公开(公告)号：US20100101843A1

公开(公告)日：2010-04-29

申请号：US12523127

申请日：2008-01-16

Applicant: Hiroaki Wakabayashi ,  Noriyuki Ohigashi

Inventor： Hiroaki Wakabayashi ,  Noriyuki Ohigashi

IPC: H05K1/00 ,  B32B15/08 ,  B32B27/30 ,  B32B27/38 ,  B32B17/06 ,  B32B27/36 ,  B32B15/04 ,  B32B5/00

CPC classification number: H05K3/4655 ,  C08F220/18 ,  C08L33/064 ,  H05K3/4652 ,  H05K2201/0358 ,  H05K2203/066 ,  Y10T428/12 ,  Y10T428/264 ,  Y10T428/31511 ,  Y10T428/31529 ,  Y10T428/31681 ,  Y10T428/31699 ,  Y10T428/31786 ,  Y10T428/31935

Abstract: Disclosed is an insulating resin sheet laminate (an insulating resin sheet with a film or a metal foil) including an insulating resin layer with a uniform thickness that is formed without repulsion or unevenness in a process of forming the insulating resin layer on a film or a metal foil, and a multi-layer printed circuit board that includes the insulating resin sheet laminate and possesses high insulating reliability. The present invention provides an insulating resin sheet laminate (an insulating resin sheet with a film or a metal foil) obtained by forming an insulating resin layer made of a resin composition on a film or a metal foil, and the resin composition includes an acrylic surfactant.

Abstract translation: 公开了一种绝缘树脂片层叠体（具有膜或金属箔的绝缘树脂片），其包括在膜上形成绝缘树脂层的过程中不产生排斥或不均匀的具有均匀厚度的绝缘树脂层 金属箔和包含绝缘树脂片层叠体并具有高绝缘可靠性的多层印刷电路板。 本发明提供一种通过在膜或金属箔上形成由树脂组合物制成的绝缘树脂层而获得的绝缘树脂片层叠体（具有膜或金属箔的绝缘树脂片），并且该树脂组合物包括丙烯酸类表面活性剂 。

公开(公告)号：US20100086792A1

公开(公告)日：2010-04-08

申请号：US12437293

申请日：2009-05-07

Applicant: Shun-Jen Chiang ,  Chung-Jen Wu

Inventor： Shun-Jen Chiang ,  Chung-Jen Wu

IPC: B32B15/08 ,  C08G69/00

CPC classification number: H05K1/0346 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1046 ,  H05K2201/0154 ,  H05K2201/0358 ,  H05K2201/068 ,  Y10T428/31681

Abstract: A polyimide precursor and its composition as well as a polyimide laminate are provided. The polyimide precursor and its composition are prepared using a diamine monomer and a dianhydride monomer in a specific composition proportion. The composition is coated on a copper foil and then cured to provide a polyimide laminate with a desired Coefficient of Thermal Expansion (CTE) and exhibiting desired properties, such as film flatness, dimensional stability, peeling strength, tensile strength, and elongation.

Abstract translation: 提供聚酰亚胺前体及其组合物以及聚酰亚胺层压体。 使用二胺单体和二酸酐单体以特定组成比例制备聚酰亚胺前体及其组合物。 将组合物涂布在铜箔上，然后固化，以提供具有所需热膨胀系数（CTE）的聚酰亚胺层压板，并显示出所需的性能，如膜平整度，尺寸稳定性，剥离强度，拉伸强度和伸长率。

公开(公告)号：US07648770B2

公开(公告)日：2010-01-19

申请号：US10557728

申请日：2004-05-21

Applicant: Kenji Tanaka ,  Kazumasa Takeuchi ,  Nobuyuki Ogawa ,  Katsuyuki Masuda

Inventor： Kenji Tanaka ,  Kazumasa Takeuchi ,  Nobuyuki Ogawa ,  Katsuyuki Masuda

