Abstract:
An electromagnetic radiation shutter device driven by electrostatic forces comprises a stationary membrane capable of allowing electromagnetic radiation transmission therethrough, and a first and second flexible membrane comprising an electrode element and at least one biasing element. The first flexible membrane has a fixed portion attached to the underside of the stationary membrane and a distal portion adjacent to the fixed portion and released from the underside of the stationary membrane. The second flexible membrane has a fixed portion attached to the topside of the stationary membrane and a distal portion adjacent to the fixed portion and released from the topside of the stationary membrane. In operation, a voltage differential is established between the electrode element of the first flexible membrane and the electrode element of the second flexible membrane thereby moving the first and second flexible membranes relative to the stationary membrane. In a closed state (i.e. fully activated), the flexible membranes will be generally parallel to the stationary membrane and will be capable of deflecting electromagnetic radiation. In an open state (i.e. no voltage applied), the flexible membranes will generally be fully curled based on biasing in the flexible membranes induced during fabrication and/or imparted by material characteristics.
Abstract:
A wet and vapor acid etching method releases a microelectromechanical systems (MEMS) structure from a substrate by dissolving a sacrificial layer disposed between the MEMS and the substrate. The sacrificial layer may be a silicon dioxide (SiO2) layer having a field portion over which the MEMS does not extend and a support portion over which the MEMS does extend. The field portion of the SiO2 layer is quickly removed using conventional wet hydrofluoric (HF) etching followed by rinsing and drying and then the support portion is removed using conventional vapor HF etching from a solution greater than 45% by weight percent. The wet HF chemical etch quickly removes the large field portion of the sacrificial layer. The HF vapor etch removes the small support portion of the sacrificial layer below the MEMS to release the MEMS from the substrate without stiction thereby preventing damage to the MEMS when released.
Abstract:
A movable mass forming a seismic mass is formed starting from an epitaxial layer and is covered by a weighting region of tungsten which has high density. To manufacture the mass, buried conductive regions are formed in the substrate. Then, at the same time, a sacrificial region is formed in the zone where the movable mass is to be formed and oxide insulating regions are formed on the buried conductive regions so as to partially cover them. An epitaxial layer is then grown, using a nucleus region. A tungsten layer is deposited and defined and, using a silicon carbide layer as mask, the suspended structure is defined. Finally, the sacrificial region is removed, forming an air gap.
Abstract:
In order to easily and accurately manufacture a micromachine comprising a member which is made of a single-crystalline material and having a complicated structure, an uppermost layer (1104) of a single-crystalline Si substrate (1102) whose (100) plane is upwardly directed is irradiated with Ne atom currents from a plurality of prescribed directions, so that the crystal orientation of the uppermost layer (1104) is converted to such orientation that the (111) plane is upwardly directed. A masking member (106) is employed as a shielding member to anisotropically etch the substrate (1102) from its bottom surface, thereby forming a V-shaped groove (1112). At this time, the uppermost layer (1104) serves as an etching stopper. Thus, it is possible to easily manufacture a micromachine having a single-crystalline diaphragm having a uniform thickness. A micromachine having a complicated member such as a diagram which is made of a single-crystalline material can be easily manufactured through no junction.
Abstract:
In order to easily and accurately manufacture a micromachine comprising a member which is made of a single-crystalline material and having a complicated structure, an uppermost layer (1104) of a single-crystalline Si substrate (1102) whose (100) plane is upwardly directed is irradiated with Ne atom currents from a plurality of prescribed directions, so that the crystal orientation of the uppermost layer (1104) is converted to such orientation that the (111) plane is upwardly directed. A masking member (106) is employed as a shielding member to anisotropically etch the substrate (1102) from its bottom surface, thereby forming a V-shaped groove (1112). At this time, the uppermost layer (1104) serves as an etching stopper. Thus, it is possible to easily manufacture a micromachine having a single-crystalline diaphragm having a uniform thickness. A micromachine having a complicated member such as a diaphragm which is made of a single-crystalline material can be easily manufactured through no junction.
Abstract:
A process for forming one or more fluid microchannels on a substrate is disclosed that is compatible with the formation of integrated circuitry on the substrate. The microchannels can be formed below an upper surface of the substrate, above the upper surface, or both. The microchannels are formed by depositing a covering layer of silicon oxynitride over a mold formed of a sacrificial material such as photoresist which can later be removed. The silicon oxynitride is deposited at a low temperature (.ltoreq.100.degree. C.) and preferably near room temperature using a high-density plasma (e.g. an electron-cyclotron resonance plasma or an inductively-coupled plasma). In some embodiments of the present invention, the microchannels can be completely lined with silicon oxynitride to present a uniform material composition to a fluid therein. The present invention has applications for forming microchannels for use in chromatography and electrophoresis. Additionally, the microchannels can be used for electrokinetic pumping, or for localized or global substrate cooling.
Abstract:
A sensor having high sensitivity is formed using a suspended structure with a high-density tungsten core. To manufacture it, a sacrificial layer of silicon oxide, a polycrystal silicon layer, a tungsten layer and a silicon carbide layer are deposited in succession over a single crystal silicon body. The suspended structure is defined by selectively removing the silicon carbide, tungsten and polycrystal silicon layers. Then spacers of silicon carbide are formed which cover the uncovered ends of the tungsten layer, and the sacrificial layer is then removed.
Abstract:
A method for fabricating metal micropatterns. Trenches are introduced into a polymer layer. These trenches are filled with the metal micropatterns using an electroplating process. Before the deposition of the metal micropatterns, the side walls of the trenches are covered with insulating layers which adhere to the metal micropatterns after the polymer layer is removed.
Abstract:
In an accelerometer sensor of crystalline material, whose components are composed partly of monocrystalline and partly of polycrystalline material, a band-shaped seismic mass preferably is composed of polycrystalline material, whose suspension by means of suspension segments of monocrystalline material at the end regions permits a movement in the longitudinal direction upon the occurrence of an acceleration. Parallel plates extend from this mass at right angles to their longitudinal direction and, together with additional plates, which run parallel to said plates and are anchored at a base, form a capacitor arrangement and are composed, in particular, of monocrystalline material. At least the monocrystalline material is doped to attain an electric conductivity. When lightly doped, the long and thin plates and suspension segments have a high conductivity, given a very small mechanical prestressing, and can easily be isotropically undercut. The polycrystalline formation of the seismic mass can be designed to be very wide and large by etching away an underlying sacrificial oxide.
Abstract:
An inventive method for the manufacture of an array of thin film actuated mirrors includes the steps of: providing an active matrix; forming a plurality of insulating layers having a planarized top surface on top of the active matrix; forming a thin film sacrificial layer having an array of empty cavities on the planarized top surface of the plurality of insulating layers; forming an array of actuating structures on top of the thin film sacrificial layer including the empty cavities, each of the actuating structures including a first thin film electrode, a thin film electrodisplacive member, a second thin film electrode, an elastic member and a conduit; and removing the thin film sacrificial layer, thereby forming the array of thin film actuated mirrors. Since the thin film layers constituting each of the actuating structures are formed on the planarized top surface of the insulating layers, the thin film layers constituting each of the actuating structures are flat, allowing the first thin film electrode placed on top thereof, which also acts as a mirror, to have a flat top surface, thereby increasing the overall optical efficiency and performance of the array.