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    Busbar interconnecting structure
    142.
    发明授权
    Busbar interconnecting structure 失效
    母线互连结构

    公开(公告)号：US5082463A

    公开(公告)日：1992-01-21

    申请号：US567522

    申请日：1990-08-15

    Applicant: Tetsuro Saimoto

    Inventor： Tetsuro Saimoto

    IPC: H01R4/58 ,  H02G3/16 ,  H05K3/40 ,  H05K7/02

    CPC classification number: H05K3/4084 ,  H05K7/026 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/0969 ,  H05K2201/10272 ,  H05K2201/1059 ,  H05K2203/063 ,  H05K3/4092

    Abstract: A busbar interconnecting structure consists of a tab formed integral with one busbar and a slot formed in another busbar. The two busbars are firmly connected by pressing the tab into the slot. The slot has the inner surfaces of its shorter sides formed in an arc so that even when the tab is inserted misaligned into the slot, a four-point contact is obtained at all times between the tab and the slot. The slot is also provided at the shorter sides with risers whose inner surfaces are also formed in an arc shape to increase the contact area between the tab and the slot, thus assuring a more stable electrical contact. The tab, when viewed in cross section, may be rounded at the shorter sides to match the curvature of the internal arc surfaces of the slot, thereby providing a still more stable surface contact.

    Interconnection apparatus for wiring harnesses
    144.
    发明授权
    Interconnection apparatus for wiring harnesses 失效
    线束互连装置

    公开(公告)号：US4685753A

    公开(公告)日：1987-08-11

    申请号：US843850

    申请日：1986-03-26

    Applicant: Isao Isshiki ,  Hitoshi Hayashi

    Inventor： Isao Isshiki ,  Hitoshi Hayashi

    IPC: H02G3/16 ,  H01R13/66 ,  H01R13/73 ,  H05K1/02 ,  H05K3/40 ,  H05K7/02 ,  H05K7/14 ,  H01R9/09

    CPC classification number: H01R23/68 ,  H05K1/0263 ,  H05K7/02 ,  H01R12/7088 ,  H01R13/66 ,  H05K2201/0352 ,  H05K2201/10272 ,  H05K3/4084

    Abstract: An apparatus for interconnecting functional component circuits and branch circuits of a wiring harness. A wiring board includes a plurality of tab contact members and mounted on one surface of the wiring board is a first printed-circuit board including a plurality of control element components forming functional component circuits. Also mounted on the other surface of the wiring board is a second printed-circuit board which includes the functional element components of the components forming the functional component circuits.

    Abstract translation: 一种用于互连线束的功能元件电路和分支电路的装置。 布线基板包括多个突片接触部件，并且安装在布线板的一个表面上，是包括形成功能元件电路的多个控制元件部件的第一印刷电路板。 还安装在布线板的另一个表面上的是第二印刷电路板，其包括形成功能元件电路的部件的功能元件部件。

    Bus bar bridged pc board for transitional termination of multiple cables and method
    145.
    发明授权
    Bus bar bridged pc board for transitional termination of multiple cables and method 失效
    母线桥接电路板，用于多条电缆的过渡终止和方法

    公开(公告)号：US4682828A

    公开(公告)日：1987-07-28

    申请号：US806347

    申请日：1985-12-06

    Applicant: Douglas E. Piper ,  Michael D. Black

    Inventor： Douglas E. Piper ,  Michael D. Black

    IPC: H01R12/62 ,  H05K1/02 ,  H05K1/11 ,  H05K3/36

    CPC classification number: H01R12/62 ,  H05K1/0263 ,  H01R12/778 ,  H05K1/117 ,  H05K2201/09354 ,  H05K2201/10272 ,  H05K3/361 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49181

    Abstract: A transitional printed circuit board (10) is disclosed for terminating four multiconductor flat electrial transmission cables (44, 46, 48, 50) wherein only a single substrate (12) is utilized. A first electrical plane (A) is formed on one side of the substrate and a second electrical plane (B) is formed on an opposing side of the substrate with the substrate material in between serving as an insulator. Each electrical plane includes a ground plane (26, 41) and spaced electrical lands (14, 16, 32 ,34). Plated through holes (24) allow the lands from opposing sides to be connected to the opposite side for programmed termination. A series of electrical pads (22, 42) provide for termination to the prongs (52a, 52b) of terminal connector (52). Two cables may be terminated on each electrical plane of the printed circuit board by terminating ground wires of the first cable to the ground plane (26, 41), and the signal wires to the electrical lands (14, 32). The next electrical cable is terminated by connecting signal wires to lands (16, 34). The ground wires of the second cable on each electrical plane are terminated at a bus bar bridge (28, 43) which spans electrical traces (18, 36) which interconnect spaced rows of lands.

