公开(公告)号：US20120214008A1

公开(公告)日：2012-08-23

申请号：US13406081

申请日：2012-02-27

Applicant: Praveen Bhimaraj ,  Omar J. Bchir

Inventor： Praveen Bhimaraj ,  Omar J. Bchir

IPC: B32B15/08 ,  C08K3/10 ,  C08K3/22 ,  C08K3/36 ,  C08K3/34 ,  C08L77/10 ,  C08K3/04 ,  B82Y30/00

CPC classification number: C08J5/005 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B27/28 ,  B32B27/281 ,  B32B2264/10 ,  B32B2457/00 ,  B32B2605/00 ,  B32B2605/18 ,  B82Y30/00 ,  C08J2379/04 ,  C08K3/346 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0257 ,  Y10T428/1157 ,  Y10T428/31681 ,  C08L79/04

Abstract: A composition includes a bismaleimide triazine (BT) compound with a nanoclay composited therewith. A mounting substrate includes polymer compound with a nanoclay composited therewith to form a core for the mounting substrate. A process includes melt blending a polymer such as BT with a nanoclay and forming a core. A process includes dissolving a monomer such as BT with a nanoclay and forming a core. A system includes a nanoclay dispersed in a polymer matrix and a microelectronic device mounted on the mounting substrate that includes the nanoclay dispersed in the polymer matrix.

Abstract translation: 组合物包含与其组合的纳米粘土的双马来酰亚胺三嗪（BT）化合物。 安装基板包括具有与其复合的纳米粘土以形成用于安装基板的芯的聚合物化合物。 一种方法包括将诸如BT的聚合物与纳米粘土熔融共混并形成核心。 一种方法包括用纳米粘土将单体例如BT溶解并形成核心。 系统包括分散在聚合物基质中的纳米粘土和安装在安装基底上的微电子器件，其包括分散在聚合物基质中的纳米粘土。

公开(公告)号：US20120204424A1

公开(公告)日：2012-08-16

申请号：US13457188

申请日：2012-04-26

Applicant: Yuji YUKIIRI ,  Izumi Tanaka

Inventor： Yuji YUKIIRI ,  Izumi Tanaka

IPC: H01B19/00

CPC classification number: H05K3/0035 ,  H05K1/0366 ,  H05K3/421 ,  H05K3/4644 ,  H05K2201/0209 ,  H05K2201/09563 ,  H05K2203/0191 ,  H05K2203/0264 ,  H05K2203/066 ,  H05K2203/1383

Abstract: There is prepared an insulation layer generation member having a support film and a semi-cured insulation layer provided on a surface of the support film. Subsequently, the insulation layer generation member is affixed to a pad such that the pad contacts the semi-cured insulation layer. The semi-cured insulation layer is cured, to thus generate an insulation layer. Subsequently, the insulation layer is exposed to laser by way of the support film, thereby opening an opening in the insulation layer.

公开(公告)号：US20120199381A1

公开(公告)日：2012-08-09

申请号：US13102323

申请日：2011-05-06

Applicant: Cheol Ho Heo ,  Young Ki Lee ,  Sang Hyun Shin

Inventor： Cheol Ho Heo ,  Young Ki Lee ,  Sang Hyun Shin

IPC: H05K7/20

CPC classification number: H05K7/205 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K3/0061 ,  H05K3/3452 ,  H05K2201/0209 ,  H05K2201/026 ,  H05K2201/0323 ,  H01L2924/00

Abstract: The present invention relates to a printed circuit board. A heat radiation coating material is applied to a portion of a circuit layer formed on an outermost portion of the printed circuit board, thereby making it possible to improve heat radiation performance of the printed circuit board. The heat radiation coating material also serves as a solder resist, thereby making it possible to insulate and protect the printed circuit board without a separate solder resist.

