公开(公告)号：US20140021400A1

公开(公告)日：2014-01-23

申请号：US13994287

申请日：2011-12-15

Applicant: Christopher Coenjarts

Inventor： Christopher Coenjarts

IPC: C09K13/06

CPC classification number: C09K13/06 ,  C03C15/00 ,  C09D11/30 ,  C09D11/38 ,  C23F1/00 ,  C23F1/02 ,  C23F1/30 ,  H05K3/067 ,  H05K2201/0108 ,  H05K2201/026

Abstract: The present invention relates to a novel printable paste composition and its use in etching conductive films formed by a plurality of interconnecting silver nano-wires. After etching, the conductive film has a pattern of conductive and non-conductive areas with low visibility. The etched films are suitable as a transparent electrode in visual display devices such as touch screens, liquid crystal displays, plasma display panels and the like.

Abstract translation: 本发明涉及一种新型可印刷糊剂组合物及其在蚀刻由多个互连银纳米线形成的导电膜中的用途。 在蚀刻之后，导电膜具有导电性和非导电性的图像，其可见度低。 在诸如触摸屏，液晶显示器，等离子体显示面板等的视觉显示装置中，蚀刻膜适合作为透明电极。

公开(公告)号：US08481860B2

公开(公告)日：2013-07-09

申请号：US13155341

申请日：2011-06-07

Applicant: Yoon-Jin Kim ,  Chang-Mo Ko ,  Ho-Souk Cho

Inventor： Yoon-Jin Kim ,  Chang-Mo Ko ,  Ho-Souk Cho

IPC: H05K1/09

CPC classification number: H01B1/22 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/174 ,  C01B2202/06 ,  C01B2202/28 ,  C01B2202/34 ,  C01B2202/36 ,  C08K3/04 ,  C08K3/08 ,  C08K9/02 ,  C09D7/62 ,  C09D7/67 ,  C09D7/68 ,  C09D7/70 ,  C09D17/004 ,  H01B1/24 ,  H05K1/097 ,  H05K2201/0221 ,  H05K2201/026 ,  H05K2201/0272 ,  Y10T428/24612

Abstract: A conductive paste composition is provided. The conductive paste composition includes 20 to 70 weight % of silver nanoparticles having an average particle size of 1 nm to 250 nm based on a total weight of the conductive paste composition, and 0.01 to 2 weight % of silver-decorated carbon nanotubes based on the total weight of the conductive paste composition.

Abstract translation: 提供导电糊组合物。 导电性糊剂组合物包含20〜70重量％的平均粒径为1nm〜250nm的导电糊剂组合物的银纳米粒子，以及0.01〜2重量％的银装饰碳纳米管 导电糊组合物的总重量。

公开(公告)号：US08440158B2

公开(公告)日：2013-05-14

申请号：US12195844

申请日：2008-08-21

Applicant: Cheng-Hsien Lin ,  Yao-Wen Bai ,  Rui Zhang ,  Wen-Chin Lee

Inventor： Cheng-Hsien Lin ,  Yao-Wen Bai ,  Rui Zhang ,  Wen-Chin Lee

IPC: D01F9/12 ,  H01B1/04 ,  H05K3/00

CPC classification number: H05K3/424 ,  B82Y10/00 ,  C23C18/1204 ,  C23C18/127 ,  C23C18/1287 ,  H05K3/427 ,  H05K2201/026 ,  H05K2201/0323

Abstract: A pre-plating solution for making a printed circuit board includes carbon nanotubes of 0.01-3 wt %, a surfactant of 0.01-4 wt %, an alkaline substance of 0.01-1 wt % and a solvent. A method for preparing a pre-plating solution comprising the steps of: providing a plurality of carbon nanotubes; purifying the carbon nanotubes; treating the purified carbon nanotubes with an acid; mixing the treated carbon nanotubes, an alkaline substance and a solvent to form suspension; and adding surfactant into suspension.

Abstract translation: 用于制造印刷电路板的预镀溶液包括0.01-3重量％的碳纳米管，0.01-4重量％的表面活性剂，0.01-1重量％的碱性物质和溶剂。 一种制备预镀液的方法，包括以下步骤：提供多个碳纳米管; 纯化碳纳米管; 用酸处理纯化的碳纳米管; 混合处理的碳纳米管，碱性物质和溶剂以形成悬浮液; 并将表面活性剂加入悬浮液中。

公开(公告)号：US08420722B2

公开(公告)日：2013-04-16

申请号：US12476925

申请日：2009-06-02

Applicant: Yong Sung Eom ,  Jong Tae Moon ,  Sangwon Oh ,  Keonsoo Jang

Inventor： Yong Sung Eom ,  Jong Tae Moon ,  Sangwon Oh ,  Keonsoo Jang

IPC: B60C1/00

CPC classification number: H05K13/0465 ,  B23K3/0623 ,  B23K35/24 ,  B23K35/34 ,  B23K35/3601 ,  B23K35/3613 ,  B23K2101/36 ,  B82Y10/00 ,  H01L24/29 ,  H01L24/30 ,  H01L24/83 ,  H01L2224/1141 ,  H01L2224/1152 ,  H01L2224/1184 ,  H01L2224/16238 ,  H01L2224/27416 ,  H01L2224/2784 ,  H01L2224/3003 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81355 ,  H01L2224/83886 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3484 ,  H05K3/46 ,  H05K2201/026 ,  H05K2201/10977 ,  Y10T29/49117 ,  Y10T29/49126

Abstract: Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.

