公开(公告)号：US07260806B2

公开(公告)日：2007-08-21

申请号：US11167264

申请日：2005-06-28

Applicant: Kenji Fukuzono ,  Hideaki Yoshimura

Inventor： Kenji Fukuzono ,  Hideaki Yoshimura

IPC: G06F17/50 ,  G06F19/00

CPC classification number: H05K3/0005 ,  G06F17/5018 ,  G06F2217/80 ,  H05K1/0271 ,  H05K2201/068

Abstract: The present invention provides a printed wiring board design aiding apparatus, method, and program that can easily and inexpensively predict the displacement of a printed wiring board of complicated shape and configuration due to temperature change. The printed wiring board design aiding program makes a computer execute the steps including a mesh division step that divides an analytical model of a printed wiring board obtained as data into meshes, a mesh displacement calculation step that calculates displacements of respective meshes of a printed wiring board which is divided in the mesh division step, a mesh displacement connection step that connects mesh displacements calculated in the mesh displacement calculation step so that the inclination of borders of respective meshes become equal, and a displacement calculation step that calculates a displacement using an entire displacement of a printed wiring board which is obtained in the mesh displacement connection step.

Abstract translation: 本发明提供一种印刷线路板设计辅助装置，方法和程序，其可以容易且廉价地预测由于温度变化而导致的复杂形状和结构的印刷线路板的位移。 印刷线路板设计辅助程序使得计算机执行包括将作为数据获得的印刷线路板的分析模型划分成网格的网格分割步骤的步骤，网格位移计算步骤，其计算印刷线路板的各个网格的位移 其在网格划分步骤中被划分为网格位移连接步骤，其连接在网格位移计算步骤中计算的网格位移，使得各个网格的边界的倾斜度相等;以及位移计算步骤，其使用整个位移计算位移 在网格位移连接步骤中获得的印刷线路板。

公开(公告)号：US20070190882A1

公开(公告)日：2007-08-16

申请号：US11352863

申请日：2006-02-13

Applicant: Ta-Hua Yu ,  Guangda Shi

Inventor： Ta-Hua Yu ,  Guangda Shi

IPC: B32B15/08 ,  B32B15/14

CPC classification number: B32B15/08 ,  B29K2079/085 ,  B32B5/024 ,  B32B7/02 ,  B32B15/20 ,  B32B27/12 ,  B32B27/281 ,  B32B27/285 ,  B32B37/0015 ,  B32B2262/101 ,  B32B2305/18 ,  B32B2311/00 ,  B32B2457/08 ,  H05K1/0366 ,  H05K1/0393 ,  H05K3/022 ,  H05K2201/0129 ,  H05K2201/029 ,  H05K2201/068 ,  H05K2203/068 ,  Y10T442/3415 ,  Y10T442/3447

Abstract: Disclosed is a method for preparing a laminate less than or equal to about 98 micrometers in thickness and having substantially diminished curling which comprises the steps of (i) providing a metal foil, a thermoplastic resin film and a woven fabric, and (ii) laminating the thermoplastic resin film between the metal foil and woven fabric, wherein the combination of thermoplastic and fabric has a coefficient of thermal expansion that differs from the coefficient of thermal expansion of the metal foil by less than about 30 ppm. Also disclosed are laminates comprising a thermoplastic resin film between a layer of metal foil and a layer of woven fabric. Also disclosed are laminates consisting of either a polyetherimide film and a woven glass fabric or consisting of a layer of woven glass fabric with a layer of polyetherimide film laminated to each side of the fabric. Articles comprising a laminate of the invention are also disclosed.

