公开(公告)号：US20090033443A1

公开(公告)日：2009-02-05

申请号：US11596559

申请日：2006-06-14

Applicant: Robert Brian Greed

Inventor： Robert Brian Greed

IPC: H01P5/00 ,  H05K3/10

CPC classification number: B81B7/007 ,  H01P3/10 ,  H05K1/0237 ,  H05K1/0306 ,  H05K3/107 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0376 ,  H05K2201/0715 ,  Y10T29/49155

Abstract: A circuit board is provided, and a method for manufacturing the same, suitable for use in high frequency circuits, and comprising a planar pattern of transmission line conductors for linking components formed on or within the circuit board, the transmission line conductors being formed within a corresponding pattern of trenches arranged so that the conductors lie beneath a finished surface of the circuit board which is polished flat to permit one or more cover boards to be bonded thereto.

Abstract translation: 提供一种电路板及其制造方法，适用于高频电路，并且包括用于连接形成在电路板上或电路板内的部件的传输线导体的平面图案，传输线导体形成在 沟槽的相应图案被布置成使得导体位于电路板的精加工表面之下，抛光平面以允许一个或多个盖板结合到其上。

公开(公告)号：US20080297422A1

公开(公告)日：2008-12-04

申请号：US12129087

申请日：2008-05-29

Applicant: Masaaki ISHIDA

Inventor： Masaaki ISHIDA

IPC: H01Q1/24 ,  H01Q9/04

CPC classification number: H01Q1/38 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01Q1/2266 ,  H05K1/0218 ,  H05K1/0237 ,  H05K1/16 ,  H05K1/185 ,  H05K3/4691 ,  H05K2201/0715 ,  H05K2201/09618 ,  H01L2924/00014

Abstract: An antenna device includes an antenna substrate 30 and a multilayer substrate 36 mounted on the antenna substrate 30. The antennal substrate 30 includes an insulating part 31, an antenna element 32 composed of a conductor pattern formed on a predetermined principal surface and a ground part 34 connected to the antenna element 32 electrically and formed on the principal surface. The multilayer substrate 36 includes a wiring pattern formed in an inside layer, an opening through which the wiring pattern is exposed on the side of one principal surface of the multilayer substrate 36, a plurality of through-holes formed so as to surround the opening and penetrate the inside layer of the multilayer substrate 36 while extending from the one principal surface and a ground layer 38 arranged to make contact with respective other ends of the through-holes and arranged in a position to interleave the wiring pattern against the opening. The antenna substrate 30 is electrically joined to the multilayer substrate 36 through the through-holes.

Abstract translation: 天线装置包括天线基板30和安装在天线基板30上的多层基板36.触角基板30包括绝缘部31，由形成在预定主面上的导体图案构成的天线元件32和接地部34 电连接到天线元件32并形成在主表面上。 多层基板36包括形成在内层中的布线图案，布线图案在多层基板36的一个主表面侧露出的开口，形成为围绕开口的多个通孔， 在从一个主表面延伸的同时穿透多层基板36的内层，以及布置成与通孔的相应另一端接触的接地层38，并且布置在将布线图案与开口交织的位置。 天线基板30通过通孔与多层基板36电连接。

公开(公告)号：US20080296048A1

公开(公告)日：2008-12-04

申请号：US12114455

申请日：2008-05-02

Applicant: Kiyomi Muro ,  Akihiko Happoya

Inventor： Kiyomi Muro ,  Akihiko Happoya

IPC: H05K1/00

CPC classification number: H05K1/0218 ,  H05K1/0237 ,  H05K1/0393 ,  H05K3/4664 ,  H05K2201/0715 ,  H05K2201/09236

Abstract: A flexible printed circuit board includes: a base film that has electrical insulation property; a conductive pattern that is formed on the base film and including a pair of differential signal lines and a ground line; an insulating layer that is formed on the conductive pattern; a conductive layer that is formed on the insulating layer; and a connecting portion that electrically connects the ground line and the conductive layer through a penetration hole formed on the insulating layer.