Abstract translation: 印刷电路板技术领域本发明涉及印刷电路板。 将辐射涂层材料施加到形成在印刷电路板的最外部的电路层的一部分，从而可以提高印刷电路板的散热性能。 散热涂层材料也用作阻焊剂，从而可以在没有单独的阻焊剂的情况下绝缘和保护印刷电路板。

公开(公告)号：US20120189826A1

公开(公告)日：2012-07-26

申请号：US13498764

申请日：2010-09-28

Applicant: Katsura Hayashi

Inventor： Katsura Hayashi

IPC: B32B3/00 ,  B32B9/04 ,  B32B18/00 ,  B32B7/02

CPC classification number: H05K3/4673 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2224/16225 ,  H05K3/4602 ,  H05K3/4655 ,  H05K2201/0175 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2203/1152 ,  Y10T428/24802 ,  Y10T428/24942

Abstract: A structure for which the electrical reliability is improved is provided. A structure in accordance with one embodiment includes an inorganic insulating layer including amorphous silicon oxide and having an elastic modulus which is 45 GPa or less. A method for manufacturing a structure in accordance with one embodiment includes applying an inorganic insulating sol including inorganic insulating particles composed of amorphous silicon oxide, and forming an inorganic insulating layer including amorphous silicon oxide and having an elastic modulus which is 45 GPa or less by heating the inorganic insulating particles at a temperature lower than a crystallization onset temperature of silicon oxide to each other.

Abstract translation: 提供了改善电可靠性的结构。 根据一个实施方案的结构包括无定形氧化硅的无机绝缘层，其弹性模量为45GPa以下。 根据一个实施方案的结构的制造方法包括：施加包含由无定形氧化硅构成的无机绝缘粒子的无机绝缘溶胶，通过加热形成包含非晶氧化硅的无机绝缘层，其弹性模量为45GPa以下 所述无机绝缘粒子的温度低于氧化硅的结晶化开始温度。

公开(公告)号：US20120168215A1

公开(公告)日：2012-07-05

申请号：US13393659

申请日：2010-08-27

Applicant: Touko Shiina ,  Masao Arima ,  Shuichi Yamamoto ,  Masato Yoshida

Inventor： Touko Shiina ,  Masao Arima ,  Shuichi Yamamoto ,  Masato Yoshida

IPC: H05K1/00 ,  B05D3/06 ,  C08K3/30 ,  B05D5/00 ,  C08L63/10 ,  C09D163/10

CPC classification number: H05K3/287 ,  C08G59/1466 ,  C08G59/4215 ,  C08L63/10 ,  G03F7/0047 ,  G03F7/0048 ,  G03F7/032 ,  H05K2201/0209

Abstract: Provided is a curable resin composition which exhibits improved developability even in through holes and can suppress the generation of development residue and which can yield a cured product with excellent heat resistance and hardness. A curable resin composition which comprises a carboxyl-containing resin, a photopolymerization initiator, and barium sulfate that has been pretreated with a dispersant having an acid group and/or a dispersant having a block copolymer structure, a graft polymer structure, and/or a star polymer structure.

Abstract translation: 提供即使在通孔中也显示出改进的显影性的可固化树脂组合物，并且可以抑制显影残渣的产生，并且可以产生具有优异的耐热性和硬度的固化产物。 一种固化性树脂组合物，其包含用具有酸基的分散剂和/或具有嵌段共聚物结构的分散剂预处理的含羧基树脂，光聚合引发剂和硫酸钡，接枝聚合物结构和/或 星形聚合物结构。

公开(公告)号：US20120152599A1

公开(公告)日：2012-06-21

申请号：US13392554

申请日：2010-09-02

Applicant: Yoshito Kitagawa ,  Naoyuki Tani ,  Toshiyuki Asahi

Inventor： Yoshito Kitagawa ,  Naoyuki Tani ,  Toshiyuki Asahi

IPC: H05K1/09 ,  H05K3/06

CPC classification number: H05K3/381 ,  H05K3/4644 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/2072 ,  H05K2203/0773 ,  Y10T29/49128

Abstract: A multi-layer printed-wiring-board is used in densely packaging electronic components such as semiconductors having improved function, and a production method therefor, and more specifically it achieves a multi-layer printed-wiring-board having excellent copper-foil-peel-strength and high connection-reliability in which occurrence of structural defects such as delamination (interlayer peeling) is prevented, and a production method therefor. Because of thinning of the printed-wiring-board or diversification of insulating layers constituting the printed-wiring-board, peeling such as delamination may occur between the insulating layers or in an interface between the insulating layer and the plated conductor. By providing pores in substantially the same plane as wiring patterns in the printed-wiring-board including insulating layers, wiring pattern layers made of copper foil alternately laminated on the insulating layers, and pores provided between the wiring patterns, a printed-wiring-board having high connection reliability free from delamination or cracks during heating or in heat cycle conditions.