IPC: B32B15/08

CPC classification number: B32B27/36 ,  B32B7/04 ,  B32B15/08 ,  B32B25/08 ,  B32B25/14 ,  B32B27/08 ,  B32B27/281 ,  B32B27/322 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/748 ,  B32B2457/00 ,  C08G73/14 ,  H05K3/386 ,  H05K2201/0358 ,  Y10T156/10 ,  Y10T428/24355 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: The invention aims to provide a resin primer which can stick an insulator layer to a conductor foil whereof the surface is not much roughened with sufficient adhesive force, a conductor foil with resin, a laminated sheet and a method of manufacturing same. The resin primer of the invention comprises a resin having film-forming ability and a breaking energy of 0.15 J or more. The conductor foil with resin of the invention comprises a resin layer comprising a conductor foil and the aforesaid resin primer. Further, the laminated sheet of the invention comprises the conductor foil, an insulating layer disposed facing the conductor foil, and a resin layer comprising the aforesaid resin primer disposed between the conductor foil and insulating layer so that it is in contact therewith. This laminated sheet can be manufactured by heating and pressurizing a laminate comprising the aforesaid conductor foil with resin, and a prepreg laminated on this resin layer.

Abstract translation: 本发明的目的是提供一种树脂底漆，其可以将绝缘体层粘附到具有足够的粘合力的表面不被粗糙化的导体箔上，具有树脂的导体箔，层压片及其制造方法。 本发明的树脂底漆包括具有成膜能力和断裂能为0.15J以上的树脂。 本发明的具有树脂的导体箔包括由导体箔和上述树脂底漆构成的树脂层。 此外，本发明的层压片包括导体箔，与导体箔相对设置的绝缘层，以及包含设置在导体箔与绝缘层之间的上述树脂底漆的树脂层，使其与其接触。 该层叠片材可以通过用树脂对包含上述导体箔的层压体进行加热加压，并将该层压在该树脂层上的预浸料坯来制造。

公开(公告)号：US07624502B2

公开(公告)日：2009-12-01

申请号：US10546730

申请日：2005-01-21

Applicant: Toshihiro Nishii

Inventor： Toshihiro Nishii

IPC: H01K3/10 ,  B32B37/00 ,  H01R12/04

CPC classification number: H05K3/4069 ,  H05K3/382 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/0382 ,  H05K2201/091 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: A conductive portion is formed in a hole formed in a material sheet. A metal foil is placed on a surface of the material sheet to provide a laminated sheet. The laminated sheet is heated and pressed to provide a circuit-forming board. The metal foil includes a pressure absorption portion and a hard portion adjacent to the pressure absorption portion. The pressure absorption portion has a thickness changing according to a pressure applied thereto. The circuit-forming board provided by this method provides a high-density circuit board of high quality having reliable electrical connection.

Abstract translation: 导电部分形成在材料片中形成的孔中。 将金属箔放置在材料片的表面上以提供层压片。 将层压片材加热并加压以提供电路形成板。 金属箔包括压力吸收部分和与压力吸收部分相邻的硬部分。 压力吸收部的厚度根据施加到其上的压力而变化。 通过该方法提供的电路形成板提供了具有可靠的电连接的高质量的高密度电路板。

公开(公告)号：US20090229750A1

公开(公告)日：2009-09-17

申请号：US12382070

申请日：2009-03-06

Applicant: Toyonari ITO ,  Satoshi OKAMOTO ,  Junichi IKEUCHI

Inventor： Toyonari ITO ,  Satoshi OKAMOTO ,  Junichi IKEUCHI

IPC: B32B37/06 ,  B32B37/00

CPC classification number: H05K3/384 ,  H05K1/0313 ,  H05K2201/0141 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0759 ,  Y10T156/10

Abstract: The present invention provides a method for producing a copper-clad laminate, the method comprising the step of placing at least one copper foil onto a resin layer containing a liquid crystalline polymer so that the resin layer adheres to a surface of the copper foil, wherein the surface of the copper foil has 0.4 or more of a ratio of nickel concentration to copper concentration and has substantially no silicon detected when measured with X-ray photoelectron spectroscopy. The copper-clad laminate can sufficiently maintain excellent adhesion between the copper foil and the resin layer even under high temperature and humidity atmosphere.

