of an air layer can be prevented.

    Abstract translation: 降低高温和低温基板之间的温度差的方法包括：介于热传导率高于空气的传热促进层，并且可以在基板之间保持颗粒，并且保持高温 基板，传热促进层和低温基板，其中至少可以在高温基板和传热促进层之间以及在低温基板和热量之间基本上防止空气层的形成 转移促进层。 流体反应装置包括容纳流体的微流体反应芯片，加热器和介于微流体反应芯片和加热器之间的传热促进层，传热促进层具有比空气更高的导热性并且可以保持 颗粒，其中可以防止空气层的形成。

    MICRO ROTARY MACHINE AND METHODS FOR USING SAME
    144.
    发明申请
    MICRO ROTARY MACHINE AND METHODS FOR USING SAME 有权
    微型旋转机及其使用方法

    公开(公告)号：US20080048519A1

    公开(公告)日：2008-02-28

    申请号：US11757331

    申请日：2007-06-01

    Applicant: Harold Stalford

    Inventor： Harold Stalford

    IPC: H02N10/00 ,  F04B9/00

    CPC classification number: H02N10/00 ,  B81B3/0024 ,  B81B2201/031 ,  B81B2201/034 ,  B81B2201/037 ,  B81B2201/051 ,  H02K7/00 ,  H02N1/002 ,  H02N11/006

    Abstract: A micro rotary machine may include a micro actuator and a micro shaft coupled to the micro actuator. The micro shaft comprises a horizontal shaft and is operable to be rotated by the micro actuator. A micro tool is coupled to the micro shaft and is operable to perform work in response to motion of the micro shaft.

    Abstract translation: 微型旋转机器可以包括微型致动器和耦合到微型致动器的微型轴。 微型轴包括水平轴，并且可由微型致动器旋转。 微型工具联接到微型轴，并且可操作以响应于微型轴的运动而执行工作。

    Polymerization welding and application to microfluidics
    150.
    发明申请
    Polymerization welding and application to microfluidics 审中-公开
    聚合焊接和应用于微流体

    公开(公告)号：US20050100712A1

    公开(公告)日：2005-05-12

    申请号：US10712808

    申请日：2003-11-12

    Applicant: Blake Simmons ,  Robert Crocker ,  Paul Dentinger ,  Marion Hunter ,  Kamlesh Patel ,  Jonathan Sala

    Inventor： Blake Simmons ,  Robert Crocker ,  Paul Dentinger ,  Marion Hunter ,  Kamlesh Patel ,  Jonathan Sala

    IPC: B29C65/00 ,  C08J5/12 ,  B32B31/26

    CPC classification number: B29C65/52 ,  B29C65/006 ,  B29C65/4815 ,  B29C65/4825 ,  B29C65/483 ,  B29C65/4835 ,  B29C65/484 ,  B29C65/485 ,  B29C65/521 ,  B29C65/523 ,  B29C65/526 ,  B29C66/112 ,  B29C66/1122 ,  B29C66/114 ,  B29C66/45 ,  B29C66/452 ,  B29C66/5346 ,  B29C66/54 ,  B29C66/71 ,  B29L2031/756 ,  B81B2201/051 ,  B81C3/001 ,  B81C2203/038 ,  C08J5/128 ,  Y10T428/24612 ,  B29K2065/00 ,  B29K2079/085 ,  B29K2071/00

    Abstract: Methods and materials are described for the joining of plastics and other materials wherein polymerizable substances are diffused into the material to form a surface diffusion zone adjacent to the surface of the plastic workpiece to be joined. The surfaces are brought into contact and the polymerization reactions in the surface diffusion zone are initiated, creating thereby a strong bond across the contacting surfaces. High-performance engineered plastics such as polyetherimides, polyphenylenes, and polyether-ether-ketones are among the materials that are advantageously joined by this technique. Polymerizable substances including styrene and divinylbenzene are shown to give good bonds. Such joining methods can bond dissimilar materials difficult or impossible to join by other techniques. The surfaces to be joined are dry prior to initiation of the polymerization reaction, permitting repositioning and realignment of the surfaces as often as desired before joining. The present joining techniques do not clog or interfere with the structure of microfeatures on the surface of the workpieces to be joined, making this joining techniques especially advantageous for the fabrication of microfluidic devices. Such devices fabricated from high-performance engineered plastic joined by the present bonding techniques are shown to be capable of routine operation at high pressures and to withstand high-pressure cycling without damage.

    Abstract translation: 描述了用于连接塑料和其它材料的方法和材料，其中可聚合物质扩散到材料中以形成邻近待连接的塑料工件的表面的表面扩散区。 使表面接触，并且开始表面扩散区中的聚合反应，从而产生穿过接触表面的强结合。 通过这种技术有利地连接的材料之中的高性能工程塑料如聚醚酰亚胺，聚苯醚和聚醚 - 醚 - 酮。 包括苯乙烯和二乙烯基苯在内的可聚合物质显示出良好的键合。 这种接合方法可以通过其他技术使不相似的材料难以或不可能接合。 在开始聚合反应之前，待连接的表面是干的，允许在接合之前经常按需要重新定位和重新排列表面。 本接合技术不会堵塞或干扰要接合的工件的表面上的微特征的结构，使得该接合技术对于微流体装置的制造特别有利。 由通过本发明的接合技术连接的高性能工程塑料制造的这种装置被证明能够在高压下常规操作并且承受高压循环而不损坏。

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