公开(公告)号：US20120244328A1

公开(公告)日：2012-09-27

申请号：US13513409

申请日：2010-11-30

Applicant: Miki Tanimura ,  Hitoshi Takahira ,  Satomi Yoshie

Inventor： Miki Tanimura ,  Hitoshi Takahira ,  Satomi Yoshie

IPC: C09J7/02 ,  C09J167/02 ,  B32B5/14 ,  B32B7/02 ,  B32B27/06 ,  B32B5/00

CPC classification number: C09J175/06 ,  B32B7/12 ,  B32B27/36 ,  C08G18/4288 ,  C09J7/00 ,  C09J7/10 ,  C09J7/38 ,  C09J167/00 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2201/622 ,  C09J2467/00 ,  Y10T428/2495 ,  Y10T428/264 ,  Y10T428/269 ,  Y10T428/2848 ,  Y10T428/2852

Abstract: The present invention provides a pressure-sensitive adhesive sheet containing a pressure-sensitive adhesive layer that contains a polyester resin as a main component, in which the pressure-sensitive adhesive layer having a laminate structure that contains at least one layer LA where a polyester resin EA having Mw of from 4×104 to 12×104 is crosslinked and at least one layer LB where a polyester resin EB having Mw of from 0.2×104 to 1×104 is crosslinked, and at least one surface of the pressure-sensitive adhesive layer is constituted by the layer LA.

Abstract translation: 本发明提供一种压敏粘合片，其含有以聚酯树脂为主要成分的压敏粘合剂层，其中所述压敏粘合剂层具有包含至少一层LA的层压结构，其中聚酯树脂 具有4×10 4至1​​2×10 4的Mw的EA交联，并且至少一层LB，其中Mw为0.2×10 4至1​​×10 4的聚酯树脂EB交联，并且压敏粘合剂的至少一个表面 层由层LA构成。

公开(公告)号：US08202594B2

公开(公告)日：2012-06-19

申请号：US12432273

申请日：2009-04-29

Applicant: Mutsumi Kobayashi ,  Kazuyuki Yagura

Inventor： Mutsumi Kobayashi ,  Kazuyuki Yagura

IPC: B32B9/00 ,  B32B33/00 ,  B32B7/12

CPC classification number: C09J7/21 ,  C09J7/38 ,  C09J2201/128 ,  C09J2201/134 ,  C09J2201/622 ,  C09J2400/263 ,  C09J2433/00 ,  Y10T428/14 ,  Y10T428/1462 ,  Y10T428/1476 ,  Y10T428/1481 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/2891 ,  Y10T442/2754

Abstract: The present invention provides a double-sided adhesive tape for fixing a decorative sheet for speaker, which includes a nonwoven fabric substrate, an acrylic pressure-sensitive adhesive layer A disposed on one side of the nonwoven fabric substrate and an acrylic pressure-sensitive adhesive layer B disposed on the other side of the nonwoven fabric substrate, in which the adhesive tape has a tensile strength in the tape flow (MD) direction of 8 N/10 mm or more and a tensile length in the width (TD) direction of 8 N/10 mm or more. The double-sided adhesive tape is excellent in the adhesion performance to a housing and a decorative sheet for speaker and at the same time, has excellent releasability ensuring that when separating the decorative sheet portion, smooth separation can be attained without leaving a residue of tape or pressure-sensitive adhesive on the housing portion.

Abstract translation: 本发明提供一种用于固定扬声器用装饰片的双面胶带，其包括无纺布基材，设置在无纺织物基材一侧的丙烯酸类粘合剂层A和丙烯酸类压敏粘合剂层 B布置在无纺布基材的另一侧，其中胶带的带流（MD）方向的拉伸强度为8N / 10mm以上，宽度（TD）方向的拉伸长度为8 N / 10 mm以上。 双面胶带对于壳体和用于扬声器的装饰片的粘合性能优异，同时具有优异的剥离性，确保在分离装饰片部分时可以实现平滑分离而不会留下胶带残留物 或压敏粘合剂在壳体部分上。

公开(公告)号：US20120115405A1

公开(公告)日：2012-05-10

申请号：US13288143

申请日：2011-11-03

Applicant: Shuuhei Yamamoto ,  Koichi Ikeda ,  Kazuyuki Yagura

Inventor： Shuuhei Yamamoto ,  Koichi Ikeda ,  Kazuyuki Yagura

IPC: C09J7/02 ,  B32B25/00 ,  B24D11/00 ,  B32B27/04

CPC classification number: B32B7/06 ,  B32B7/12 ,  B32B27/10 ,  B32B2255/26 ,  B32B2405/00 ,  C09J7/381 ,  C09J2201/134 ,  C09J2407/00 ,  C09J2433/00 ,  Y10T428/1452 ,  Y10T428/1462 ,  Y10T428/1476

Abstract: A double-sided pressure-sensitive adhesive tape 10 according to an embodiment of the present invention includes: a first pressure-sensitive layer 30 that serves as a pressure-sensitive adhesive surface to a surface plate; a second pressure-sensitive adhesive layer 40 that serves as a pressure-sensitive adhesive surface to a polishing member; and a substrate 20 between the first pressure-sensitive adhesive layer 30 and the second pressure-sensitive adhesive layer 40. In the double-sided pressure-sensitive adhesive layer 10 having such a layer structure, the loop tack adhesive strength of the first pressure-sensitive adhesive layer 30 is 16 N/50 mm or less.