Abstract translation: 多层印刷电路板用于密封地包装具有改进功能的半导体的电子部件及其制造方法，更具体地说，实现了具有优异的铜箔剥离性的多层印刷电路板 - 防止出现分层（层间剥离）等结构缺陷的强度和高连接可靠性及其制造方法。 由于印刷电路板的薄化或构成印刷电路板的绝缘层的多样化，可能会在绝缘层之间或绝缘层与电镀导体之间的界面中发生分层剥离。 通过在包括绝缘层的印刷电路板中的布线图案的基本相同的平面上设置孔，在交替层叠在绝缘层上的由铜箔制成的布线图案层和设置在布线图案之间的孔，印刷布线板 具有高的连接可靠性，在加热或热循环条件下不会发生分层或裂纹。

公开(公告)号：US08196296B2

公开(公告)日：2012-06-12

申请号：US12250755

申请日：2008-10-14

Applicant: Yuji Yukiiri ,  Izumi Tanaka

Inventor： Yuji Yukiiri ,  Izumi Tanaka

IPC: H05K3/02 ,  H05K3/10

CPC classification number: H05K3/0035 ,  H05K1/0366 ,  H05K3/421 ,  H05K3/4644 ,  H05K2201/0209 ,  H05K2201/09563 ,  H05K2203/0191 ,  H05K2203/0264 ,  H05K2203/066 ,  H05K2203/1383

Abstract: There is prepared an insulation layer generation member having a support film and a semi-cured insulation layer provided on a surface of the support film. Subsequently, the insulation layer generation member is affixed to a pad such that the pad contacts the semi-cured insulation layer. The semi-cured insulation layer is cured, to thus generate an insulation layer. Subsequently, the insulation layer is exposed to laser by way of the support film, thereby opening an opening in the insulation layer.

Abstract translation: 制备了具有支撑膜和设置在支撑膜的表面上的半固化绝缘层的绝缘层产生构件。 随后，绝缘层产生件被固定到垫上，使得焊盘接触半固化绝缘层。 半固化绝缘层被固化，从而产生绝缘层。 随后，通过支撑膜将绝缘层暴露于激光，从而在绝缘层中打开开口。

公开(公告)号：US20120141777A1

公开(公告)日：2012-06-07

申请号：US13375296

申请日：2010-04-20

Applicant: Yasushi Idemoto ,  Ryuichi Sato ,  Naohiko Abe

Inventor： Yasushi Idemoto ,  Ryuichi Sato ,  Naohiko Abe

IPC: B32B18/00 ,  C25D13/02 ,  B05D3/02 ,  B32B15/04

CPC classification number: H05K1/162 ,  C23C18/1208 ,  C23C18/1254 ,  C25D13/02 ,  H05K1/0306 ,  H05K3/022 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2203/135 ,  Y10T428/252 ,  Y10T428/265 ,  Y10T428/31678

Abstract: The object of the present invention is to provide a metal layer with an insulating layer which is uniform and thin and can be produced in low cost. To achieve the object, a laminate composed of a ceramic insulating layer and a metal layer characterized in that the ceramic insulating layer has a binder provided among ceramic particles constituting a ceramic particle film formed by electrophoretic deposition of the ceramic particles is employed. The laminate can be suitably used as a base material for production of various types of electronic devices, the circuit formation of printed wiring boards, semiconductor circuits and circuits including semiconductor circuits, and capacitors utilizing dielectric performance of the ceramic insulating layer.

