公开(公告)号：US11662264B2

公开(公告)日：2023-05-30

申请号：US16711550

申请日：2019-12-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Inho Won ,  Minseok Moon ,  Byoungkon Park ,  Sangho Lee ,  Jaewon Jeong

IPC: G01L9/06 ,  G01B17/04 ,  G01L19/00 ,  G01L9/00 ,  G01L1/20 ,  H01L21/67 ,  G01L1/18 ,  G01L5/00

CPC classification number: G01L9/065 ,  G01B17/04 ,  G01L1/18 ,  G01L1/205 ,  G01L5/0076 ,  G01L9/0026 ,  G01L19/0092 ,  H01L21/67253

Abstract: A pressure measuring apparatus for measuring a jetting pressure of a liquid jetted from a nozzle includes a plate including: a first surface facing the nozzle; and a second surface opposite to the first surface; a pressure sensor configured to detect a discharge position and the discharge pressure at the discharge position of the liquid and generate a signal based on the discharge pressure; and electrical components including a controller configured to receive the signal and collect data regarding the discharge pressure. The pressure sensor is provided on the first surface of the plate and the electrical components are provided on the second surface of the plate.

公开(公告)号：US20180364114A1

公开(公告)日：2018-12-20

申请号：US15990479

申请日：2018-05-25

Applicant: TAIWAN ALPHA ELECTRONIC CO., LTD.

Inventor： Tzu-Hsuan HUANG ,  Wei-Liang LIU

IPC: G01L1/20 ,  H05K1/14

CPC classification number: G01L1/205 ,  H05K1/147 ,  H05K2201/042 ,  H05K2201/10151

Abstract: A finger movement-sensing assembly includes a flexible substrate, a bend-sensing circuit structure and a depression-sensing circuit structure. The flexible substrate extends in a first direction for use on a finger. The flexible substrate has an outer extension section and an inner deflection section. The outer extension section is applied to be mounted onto a back of the finger, and the inner deflection section is applied to be mounted onto a pulp of the finger. The bend-sensing circuit structure is disposed on the outer extension section to produce a bend-sensing signal. The depression-sensing circuit structure is disposed on the inner deflection section to produce a depression-sensing signal.

公开(公告)号：US20180179050A1

公开(公告)日：2018-06-28

申请号：US15904631

申请日：2018-02-26

Applicant: NextInput, Inc.

Inventor： Amnon Brosh ,  Ryan Diestelhorst ,  Steven Nasiri

IPC: B81B3/00 ,  G01L1/18 ,  G01L1/20 ,  B81C1/00

CPC classification number: B81B3/0056 ,  B81B2201/0264 ,  B81B2201/0292 ,  B81C1/00626 ,  G01L1/18 ,  G01L1/205 ,  G01L9/0047 ,  G01L9/0048

Abstract: Described herein is a miniaturized and ruggedized wafer level MEMS force sensor composed of a base and a cap. The sensor employs multiple flexible membranes, a mechanical overload stop, a retaining wall, and piezoresistive strain gauges.

公开(公告)号：US20180145244A1

公开(公告)日：2018-05-24

申请号：US15813321

申请日：2017-11-15

Applicant: Mizuki OTAGIRI ,  Tsuneaki KONDOH ,  Yuko ARIZUMI ,  Tomoaki SUGAWARA ,  Junichiro NATORI ,  Mayuka ARAUMI ,  Hideyuki MIYAZAWA ,  Makito NAKASHIMA ,  Kimio AOKI ,  Takahiro IMAI ,  Megumi KITAMURA ,  Yuki HOSHIKAWA

Inventor： Mizuki OTAGIRI ,  Tsuneaki KONDOH ,  Yuko ARIZUMI ,  Tomoaki SUGAWARA ,  Junichiro NATORI ,  Mayuka ARAUMI ,  Hideyuki MIYAZAWA ,  Makito NAKASHIMA ,  Kimio AOKI ,  Takahiro IMAI ,  Megumi KITAMURA ,  Yuki HOSHIKAWA

IPC: H01L41/113 ,  G01L1/20 ,  H01L41/047 ,  H02N1/04

CPC classification number: H01L41/1132 ,  G01L1/18 ,  G01L1/205 ,  G01L1/2287 ,  G01L5/226 ,  H01L41/0477 ,  H02N1/04

Abstract: A sensor includes a plurality of elements and an insulating layer. The plurality of elements is deformable to generate power. The insulating layer is interposed between the plurality of elements. Each of the plurality of elements includes a pair of electrodes and an intermediate layer. The intermediate layer is disposed between the pair of electrodes and formed of one of a rubber and a rubber composition.