Abstract translation: 根据本发明实施例的双面粘合带10包括：用作表面板的压敏粘合剂表面的第一压敏层30; 用作对抛光部件的压敏粘合剂表面的第二压敏粘合剂层40; 以及在第一粘合剂层30和第二粘合剂层40之间的基板20.在具有这种层结构的双面粘合剂层10中，第一压敏粘合剂层 粘合剂层30为16N / 50mm以下。

公开(公告)号：US08101527B2

公开(公告)日：2012-01-24

申请号：US12758505

申请日：2010-04-12

Applicant: Joon Mo Seo ,  Hyuk Soo Moon ,  Cheol Jong Han ,  Jong Geol Lee ,  Kyung Tae Wi

Inventor： Joon Mo Seo ,  Hyuk Soo Moon ,  Cheol Jong Han ,  Jong Geol Lee ,  Kyung Tae Wi

IPC: H01L21/31

CPC classification number: H01L21/78 ,  C09J7/22 ,  C09J7/35 ,  C09J2201/134 ,  C09J2203/326 ,  C09J2463/00 ,  C09J2467/006 ,  C09J2479/08 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2224/85201 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/32245 ,  H01L2224/48247

Abstract: The present invention relates to a dicing film having an adhesive film for dicing a wafer and a die adhesive film, which are used for manufacturing a semiconductor package, and a method of manufacturing a semiconductor package using the same. More particularly, the present invention relates to a dicing film wherein a shrinkage release film is inserted between an adhesive film for dicing a wafer and a die adhesive film so that the die adhesive film and a die can be easily separated from the adhesive film for dicing a wafer when picking up a semiconductor die, and a method of manufacturing a semiconductor package using the same.

Abstract translation: 本发明涉及一种具有用于切割晶片的粘合剂膜和用于制造半导体封装的芯片粘合膜的切割膜以及使用其的半导体封装的制造方法。 更具体地说，本发明涉及一种切割膜，其中将收缩剥离膜插入在用于切割晶片的粘合膜和模片粘合剂膜之间，使得模片粘合剂膜和模具可以容易地从用于切割的粘合剂膜分离 拾取半导体管芯时的晶片，以及使用其制造半导体封装的方法。

公开(公告)号：US07833577B2

公开(公告)日：2010-11-16

申请号：US11747530

申请日：2007-05-11

Applicant: Margaret M. Sheridan ,  James L. Bries ,  Jeffrey D. Malmer

Inventor： Margaret M. Sheridan ,  James L. Bries ,  Jeffrey D. Malmer

IPC: B05D5/10

CPC classification number: C09J7/10 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2407/00 ,  C09J2409/00 ,  C09J2411/00 ,  C09J2433/00 ,  C09J2483/00 ,  Y10T428/14 ,  Y10T428/28 ,  Y10T428/31663

Abstract: A method of making a pressure-sensitive adhesive assembly, the method including coating a pressure-sensitive adhesive composition that includes a silicone polymer on a first major surface of a first release liner to form a first layer, coating a composition on the first layer to form a second layer, the composition of the second layer including an elastomer, at least one of the pressure-sensitive adhesive composition of the first layer and the composition of the second layer being in an uncured state during the coating of the second layer, and curing at least one of the first layer and the second layer, the first pressure-sensitive adhesive composition of the multi-layer assembly exhibiting a release force to the release liner of no greater than 100 gram per 0.5 inch width after the multi-layer assembly has been stored for 46 days at 120° F.

