中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

232 records (took 0.027 seconds)

    Apparatus and method for bonding anisotropic conductive film using laser beam
    151.
    发明申请
    Apparatus and method for bonding anisotropic conductive film using laser beam 审中-公开
    使用激光束粘合各向异性导电膜的设备和方法

    公开(公告)号：US20080047663A1

    公开(公告)日：2008-02-28

    申请号：US11977396

    申请日：2007-10-24

    Applicant: Gi-Jung Nam ,  No-Heung Kwak

    Inventor： Gi-Jung Nam ,  No-Heung Kwak

    IPC: B29C65/16

    CPC classification number: H05K3/323 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H05K3/3494 ,  H05K3/361 ,  H05K2201/0108 ,  H05K2201/0112 ,  H05K2203/0278 ,  H05K2203/107 ,  H01L2224/0401

    Abstract: An anisotropic conductive film bonding apparatus and a method using a laser beam instead of thermal welding using a hot bar are disclosed. The apparatus includes a light source for generating a laser beam, a laser beam transmitter for guiding the laser beam from the light source to project the laser beam onto a connecting portion, a jig, on which the substrate, the ACF, and the material are accumulated, for projecting the laser beam on the accumulated material, a manipulation panel, and a controller for setting intensity and projection manner of the laser beam and pressure and for controlling overall operation of the apparatus. The process using the hot bar as a heat source for the connection of the anisotropic conductive film is replaced with the process using a diode laser, so that reliability and precision of the process can be achieved, the processing time can be also reduced, and full-automated process can enhance productivity

    Abstract translation: 公开了各向异性导电膜接合装置和使用激光束代替使用热棒的热焊接的方法。 该装置包括用于产生激光束的光源，用于引导来自光源的激光束以将激光束投影到连接部分上的激光束发射器，其上基板，ACF和材料在其上的夹具 累积，用于将激光束投射在累积材料上，操纵面板和控制器，用于设置激光束的强度和投影方式和压力，并用于控制设备的整体操作。 使用热棒作为用于连接各向异性导电膜的热源的方法被使用二极管激光器的工艺替代，从而可以实现工艺的可靠性和精度，还可以减少处理时间，并且满足 自动过程可以提高生产率

    Forming a patterned metal layer using laser induced thermal transfer method
    152.
    发明申请
    Forming a patterned metal layer using laser induced thermal transfer method 有权
    使用激光诱导热转印法形成图案化的金属层

    公开(公告)号：US20060263725A1

    公开(公告)日：2006-11-23

    申请号：US11130772

    申请日：2005-05-17

    Applicant: Kelvin Nguyen ,  Zhihao Yang

    Inventor： Kelvin Nguyen ,  Zhihao Yang

    IPC: G03C5/00

    CPC classification number: H05K3/046 ,  H05K2201/0112 ,  H05K2201/0257 ,  H05K2203/0528 ,  H05K2203/107

    Abstract: A method of forming a pattern of electrical conductors on a receiving substrate (110) comprises forming metal nanoparticles of a conductive material. A donor substrate (45) is formed. A layer of release material (75) is deposited on a first side of the donor substrate. The metal nanoparticles are deposited on the release material. The metal nanoparticulate layer are placed in contact with the receiving substrate. A pattern is written on a sandwich formed by the donor substrate and the receiving substrate, causing metal nanoparticles from the nanoparticulate layer (90) to anneal and transfer to the receiving substrate to form the pattern of electrical conductors on the receiving substrate.

    Abstract translation: 在接收基板（110）上形成电导体图案的方法包括形成导电材料的金属纳米颗粒。 形成供体衬底（45）。 释放材料层（75）沉积在施主衬底的第一侧上。 金属纳米颗粒沉积在剥离材料上。 将金属纳米颗粒层放置成与接收衬底接触。 将图案写在由施主基板和接收基板形成的夹层上，使得纳米颗粒层（90）的金属纳米颗粒退火并转移到接收基板，以在接收基板上形成电导体图案。