公开(公告)号：US08372726B2

公开(公告)日：2013-02-12

申请号：US12686076

申请日：2010-01-12

Applicant: Bassel de Graff ,  William J. Arora ,  Gilman Callsen ,  Roozbeh Ghaffari

Inventor： Bassel de Graff ,  William J. Arora ,  Gilman Callsen ,  Roozbeh Ghaffari

IPC: H01L21/30 ,  H01L29/40

CPC classification number: H01L21/30 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14645 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3011 ,  H05K1/0283 ,  H05K2201/026 ,  H05K2201/09263 ,  H05K2201/10106 ,  H01L2924/00

Abstract: System, devices and methods are presented that provide an imaging array fabrication process method, comprising fabricating an array of semiconductor imaging elements, interconnecting the elements with stretchable interconnections, and transfer printing the array with a pre-strained elastomeric stamp to a secondary non-planar surface.

公开(公告)号：US08320133B1

公开(公告)日：2012-11-27

申请号：US11951100

申请日：2007-12-05

Applicant: Harold S. Fenger ,  Ike Y. Chang ,  Richard W. Nichols

Inventor： Harold S. Fenger ,  Ike Y. Chang ,  Richard W. Nichols

IPC: H05K1/00

CPC classification number: H05K1/00 ,  H05K1/0306 ,  H05K3/0058 ,  H05K3/4691 ,  H05K2201/026 ,  H05K2201/056

Abstract: According to one embodiment, a circuit board comprises an anisotropic film disposed outwardly from a first flexible dielectric layer, and a second flexible dielectric layer disposed outwardly from the anisotropic film. The first and second flexible dielectric layers each have at least one conductive trace conductively coupled to a pad. The anisotropic film forms a via region that conductively couples the pad of the first flexible dielectric layer to the pad of the second flexible dielectric layer, and electrically isolates the conductive trace of the first flexible dielectric layer from the conductive trace of the second flexible dielectric layer.

Abstract translation: 根据一个实施例，电路板包括从第一柔性介电层向外设置的各向异性膜和从各向异性膜向外设置的第二柔性介电层。 第一和第二柔性介电层各自具有至少一个传导性迹线，导电性地耦合到焊盘。 各向异性膜形成通孔区，其导电地将第一柔性介电层的焊盘耦合到第二柔性介电层的焊盘，并且将第一柔性介电层的导电迹线与第二柔性介电层的导电迹线电隔离 。

公开(公告)号：US08309857B2

公开(公告)日：2012-11-13

申请号：US12875184

申请日：2010-09-03

Applicant: Masaki Goto ,  Akihiko Takeda ,  Kazuaki Nakamura

Inventor： Masaki Goto ,  Akihiko Takeda ,  Kazuaki Nakamura

IPC: H05K1/09

CPC classification number: H05K3/06 ,  H01L51/442 ,  H05K1/095 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2203/121 ,  Y02E10/549 ,  Y02P70/521 ,  Y10T29/4921 ,  Y10T29/49211 ,  Y10T428/12063

Abstract: Disclosed is a method of manufacturing a pattern electrode which excels in electroconductivity, transparency and etching property and a pattern electrode, the method comprising a step of applying a metal particle containing solution onto a substrate to form a conductive layer, a step of pattern printing a metal particle removing solution on a portion of the conductive layer, which is to be removed, and a step of washing the resulting printed material, whereby the portion of the conductive layer on which the metal particle removing solution has been printed is removed to form a non-conductive portion.

Abstract translation: 公开了一种制造导电性，透明性和蚀刻性优异的图形电极的方法以及图案电极，所述方法包括将含金属颗粒的溶液涂布在基板上以形成导电层的步骤，图案印刷步骤 将要除去的导电层的一部分上的金属颗粒去除溶液和洗涤所得印刷材料的步骤，从而去除已经印刷有金属颗粒去除溶液的导电层的部分以形成 非导电部分。

公开(公告)号：US08293577B2

公开(公告)日：2012-10-23

申请号：US12923590

申请日：2010-09-29

Applicant: Yuji Awano ,  Masataka Mizukoshi

Inventor： Yuji Awano ,  Masataka Mizukoshi

IPC: H01L21/44

CPC classification number: H05K3/325 ,  B82Y10/00 ,  H01L24/12 ,  H01L24/16 ,  H01L24/90 ,  H01L2224/1134 ,  H01L2224/13193 ,  H01L2224/13582 ,  H01L2224/13693 ,  H01L2224/16237 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81345 ,  H01L2224/81385 ,  H01L2224/81899 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K2201/026 ,  H05K2201/09472 ,  H05K2201/209 ,  H01L2224/13099 ,  H01L2224/0401

