公开(公告)号：US20150251285A1

公开(公告)日：2015-09-10

申请号：US14198646

申请日：2014-03-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Alfons Dehe ,  Reinhard Gabl ,  Ulrich Krumbein

IPC: B23Q3/18

CPC classification number: B23Q3/18 ,  B81B3/0072 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81C1/00158 ,  H04R7/18 ,  H04R17/00 ,  H04R19/005 ,  H04R31/003 ,  H04R2201/003 ,  H04R2307/207 ,  H04R2499/11

Abstract: A structure for fixing a membrane to a carrier including a carrier; a suspended structure; and a holding structure with a rounded concave shape which is configured to fix the suspended structure to the carrier and where a tapered side of the holding structure physically connects to the suspended structure is disclosed. A method of forming the holding structure on a carrier to support a suspended structure is further disclosed. The method may include: forming a holding structure on a carrier; forming a suspended structure on the holding structure; shaping the holding structure such that it has a concave shape; and arranging the holding structure such that a tapered side of the holding structure physically connects to the suspended structure.

Abstract translation: 一种用于将膜固定到包括载体的载体的结构; 悬挂式结构; 以及具有圆形凹形的保持结构，其被构造成将悬挂结构固定到托架上，并且其中保持结构的锥形侧物理连接到悬挂结构。 还公开了一种在载体上形成保持结构以支撑悬挂结构的方法。 该方法可以包括：在载体上形成保持结构; 在所述保持结构上形成悬挂结构; 使保持结构成形为具有凹形; 并且将所述保持结构布置成使得所述保持结构的锥形侧物理地连接到所述悬挂结构。

公开(公告)号：US09120668B2

公开(公告)日：2015-09-01

申请号：US14268536

申请日：2014-05-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Woo Park ,  Jong Woo Han ,  Tae Hyun Kim

IPC: B81B3/00 ,  B81B7/00 ,  B81B7/02

CPC classification number: B81B7/0077 ,  B81B7/0061 ,  B81B2201/0257

Abstract: There are provided a microphone package and a mounting structure thereof, allowing for an increase in a back volume, the microphone package including: a package substrate; an acoustic element mounted on the package substrate and having a space formed in a lower portion thereof; and at least one electronic component mounted on the package substrate and having a space formed in a lower portion thereof, wherein the package substrate includes an acoustic volume connecting the space of the acoustic element and the space of the electronic component.

Abstract translation: 提供了麦克风封装及其安装结构，允许增加背部体积，麦克风封装包括：封装基板; 声学元件，其安装在所述封装基板上并且具有形成在其下部的空间; 以及安装在所述封装基板上并具有形成在其下部的空间的至少一个电子部件，其中所述封装基板包括连接所述声学元件的空间和所述电子部件的空间的声学体积。

公开(公告)号：US09096423B1

公开(公告)日：2015-08-04

申请号：US14159742

申请日：2014-01-21

Applicant: Knowles Electronics, LLC

Inventor： Anthony D. Minervini

IPC: H01L21/00 ,  H04R31/00 ,  H01L23/12 ,  H04R11/04 ,  B81C1/00 ,  B81C3/00 ,  B81B7/00 ,  H01L23/10 ,  H04R19/04 ,  H04R19/00

CPC classification number: H04R1/2892 ,  B81B3/0021 ,  B81B7/0038 ,  B81B7/0058 ,  B81B7/0061 ,  B81B7/0064 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/092 ,  B81C1/00158 ,  B81C1/00301 ,  B81C3/00 ,  H01L21/78 ,  H01L23/10 ,  H01L23/15 ,  H01L2924/0002 ,  H01L2924/1461 ,  H04R1/04 ,  H04R1/222 ,  H04R3/00 ,  H04R19/005 ,  H04R19/016 ,  H04R19/04 ,  H04R23/00 ,  H04R31/006 ,  H04R2201/003 ,  H04R2225/49 ,  H04R2410/03 ,  Y10T29/49005 ,  Y10T29/4908 ,  Y10T29/49798 ,  H01L2924/00

Abstract: Methods for manufacturing multiple top port, surface mount microphones, each containing a micro-electro-mechanical system (MEMS) microphone die, are disclosed. Each surface mount microphone features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphones are manufactured from panels of substrates, sidewall spacers, and lids. Each MEMS microphone die is lid-mounted and acoustically coupled to the acoustic port disposed in the lid. The panels are joined together, and each individual substrate, sidewall spacer, and lid cooperate to form an acoustic chamber for its respective MEMS microphone die. The joined panels are then singulated to form individual MEMS microphones.