Abstract translation: 公开了一种制备厚度小于或等于约98微米并且具有基本上减小的卷曲的层压体的方法，其包括以下步骤：（i）提供金属箔，热塑性树脂膜和机织织物，和（ii）层压 金属箔和织物之间的热塑性树脂膜，其中热塑性和织物的组合具有与金属箔的热膨胀系数不同的热膨胀系数小于约30ppm。 还公开了包括在金属箔层和机织织物层之间的热塑性树脂膜的层压体。 还公开了由聚醚酰亚胺膜和机织玻璃织物组成或由层压在织物的每一侧上的具有聚醚酰亚胺膜层的机织玻璃织物层组成的层压体。 还公开了包含本发明的层压体的制品。

公开(公告)号：US07253504B1

公开(公告)日：2007-08-07

申请号：US11010784

申请日：2004-12-13

Applicant: Jun Zhai ,  Jinsu Kwon ,  Richard C. Blish, II

Inventor： Jun Zhai ,  Jinsu Kwon ,  Richard C. Blish, II

IPC: H01L23/48 ,  H01L23/12 ,  H05K1/11 ,  H01R12/04

CPC classification number: H05K3/4641 ,  H01L21/563 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/3025 ,  H05K1/0271 ,  H05K2201/0352 ,  H05K2201/068 ,  H01L2924/00

Abstract: An integrated circuit package includes a substrate having a central axis dividing the substrate into an upper half and a lower half and an integrated circuit coupled to the substrate. A layer is provided within the substrate in the lower half thereof that is configured to resist warpage of the integrated circuit package, the layer provided a distance from the central axis.

Abstract translation: 集成电路封装包括具有将基板划分为上半部和下半部的中心轴以及耦合到基板的集成电路的基板。 在其下半部分中的衬底内设置有层，其被配置为抵抗集成电路封装的翘曲，该层与中心轴线设置一段距离。

公开(公告)号：US20070169886A1

公开(公告)日：2007-07-26

申请号：US10591580

申请日：2005-03-01

Applicant: Takuo Watanabe ,  Yu Matsumoto

Inventor： Takuo Watanabe ,  Yu Matsumoto

IPC: B32B15/04 ,  B32B27/38

CPC classification number: H05K1/036 ,  B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B2250/02 ,  B32B2307/206 ,  B32B2307/306 ,  B32B2307/308 ,  B32B2307/734 ,  B32B2457/08 ,  B32B2457/14 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/068 ,  Y10T428/31504 ,  Y10T428/31511 ,  Y10T428/31678 ,  Y10T428/31721

Abstract: Disclosed are a heat-resistant resin laminate film comprising a heat-resistant insulating film such as a polyimide film and a heat-resistant resin layer laminated thereon, which laminate film is free from warp; and a laminate film with a metal layer, comprising a heat-resistant insulating film and a metal layer laminated thereon through a heat-resistant resin layer, which laminate film with a metal layer is free from warp in the state that a circuit pattern is formed. In the heat-resistant resin laminate film, a heat-resistant resin layer is laminated on at least one surface of the heat-resistant insulating film, wherein the heat-resistant resin layer has a coefficient of linear expansion kA (ppm/° C.) within the range of k−10≦kA≦k+20 (k: coefficient of linear expansion of the heat-resistant insulating film). The laminate film with a metal layer is one obtained by laminating the metal layer on the heat-resistant resin layer of the heat-resistant resin laminate film.

Abstract translation: 公开了一种耐热树脂层压膜，其包含层压在其上的聚酰亚胺膜和耐热树脂层之类的耐热绝缘膜，该层压膜不翘曲; 以及具有金属层的层压膜，其包含耐热绝缘膜和通过耐热树脂层层合在其上的金属层，该层压膜与金属层在形成电路图案的状态下没有翘曲 。 在耐热性树脂层叠膜中，在耐热性绝缘膜的至少一个面上层叠耐热性树脂层，耐热树脂层的线膨胀系数kA（ppm /℃） ）在k-10 <= kA <= k + 20的范围内（k：耐热绝缘膜的线膨胀系数）。 具有金属层的层压膜是通过将耐热树脂层压膜的耐热树脂层上的金属层层压而成的层压膜。

公开(公告)号：US20070147005A1

公开(公告)日：2007-06-28

申请号：US10587480

申请日：2005-03-11

Applicant: Kouji Harada ,  Hiroatsu Tokuda ,  Kazuo Ojima ,  Masayuki Kobayashi

Inventor： Kouji Harada ,  Hiroatsu Tokuda ,  Kazuo Ojima ,  Masayuki Kobayashi

IPC: H05K7/20

CPC classification number: H01L23/3735 ,  H01L23/36 ,  H01L2224/32225 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/341 ,  H05K2201/068 ,  H05K2201/10416