    Copper clad laminate
    155.
    发明授权
    Copper clad laminate 失效
    覆铜层压板

    公开(公告)号：US06833198B2

    公开(公告)日：2004-12-21

    申请号：US10203837

    申请日：2002-08-14

    Applicant: Masaru Sakamoto ,  Kouji Kitano

    Inventor： Masaru Sakamoto ,  Kouji Kitano

    IPC: B32B1508

    CPC classification number: H05K3/0038 ,  H05K3/384 ,  H05K2201/0112 ,  H05K2201/0355 ,  H05K2203/0307 ,  Y10S428/935 ,  Y10T29/49078 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T428/12361 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12569 ,  Y10T428/12993

    Abstract: There is provided a copper clad laminate which makes laser beam drilling extremely easy and is suitable for forming an interlayer connection microhole by improving a surface of its copper foil, which is to be used as the surface which a laser beam enters, in the production of printed circuit boards. Specifically, the copper clad laminate is such that it includes electrodeposited copper foil for use in the laser beam drilling and is characterized in that the matte side of the above electrodeposited copper foil is used as the surface which the laser beam enters.

    Abstract translation: 提供了一种覆铜层压板，其使得激光束钻孔非常容易，并且适于通过改进其用作激光束进入的表面的铜箔的表面来形成中间连接微孔，以生产 印刷电路板。 具体地，覆铜层压板包括用于激光束钻孔的电沉积铜箔，其特征在于将上述电沉积铜箔的无光泽面用作激光束进入的表面。

    Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole
    156.
    发明申请
    Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole 审中-公开

    公开(公告)号：US20040182819A1

    公开(公告)日：2004-09-23

    申请号：US10813232

    申请日：2004-03-31

    Inventor： Morio Gaku ,  Nobuyuki Ikeguchi ,  Yasuo Tanaka ,  Yoshihiro Kato

    IPC: H01B013/00

    CPC classification number: H05K3/0038 ,  B23K26/18 ,  H05K1/0373 ,  H05K3/427 ,  H05K2201/0112 ,  H05K2201/0215 ,  H05K2201/0323 ,  H05K2203/1383

    Abstract: A method of making a small-diameter through hole having high reliability with regard to a hole wall at a high rate with the energy of a high-output carbon dioxide gas laser without pre-making any hole in a copper foil, forming or disposing a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900null C. and a bond energy of at least 300 KJ/mol on at least a copper foil surface to be irradiated with the carbon dioxide gas laser, and irradiating a surface thereof with necessary pulses of the carbon dioxide gas laser to form the penetration hole, and an auxiliary material for use when a penetration hole is made in the copper-clad laminate with a carbon dioxide gas laser, the auxiliary material being a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900null C. and a bond energy of at least 300 KJ/mol.

    Sensor circuit module and electronic device using the same
    157.
    发明授权
    Sensor circuit module and electronic device using the same 有权
    传感器电路模块和电子设备使用相同

    公开(公告)号：US06770956B2

    公开(公告)日：2004-08-03

    申请号：US10127478

    申请日：2002-04-23

    Applicant: Katsumi Fujimoto ,  Keiichi Okano ,  Masato Koike

    Inventor： Katsumi Fujimoto ,  Keiichi Okano ,  Masato Koike

    IPC: H01L23552

    CPC classification number: H04N5/23258 ,  G01C19/56 ,  H01L2224/73204 ,  H04N5/23248 ,  H05K1/02 ,  H05K1/141 ,  H05K3/403 ,  H05K2201/0112 ,  H05K2201/09145 ,  H05K2201/09181 ,  H05K2201/10151

    Abstract: A vibration gyro which is a sensor circuit module includes a packaging substrate, a vibrator mounted on the substrate, a chip type semiconductor element mounted by flip-chip bonding, a chip element, and a cover. The portion of the end surfaces of the packaging substrate in which no through-hole terminals are formed is coated with a light-shielding coating material which is a light-transmission-stopping member. Preferably, the color of the light-shielding coating material is as dark as possible, and is black, if possible.