Abstract translation: 公开了制造多个顶端口表面贴装麦克风的方法，每个麦克风包含微机电系统（MEMS）麦克风管芯。 每个表面贴装麦克风都具有带有金属垫的基板，用于将封装表面安装到设备的印刷电路板上，并用于在麦克风封装和设备的电路板之间进行电气连接。 表面安装式麦克风由基板，侧壁间隔件和盖子的面板制成。 每个MEMS麦克风管芯被盖安装并且声耦合到设置在盖中的声学端口。 面板连接在一起，并且每个单独的基板，侧壁间隔件和盖子协作以形成用于其各自的MEMS麦克风管芯的声室。 然后将接合的面板分割成单个MEMS麦克风。

公开(公告)号：US09085012B2

公开(公告)日：2015-07-21

申请号：US13321947

申请日：2010-05-21

Applicant: Shuntaro Machida ,  Takashi Kobayashi

Inventor： Shuntaro Machida ,  Takashi Kobayashi

IPC: B06B1/02 ,  B81B3/00 ,  G01N29/24 ,  H04R19/00 ,  A61B8/00

CPC classification number: B06B1/0292 ,  A61B8/00 ,  A61B8/4483 ,  B81B3/0021 ,  B81B2201/0257 ,  G01N29/2406 ,  H04R19/005

Abstract: For disposing projections of insulating film protruding into a hollow part in CMUT in order to suppress injection of electrical charge into the insulating film due to contact of a lower surface of a membrane with a lower surface of the hollow part, there are provided a structure of disposed projections preferred for suppressing increase in driving voltage for CMUT and decrease in receiving sensitivity, and an ultrasonic diagnostic apparatus using the same. The ultrasonic transducer of the present invention comprises a first electrode, a lower insulating film formed on the first electrode, an upper insulating film provided so as to form a hollow part above the lower insulating film, and a second electrode formed on the upper insulating film, and is characterized in that the lower insulating film or the upper insulating film has projections on the side of the hollow part, and the first electrode or the second electrode has openings formed at positions corresponding to the positions at which the projections are formed.

Abstract translation: 为了在CMUT中设置突出于中空部分的绝缘膜的突起，以便由于膜的下表面与中空部分的下表面的接触而抑制将电荷注入到绝缘膜中，因此提供了一种结构 优选用于抑制CMUT的驱动电压的增加和接收灵敏度的降低的放置突起，以及使用该突起的超声波诊断装置。 本发明的超声波换能器包括第一电极，形成在第一电极上的下绝缘膜，设置成在下绝缘膜上形成中空部的上绝缘膜，以及形成在上绝缘膜上的第二电极 其特征在于，所述下绝缘膜或所述上绝缘膜在所述中空部的一侧具有突起，并且所述第一电极或所述第二电极具有形成在与形成所述突起的位置对应的位置的开口。

公开(公告)号：US20150191346A1

公开(公告)日：2015-07-09

申请号：US14659693

申请日：2015-03-17

Applicant: Amkor Technology, Inc.

Inventor： David Bolognia ,  Bob Shih-Wei Kuo ,  Bud Troche

IPC: B81B7/00

CPC classification number: B81B7/0061 ,  B81B7/0064 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/095 ,  H01L23/552 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/165 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: Methods and systems for a reversible top/bottom MEMS package may comprise a base substrate comprising metal traces, an opening through the base substrate, a die coupled to a first surface of the substrate and positioned over the opening, a frame member coupled to the first surface of the substrate wherein the die is positioned interior of the frame member, a cover substrate coupled to the frame member, and conductive plating on the frame member that electrically couples the base substrate to the cover substrate, wherein the conductive plating is exposed. The conductive plating may couple a ground plane in the base substrate to a ground plane in the cover substrate. The conductive plating may be exposed at an outer surface of the frame member and/or at an inner perimeter of the frame member. Conductive vias within the frame member may be coupled to the metal traces in the base substrate.