Abstract translation: 本发明提供一种覆铜层压板的制造方法，该方法包括将至少一层铜箔放置在含有液晶聚合物的树脂层上，使树脂层粘附在铜箔的表面， 铜箔的表面的镍浓度与铜浓度的比例为0.4以上，并且在用X射线光电子能谱测定时基本上没有检测到硅。 覆铜层压板即使在高温高湿环境下也能够充分地保持铜箔和树脂层之间的优异的粘附性。

公开(公告)号：US07572500B2

公开(公告)日：2009-08-11

申请号：US11882396

申请日：2007-08-01

Applicant: Toshihiro Nishii

Inventor： Toshihiro Nishii

IPC: H01K1/00

CPC classification number: H05K3/4069 ,  H05K3/382 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/0382 ,  H05K2201/091 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: A conductive portion is formed in a hole formed in a material sheet. A metal foil is placed on a surface of the material sheet to provide a laminated sheet. The laminated sheet is heated and pressed to provide a circuit-forming board. The metal foil includes a pressure absorption portion and a hard portion adjacent to the pressure absorption portion. The pressure absorption portion has a thickness changing according to a pressure applied thereto. The circuit-forming board provided by this method provides a high-density circuit board of high quality having reliable electrical connection.

Abstract translation: 导电部分形成在材料片中形成的孔中。 将金属箔放置在材料片的表面上以提供层压片。 将层压片材加热并加压以提供电路形成板。 金属箔包括压力吸收部分和与压力吸收部分相邻的硬部分。 压力吸收部的厚度根据施加到其上的压力而变化。 通过该方法提供的电路形成板提供了具有可靠的电连接的高质量的高密度电路板。

公开(公告)号：US07570491B2

公开(公告)日：2009-08-04

申请号：US10728591

申请日：2003-12-04

Applicant: Seok-Kyu Lee ,  Byoung-Youl Min ,  Chang-Hyun Nam ,  Hyun-Ju Jin ,  Jang-Kyu Kang

Inventor： Seok-Kyu Lee ,  Byoung-Youl Min ,  Chang-Hyun Nam ,  Hyun-Ju Jin ,  Jang-Kyu Kang

IPC: H05K1/02 ,  H05K1/16

CPC classification number: H05K1/162 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/09509 ,  H05K2203/1461

Abstract: Disclosed herein is a printed circuit board with embedded capacitors therein which comprises inner via holes filled with a high dielectric polymer capacitor paste composed of a composite of BaTiO3 and an epoxy resin, and a process for manufacturing the printed circuit board.

Abstract translation: 这里公开了一种其中具有嵌入式电容器的印刷电路板，其包括填充有由BaTiO 3和环氧树脂的复合材料组成的高介电聚合物电容器糊的内部通孔，以及用于制造印刷电路板的工艺。

公开(公告)号：US20090056982A1

公开(公告)日：2009-03-05

申请号：US11918975

申请日：2006-04-28

Applicant: Yasumasa Akatsuka ,  Shigeru Moteki ,  Makoto Uchida ,  Kazunori Ishikawa

Inventor： Yasumasa Akatsuka ,  Shigeru Moteki ,  Makoto Uchida ,  Kazunori Ishikawa

IPC: H05K1/00 ,  B32B38/00

CPC classification number: H05K1/0346 ,  H05K3/022 ,  H05K2201/0358 ,  H05K2203/0759 ,  Y10T156/10

Abstract: [Problems] To provide a process for producing a printed board having sufficient heat resistance. [Means for Solving Problems] The process for double-sided flexible printed board production comprising: a step in which a varnish comprising an aromatic resin represented by the following formula (1), an epoxy resin, and an organic solvent is directly applied to a metal foil; a step in which the solvent is removed to form a resin layer; and a step in which another foil is applied to the resin-layer side and the resin layer is cured. (In the formula, m and n are average value, m+n is a positive number of 2-200, and n is a positive number of 0.1 or larger; Ar1 and Ar3 each is a divalent aromatic group; and Ar2 is a divalent residue having a phenolic hydroxy group.)

Abstract translation: [问题]提供一种具有足够的耐热性的印刷电路板的制造方法。 解决问题的方法本发明的双面柔性印刷电路板的制造方法，其特征在于，包括：将由下述式（1）表示的芳香族树脂，环氧树脂和有机溶剂构成的清漆直接涂布在 金属箔 除去溶剂以形成树脂层的步骤; 并且将另一箔施加到树脂层侧并树脂层固化的步骤。 （式中，m和n为平均值，m + n为2〜200的正数，n为0.1以上的正数; Ar 1和Ar 3分别为二价芳香族基团，Ar 2为二价 具有酚羟基的残基）

