公开(公告)号：US20130292789A1

公开(公告)日：2013-11-07

申请号：US13930844

申请日：2013-06-28

Applicant: L-3 Communications Corporation

Inventor： Howard Beratan

IPC: H01L37/00

CPC classification number: H01L37/00 ,  G01J1/02 ,  G01J1/0204 ,  G01J1/04 ,  G01J1/0411 ,  G01J1/0429 ,  G01J1/0488 ,  G01J4/04 ,  G01J5/02 ,  G01J5/0215 ,  G01J5/023 ,  G01J5/024 ,  G01J5/06 ,  G01J5/08 ,  G01J5/0806 ,  G01J5/0825 ,  G01J5/0862 ,  G01J5/20 ,  G01J2005/065 ,  G01N21/3581 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14669 ,  H01L27/14683

Abstract: A thermal absorption structure of a radiation thermal detector element may include an optically transitioning material configured such that optical conductivity of the thermal absorption structure is temperature sensitive and such that the detector element absorbs radiation less efficiently as its temperature increases, thus reducing its ultimate maximum temperature.

Abstract translation: 辐射热检测器元件的热吸收结构可以包括光学过渡材料，其被配置为使得热吸收结构的光学导电性是温度敏感的，并且使得检测器元件随着其温度升高而更低效地吸收辐射，从而降低其最终最高温度 。

公开(公告)号：US20110299086A1

公开(公告)日：2011-12-08

申请号：US12880457

申请日：2010-09-13

Applicant: Hui Hsuan Chen ,  Cheng Nan Tsai ,  Chih Hung Lu ,  Wei Chung Wang

Inventor： Hui Hsuan Chen ,  Cheng Nan Tsai ,  Chih Hung Lu ,  Wei Chung Wang

IPC: G01N21/55

CPC classification number: G01J1/0204 ,  G01J1/0219 ,  G01J1/0233 ,  G01J1/0271 ,  G01J1/0411 ,  G01J1/0414 ,  G01J1/0477 ,  G01J1/0488

Abstract: A sensing device includes a housing and an image sensing system disposed in the housing and used for detecting a reflected light from an object. The image sensing system includes a substrate, a light sensing element, and a reflection and redirection element. The light sensing element is disposed on the substrate. The reflection and redirection element is disposed between the light sensing element and the object, and used for reflecting and redirecting the reflected light from the object to a receiving direction of the light sensing element, such that the light sensing element receives the reflected light and generates a corresponding sensing signal.

Abstract translation: 感测装置包括壳体和设置在壳体中并用于检测来自物体的反射光的图像感测系统。 图像感测系统包括基板，光感测元件和反射和重定向元件。 感光元件设置在基板上。 反射和重定向元件设置在光感测元件和物体之间，并用于将来自物体的反射光反射并重定向到感光元件的接收方向，使得光感测元件接收反射光并产生 相应的感应信号。

公开(公告)号：US07902988B2

公开(公告)日：2011-03-08

申请号：US12139016

申请日：2008-06-13

Applicant: Koichi Goto

Inventor： Koichi Goto

IPC: G08B21/00

CPC classification number: B60S1/0837 ,  B60S1/087 ,  G01J1/02 ,  G01J1/0204 ,  G01J1/0407 ,  G01J1/0411 ,  G01J1/4228

Abstract: An illuminance sensor for detecting brightness of outside a vehicle having a windshield includes first and second light receiving elements and a light emitting element for emitting light to the windshield. The first light receiving element outputs a first signal corresponding to outside light. The light emitted from the light emitting element is reflected at an outside surface of the windshield. The second light receiving element outputs a second signal corresponding to the reflected light. The outside light passes a first region of the windshield through which the light emitted from the light emitting element passes or a second region of the windshield through which the reflected light passes. The first signal is corrected based on the second signal to detect the brightness.

Abstract translation: 用于检测具有挡风玻璃的车辆外部的亮度的照度传感器包括第一和第二光接收元件和用于向挡风玻璃发射光的发光元件。 第一光接收元件输出对应于外部光的第一信号。 从发光元件发出的光在挡风玻璃的外表面反射。 第二光接收元件输出与反射光对应的第二信号。 外部光通过挡风玻璃的第一区域，通过该第一区域从发光元件发射的光通过该挡风玻璃的第二区域，反射光通过该第二区域。 基于第二信号校正第一信号以检测亮度。

公开(公告)号：US20100264459A1

公开(公告)日：2010-10-21

申请号：US12801718

申请日：2010-06-22

Applicant: Koichiro Ueno ,  Naohiro Kuze ,  Yoshitaka Moriyasu ,  Kazuhiro Nagase

