公开(公告)号：US20080235646A1

公开(公告)日：2008-09-25

申请号：US12039389

申请日：2008-02-28

Applicant: Vladimir V. Petunin

Inventor： Vladimir V. Petunin

IPC: G06F17/50

CPC classification number: G06F17/5077 ,  G06F17/5081 ,  H05K1/0216 ,  H05K3/0005 ,  H05K2201/09236 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49162

Abstract: In one aspect of the invention is a method for reducing crosstalk and maintaining clearances between traces on a printed circuit board design. Crosstalk caused by placing traces a virtual printed circuit board are reduced by placing artificial obstructs, called spacers, between traces and/or between traces and nets to create a user-specified clearance between the traces and/or nets. As additional traces and/or nets are added to the virtual printed circuit board, the spacers are dynamic and adjust accordingly to maintain the specified clearances.

Abstract translation: 本发明的一个方面是减少串扰并保持印刷电路板设计上的迹线之间的间隙的方法。 通过在轨迹和/或迹线和网之间放置人造阻挡物（称为间隔物），在轨迹和/或网之间产生用户指定的间隙，减少了通过将迹线放置在虚拟印刷电路板上引起的串扰。 随着附加迹线和/或网络被添加到虚拟印刷电路板，间隔物是动态的并且相应地进行调整以保持指定的间隙。

公开(公告)号：US20080227311A1

公开(公告)日：2008-09-18

申请号：US11717634

申请日：2007-03-14

Applicant: Jason Edward Chan ,  Jose Ricardo Paniagua

Inventor： Jason Edward Chan ,  Jose Ricardo Paniagua

IPC: H01R13/646

CPC classification number: H01R12/523 ,  H01R12/58 ,  H01R13/6461 ,  H01R13/6477 ,  H05K1/0216 ,  H05K1/0245 ,  H05K1/0298 ,  H05K3/429 ,  H05K2201/09236 ,  H05K2201/09636 ,  H05K2201/09845 ,  H05K2203/0242

Abstract: An electrical signal connection, an electrical signaling system, and a method of connecting printed circuit boards. The electrical signal connection having a first conductive via and a second conductive via disposed in a first printed circuit board. A first conductive trace with a first end and a second end has the first end electrically coupled to the first conductive via at a first distance from the top surface of the first printed circuit board. The second end of the first conductive via is electrically coupled to the second printed circuit board. A second conductive trace with a first end and a second end has the first end being electrically coupled to the second conductive via at a second distance from the top surface of the first printed circuit board. The second end being is electrically coupled to the second printed circuit board.

Abstract translation: 电信号连接，电信号系统和连接印刷电路板的方法。 电信号连接具有设置在第一印刷电路板中的第一导电通孔和第二导电通孔。 具有第一端和第二端的第一导电迹线具有与第一印刷电路板的顶表面第一距离处电耦合到第一导电通孔的第一端。 第一导电通孔的第二端电耦合到第二印刷电路板。 具有第一端和第二端的第二导电迹线具有第一端部，其与第一印刷电路板的顶表面距离第二距离电耦合到第二导电通孔。 第二端电连接到第二印刷电路板。

公开(公告)号：US07422484B2

公开(公告)日：2008-09-09

申请号：US11522530

申请日：2006-09-18

Applicant: Thomas S. Cohen ,  Marc B. Cartier, Jr. ,  Mark W. Gailus

Inventor： Thomas S. Cohen ,  Marc B. Cartier, Jr. ,  Mark W. Gailus

IPC: H01R13/648

CPC classification number: H05K7/1445 ,  H01R13/514 ,  H01R13/6587 ,  H01R13/6591 ,  H05K1/0231 ,  H05K1/0237 ,  H05K1/116 ,  H05K1/14 ,  H05K3/429 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09718 ,  H05K2201/10189 ,  H05K2203/1572

Abstract: A midplane has a first side to which contact ends of a first differential connector are connected and a second side opposite the first side to which contact ends of a second differential connector are connected. The midplane includes a plurality of vias extending from the first side to the second side, with the vias providing first signal launches on the first side and second signal launches on the second side. The first signal launches are provided in a plurality of rows, with each row having first signal launches along a first line and first signal launches along a second line substantially parallel to the first line. The second signal launches are provided in a plurality of columns, with each column having second signal launches along a third line and second signal launches along a fourth line substantially parallel to the third line.