Abstract: The invention provides a heat sink board and a manufacturing method thereof, which can realize a high product accuracy and superior productivity. To that end, a second heat sink (3) having a smaller linear expansion coefficient than that of a first heat sink (2) is bonded to the first heat sink (2) to form a heat sink board. The second heat sink (3) is fitted to the first heat sink (2), and a material of the first heat sink (2) in the vicinity of a boundary between the fitted heat sinks is plastically deformed for close adhesion to the second heat sink (3). Such a forming method makes bonding between the first and second heat sinks possible at room temperature, and the heat sink board made of a composite member having a high flat-surface accuracy can be easily and reliably obtained.

Abstract translation: 本发明提供一种散热板及其制造方法，能够实现高的产品精度和优异的生产率。 为此，具有比第一散热器（2）的线膨胀系数小的第二散热器（3）被接合到第一散热器（2）以形成散热板。 第二散热器（3）安装在第一散热器（2）上，并且在装配的散热器之间的边界附近的第一散热器（2）的材料被塑性变形以与第二散热器 水槽（3）。 这样的形成方法能够使室温下的第一散热器和第二散热器之间进行接合，能够容易且可靠地获得由平面精度高的复合部件构成的散热板。

公开(公告)号：US20070126095A1

公开(公告)日：2007-06-07

申请号：US11607312

申请日：2006-11-30

Applicant: Hisashi Tanie

Inventor： Hisashi Tanie

IPC: H01L23/495

CPC classification number: H05K1/0366 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K1/036 ,  H05K1/181 ,  H05K2201/0287 ,  H05K2201/068 ,  H05K2201/10734

Abstract: A semiconductor device has a semiconductor package with a semiconductor element is mounted on a mounting substrate. The mounting substrate has at least two anisotropic areas which are located at both sides of a semiconductor package mounting area in a way to sandwich it and have an anisotropic linear expansion coefficient. In the anisotropic areas, a linear expansion coefficient in a direction toward a center of the semiconductor package mounting area is larger than a linear expansion coefficient in an in-plane direction of the mounting substrate perpendicular to the direction and larger than a linear expansion coefficient of the semiconductor package mounting area in a direction toward the anisotropic areas. The semiconductor device makes it possible to reduce thermal deformation of a semiconductor package mounting area of a mounting substrate easily and at low cost.

Abstract translation: 具有半导体元件的半导体封装的半导体器件安装在安装基板上。 安装基板具有至少两个各向异性区域，其位于半导体封装安装区域的两侧，以夹持它并具有各向异性线性膨胀系数。 在各向异性区域中，朝向半导体封装安装区域的中心的方向的线膨胀系数大于垂直于方向的安装基板的面内方向的线膨胀系数，大于线膨胀系数 半导体封装安装区域朝向各向异性区域的方向。 半导体器件能够容易地且以低成本降低安装基板的半导体封装安装区域的热变形。

公开(公告)号：US07225538B2

公开(公告)日：2007-06-05

申请号：US10035633

申请日：2001-12-28

Applicant: Benjamin Niles Eldridge ,  Gary William Grube ,  Igor Yan Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin Niles Eldridge ,  Gary William Grube ,  Igor Yan Khandros ,  Gaetan L. Mathieu

IPC: H01R43/16

CPC classification number: H05K7/1069 ,  B23K20/004 ,  B23K2101/40 ,  C23C18/31 ,  C23C18/32 ,  C23C18/38 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/6715 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/67288 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/78 ,  H01L24/81 ,  H01L24/85 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13082 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/16145 ,  H01L2224/45015 ,  H01L2224/45109 ,  H01L2224/45111 ,  H01L2224/45116 ,  H01L2224/4512 ,  H01L2224/45123 ,  H01L2224/45124 ,  H01L2224/45138 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45163 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45176 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48599 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49174 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/00012 ,  H01L2924/20752 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/01204 ,  H01L2924/013 ,  H01L2924/01004 ,  H01L2924/01048

Abstract: Contact structures exhibiting resilience or compliance are formed. The contact structures may be formed on a sacrificial substrate. The contact structures are attached to an array of electrical connections on a substrate to form a contact assembly. The electrical connections on the substrate may be metallic pads.