Abstract translation: 用于可逆的顶部/底部MEMS封装的方法和系统可以包括基底衬底，其包括金属迹线，通过基底衬底的开口，与衬底的第一表面连接并定位在开口上的模具，耦合到第一 基板的表面，其中模具位于框架构件的内部，连接到框架构件的盖基板和在框架构件上的导电电镀，其将基底基板电耦合到盖基板，其中导电电镀被暴露。 导电电镀可以将基底衬底中的接地平面耦合到覆盖衬底中的接地平面。 导电电镀可以在框架构件的外表面和/或在框架构件的内周边处露出。 框架构件内的导电孔可以连接到基底衬底中的金属迹线。

公开(公告)号：US09067780B1

公开(公告)日：2015-06-30

申请号：US14321525

申请日：2014-07-01

Applicant: Knowles Electronics, LLC

Inventor： Anthony D. Minervini

IPC: H01L21/00 ,  H04R31/00 ,  H04R11/04 ,  H01L23/12 ,  B81C1/00 ,  H04R19/04 ,  H01L21/78 ,  B81B7/00 ,  H01L23/10 ,  B81B3/00 ,  H04R19/00

CPC classification number: H04R1/2892 ,  B81B3/0021 ,  B81B7/0038 ,  B81B7/0058 ,  B81B7/0061 ,  B81B7/0064 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/092 ,  B81C1/00158 ,  B81C1/00301 ,  B81C3/00 ,  H01L21/78 ,  H01L23/10 ,  H01L23/15 ,  H01L2924/0002 ,  H01L2924/1461 ,  H04R1/04 ,  H04R1/222 ,  H04R3/00 ,  H04R19/005 ,  H04R19/016 ,  H04R19/04 ,  H04R23/00 ,  H04R31/006 ,  H04R2201/003 ,  H04R2225/49 ,  H04R2410/03 ,  Y10T29/49005 ,  Y10T29/4908 ,  Y10T29/49798 ,  H01L2924/00

Abstract: Methods for manufacturing multiple top port, surface mount microphones, each containing a micro-electro-mechanical system (MEMS) microphone die, are disclosed. Each surface mount microphone features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphones are manufactured from a panel of unsingulated substrates, and each MEMS microphone die is substrate-mounted. Individual covers, each with an acoustic port, are joined to the panel of unsingulated substrates, and each individual substrate and cover pair cooperates to form an acoustic chamber for its respective MEMS microphone die, which is acoustically coupled to the acoustic port in the cover. The completed panel is singulated to form individual MEMS microphones.

Abstract translation: 公开了制造多个顶端口表面贴装麦克风的方法，每个麦克风包含微机电系统（MEMS）麦克风管芯。 每个表面贴装麦克风都具有带有金属垫的基板，用于将封装表面安装到设备的印刷电路板上，并用于在麦克风封装和设备的电路板之间进行电气连接。 表面安装式麦克风是由一组不带键盘的基板制成的，每个MEMS麦克风模具都是基板安装的。 每个具有声学端口的单个盖子被连接到未弯曲的基板的面板，并且每个单独的基板和盖子对协作以形成用于其相应的MEMS麦克风管芯的声室，其声学耦合到盖子中的声学端口。 完成的面板被单独形成单个MEMS麦克风。

公开(公告)号：US09061893B1

公开(公告)日：2015-06-23

申请号：US14144089

申请日：2013-12-30

Applicant: Knowles Electronics, LLC

Inventor： Anthony D. Minervini

IPC: H01L21/00 ,  H04R31/00 ,  H01L23/12 ,  H04R11/04 ,  B81C1/00 ,  H04R3/00 ,  H01L23/10 ,  H01L23/15 ,  H04R19/04 ,  H04R1/04 ,  H04R19/01

CPC classification number: B81C1/00309 ,  B81B3/0021 ,  B81B7/0061 ,  B81B7/0064 ,  B81B2201/0257 ,  B81B2207/097 ,  B81C1/00301 ,  B81C1/00333 ,  B81C3/002 ,  H01L21/78 ,  H01L23/10 ,  H01L23/15 ,  H01L2924/0002 ,  H01L2924/1461 ,  H04R1/04 ,  H04R3/00 ,  H04R19/005 ,  H04R19/016 ,  H04R19/04 ,  H04R2225/49 ,  Y10T29/49005 ,  Y10T29/4908 ,  H01L2924/00

Abstract: The present invention relates to a surface mount package for a micro-electro-mechanical system (MEMS) microphone die and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components that simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the MEMS microphone die is mechanically attached, providing an interior surface for making electrical connections between the MEMS microphone die and the package, and providing an exterior surface for surface mounting the microphone package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The manufacturing process uses an unsingulated panel of individual substrates, each substrate having metal pads on its top and bottom surfaces, an unsingulated panel of individual sidewall spacers, and an unsingulated panel of individual lids. A MEMS microphone die is mounted on each substrate in the unsingulated panel of substrates, and the substrate panel, the sidewall panel, and the lid panel are joined together into a single panel, which is then singulated into individual MEMS microphones.