公开(公告)号：US20090056118A1

公开(公告)日：2009-03-05

申请号：US12262261

申请日：2008-10-31

Applicant: Roger CHANG

Inventor： Roger CHANG

IPC: H05K3/30

CPC classification number: H05K1/187 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/186 ,  H05K3/28 ,  H05K3/4623 ,  H05K3/4652 ,  H05K2201/0358 ,  H05K2201/09536 ,  H05K2201/10674 ,  H05K2203/063 ,  H05K2203/068 ,  H05K2203/085 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method has acts of providing at least two multilayer circuit boards, combining the at least two multilayer circuit boards to form a combined multilayer circuit board, forming multiple outer conductive vias, circuits and contacts on the combined multilayer circuit board. Each multilayer circuit board is fabricated by steps of preparing a single-layer printed circuit board having multiple chip sections, attaching at least one chip to the corresponding chip section, attaching a frame having multiple enclosures to the single-layer printed circuit board, attaching a semi-fluid glue sheet to the frame, vacuum pressing a conductive layer on the semi-fluid glue sheet and forming multiple conductive inner vias through the multilayer circuit board. The at least two multilayer circuit boards are combined by steps of reversing one of the multilayer circuit boards and vacuum pressing other multilayer circuit boards on the reversed multilayer circuit board.

Abstract translation: 一种方法具有提供至少两个多层电路板的动作，组合至少两个多层电路板以形成组合的多层电路板，在组合的多层电路板上形成多个外部导电通孔，电路和触点。 每个多层电路板通过制备具有多个芯片部分的单层印刷电路板的步骤制造，将至少一个芯片附接到相应的芯片部分，将具有多个外壳的框架附接到单层印刷电路板， 半流体胶片到框架，真空挤压半流体胶片上的导电层，并通过多层电路板形成多个导电内通孔。 所述至少两个多层电路板通过反转多层电路板中的一个并在反向多层电路板上真空压制其它多层电路板的步骤组合。

公开(公告)号：US20090029186A1

公开(公告)日：2009-01-29

申请号：US11915038

申请日：2006-06-12

Applicant: Tetsuhiro Matsunaga

Inventor： Tetsuhiro Matsunaga

IPC: B21C37/02 ,  B05D3/02

CPC classification number: C23C28/00 ,  B05D2202/45 ,  B05D2350/65 ,  H05K3/384 ,  H05K3/386 ,  H05K3/389 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T428/12438 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/265 ,  Y10T428/27 ,  Y10T428/31663

Abstract: It is an object of the present invention to provide a surface-treated copper foil comprising an electrodeposited copper foil with a chromium-free rust-proofing layer which exhibits good performance in peel strength and resistance to peel loss after chemical treatment as a printed wiring board. To achieve this object, a surface-treated copper foil comprising an rust-proofing layer and a silane coupling agent layer formed on the bonding surface of an electrodeposited copper foil to an insulating resin substrate, wherein the rust-proofing layer comprises a nickel layer having a thickness by weight of 5 to 40 mg/m2 and a tin layer having a thickness by weight of 5 to 40 mg/m2 stacked in this order, and the rust-proofing layer is provided with the silane coupling layer on the surface is applied. Also a surface-treated copper foil coated with a very thin primer resin layer, comprising the surface-treated copper foil according to the present invention (without roughening treatment), and a very thin primer resin layer having a thickness by calculation of 0.5 to 5-micron meter provided on the bonding surface of the surface-treated copper foil to the insulating resin substrate is applied.

Abstract translation: 本发明的目的是提供一种表面处理铜箔，其包括具有无铬防锈层的电沉积铜箔，其作为印刷线路板在化学处理后表现出良好的剥离强度和耐剥离损失性能 。 为了实现该目的，在电解铜箔与绝缘树脂基板的接合面上形成有防锈层和硅烷偶联剂层的表面处理铜箔，其中，防锈层包括具有 按重量计5〜40mg / m 2，层叠厚度为5〜40mg / m2的锡层依次层叠，并且在其表面上设置有硅烷偶合层的防锈层 。 另外，涂覆有非常薄的底漆树脂层的表面处理铜箔，包括根据本发明的表面处理铜箔（不经粗糙化处理）和非常薄的底漆树脂层，其厚度计算为0.5至5 应用表面处理铜箔与绝缘树脂基板的接合面上的微米计。