公开(公告)号：US20090197011A1

公开(公告)日：2009-08-06

申请号：US12362080

申请日：2009-01-29

Applicant: Tzong-Ming LEE ,  Ruoh-Huey Uang ,  Kuo-Chan Chiou ,  Yu-Ming Wang ,  Yi-Ting Cheng

Inventor： Tzong-Ming LEE ,  Ruoh-Huey Uang ,  Kuo-Chan Chiou ,  Yu-Ming Wang ,  Yi-Ting Cheng

IPC: B05D3/06

CPC classification number: H05K3/102 ,  B82Y10/00 ,  H05K3/381 ,  H05K2201/0129 ,  H05K2201/0257 ,  H05K2203/107 ,  H05K2203/128

Abstract: A method for manufacturing a substrate with surface substrates by employing photothermal effect is described. Nanoparticles on the surface of the substrate excited by a beam convert light energy to thermal energy. The surface structure on the substrate is formed through the thermal energy generated by the excited nanoparticles. The substrate with plural pores is thus formed.

Abstract translation: 描述了通过使用光热效应制造具有表面基板的基板的方法。 由光束激发的衬底表面上的纳米颗粒将光能转换成热能。 通过激发的纳米粒子产生的热能形成衬底上的表面结构。 由此形成具有多个孔的基板。

公开(公告)号：US20090110884A1

公开(公告)日：2009-04-30

申请号：US12115875

申请日：2008-05-06

Applicant: Jeff Chinn ,  W. Robert Ashurst ,  Adam Anderson

Inventor： Jeff Chinn ,  W. Robert Ashurst ,  Adam Anderson

IPC: B32B27/00 ,  B32B3/10 ,  B32B5/16 ,  H05K1/00 ,  B32B15/02 ,  B32B9/00

CPC classification number: H05K3/284 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0257 ,  H05K2201/09872 ,  Y10T428/24355 ,  Y10T428/24364 ,  Y10T428/24372 ,  Y10T428/24388 ,  Y10T428/24405 ,  Y10T428/24413 ,  Y10T428/24421 ,  Y10T428/269 ,  Y10T428/2839 ,  H01L2924/00

Abstract: A composite is provided, comprising a substrate and a film on the substrate. The film has an RMS surface roughness of 25 nm to 500 nm, a film coverage of 25% to 60%, a surface energy of less than 70 dyne/cm; and a durability of 10 to 5000 microNewtons. Depending on the particular environment in which the film is to be used, a durability of 10 to 500 microNewtons may be preferred. A film thickness 3 to 100 times the RMS surface roughness of the film is preferred.

Abstract translation: 提供了一种复合材料，其包括基底和基底上的薄膜。 膜的RMS表面粗糙度为25nm至500nm，膜覆盖率为25％至60％，表面能小于70达因/厘米; 耐久性为10至5000微瓦。 根据使用薄膜的具体环境，可以优选10至500微瓦的耐久性。 膜的厚度为膜的RMS表面粗糙度的3〜100倍是优选的。

公开(公告)号：US20080282537A1

公开(公告)日：2008-11-20

申请号：US12149892

申请日：2008-05-09

Applicant: Kwi-Jong Lee ,  Young-Il Lee ,  Byung-Ho Jun ,  Joon-Rak Choi ,  In-Keun Shim

Inventor： Kwi-Jong Lee ,  Young-Il Lee ,  Byung-Ho Jun ,  Joon-Rak Choi ,  In-Keun Shim

IPC: H01K3/22

CPC classification number: H05K3/1283 ,  H05K1/0373 ,  H05K3/125 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2203/013 ,  H05K2203/101 ,  H05K2203/1131 ,  Y10T29/49155 ,  Y10T29/49163

Abstract: The present invention relates to a method for forming a wiring of a printed circuit board and more particularly, to a method including: preparing a base film; forming a wiring pattern with ink including metal nanoparticles on the base film by printing; and forming a wring by the induction heating of the base film on which the wiring pattern is formed. The method of the present invention which minimizes the thermal strain and thermal decomposition of a base film, provides an appropriate sintering process of wirings, shortens the manufacturing process, and exhibits excellent mechanical strength is provided by using the induction heating.