Abstract translation: 形成表现出弹性或顺应性的接触结构。 接触结构可以形成在牺牲衬底上。 接触结构附接到基底上的电连接阵列以形成接触组件。 基板上的电连接可以是金属焊盘。

公开(公告)号：US20070080441A1

公开(公告)日：2007-04-12

申请号：US11206568

申请日：2005-08-18

Applicant: Scott Kirkman ,  Bidyut Sen

Inventor： Scott Kirkman ,  Bidyut Sen

IPC: H01L23/02

CPC classification number: H01L23/5385 ,  H01L23/50 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/32145 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06589 ,  H01L2924/01019 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/0271 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/049 ,  H05K2201/068 ,  H05K2201/10734 ,  H05K2201/10977

Abstract: An apparatus and method for connecting one substrate, such as a semiconductor die, to an opposing substrate, such as a semiconductor package or circuit board, through a plurality of intermediate thermal compensator devices, each of which can incrementally and/or locally mitigate the stresses imposed by differences in the two substrate's thermal expansion characteristics. The compensator devices can be coupled to one another, with the resulting assembly attached to the first substrate on one side, and to the second substrate on the other side, through solder bump attach, or some equivalent method. The method of the invention provides electrical connection and thermal dissipation between the two substrates as well as providing mechanical protection by absorbing the stresses imposed by the difference in thermal expansion characteristics of the two substrates.

Abstract translation: 通过多个中间热补偿装置将诸如半导体管芯的一个基板，诸如半导体封装或电路板的一个基板连接到相对的基板上的装置和方法，每个中间热补偿装置可以递增地和/或局部地缓解应力 由两个基板的热膨胀特性的差异引起。 补偿器装置可以彼此耦合，其中所得的组件在一侧附接到第一衬底，而在另一侧上连接到第二衬底，通过焊料凸块附着或一些等效的方法。 本发明的方法提供了两个基板之间的电连接和热耗散，并且通过吸收由两个基板的热膨胀特性差引起的应力来提供机械保护。

公开(公告)号：US07202154B2

公开(公告)日：2007-04-10

申请号：US10707693

申请日：2004-01-05

Applicant: Jon A. Casey ,  Brian R. Sundlof

Inventor： Jon A. Casey ,  Brian R. Sundlof

IPC: H01L21/4763

CPC classification number: H05K3/4061 ,  H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/092 ,  H05K2201/068 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A metallization process and material system for metallizing either blind or through vias in silicon, involving forming a low coefficient of thermal expansion composite or suspension, relative to pure metals, such as copper, silver, or gold, and filling the via holes in the silicon with the paste or suspension. The suspensions sinter with minimal bulk shrinkage, forming highly conductive structures without the formation of macroscopic voids. The selected suspension maintains a coefficient of thermal expansion closer to that of silicon.

公开(公告)号：US07200930B2

公开(公告)日：2007-04-10

申请号：US11256514

申请日：2005-10-19

Applicant: Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: H01R43/00 ,  H05K3/00 ,  G01R1/067

CPC classification number: B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/06716 ,  G01R1/06744 ,  G01R1/07378 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/04042 ,  H01L2224/1134 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73251 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/328 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2203/049 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49179 ,  Y10T29/49204 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/72

Abstract: An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.

Abstract translation: 一种互连接触结构组件，包括具有表面的电子部件和由电子部件承载并可在表面处接触的导电接触。 接触结构包括具有第一端和第二端的内部柔性细长构件，并且第一端在不使用单独的接合材料的情况下形成与所述导电接触端子的表面的第一紧密结合。 提供导电外壳，并且由至少一层导电材料形成，该导电材料层包围细长构件，并与紧邻第一紧密接合的导电接触端子的至少一部分形成第二紧密接合。