公开(公告)号：US20180117772A1

公开(公告)日：2018-05-03

申请号：US15783350

申请日：2017-10-13

Applicant: Seiko Epson Corporation

Inventor： Tomo IKEBE

IPC: B25J13/08 ,  B25J15/00

CPC classification number: B25J13/081 ,  B25J13/082 ,  B25J13/085 ,  B25J15/0004 ,  B25J15/0028 ,  G01L1/16 ,  G01L1/205 ,  G01L1/2287 ,  G01L5/228

Abstract: A hand includes a grasper that grasps a target object and a sensor section that detects force exerted on the grasper when the grasper grasps the target object, and the sensor section includes a pressure sensitive section including a resin and carbon nanotubes. The sensor section includes a first sensor section located between the target object and the grasper in a state in which the grasper grasps the target object.

公开(公告)号：US20180111332A1

公开(公告)日：2018-04-26

申请号：US15568337

申请日：2016-04-26

Applicant: Composite Technology and Applications Limited

Inventor： Andrew Collis ,  Nolan Richmond

IPC: B29C65/00 ,  B29C65/48 ,  B29C65/78 ,  F01D5/14 ,  F16B11/00 ,  G01B7/16 ,  G01B7/287 ,  G01L1/20 ,  G01L1/16 ,  G01B7/28

CPC classification number: B29C66/92211 ,  B29C65/48 ,  B29C65/782 ,  B29C66/1122 ,  B29C66/301 ,  B29C66/346 ,  B29C66/532 ,  B29C66/721 ,  B29C66/73112 ,  B29C66/742 ,  B29L2031/082 ,  F01D5/147 ,  F01D5/282 ,  F01D17/02 ,  F05D2220/36 ,  F05D2230/23 ,  F05D2230/31 ,  F05D2260/407 ,  F05D2260/83 ,  F16B11/006 ,  G01B7/22 ,  G01B7/285 ,  G01B7/287 ,  G01L1/16 ,  G01L1/205

Abstract: Methods and apparatus are described for improving fit checking at the bonding interface of a first component, such as a fan blade (1), and a second component, such as an edge guard (2) for the fan blade (1), to be bonded by adhesive. A bondline thickness profile over the area of the bonding interface is determined by interposing a compressible, flexible sensor layer between the components before they are bonded. The sensor layer contains an array of piezoelectric elements which indicate local bondline thickness by signalling pressure due to compression of the layer. The bondline thickness profile can be processed by a programmed control processor to produce an adhesive application schedule prescribing the shapes of pieces of adhesive film which, when applied over the bonding interface, will build up an adhesive layer corresponding in thickness to the bondline thickness. The sensor layer can be prepared as a kit of shaped panels or as a contoured preform (55) matching the form of the bonding interface.

公开(公告)号：US20180087984A1

公开(公告)日：2018-03-29

申请号：US15702717

申请日：2017-09-12

Applicant: SiTime Corporation

Inventor： Paul M. Hagelin ,  Charles I. Grosjean ,  Lev Goncharov

IPC: G01L9/00

CPC classification number: G01L9/001 ,  G01L1/146 ,  G01L1/205 ,  G01L5/16

Abstract: Spatially-distributed resonant MEMS sensors are coordinated to generate frequency-modulated signals indicative of regional contact forces, ambient conditions and/or environmental composition.

公开(公告)号：US20180087979A1

公开(公告)日：2018-03-29

申请号：US15824593

申请日：2017-11-28

Applicant: NIKE, Inc.