Abstract translation: 本发明涉及一种印刷电路板的布线形成方法，特别是涉及一种制备基膜的方法。 通过印刷在基膜上形成具有包含金属纳米颗粒的油墨的布线图案; 并且通过对其上形成有布线图案的基膜进行感应加热而形成绞合。 本发明的使基膜的热应变和热分解最小化的方法提供了适当的布线烧结工艺，缩短了制造工艺，并且通过使用感应加热提供了优异的机械强度。

公开(公告)号：US20080272344A1

公开(公告)日：2008-11-06

申请号：US12077812

申请日：2008-03-21

Applicant: HongJin Jiang ,  Kyoung-sik Moon ,  Yi Li ,  Ching Ping Wong

Inventor： HongJin Jiang ,  Kyoung-sik Moon ,  Yi Li ,  Ching Ping Wong

IPC: H01B1/22

CPC classification number: H01B1/22 ,  H01L2224/16 ,  H01L2224/29339 ,  H01L2224/8384 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H05K3/321 ,  H05K2201/0245 ,  H05K2201/0257

Abstract: The present invention relates generally to conductive polymer composites, electrically conductive adhesives, and methods of producing the same. The conductive polymer composites and electrically conductive adhesives may be used for electronic component interconnects, flip chip interconnections, electrical connections to circuit boards, jumper connections, or similar uses. The method of forming a conductive polymer composite includes mixing conductive metal flakes, functionalized conductive metal nanoparticles, and a polymer precursor and curing the polymer precursor to form a composite. In one embodiment, the conductive polymer composites may be composed of microparticles of silver flake and sintered silver nanoparticles between the silver flakes. The polymer composites have an electrical conductivity of less than 10−5 Ω·cm.

Abstract translation: 本发明一般涉及导电聚合物复合材料，导电粘合剂及其制备方法。 导电聚合物复合物和导电粘合剂可用于电子元件互连，倒装芯片互连，到电路板的电连接，跳线连接或类似用途。 形成导电聚合物复合材料的方法包括混合导电金属薄片，官能化导电金属纳米颗粒和聚合物前体，并固化聚合物前体以形成复合材料。 在一个实施方案中，导电聚合物复合材料可以由银薄片的微粒和银薄片之间的烧结银纳米颗粒组成。 聚合物复合材料具有小于10 -5Ω·cm的电导率。

公开(公告)号：US07357883B2

公开(公告)日：2008-04-15

申请号：US11500307

申请日：2006-08-08

Applicant: Yasunori Ninomiya ,  Masashi Totokawa ,  Hirokazu Imai ,  Yukinori Migitaka

Inventor： Yasunori Ninomiya ,  Masashi Totokawa ,  Hirokazu Imai ,  Yukinori Migitaka

IPC: H01B1/00 ,  H01B1/12

CPC classification number: H01B1/22 ,  H05K3/321 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2201/0272 ,  Y10T428/12882 ,  Y10T428/12903 ,  Y10T428/29 ,  Y10T428/2933

Abstract: A conductive adhesive is formed by mixing a plurality of conductive fillers into a thermosetting resin. The conductive filler includes a core material made of copper-based metal, a coating film made of silver and a plurality of particles made of silver. The coating film is provided on the core material to cover the core material, and the particles are provided on a surface of the coating film. Accordingly, a surface of the core material is prevented from being exposed. The conductive adhesive can be suitably used for bonding two members.