    Abstract translation: 公开了一种过渡印刷电路板（10），用于端接四个多导体平面电传输电缆（44,46,48,50），其中仅使用单个基板（12）。 第一电平面（A）形成在基板的一侧上，并且第二电平面（B）形成在基板的相对侧上，其间的基板材料用作绝缘体。 每个电平面包括接地平面（26,41）和间隔开的电焊盘（14,16,32,34）。 电镀通孔（24）允许来自相对侧的焊盘连接到相对侧用于编程终止。 一系列电焊盘（22,42）提供终端连接器（52）的插脚（52a，52b）的端接。 两条电缆可以通过将第一电缆的接地线接地到地平面（26,41），并将信号导线连接到电焊盘（14,32），从而终止在印刷电路板的每个电平面上。 通过将信号线连接到平台（16,34）来终止下一个电缆。 每个电平面上的第二电缆的接地线终止于汇流排桥（28,43），母线桥（28,43）跨过互连间隔开的一排平台的电迹线（18,36）。

    Layer-built laminated bus embedding condensers
    148.
    发明授权
    Layer-built laminated bus embedding condensers 失效
    层压式总线嵌入电容器

    公开(公告)号：US4266091A

    公开(公告)日：1981-05-05

    申请号：US950266

    申请日：1978-10-10

    Applicant: Sunichi Fukuda

    Inventor： Sunichi Fukuda

    IPC: H01B7/00 ,  H02G5/00 ,  H05K1/18 ,  H05K3/40

    CPC classification number: H05K1/186 ,  H02G5/005 ,  H05K1/145 ,  H05K2201/10015 ,  H05K2201/10272 ,  H05K2201/10643 ,  H05K3/4611

    Abstract: A laminated bus bar comprises a pair of elongated flat conductors separated by a layer of insulating material which is provided with longitudinally spaced cut-outs. Capacitors which are comprised of a flat wafer of solid dielectric material are positioned in each of the cut-outs in the layer of insulating material and the capacitor plates are electrically and mechanically connected to the conductors.

    Abstract translation: 叠层母线包括一对细长扁平导体，隔开的绝缘材料层具有纵向隔开的切口。 由固体电介质材料的平坦晶片组成的电容器定位在绝缘材料层的每个切口中，并且电容器板电连接和机械连接到导体。

    Circuit module providing high density interconnections
    149.
    发明授权
    Circuit module providing high density interconnections 失效
    提供高密度互连的电路模块

    公开(公告)号：US3726989A

    公开(公告)日：1973-04-10

    申请号：US3726989D

    申请日：1970-07-27

    Applicant: HUGHES AIRCRAFT CO

    Inventor： LESLEY A

    IPC: H05K1/02 ,  H05K1/11 ,  H05K3/22 ,  H05K3/34 ,  H05K3/40 ,  H05K1/04

    CPC classification number: H05K1/0263 ,  H05K1/117 ,  H05K3/222 ,  H05K3/3447 ,  H05K3/403 ,  H05K3/4092 ,  H05K2201/10212 ,  H05K2201/10272 ,  H05K2201/10363 ,  H05K2201/10689

    Abstract: A multilayer conductor strip construction for interconnections in a circuit module is disclosed wherein narrow, flat and elongated sections of multilevel laminations retain the high density characteristic of multilayer construction and lateral extensions of flat conductors outside the laminations expose ends of the conductors at connection sites of a printed circuit board. Uniformly spaced holes in the circuit boards provide the sites for solder connections to circuit components positioned over the strips. The holes are arranged in parallel rows between conductor strips and are staggered to provide for high density interlacing of conductor ends projecting laterally from opposing sides of adjacent strips.

    Abstract translation: 公开了一种用于电路模块中的互连的多层导体条构造，其中多层叠片的狭窄，平坦和细长部分保持了多层结构的高密度特性，并且在叠片外部的扁平导体的横向延伸暴露在导体的连接位置处的端部 印刷电路板。 电路板中均匀间隔的孔提供了焊接连接到位于条上的电路元件的位置。 孔在导体条之间平行地布置并且交错以提供从相邻条的相对侧横向突出的导体端的高密度交织。

    Wire-routing system
    150.
    发明授权
    Wire-routing system 失效
    电线路由系统

    公开(公告)号：US3626086A

    公开(公告)日：1971-12-07

    申请号：US3626086D

    申请日：1970-04-28

    Applicant: COMPUTER IND INC

    Inventor： RUBEY ULYSS RAY

    IPC: H05K1/00 ,  H05K3/22 ,  H05K3/30 ,  H05K7/06 ,  H05K1/18

    CPC classification number: H05K3/301 ,  H05K1/0287 ,  H05K3/222 ,  H05K7/06 ,  H05K2201/10272 ,  H05K2201/10287 ,  H05K2201/10689

    Abstract: An improved wire-routing system for use with reflow wiring machines is disclosed in which the system includes a single-sided printed circuit board having a plurality of wire land pads and integrated circuit land pads located thereon. Wire routing fixtures are also adapted to be positioned on the circuit board; each fixture having a plurality of longitudinally spaced guides positioned near adjacent land pads for receiving portions of the insulated wire as it is strung or routed from one wire land pad to another. Each of the guides extends upwardly on a slant to enable the wire to be directed downwardly flush with the base of the fixture when routed thereby so as not to interfere with subsequent wiring in that area. Power busses are also provided for connection to any desired integrated circuit land pad. The power busses are formed as flat strips and are positioned beneath the fixtures in such a manner that they also do not interfere with the wire-routing operation.

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