Inventor： Koichiro Ueno ,  Naohiro Kuze ,  Yoshitaka Moriyasu ,  Kazuhiro Nagase

IPC: H01L31/062 ,  H01L31/113

CPC classification number: H01L31/035236 ,  B82Y20/00 ,  G01J1/02 ,  G01J1/0204 ,  G01J5/02 ,  G01J5/0215 ,  G01J5/04 ,  G01J5/045 ,  G01J5/20 ,  G01J2001/0276 ,  H01L31/1035 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An infrared sensor IC and an infrared sensor, which are extremely small and are not easily affected by electromagnetic noise and thermal fluctuation, and a manufacturing method thereof are provided. A compound semiconductor that has a small device resistance and a large electron mobility is used for a sensor (2), and then, the compound semiconductor sensor (2) and an integrated circuit (3), which processes an electrical signal output by the compound semiconductor sensor (2) and performs an operation, are arranged in a single package using hybrid formation. In this manner, an infrared sensor IC that can be operated at room temperature can be provided by a microminiature and simple package that is not conventionally produced.

公开(公告)号：US20100102212A1

公开(公告)日：2010-04-29

申请号：US12605687

申请日：2009-10-26

Applicant: Katsuhiro SAIKI

Inventor： Katsuhiro SAIKI

IPC: G01J1/06

CPC classification number: G01J1/02 ,  G01J1/0204 ,  G01J1/0271 ,  G01J1/04 ,  G01J1/0407 ,  G01J1/0411 ,  G01J1/0414 ,  G01J1/06

Abstract: A light detecting device includes a case, a reflector, and a light receiving element. The case is fixed to a windshield, and outside light passes through the windshield and an entrance hole defined in the case. A predetermined light travels from a predetermined area, and the reflector reflects the predetermined light of the outside light. The light receiving element is disposed in the case to have a distance from the windshield, and the distance is larger than a distance between the windshield and the entrance hole. The light receiving element receives the reflected predetermined light.

Abstract translation: 光检测装置包括壳体，反射器和光接收元件。 外壳固定在挡风玻璃上，外部光线穿过挡风玻璃和外壳中定义的入口孔。 预定的光从预定区域行进，并且反射器反射外部光的预定光。 光接收元件设置在壳体中以与挡风玻璃具有距离，并且该距离大于挡风玻璃和入口孔之间的距离。 光接收元件接收反射的预定光。

公开(公告)号：US20100098429A1

公开(公告)日：2010-04-22

申请号：US12517783

申请日：2007-12-05

Applicant: Yong-Il Jun ,  Wangjoo Lee ,  Tae-Joon Park ,  Young-Boo Kim

Inventor： Yong-Il Jun ,  Wangjoo Lee ,  Tae-Joon Park ,  Young-Boo Kim

IPC: H04B10/12

CPC classification number: G01J1/0411 ,  G01J1/02 ,  G01J1/0204 ,  G01J1/04 ,  G01J1/46 ,  H01L31/0203 ,  H01L31/02325

Abstract: Provided are a multi-aperture optical detector that can address structural problems such as a complex signal wiring in array type optical detectors, and a need for a plurality of low noise amplifiers, signal to noise ratio detectors, etc., and an optical signal detecting circuit including the multi-aperture optical detector. The multi-aperture optical detector includes transmission lines having two output terminals; and a plurality of unit optical detectors which respectively have random polarities through the transmission lines and are connected in parallel, and optical signals from each of the unit optical detectors are added and output through the two output terminals. The multi-aperture optical detector has a high operation band width and can detect optical signals with a high sensitivity by connecting a plurality of unit optical detectors that respectively have a low optical detecting sensitivity and are physically compact and small.

Abstract translation: 提供了一种可以解决诸如阵列式光检测器中的复杂信号布线等结构问题的多孔光学检测器，以及需要多个低噪声放大器，信噪比检测器等，以及光信号检测 电路包括多孔光学检测器。 多孔光学检测器包括具有两个输出端的传输线; 以及分别通过传输线具有并联并联的随机极性的多​​个单元光学检测器，并且来自每个单元光学检测器的光信号通过两个输出端相加并输出。 多孔光学检测器具有高的操作带宽，并且可以通过连接分别具有低光学检测灵敏度并且物理紧凑和小的多个单元光学检测器来检测具有高灵敏度的光信号。

公开(公告)号：US07696470B2

公开(公告)日：2010-04-13

申请号：US12155291

申请日：2008-06-02

Applicant: Ryou Sekikawa

Inventor： Ryou Sekikawa

IPC: G01J1/04 ,  H01L31/18

CPC classification number: G01J1/02 ,  G01J1/0204 ,  G02B6/423 ,  G02B6/4239 ,  G02B6/4246

Abstract: The an optical communication module associated with the present invention comprises a semiconductor substrate, a light emitting element mounted on said semiconductor substrate to output light for transmission (transmitted light), a light receiving element mounted with an adhesive resin on said semiconductor substrate to convert light received (received light) to an electric signal and a wavelength filter to branch out the received light guided to said light receiving element and the transmitted light output from said light emitting element. A groove for an optical path, through which the received light passes to be guided to said light receiving element and a first protective groove formed around said groove for an optical path to block said adhesive resin from intruding into said groove for an optical path are formed on said semiconductor substrate.

