Abstract:
The present invention, roughly described, pertains to a small memory card that includes features which allow the memory card to be more easily handled by a user. In various embodiments, the memory card can include a chamfer and/or a raised portion that allows the memory card to be more easily grabbed by a human hand (or mechanical device) and also provides additional room to store passive devices such as capacitors and/or resistors. Because different electronic devices use different types of memory cards, an adaptor is provided that allows the memory cards disclosed herein to be used in ports or connectors on electronic devices that are meant for other types of memory cards.
Abstract:
The present invention, roughly described, pertains to a small memory card that includes features which allow the memory card to be more easily handled by a user. In various embodiments, the memory card can include a chamfer and/or a raised portion that allows the memory card to be more easily grabbed by a human hand (or mechanical device) and also provides additional room to store passive devices such as capacitors and/or resistors. Because different electronic devices use different types of memory cards, an adaptor is provided that allows the memory cards disclosed herein to be used in ports or connectors on electronic devices that are meant for other types of memory cards.
Abstract:
The invention relates to a circuit carrier and a method for producing it, the circuit carrier having a substrate with two oppositely arranged areas. The terminal contacts of a flat connector strip are arranged in the edge regions of the areas. A through contact is arranged under at least one of the terminal contacts with concealed electrical connection to the rear side of the terminal contact and the top side of the terminal contact exhibits an undisturbed morphology and planar surface.
Abstract:
Provided are thin-laminate panels (i.e., thin-laminate panels having dielectric layers of about 0.006 inches or less and conductive layers on either side of the dielectric layer), wherein the edges of the dielectric layers of the panels are free of conductive material, such as copper. The thin-laminate panel is designed to provide necessary capacitance for all or a substantial number of the integrated circuits to be formed thereon. Finishing methods for treating unfinished thin-laminate panels into finished thin-laminate panels assure that the edges of the dielectric layer of the panel are substantially free of conductive material.
Abstract:
A card edge connector comprises a connector body and a conductive pad, and is constructed such that the conductive pad terminates at a predetermined distance from the end of the tip portion of the connector body, and that there is further provided a protective pad, adjacent to the terminating portion of the conductive pad, which is formed at the same time with the formation of a wiring pattern in a post-fabrication step of the wiring pattern. Using the card edge connector, an electric card and an electric equipment are also provided.
Abstract:
The invention relates to a method for producing interconnections with electrically conductive cross connections between the top and the bottom part of a substrate and interconnections having such cross connections. The substrate (S1) is given a slanted, roof-shaped or convex contour (K1) in the area of at least one front face and/or in the area of at least one inner wall of a recess. After metallizing the substrate (S1), printed-board conductor-shaped cross connections (Q) are produced in the area of the above-mentioned contours (K1) simultaneously with laser structuring of printed board conductors (L) on the top part (0) and the bottom part (U) of the substrate (S1).
Abstract:
A milling system to be used in the manufacturing of electronic card for chamfering the edge of a card (e.g. a SIMM card) to facilitate its insertion in a socket on a board. According to a preferred embodiment of the present invention, the card to be chamfered (e.g. a SIMM card) is linearly moved within a milling system including two motor mills. The two mills are inclined with respect to each other forming an angle of about 90°. The card passes through the apex of this angle. The mills are mounted on a bracket system having a guide which guarantees the correct positioning of the milling system with respect to the card edge.
Abstract:
The integrated component has a plurality of contact elements disposed at an edge region of a main surface of the integrated component which contains the functional element. The contact elements project into the edge region of the main surface and have at least one contact surface that is inclined relative to the main surface. The component is configured to be fastened to conductor tracks of a fastening device, such that the conductor tracks are disposed to face the component body and extend parallel to the main surface of the component body.
Abstract:
Disclosed is a printed circuit board multipack, having a plurality of printed circuit boards (for example, a plurality of PCI compliant cards) provided using a common web of substrate material for a printed circuit board. Also disclosed is printed circuit board multipack structure, from which the multipack is formed, and individual printed circuit boards formed from the multipack, and methods of manufacture of each. Printed circuit board structures of the multipack have an internal edge, spaced from the periphery of the web, that is bevelled, and have conductive fingers, e.g., with an electrodeposited gold uppermost layer, extending to the internal edge. The multipack structure includes a common bus bar running adjacent the inner boundary of the printed circuit board structures, and conductive extensions from a conductive base layer of the conductive fingers to the bus bar. Due to the conductive extensions and common bus bar, electrode-position of the gold for the conductive fingers can easily be performed. In forming the multipack from the multipack structure, the structure is bevelled at the inner boundary, using a circular bevelling blade, to both provide the bevelled inner edge and remove the common bus bar and conductive extensions. The bevelling thins the web at the inner edge. The printed circuit boards are separated by snapping an individual printed circuit board apart from a remainder of the web, at the thinned portion of the web.
Abstract:
The present invention relates to a tool, and method of is use, that puts a pair of bevels onto an edge of a printed circuit board (PCB) so that the PCB can be inserted into an expansion slot of a computer. The tool has a bevel wheel, preferably with a bilaterally symmetrical angle channel shape, that is connected to a carriage. The bevel wheel rolls along the carriage while the bevel wheel is pressed onto the edge of the PCB so as to form the pair of bevels on the edge of the PCB. No material is removed from the PCB while forming the pair of bevels. The bevel wheel is forced upon the edge using a piston that monitors and regulates the pressure applied to the edge of the PCB in order to achieve a preferred height and angular orientation of the pair of bevels.