Abstract translation: 柔性印刷电路板包括：具有电绝缘性能的基膜; 导电图案，其形成在所述基底膜上并且包括一对差分信号线和接地线; 形成在所述导电图案上的绝缘层; 形成在所述绝缘层上的导电层; 以及连接部，其通过形成在所述绝缘层上的贯通孔将所述接地线与所述导电层电连接。

公开(公告)号：US20080283286A1

公开(公告)日：2008-11-20

申请号：US12019661

申请日：2008-01-25

Applicant: Mitsuru Honjo

Inventor： Mitsuru Honjo

IPC: H05K1/11 ,  H05K1/00

CPC classification number: H05K1/0218 ,  H05K1/0216 ,  H05K1/162 ,  H05K3/4664 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/09727

Abstract: A printed circuit board includes a base insulating layer, first to third signal lines, a first cover insulating layer and a conductive layer. Wide parts are formed in the first to third signal lines. The first cover insulating layer is provided on the base insulating layer so as to cover the wide parts. The conductive layer is provided on the first cover insulating layer so as to cover a portion above the wide parts.

Abstract translation: 印刷电路板包括基底绝缘层，第一至第三信号线，第一覆盖绝缘层和导电层。 在第一至第三信号线中形成宽部分。 第一覆盖绝缘层设置在基底绝缘层上以覆盖宽部分。 导电层设置在第一覆盖绝缘层上，以覆盖宽部分上方的部分。

公开(公告)号：US20080272982A1

公开(公告)日：2008-11-06

申请号：US12174960

申请日：2008-07-17

Applicant: Gregory J. Dunn ,  Robert T. Croswell ,  George H. Kumpf ,  John A. Svigelj

Inventor： Gregory J. Dunn ,  Robert T. Croswell ,  George H. Kumpf ,  John A. Svigelj

IPC: H01Q15/24

CPC classification number: H01Q15/006 ,  H05K1/116 ,  H05K1/162 ,  H05K1/165 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09509 ,  H05K2201/09609

Abstract: A high impedance surface (300) has a printed circuit board (302) with a first surface (314) and a second surface (316), and a continuous electrically conductive plate (319) disposed on the second surface (316) of the printed circuit board (302). A plurality of electrically conductive plates (318) is disposed on the first surface (314) of the printed circuit board (302), while a plurality of elements are also provided. Each element comprises at least one of (1) at least one multi-layer inductor (330, 331) electrically coupled between at least two of the electrically conductive plates (318) and embedded within the printed circuit board (302), and (2) at least one capacitor (320) electrically coupled between at least two of the electrically conductive plates (318). The capacitor (320) comprises at least one of (a) a dielectric material (328) disposed between adjacent electrically conductive plates, wherein the dielectric material (328) has a relative dielectric constant greater than 6, and (b) a mezzanine capacitor embedded within the printed circuit board (302).

Abstract translation: 高阻抗表面（300）具有带有第一表面（314）和第二表面（316）的印刷电路板（302）和设置在印刷的第二表面（316）上的连续导电板（319） 电路板（302）。 多个导电板（318）设置在印刷电路板（302）的第一表面（314）上，同时还提供多个元件。 每个元件包括（1）至少一个电耦合在至少两个导电板（318）之间并嵌入印刷电路板（302）内的多层电感器（330,331）中的至少一个，和（2 ）至少一个电耦合在至少两个导电板（318）之间的电容器（320）。 电容器（320）包括设置在相邻导电板之间的（a）介电材料（328）中的至少一个，其中介电材料（328）具有大于6的相对介电常数，以及（b）嵌入的夹层电容器 在印刷电路板（302）内。