Abstract translation: 本发明涉及用于微机电系统（MEMS）麦克风模具的表面安装封装以及用于制造表面贴装封装的方法。 表面安装封装使用有限数量的部件，其简化制造并降低成本，并且具有执行传统上需要多个部件的功能的基板，包括提供MEMS麦克风管芯机械连接的内表面，提供内部 表面，用于在MEMS麦克风管芯和封装之间进行电连接，并且提供用于将麦克风封装件表面安装到器件的印刷电路板的外表面，以及用于在麦克风封装和器件的电路板之间进行电连接。 制造过程使用单个基板的无镶嵌面板，每个基板在其顶部和底部表面上具有金属垫，单个侧壁间隔件的无凹凸面板以及单个盖子的无镶嵌面板。 MEMS麦克风管芯安装在基板的未镶嵌面板中的每个基板上，并将基板面板，侧壁面板和盖板连接在一起成为单个面板，然后将其单独分割成各个MEMS麦克风。

公开(公告)号：US09056760B2

公开(公告)日：2015-06-16

申请号：US13520923

申请日：2011-01-24

Applicant: Gregor Feiertag ,  Hans Krueger ,  Wolfgang Pahl ,  Anton Leidl

Inventor： Gregor Feiertag ,  Hans Krueger ,  Wolfgang Pahl ,  Anton Leidl

IPC: H01L29/72 ,  B81B7/00 ,  B81C1/00 ,  G01L9/00 ,  H01L23/10 ,  H04R19/04 ,  H01L23/552 ,  H01L23/00 ,  H01L25/065

CPC classification number: B81B7/0061 ,  B81B2201/0257 ,  B81B2207/012 ,  B81C1/00238 ,  B81C1/00309 ,  G01L9/0073 ,  H01L23/10 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/131 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/27438 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32145 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/83825 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01029 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/163 ,  H01L2924/181 ,  H04R19/04 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/014 ,  H01L2924/00

Abstract: The invention relates to a miniaturized electrical component comprising an MEMS chip and an ASIC chip. The MEMS chip and the ASIC chip are disposed on top of each other; an internal mounting of MEMS chip and ASIC chip is connected to external electrical terminals of the electrical component by means of vias through the MEMS chip or the ASIC chip.

Abstract translation: 本发明涉及包括MEMS芯片和ASIC芯片的小型化电气部件。 MEMS芯片和ASIC芯片设置在彼此的顶部; MEMS芯片和ASIC芯片的内部安装通过MEMS芯片或ASIC芯片的通孔连接到电气部件的外部电气端子。

公开(公告)号：US20150146894A1

公开(公告)日：2015-05-28

申请号：US14088747

申请日：2013-11-25

Applicant: Infineon Technologies AG

Inventor： Chee Yang Ng

IPC: H04R1/08 ,  B81C1/00

CPC classification number: H04R19/005 ,  B81B2201/0257 ,  B81C1/0023 ,  B81C1/00238 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48471 ,  H04R19/04 ,  H04R2499/11 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A semiconductor device includes a microphone module implemented on a first semiconductor die and a signal processing module implemented on a second semiconductor die. The microphone module includes a movable microphone element arranged at a main side of the first semiconductor die and the second semiconductor die is mounted to the main side of the first semiconductor die.

Abstract translation: 半导体器件包括实现在第一半导体管芯上的麦克风模块和在第二半导体管芯上实现的信号处理模块。 麦克风模块包括布置在第一半导体管芯的主侧的可移动的麦克风元件，并且第二半导体管芯安装到第一半导体管芯的主侧。

公开(公告)号：US09029963B2

公开(公告)日：2015-05-12

申请号：US14034986

申请日：2013-09-24

Applicant: Andrew Sparks ,  Todd M. Borkowski

Inventor： Andrew Sparks ,  Todd M. Borkowski

IPC: H01L29/84 ,  H01L21/00 ,  B81B3/00 ,  B81C1/00

CPC classification number: H04R17/02 ,  B81B3/0018 ,  B81B2201/0257 ,  B81C1/00158 ,  B81C2201/0191 ,  G01L9/008 ,  H04R2201/003

Abstract: Mechanical resonating structures, as well as related devices and methods of manufacture. The mechanical resonating structures can be microphones, each including a diaphragm and a piezoelectric stack. The diaphragm can have one or more openings formed therethrough to enable the determination of an acoustic pressure being applied to the diaphragm through signals emitted by the piezoelectric stack.

Abstract translation: 机械共振结构，以及相关设备和制造方法。 机械谐振结构可以是麦克风，每个麦克风包括隔膜和压电叠层。 隔膜可以具有穿过其中形成的一个或多个开口，以使得能够通过由压电叠层发射的信号来确定施加到隔膜的声压。