Abstract translation: 一种制造压敏粘合剂组件的方法，所述方法包括在第一剥离衬垫的第一主表面上涂覆包含硅氧烷聚合物的压敏粘合剂组合物以形成第一层，在第一层上涂覆组合物 形成第二层，第二层的组成包括弹性体，在第二层的涂覆期间，第一层的压敏粘合剂组合物和第二层的组合物中的至少一种处于未固化状态，以及 固化第一层和第二层中的至少一个，在多层组装之后，多层组件的第一压敏粘合剂组合物在剥离衬垫上具有不大于100克/ 0.5英寸宽度的释放力 已在120°F储存46天。

公开(公告)号：US20100178496A1

公开(公告)日：2010-07-15

申请号：US12601185

申请日：2008-11-11

Applicant: Masahiko Masuda ,  Yoriko Nakata ,  Hidetomo Kawai

Inventor： Masahiko Masuda ,  Yoriko Nakata ,  Hidetomo Kawai

IPC: B32B7/12 ,  B29D11/00

CPC classification number: B32B37/1284 ,  B32B37/06 ,  B32B37/08 ,  B32B37/26 ,  B32B38/0012 ,  B32B2037/1253 ,  B32B2037/268 ,  C08L83/00 ,  C09J7/10 ,  C09J7/38 ,  C09J183/04 ,  C09J2201/134 ,  C09J2203/30 ,  C09J2483/00 ,  G02F2202/28 ,  Y10T428/2817

Abstract: A transparent pressure-sensitive adhesive product for optical use, a transparent pressure-sensitive adhesive laminate for optical use and a manufacturing method thereof, which afford, upon affixing, stable peeling site selectivity between release sheets and both faces of a transparent pressure-sensitive adhesive product, and which accomplish, in a stable and easy manner, peeling site selectivity on both faces of the transparent pressure-sensitive adhesive product during rework involving re-affixing.The transparent pressure-sensitive adhesive product for optical use has an adhesive face (a) and an adhesive face (b) of dissimilar tackiness, and is formed of an addition reaction-type silicone gel. A relationship between an adhesive power (Ga) of the adhesive face (a) and an adhesive power (Gb) of the adhesive face (b) is Ga

Abstract translation: 用于光学用途的透明压敏粘合剂产品，用于光学用途的透明压敏粘合剂层压体及其制造方法，其在粘合剂上提供了在剥离片材和透明压敏粘合剂两面之间的稳定的剥离位置选择性 产品，并且以稳定和容易的方式实现在返修期间在透明压敏粘合剂产品的两面上剥离位点选择性，包​​括重新固定。 用于光学用途的透明压敏粘合剂产品具有粘合面（a）和不同粘性的粘合面（b），并且由加成反应型硅凝胶形成。 粘合面（a）的粘合力（Ga）和粘合面（b）的粘合力（Gb）之间的关系为Ga

公开(公告)号：US07675601B2

公开(公告)日：2010-03-09

申请号：US11407669

申请日：2006-04-20

Applicant: Ho Min Kang ,  Hee Young Park ,  Jong Sig Hyun ,  Yun Hee Kim

Inventor： Ho Min Kang ,  Hee Young Park ,  Jong Sig Hyun ,  Yun Hee Kim

IPC: G02F1/1345 ,  H01L23/48

CPC classification number: H05K3/323 ,  C09J7/20 ,  C09J9/02 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2201/40 ,  C09J2205/102 ,  G02F1/13452 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2924/12044 ,  H05K3/361 ,  H05K2201/0379 ,  H05K2201/10674 ,  H05K2203/0143 ,  H05K2203/0156 ,  H05K2203/1189 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention relates to an anisotropic conductive film with two or more adhesive resins simultaneously formed thereon, such that the two or more adhesive resins are simultaneously formed on a substrate of a flat panel display so as to connect various kinds of devices and flexible circuit boards thereto, thereby reducing the size of a non-display region of the substrate and reducing the number of steps of a manufacturing process. Moreover, with the use of an anisotropic conductive film with two layers of adhesive resins with different conductive particles, an excellent bonding force thereof enables a device or flexible circuit board to be stably mounted on a narrow area.

Abstract translation: 本发明涉及同时形成有两种或更多种粘合剂树脂的各向异性导电膜，使得两个或更多个粘合剂树脂同时形成在平板显示器的基板上，以便连接各种装置和柔性电路板 从而减小了基板的非显示区域的尺寸并减少了制造工艺的步骤数量。 此外，通过使用具有两层具有不同导电粒子的粘合剂树脂的各向异性导电膜，其优异的结合力能够将器件或柔性电路板稳定地安装在狭窄的区域上。

公开(公告)号：US20100028653A1

公开(公告)日：2010-02-04

申请号：US12533035

申请日：2009-07-31

Applicant: Mutsumi KOBAYASHI ,  Kazuyuki YAGURA

Inventor： Mutsumi KOBAYASHI ,  Kazuyuki YAGURA

IPC: B32B3/26 ,  B32B27/36 ,  B32B37/00

CPC classification number: C09J5/00 ,  C09J7/385 ,  C09J2201/134 ,  C09J2400/243 ,  Y10T156/10 ,  Y10T428/249991 ,  Y10T428/2839 ,  Y10T428/2848