Abstract translation: 与本发明相关的光通信模块包括半导体衬底，安装在所述半导体衬底上的发光元件以输出用于透射的光（透射光），在所述半导体衬底上安装有粘合树脂的光接收元件，以将光 接收（接收到的光）到电信号和波长滤波器以分支引导到所述光接收元件的接收光和从所述发光元件输出的透射光。 形成用于光路的槽，所述光路通过所述凹槽被引导到所述光接收元件，以及围绕所述凹槽形成的用于光路的第一保护槽，以阻挡所述粘合树脂侵入所述光路用槽中 在所述半导体衬底上。

公开(公告)号：US07586166B2

公开(公告)日：2009-09-08

申请号：US11407008

申请日：2006-04-18

Applicant: Dawn A. Bonnell ,  Xiaojun Joseph Lei ,  David Conklin

Inventor： Dawn A. Bonnell ,  Xiaojun Joseph Lei ,  David Conklin

IPC: H01L31/0352

CPC classification number: H01L31/08 ,  B81B1/00 ,  B82B3/00 ,  G01J1/0204 ,  G01J1/42 ,  G01Q80/00 ,  H01L31/18 ,  H01L51/0595 ,  H01L51/428

Abstract: Disclosed are electronic, plasmonic and opto-electronic components that are prepared using patterned photodeposited nanoparticles on a substrate surface. Also disclosed are ferroelectric nanolithography methods for preparing components, circuits and devices.

Abstract translation: 公开了使用图案化的沉积纳米颗粒在基材表面上制备的电子，等离子体激元和光电子部件。 还公开了用于制备组件，电路和器件的铁电纳米光刻方法。

公开(公告)号：US07569807B2

公开(公告)日：2009-08-04

申请号：US11842612

申请日：2007-08-21

Applicant: George E. Matheson

Inventor： George E. Matheson

IPC: G01J1/04 ,  G01J1/32

CPC classification number: H05B33/0869 ,  F21K9/00 ,  F21V23/0442 ,  G01J1/02 ,  G01J1/0204 ,  G01J1/0214 ,  G01J1/04 ,  G01J1/0407 ,  G01J1/0474 ,  G01J1/32 ,  G01J2001/4247 ,  G02B6/0036 ,  G02B6/0038 ,  G02B6/0043 ,  G02B6/0058 ,  H05B33/0803 ,  H05B37/0218 ,  Y02B20/46

Abstract: The present invention provides a light source comprising one or more light-emitting elements, one or more photosensors and, a photosensor light guide, such as, for example, a substantially planar light guide. The photosensor light guide is generally configured to capture and guide some of the light emitted from the one or more light-emitting elements to one or more photosensors optically coupled thereto, the light sensed thereby being useable as a basis for controlling the respective outputs of the one or more light-emitting elements.

Abstract translation: 本发明提供了包括一个或多个发光元件，一个或多个光电传感器和光传感器光导（例如基本上平面的光导）的光源。 光传感器光导通常被配置为捕获并引导从一个或多个发光元件发射的一些光与一个或多个光耦合到其上的光电传感器，因此可以将光感应用作控制各个输出的基础 一个或多个发光元件。

公开(公告)号：US20090174947A1

公开(公告)日：2009-07-09

申请号：US12316057

申请日：2008-12-09

Applicant: Masahiro Hasegawa

Inventor： Masahiro Hasegawa

IPC: G02B3/00 ,  G01J1/00 ,  B32B38/04

CPC classification number: B32B38/0004 ,  B32B37/12 ,  B32B38/04 ,  B32B2307/416 ,  B32B2310/0843 ,  B32B2315/08 ,  B32B2457/14 ,  G01J1/02 ,  G01J1/0204 ,  G01J1/0209 ,  G01J1/04 ,  G01J1/0403 ,  G01J1/0411 ,  G02B3/0012 ,  G02B3/0056 ,  G02B3/0062 ,  G02B13/0035 ,  G02B13/0085 ,  H01L2224/02372 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/11 ,  H01L2924/00014 ,  Y10T156/1052 ,  H01L2224/05099

Abstract: An electronic element wafer module is provided, comprising: an electronic element wafer arranged with a plurality of electronic elements having a through hole electrode; a resin adhesion layer formed in a predetermined area on the electronic element wafer; a transparent cover member covering the electronic element wafer and fixed on the resin adhesion layer; and a plurality of resin optical elements adhered and fixed on the transparent cover member to be integrated in such a manner to correspond to the respective plurality of electronic elements.

Abstract translation: 提供了一种电子元件晶片模块，包括：电子元件晶片，其布置有多个具有通孔电极的电子元件; 形成在电子元件晶片上的预定区域中的树脂粘附层; 覆盖所述电子元件晶片并固定在所述树脂粘合层上的透明盖构件; 以及多个树脂光学元件，其粘附并固定在透明盖构件上，以便以与相应的多个电子元件对应的方式集成。