Abstract: A semiconductor package is disclosed that includes a semiconductor device; a circuit board; and a connection mechanism including a first conductive terminal provided on the semiconductor device, and a second conductive terminal provided on the circuit board side, the connection mechanism electrically connecting the semiconductor device and the circuit board via the first conductive terminal and the second conductive terminal. At least one of the first conductive terminal and the second conductive terminal of the connection mechanism includes one or more carbon nanotubes each having one end thereof fixed to the surface of the at least one of the first conductive terminal and the second conductive terminal, and extending in a direction away from the surface. The first conductive terminal and the second conductive terminal engage each other through the carbon nanotubes.

Abstract translation: 公开了一种包括半导体器件的半导体封装; 电路板; 以及连接机构，其包括设置在所述半导体器件上的第一导电端子和设置在所述电路板侧的第二导电端子，所述连接机构经由所述第一导电端子和所述第二导电端子电连接所述半导体器件和所述电路板。 连接机构的第一导电端子和第二导电端子中的至少一个包括一个或多个碳纳米管，每个碳纳米管的一端固定到第一导电端子和第二导电端子中的至少一个的表面，并且延伸 在远离表面的方向上。 第一导电端子和第二导电端子通过碳纳米管彼此接合。

公开(公告)号：US08288655B2

公开(公告)日：2012-10-16

申请号：US12258453

申请日：2008-10-27

Applicant: Ra-Min Tain ,  Ming-Ji Dai

Inventor： Ra-Min Tain ,  Ming-Ji Dai

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/00 ,  H05K7/20

CPC classification number: H05K1/053 ,  B82Y10/00 ,  H05K2201/0179 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2203/025

Abstract: A circuit board structure and a manufacturing method thereof are provided. The circuit board structure includes a composite substrate, a dielectric layer, and a circuit layer. The composite substrate includes a metal substrate doped with non-metal powders and a metal buffer layer. A surface of the metal buffer layer opposite to the other surface of the metal buffer layer in contact with the metal substrate is treated by a polishing process. The dielectric layer is formed on the polished surface of the metal buffer layer, and the circuit layer is formed on the dielectric layer. Alternatively, a barrier layer is interposed between the dielectric layer and the metal buffer layer for preventing a diffusion effect of the metal buffer layer.

Abstract translation: 提供一种电路板结构及其制造方法。 电路板结构包括复合衬底，电介质层和电路层。 复合衬底包括掺杂有非金属粉末和金属缓冲层的金属衬底。 通过抛光处理处理与金属基板接触的金属缓冲层的另一表面相对的金属缓冲层的表面。 电介质层形成在金属缓冲层的抛光表面上，电介质层形成在电介质层上。 或者，在电介质层和金属缓冲层之间插入阻挡层，以防止金属缓冲层的扩散效应。

公开(公告)号：US20120258302A1

公开(公告)日：2012-10-11

申请号：US13082831

申请日：2011-04-08

Applicant: Robert N. Hunt ,  Charles Todd Williams

Inventor： Robert N. Hunt ,  Charles Todd Williams

IPC: B32B27/04 ,  C08F2/50 ,  B05D3/06 ,  B82Y30/00

CPC classification number: B82Y30/00 ,  G01L1/205 ,  H05K1/0393 ,  H05K1/167 ,  H05K2201/026 ,  H05K2201/0323 ,  Y10T428/24995

Abstract: The present invention relates to a flexible sensing material made from (a) at least one flexible polymeric layer and (b) at least one conductive, curable coating layer containing about 0.01 wt. % to about 5 wt. % of multi-walled carbon nanotubes having a diameter of greater than about 4 nm, about 10 wt. % to about 99 wt. % of an aliphatic urethane acrylate and about 0.1 wt. % to about 15 wt. % of a photoinitiator, wherein the weight percentages are based on the weight of the formulation, wherein the coating layer is curable by exposure to radiation and wherein the cured coating layer has a surface resistivity of about 102Ω/□ to about 1010Ω/□. The inventive sensing material may prove useful for sensing one or more of pressure, temperature and moisture and find use in a wide variety of applications.

Abstract translation: 本发明涉及由（a）至少一个柔性聚合物层制成的柔性感测材料，和（b）至少一种含有约0.01重量％ ％至约5wt。 ％的直径大于约4nm的多壁碳纳米管，约10wt。 ％至约99wt。 ％的脂族聚氨酯丙烯酸酯和约0.1wt。 ％至约15wt。 ％的光引发剂，其中所述重量百分比基于制剂的重量，其中所述涂层通过暴露于辐射而可固化，并且其中所述固化涂层的表面电阻率为约102Ω/□至约1010Ω。 。 本发明的传感材料可用于感测压力，温度和湿度中的一种或多种，​​并且可用于各种应用中。