    Abstract translation: 作为传感器电路模块的振动陀螺仪包括封装基板，安装在基板上的振动器，通过倒装芯片接合安装的芯片型半导体元件，芯片元件和盖。 在其中没有形成通孔端子的封装基板的端面的一部分涂覆有作为光传输阻止部件的遮光涂层材料。 优选地，遮光涂层材料的颜色尽可能暗，并且如果可能的话是黑色的。

    Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole
    158.
    发明授权
    Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole 有权
    用激光制作通孔的方法，适合制作孔的覆铜层压板，以及用于制作孔的辅助材料

    公开(公告)号：US06750422B2

    公开(公告)日：2004-06-15

    申请号：US10028734

    申请日：2001-12-28

    Applicant: Morio Gaku ,  Nobuyuki Ikeguchi ,  Yasuo Tanaka ,  Yoshihiro Kato

    Inventor： Morio Gaku ,  Nobuyuki Ikeguchi ,  Yasuo Tanaka ,  Yoshihiro Kato

    IPC: B23K2600

    CPC classification number: H05K3/0038 ,  B23K26/18 ,  H05K1/0373 ,  H05K3/427 ,  H05K2201/0112 ,  H05K2201/0215 ,  H05K2201/0323 ,  H05K2203/1383

    Abstract: A method of making a small-diameter through hole having high reliability with regard to a hole wall at a high rate with the energy of a high-output carbon dioxide gas laser without pre-making any hole in a copper foil, forming or disposing a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900° C. and a bond energy of at least 300 KJ/mol on at least a copper foil surface to be irradiated with the carbon dioxide gas laser, and irradiating a surface thereof with necessary pulses of the carbon dioxide gas laser to form the penetration hole, and an auxiliary material for use when a penetration hole is made in the copper-clad laminate with a carbon dioxide gas laser, the auxiliary material being a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900° C. and a bond energy of at least 300 KJ/mol.

    Abstract translation: 一种制造小孔直径通孔的方法，其具有高孔率的孔壁，高速率地输出高输出二氧化碳气体激光器的能量，而不在铜箔中预先制造任何孔，形成或布置 包含或含有3至97体积％的至少一种选自熔点为900℃以上的金属化合物粉末，碳粉末和金属粉末的粉末的有机物的片材，以及 至少在300KJ / mol的键能上至少要用二氧化碳气体激光器照射的铜箔表面，并用二氧化碳气体激光器的必要脉冲照射其表面以形成贯通孔，辅助 在用二氧化碳气体激光器在覆铜层压板中形成贯通孔时使用的材料，辅助材料是含有3〜97体积％的至少一种粉末的涂层或片材，所述粉末选自 G 该组合物由金属化合物粉末，碳粉末和金属粉末组成，其熔点至少为900℃，结合能为至少300KJ / mol。

    Copper-clad laminated sheet
    160.
    发明申请
    Copper-clad laminated sheet 失效
    覆铜层压板

    公开(公告)号：US20030093899A1

    公开(公告)日：2003-05-22

    申请号：US10203837

    申请日：2002-08-14

    Inventor： Masaru Sakamoto ,  Kouji Kitano

    IPC: H01F003/04

    CPC classification number: H05K3/0038 ,  H05K3/384 ,  H05K2201/0112 ,  H05K2201/0355 ,  H05K2203/0307 ,  Y10S428/935 ,  Y10T29/49078 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T428/12361 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12569 ,  Y10T428/12993

    Abstract: There is provided a copper clad laminate which makes laser beam drilling extremely easy and is suitable for forming an interlayer connection microhole by improving a surface of its copper foil, which is to be used as the surface which a laser beam enters, in the production of printed circuit boards. Specifically, the copper clad laminate is such that it includes electrodeposited copper foil for use in the laser beam drilling and is characterized in that the matte side of the above electrodeposited copper foil is used as the surface which the laser beam enters.

    Abstract translation: 提供了一种覆铜层压板，其使得激光束钻孔非常容易，并且适于通过改进其用作激光束进入的表面的铜箔的表面来形成中间连接微孔，以生产 印刷电路板。 具体地，覆铜层压板包括用于激光束钻孔的电沉积铜箔，其特征在于将上述电沉积铜箔的无光泽面用作激光束进入的表面。

Patent Agency Ranking