Abstract translation: 通过将多种导电填料混合到热固性树脂中形成导电粘合剂。 导电填料包括由铜基金属制成的芯材，由银制成的涂膜和多个由银制成的颗粒。 涂覆膜设置在芯材上以覆盖芯材，并且将颗粒设置在涂膜的表面上。 因此，防止芯材的表面露出。 导电粘合剂可以适合用于粘接两个部件。

公开(公告)号：US20080085962A1

公开(公告)日：2008-04-10

申请号：US11539305

申请日：2006-10-06

Applicant: Davide Louis Simone ,  David Alexander Gibson ,  Eric James Crane Olson

Inventor： Davide Louis Simone ,  David Alexander Gibson ,  Eric James Crane Olson

IPC: C08K3/10

CPC classification number: C08K3/08 ,  C08K5/205 ,  H05K3/105 ,  H05K3/321 ,  H05K2201/0257 ,  H05K2203/121

Abstract: A composition includes a polymer precursor and a metal precursor. The metal precursor may include a carbamate and a metal cation. The metal precursor may be responsive to an application of energy to form a metal nanoparticle. An associated method is provided.

Abstract translation: 组合物包括聚合物前体和金属前体。 金属前体可以包括氨基甲酸酯和金属阳离子。 金属前体可以响应于施加能量以形成金属纳米颗粒。 提供了一种相关联的方法。

公开(公告)号：US20080044749A1

公开(公告)日：2008-02-21

申请号：US11772867

申请日：2007-07-03

Applicant: Yuichiro Sano ,  Toru Miyasaka

Inventor： Yuichiro Sano ,  Toru Miyasaka

IPC: G03G13/18 ,  G03G15/22

CPC classification number: G03G15/1625 ,  G03G15/224 ,  G03G15/225 ,  G03G15/6585 ,  G03G15/6591 ,  H05K1/0218 ,  H05K3/102 ,  H05K3/1266 ,  H05K3/207 ,  H05K3/28 ,  H05K3/386 ,  H05K2201/0257 ,  H05K2201/0715 ,  H05K2203/0143 ,  H05K2203/0517 ,  H05K2203/105

Abstract: An object is to improve the adhesion strength between a circuit pattern and its substrate without increasing the resistance value of the circuit pattern in preparation of a circuit pattern holding substrate. A circuit pattern formation device 100 forms, after forming a precursor circuit-pattern 12 in the surface of a dielectric thin film body 4, a circuit pattern 14 onto a target substrate 23 from the dielectric thin film body. After forming an electrostatic latent image 2 in the upper surface of the dielectric thin film body, the electrostatic latent image is exposed using an exposure unit 3 to prepare a pattern. A development apparatus 7 supplies a conductive particle dispersion solution 6 to this pattern to form a precursor circuit-pattern. By energizing the circuit pattern holding substrate 8, in which an adhesive layer 22 is formed, the precursor circuit-pattern is temporarily transferred to the circuit pattern holding substrate. The transferred precursor circuit-pattern is heated using the heater 13 to form a circuit pattern. The circuit pattern and the adhesive layer are released from the circuit pattern holding substrate, thereby transferring to the target substrate.

Abstract translation: 本发明的目的是在电路图案保持基板的制备中不增加电路图案的电阻值而提高电路图案与其基板之间的粘合强度。 电路图案形成装置100在电介质薄膜体4的表面形成前驱体电路图案12后，形成从电介质薄膜体到目标基板23的电路图案14。 在电介质薄膜体的上表面形成静电潜像2之后，使用曝光单元3曝光静电潜像以制备图案。 显影装置7向该图案供给导电性粒子分散液6，形成前驱体电路图案。 通过对其中形成有粘合剂层22的电路图案保持基板8通电，将前驱体电路图案暂时转移到电路图案保持基板。 使用加热器13加热转移的前体电路图案以形成电路图案。 电路图案和粘合剂层从电路图案保持基板释放，从而转移到目标基板。