公开(公告)号：US20080222827A1

公开(公告)日：2008-09-18

申请号：US12076239

申请日：2008-03-14

Applicant: Vijayen S. Veerasamy

Inventor： Vijayen S. Veerasamy

IPC: B60S1/06 ,  G08B21/20 ,  G01R27/26 ,  G01W1/14

CPC classification number: B60S1/0825 ,  B32B17/10036 ,  B32B17/10174 ,  B32B17/10761 ,  B32B17/10788 ,  B60S1/0822 ,  B60S1/087 ,  G01D5/2405 ,  H05K1/0218 ,  H05K1/0219 ,  H05K1/0298 ,  H05K1/162 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/0715 ,  H05K2201/09336 ,  H05K2201/09663

Abstract: A system and/or method for sensing the presence of moisture (e.g., rain) and/or other material(s) on a window such as a vehicle window (e.g., vehicle windshield, sunroof or backlite). In certain example embodiments, a plurality of sensing capacitors are supported by a window such as a vehicle windshield, the capacitors each having a different field and/or pattern. A sensing circuit outputs an analog signal that is based on and/or related to the capacitances of one or more of the sensing capacitors. In certain example embodiments, a flexible printed circuit board (PCB) mountable in or on a vehicle window is provided. First and second sensing circuits are formed on opposing sides of the flexible PCB, with each said sensing circuit comprising a plurality of different fractal structures. A ground plane is located between the first and second sensing circuits, with the ground plane being arranged so as to decouple the first and second capacitor arrays and to shield the first capacitor array from fields emanating from the second capacitor array and vice versa. The electronic device is configured to detect moisture on an exterior surface of the vehicle window, humidity on an interior surface of the vehicle window, and EMI.

Abstract translation: 用于感测窗户（例如车辆窗户（例如车辆挡风玻璃，天窗或背衬））上的湿气（例如雨）和/或其他材料的存在的系统和/或方法。 在某些示例性实施例中，多个感测电容器由诸如车辆挡风玻璃的窗户支撑，每个电容器具有不同的场和/或图案。 感测电路输出基于和/或与一个或多个感测电容器的电容相关的模拟信号。 在某些示例性实施例中，提供可安装在车窗中或其上的柔性印刷电路板（PCB）。 第一和第二感测电路形成在柔性PCB的相对侧上，每个所述感测电路包括多个不同的分形结构。 接地平面位于第一感测电路和第二感测电路之间，其中接地平面布置成使第一和第二电容器阵列去耦，并且使第一电容器阵列与从第二电容器阵列发出的场屏蔽起来，反之亦然。 电子设备被配置为检测车窗外表面的湿度，车窗内表面的湿度和EMI。

公开(公告)号：US20080176471A1

公开(公告)日：2008-07-24

申请号：US12005592

申请日：2007-12-26

Applicant: Masao Ogihara ,  Kazunori Nakajima

Inventor： Masao Ogihara ,  Kazunori Nakajima

IPC: D03D13/00

CPC classification number: D03D9/00 ,  D03D15/0011 ,  H05K1/0218 ,  H05K1/024 ,  H05K1/0366 ,  H05K2201/029 ,  H05K2201/0715 ,  H05K2201/09236 ,  Y10T442/3179

Abstract: According to the present invention, variations in characteristic impedance and transmission loss of a signal wiring in a glass cloth wiring substrate can be reduced. There is provided a glass cloth wiring substrate in which signal wirings, plural glass cloth layers, and conductor faces are laminated, and spaces between the signal wirings, the plural glass cloth layers, and the conductor faces are impregnated with resin, wherein the glass cloth layers are formed by weaving bundles of glass fibers in a lattice shape, and the adjacent glass cloth layers are laminated on each other while rotating the warp-weft directions of the glass fibers by a predetermined angle with respect to each other. It is preferable that the rotation angle of the warp-weft directions of the glass fibers of the adjacent glass cloth layers falls within a range from 30 to 60 degrees.