Abstract translation: 本发明的目的是提供一种具有均匀且薄而可以以低成本制造的绝缘层的金属层。 为了实现该目的，采用由陶瓷绝缘层和金属层组成的层压体，其特征在于，陶瓷绝缘层具有在构成通过陶瓷颗粒的电泳沉积形成的陶瓷颗粒膜的陶瓷颗粒中提供的粘合剂。 该层压体可以适合用作生产各种类型的电子器件的基材，印刷电路板的电路形成，半导体电路和包括半导体电路的电路，以及利用陶瓷绝缘层的介电性能的电容器。

公开(公告)号：US20120132462A1

公开(公告)日：2012-05-31

申请号：US13301152

申请日：2011-11-21

Applicant: Masaaki Harazono ,  Yoshihiro Hosoi

Inventor： Masaaki Harazono ,  Yoshihiro Hosoi

IPC: H05K1/16 ,  H05K1/11

CPC classification number: H05K1/0366 ,  H01L2224/16225 ,  H05K1/0373 ,  H05K1/113 ,  H05K3/42 ,  H05K2201/0209 ,  H05K2201/0959

Abstract: A circuit board comprises a substrate; a through hole penetrating the substrate along with a direction of a thickness thereof; and a through hole conductor covering an inner wall of the through hole. The substrate comprises a first fiber layer, a second fiber layer, and a resin layer arranged between the first fiber layer and the second fiber layer. Each of the first fiber layer and the second fiber layer has a plurality of fibers and a resin arranged among the plurality of the fibers. The resin layer contains a resin and doesn't contain a fiber. The inner wall of the through hole, in a cross-section view along with the direction of the thickness of the substrate, comprises a curved depression in the resin layer.

Abstract translation: 电路板包括基板; 贯穿基板的通孔及其厚度方向; 以及覆盖通孔的内壁的通孔导体。 基板包括第一纤维层，第二纤维层和布置在第一纤维层和第二纤维层之间的树脂层。 第一纤维层和第二纤维层中的每一个具有布置在多个纤维中的多个纤维和树脂。 树脂层含有树脂，不含纤维。 贯穿孔的内壁与基板的厚度方向一起在横截面图中包括树脂层中的弯曲凹陷。

公开(公告)号：US20120100770A1

公开(公告)日：2012-04-26

申请号：US13341015

申请日：2011-12-30

Applicant: Dein-Run Fung ,  Te-Chao Liao ,  Hao-Sheng Chen

Inventor： Dein-Run Fung ,  Te-Chao Liao ,  Hao-Sheng Chen

IPC: B32B5/02 ,  B32B27/38 ,  C09K5/14

CPC classification number: H05K1/0373 ,  C08G59/4021 ,  C08G59/504 ,  C08L63/00 ,  H05K2201/0209 ,  Y10T428/31511 ,  Y10T428/31529 ,  Y10T442/20

Abstract: A resin composition includes solid brominated epoxy resin of 20-70 wt %, a hardener of 1-10 wt %, a promoter of 0.1-10 wt %, inorganic powder of 0.01-20 wt %, high thermal conductivity powder of 5-85 wt % closest packed by Horsfield packing model and a processing aid of 0-10 wt %; the resin composition possesses high glass transition temperature ranged from 169° C. to 235° C. measured by DSC, high thermal conductivity ranged from 5.7 W/m·K to 14.2 W/m·K, and excellent heat resistance as well as flame retardancy. The resin composition, which acts as a dielectric layer of a printed circuit board so as to endow the PCB with high thermal conductivity, is a high thermal conductivity prepreg formed by retting or a high thermal conductivity coating formed by coating. As a result, prompt dissipation of heat generated by electronic components on the PCB is achievable so that service life and stability of the electronic components are improved.

Abstract translation: 树脂组合物包括20-70重量％的固体溴化环氧树脂，1-10重量％的固化剂，0.1-10重量％的助催化剂，0.01-20重量％的无机粉末，5-85的高导热性粉末 重量％最接近Horsfield包装模型和0-10重量％的加工助剂; 树脂组合物具有高的玻璃化转变温度，范围从169℃到235℃，通过DSC测量，高导热系数范围为5.7W / m·K至14.2W / m·K，耐热性和火焰优良 阻力。 用作印刷电路板的电介质层以赋予PCB高导热性的树脂组合物是通过浸渍形成的高导热性预浸料或通过涂布形成的高导热性涂层。 结果，可以实现电子部件在PCB上产生的热量的迅速消散，从而提高电子部件的使用寿命和稳定性。