公开(公告)号：US20080044683A1

公开(公告)日：2008-02-21

申请号：US11758796

申请日：2007-06-06

Applicant: Kwok Pong Chan ,  Erik Hagberg ,  Tara J. Mullen ,  Roy Ray Odle

Inventor： Kwok Pong Chan ,  Erik Hagberg ,  Tara J. Mullen ,  Roy Ray Odle

IPC: B32B15/088 ,  B32B5/00 ,  C08G69/26 ,  C08K3/34

CPC classification number: H05K1/0346 ,  C08G73/1007 ,  C08J5/18 ,  C08J2379/08 ,  C08L79/08 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/068 ,  Y10T428/12569 ,  Y10T428/25 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: A solvent cast film comprises a polyimide comprising structural units derived from polymerization of a dianhydride component comprising a dianhydride selected from the group consisting of 3,4′-oxydiphthalic dianhydride, 3,3′-oxydiphthalic dianhydride, 4,4′-oxydiphthalic dianhydride, and combinations thereof, with a diamine component comprising 4,4′-diaminodiphenylsulfone; wherein the polyimide has a glass transition temperature from 190° C. to 400° C.; and wherein the film has a coefficient of thermal expansion of less than 60 ppm/° C., a thickness from 0.1 to 250 micrometers, endless than 5% residual solvent by weight.

Abstract translation: 溶剂流延膜包括聚酰亚胺，其包含衍生自二酐组分的聚合的结构单元，所述二酐组分包含二酐，其选自3,4'-氧二邻苯二甲酸二酐，3,3'-氧联二邻苯二甲酸二酐，4,4'-氧联二邻苯二甲酸二酐， 和其组合与二胺组分包含4,4'-二氨基二苯砜; 其中所述聚酰亚胺的玻璃化转变温度为190℃至400℃; 并且其中所述膜具有小于60ppm /℃的热膨胀系数，0.1至250微米的厚度，不超过5重量％的残留溶剂。

公开(公告)号：US20080044634A1

公开(公告)日：2008-02-21

申请号：US11834775

申请日：2007-08-07

Applicant: Billie Jo Enciu ,  Ann P. Holloway ,  Paul Sacoto ,  Jean Marie Saldanha Singh ,  Rebecca Beth Silveston-Keith

Inventor： Billie Jo Enciu ,  Ann P. Holloway ,  Paul Sacoto ,  Jean Marie Saldanha Singh ,  Rebecca Beth Silveston-Keith

IPC: B05D5/00 ,  B32B3/00 ,  H01B1/00

CPC classification number: H05K3/386 ,  H05K1/16 ,  H05K3/12 ,  H05K3/125 ,  H05K3/4664 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2203/013 ,  Y10T428/24917

Abstract: Printed circuits having conductive traces applied adjacent to a substrate, such as one where the traces have a resistivity of from about 1 to about 0.1 ohms/square, and methods for forming a fluid composition receiving layer adjacent to a substrate. One such method includes depositing a primary treatment fluid having a particle dispersion and a binder in a carrier fluid adjacent to at least a portion of a substrate to provide a treated substrate having a fluid composition receiving layer. The primary treatment fluid is deposited in a pattern using a: micro-fluid ejection head. After deposition, the carrier fluid content of the fluid composition receiving layer is reduced.

Abstract translation: 具有与衬底相邻施加的导电迹线的印刷电路，例如具有约1至约0.1欧姆/平方的电阻率的迹线以及用于形成与衬底相邻的流体组合物接收层的方法。 一种这样的方法包括将具有颗粒分散体和粘合剂的初级处理流体沉积在与基底的至少一部分相邻的载体流体中，以提供具有流体组成物接收层的经处理的基底。 主要处理流体使用：微流体喷射头以图案沉积。 沉积后，流体组合物接收层的载流体含量降低。

公开(公告)号：US20080023675A1

公开(公告)日：2008-01-31

申请号：US11881896

申请日：2007-07-29

Applicant: Lex Kosowsky ,  Robert Fleming

Inventor： Lex Kosowsky ,  Robert Fleming

IPC: H01B1/00

CPC classification number: H01C7/1006 ,  H01C7/105 ,  H01C17/0652 ,  H01L25/167 ,  H01L51/5203 ,  H01L2924/0002 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/188 ,  H05K2201/0257 ,  H05K2201/0738 ,  H05K2201/10106 ,  H05K2203/0723 ,  H05K2203/105 ,  H01L2924/00

Abstract: One or more embodiments provide for a device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material on the device.

Abstract translation: 一个或多个实施例提供了一种使用具有半导体或导电材料的电压可切换介电材料的器件，该器件具有相对较高的纵横比，以便增强器件上的VSD材料的机械和电学特性。