Abstract translation: 根据本发明，可以降低玻璃布线基板中的信号布线的特性阻抗和传输损耗的变化。 提供了层叠有信号布线，多个玻璃布层和导体面的玻璃布布线基板，信号布线，多个玻璃布层和导体面之间的空间用树脂浸渍，其中玻璃布 通过编织格子状的玻璃纤维束形成层，并且相邻的玻璃布层彼此层叠，同时使玻璃纤维的经纬方向相对于彼此旋转预定角度。 相邻玻璃布层的玻璃纤维的经向方向的旋转角度优选为30〜60度的范围。

公开(公告)号：US20080165514A1

公开(公告)日：2008-07-10

申请号：US11762365

申请日：2007-06-13

Applicant: Yong-won HWANG

Inventor： Yong-won HWANG

IPC: H05K3/00 ,  H05K7/02

CPC classification number: H05K1/0218 ,  H05K1/0298 ,  H05K2201/0715 ,  H05K2201/09345 ,  Y10T29/4913

Abstract: A printed circuit board (PCB) having a multi-layered structure for improving shielding against electromagnetic interference, the PCB including one or more signal layers and an outer grounding layer located on an outermost surface of the PCB. Accordingly, the radiation of electromagnetic waves to the outside from the outer grounding layer is prevented.

Abstract translation: 一种具有用于改善屏蔽电磁干扰的多层结构的印刷电路板（PCB），该PCB包括一个或多个信号层和位于该PCB的最外表面上的外部接地层。 因此，防止了从外部接地层向外部的电磁波的辐射。

公开(公告)号：US20080099230A1

公开(公告)日：2008-05-01

申请号：US11927144

申请日：2007-10-29

Applicant: Michimasa TAKAHASHI ,  Masakazu Aoyama

Inventor： Michimasa TAKAHASHI ,  Masakazu Aoyama

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/00

CPC classification number: H05K3/4691 ,  H05K1/0218 ,  H05K3/0035 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4664 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09509 ,  H05K2201/096 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer including an inorganic material and covering the flexible board and the non-flexible substrate, the insulating layer exposing at least one portion of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer.

Abstract translation: 弹性刚性布线板包括柔性基板，该柔性基板包括柔性基板和形成在柔性基板上的导体图案，邻近柔性基板设置的非柔性基板，包括无机材料并覆盖柔性基板的绝缘层和 非柔性基板，绝缘层暴露柔性板的至少一部分，形成在绝缘层上的导体图案，以及将柔性基板的导体图案与导体图案连接在绝缘层上的镀层。

公开(公告)号：US20080088007A1

公开(公告)日：2008-04-17

申请号：US11580444

申请日：2006-10-13

Applicant: Minh van Quach ,  Nurwati S. Devnani ,  Robert B. Manley

Inventor： Minh van Quach ,  Nurwati S. Devnani ,  Robert B. Manley

IPC: H01L23/52 ,  H01L21/00

CPC classification number: H05K1/0219 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2223/6638 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/19032 ,  H01L2924/19051 ,  H01L2924/3011 ,  H05K1/0237 ,  H05K2201/0715 ,  H05K2201/09236 ,  H01L2924/00

Abstract: Systems, devices and methods are disclosed herein for reducing crosstalk between pairs of differential signal conductors. One or more ground traces connected to one or more over- or under-lying ground planes by vias are located between pairs of differential signal conductors. The electrical shielding provided by the combination of the one or more ground traces and the one or more ground planes results in reduced cross-talk between different pairs of differential signal conductors, and facilitates high-speed data rates between integrated circuits and printed circuit boards. In a preferred embodiment, such ground traces and ground planes are employed in HiTCE packaging containing multiple pairs of differential signal conductors.

Abstract translation: 本文公开了用于减少差分信号导体对之间的串扰的系统，装置和方法。 通过通孔连接到一个或多个过或不足的接地层的一个或多个接地迹线位于差分信号导体对之间。 由一个或多个接地迹线和一个或多个接地平面的组合提供的电屏蔽导致不同差分信号导体对之间的串扰减少，并且有助于集成电路和印刷电路板之间的高速数据速率。 在优选实施例中，在包含多对差分信号导体的HiTCE封装中使用这种接地迹线和接地层。