Abstract: The present invention provides a double-sided pressure-sensitive adhesive sheet including: a plastic film substrate; a pressure-sensitive adhesive layer A provided on one side of the substrate; and a pressure-sensitive adhesive layer B provided on the other side of the substrate, in which the layer A is formed from an acrylic pressure-sensitive adhesive containing a crosslinking agent and a (meth)acrylic polymer composed of, as essential monomer components, a (meth)acrylic acid alkyl ester having an alkyl group having a carbon number of 2 to 6, a (meth)acrylic acid alkyl ester having an alkyl group having a carbon number of 7 to 12, a carboxyl group-containing monomer and a hydroxyl group-containing monomer and has a gel fraction of 5 to 40%, and the layer B is formed from an acrylic pressure-sensitive adhesive containing a crosslinking agent and a (meth)acrylic polymer composed of, as essential monomer components, a (meth)acrylic acid alkyl ester having an alkyl group having a carbon number of 2 to 12, a carboxyl group-containing monomer and a hydroxyl group-containing monomer and has a gel fraction of 30 to 60%.

Abstract translation: 本发明提供一种双面压敏粘合片，其包括：塑料膜基材; 设置在基板的一侧的压敏粘合剂层A; 以及设置在基板的另一侧的压敏粘合剂层B，其中层A由含有交联剂的丙烯酸类压敏粘合剂和由（甲基）丙烯酸类聚合物组成的（甲基）丙烯酸类聚合物作为必需单体组分形成， 具有碳数为2至6的烷基的（甲基）丙烯酸烷基酯，具有碳数为7至12的烷基的（甲基）丙烯酸烷基酯，含羧基的单体和 含有羟基的单体，凝胶分数为5〜40％，B层由含有交联剂和（甲基）丙烯酸类聚合物的丙烯酸类压敏粘合剂形成，所述丙烯酸类粘合剂由作为必需单体组分的（甲基） 甲基）丙烯酸烷基酯，具有碳数为2〜12的烷基，含羧基的单体和含羟基的单体，凝胶分数为30〜60％。

公开(公告)号：US20090231384A1

公开(公告)日：2009-09-17

申请号：US12049373

申请日：2008-03-17

Applicant: Sarkis Minas Keshishian ,  Susan Williams ,  Paul Andrew Papworth ,  Kia Silverbrook

Inventor： Sarkis Minas Keshishian ,  Susan Williams ,  Paul Andrew Papworth ,  Kia Silverbrook

IPC: B41J2/01 ,  B32B3/10 ,  B32B33/00

CPC classification number: B41J2/16 ,  B41J2/1623 ,  B41J2/1634 ,  B41J2202/19 ,  B41J2202/20 ,  C09J7/35 ,  C09J2201/128 ,  C09J2201/134 ,  C09J2201/20 ,  C09J2463/00 ,  C09J2479/086 ,  Y10T428/14 ,  Y10T428/24322

Abstract: A laminated film for attachment of printhead integrated circuits to an ink supply manifold. The film has a plurality of ink supply holes defined therein and film comprises: a central polymeric film; a first adhesive layer for bonding a first surface of the film to the ink supply manifold; and a second adhesive layer for bonding a second surface of the film to the printhead integrated circuits. The central polymeric film is sandwiched between the first and second adhesive layers. A first melt temperature of the first adhesive layer is at least 20° C. less than a second melt temperature of the second adhesive layer.

Abstract translation: 用于将打印头集成电路连接到供墨歧管的层压膜。 膜具有限定在其中的多个供墨孔，膜包括：中心聚合物膜; 用于将所述膜的第一表面粘合到所述供墨歧管的第一粘合剂层; 以及用于将薄膜的第二表面粘合到打印头集成电路的第二粘合剂层。 中心聚合物膜夹在第一和第二粘合剂层之间。 第一粘合剂层的第一熔融温度比第二粘合剂层的第二熔融温度低至少20℃。

公开(公告)号：US07562827B2

公开(公告)日：2009-07-21

申请号：US10569339

申请日：2004-08-20

Applicant: Renke Bargmann ,  Marc Husemann

Inventor： Renke Bargmann ,  Marc Husemann

IPC: G06K7/10

CPC classification number: C09J7/22 ,  C09J7/10 ,  C09J7/35 ,  C09J2201/134 ,  C09J2421/00 ,  C09J2467/00 ,  C09J2475/00 ,  C09J2477/00 ,  Y10T428/2998 ,  Y10T428/31511 ,  Y10T428/31573 ,  Y10T428/31663 ,  Y10T428/31938

Abstract: The invention relates to the use of an adhesive film for bonding a chip module in a card body. Said adhesive film comprises at least two adhesive layers (i) and (ii), which differ chemically from one another.

Abstract translation: 本发明涉及粘合膜用于将芯片模块粘合在卡体内的用途。 所述粘合剂膜包括彼此化学上不同的至少两个粘合剂层（i）和（ii）。