Inventor： Tina M. Casillas ,  James Meschter ,  Richard L. Watkins

IPC: G01L1/20 ,  A61B5/00

CPC classification number: G01L1/205 ,  A41D1/002 ,  A61B5/002 ,  A61B5/1114 ,  A61B5/1126 ,  A61B5/6802 ,  A61B5/6804 ,  A61B5/6805 ,  A61B2503/10 ,  A61B2562/0261 ,  A61B2562/04 ,  A63B24/00

Abstract: A sensor system configured for use with an article of apparel includes one or a plurality of sensors formed of a polymeric material having a conductive particulate material dispersed therein and conductive leads connecting the sensors to a port. The leads may also be formed of a polymeric material having a conductive particulate material dispersed therein. The conductive material is dispersed in the sensor(s) at a first dispersion density and the conductive material is dispersed in the leads at a second dispersion density that is higher than the first dispersion density. Each of the sensors is configured to increase in resistance when deformed under pressure, which is detected by a module connected to the port. The second dispersion density is such that each of the leads has sufficient conductivity that the leads are configured to conduct an electronic signal between each sensor and the port in any state of deformation.

公开(公告)号：US09921114B2

公开(公告)日：2018-03-20

申请号：US15388629

申请日：2016-12-22

Applicant: Kabushiki Kaisha Toshiba

Inventor： Yoshihiko Fuji ,  Kei Masunishi ,  Hideaki Fukuzawa ,  Yoshihiro Higashi ,  Michiko Hara ,  Akio Hori ,  Tomohiko Nagata ,  Shiori Kaji ,  Akiko Yuzawa

IPC: G01L1/22 ,  G01L1/12 ,  G01L5/16 ,  G01L9/00 ,  H04R1/02 ,  H04R1/04 ,  H04R7/00 ,  H04R19/00 ,  G06F3/041 ,  A61B5/00 ,  A61B5/021 ,  A61B5/024 ,  G01L1/20 ,  H04R19/04

CPC classification number: G01L1/2287 ,  A61B5/02141 ,  A61B5/02438 ,  A61B5/7475 ,  G01L1/12 ,  G01L1/205 ,  G01L1/2262 ,  G01L1/2293 ,  G01L5/161 ,  G01L9/0051 ,  G06F3/041 ,  G06F3/0414 ,  G06F2203/04105 ,  H04R1/028 ,  H04R1/04 ,  H04R7/00 ,  H04R19/005 ,  H04R19/04 ,  H04R2499/11

Abstract: According to one embodiment, a pressure sensor includes a film part, and a sensing unit. A circumscribing rectangle circumscribing a configuration of a film surface of the film part has a first side, a second side, a third side connected to one end of the first side and one end of the second side, a fourth side connected to one other end of the first side and one other end of the second side, and a centroid of the circumscribing rectangle. The circumscribing rectangle includes a first region enclosed by the first side, line segments connecting the centroid to the one end of the first side, and to the one other end of the first side. The sensing unit includes sensing elements provided on a portion of the film surface overlapping the first region. Each sensing element includes a first, second magnetic layers, and a spacer layer.

公开(公告)号：US09874965B2

公开(公告)日：2018-01-23

申请号：US14851579

申请日：2015-09-11

Applicant: Apple Inc.

Inventor： James E. Pedder ,  Sunggu Kang ,  David J. Meyer ,  John Z. Zhong

IPC: G06F3/041 ,  G06F3/045 ,  G01L1/18

CPC classification number: G06F3/0414 ,  G01L1/18 ,  G01L1/205 ,  G06F3/0416 ,  G06F3/045 ,  G06F2203/04103 ,  G06F2203/04105

Abstract: An electronic device includes one or more transparent strain sensors configured to detect strain based on an amount of force applied to the electronic device, a component in the electronic device, and/or an input surface of the electronic device. The one or more transparent strain sensors may be included in or positioned below an input surface that is configured to receive touch inputs from a user. The area below the input surface can be visible to a user when the user is viewing the input surface. The one or more transparent strain sensors are formed with a nanostructure, including a nanomesh or nanowires.