Abstract translation: 中平面具有连接第一差分连接器的接触端的第一侧和与第二差分连接器的接触端连接的第一侧相对的第二侧。 中平面包括从第一侧延伸到第二侧的多个通孔，其中通孔在第一侧上提供第一信号发射，而第二信号在第二侧上发射。 第一信号发射被设置成多行，每行具有沿着第一线的第一信号发射，并且第一信号沿着基本上平行于第一线的第二线发射。 第二信号发射被提供在多列中，每列具有沿着第三线的第二信号发射，而第二信号沿着基本上平行于第三线的第四线发射。

公开(公告)号：US07411134B1

公开(公告)日：2008-08-12

申请号：US11681149

申请日：2007-03-01

Applicant: Robert Steinfeld ,  Cheung-Wei Lam

Inventor： Robert Steinfeld ,  Cheung-Wei Lam

IPC: H05K1/03

CPC classification number: H05K1/0219 ,  H05K1/0289 ,  H05K1/0298 ,  H05K2201/09236 ,  H05K2201/09972 ,  Y10T29/49117

Abstract: Electrical mounting boards and methods for their fabrication and use are disclosed herein. In particular, such mounting boards embodiments utilize hybrid ground lines interconnected through a substrate core to form multilayer ground grids. Such hybrid ground lines include groups of substantially parallel ground lines configured such that the groups of ground lines are positioned in transverse arrangement with other groups of ground lines formed on the same level. Such implementations have many uses, including, but not limited to, the ability to more efficiently route signal lines and connect electrical components on a circuit board.

Abstract translation: 电气安装板及其制造和使用的方法在本文中公开。 特别地，这种安装板实施例利用通过衬底芯互连的混合地线，以形成多层地面网格。 这样的混合接地线包括基本上平行的接地线的组，其被配置为使得接地线组以与形成在同一水平面上的其它接地线组横向布置的方式配置。 这样的实施方式具有许多用途，包括但不限于更有效地路由信号线并连接电路板上的电气部件的能力。

公开(公告)号：US07405946B2

公开(公告)日：2008-07-29

申请号：US11122370

申请日：2005-05-05

Applicant: Jeffrey A. Hall ,  Farshad Ghahghahi

Inventor： Jeffrey A. Hall ,  Farshad Ghahghahi

IPC: H05K7/00

CPC classification number: H05K1/112 ,  H01L23/50 ,  H01L24/06 ,  H01L2924/14 ,  H05K1/0237 ,  H05K2201/09236 ,  H05K2201/10734 ,  H01L2924/00

Abstract: A pattern of contacts that includes high speed transmitter contacts disposed in a first portion of the pattern, where the high speed transmitter contacts are disposed in first ordered channels of adjacent transmitter differential pairs. High speed receiver contacts are disposed in a second portion of the pattern, where the first portion of the pattern is not interspersed with the second portion of the pattern, and the high speed receiver contacts are disposed in first ordered channels of adjacent receiver differential pairs. At least one unbroken line of other contacts is disposed between the first portion of the pattern and the second portion of the pattern, where the other contacts do not contain any high speed transmitter contacts and high speed receiver contacts. Low speed IO contacts are disposed in a third portion of the pattern. The first ordered channels are ordered to match an order of transmitter channels of a connector or another component on a printed circuit board to which the transmitter differential pairs are routed, and the second ordered channels are ordered to match an order of receiver channels of a connector or another component on a printed circuit board to which the receiver differential pairs are routed.

Abstract translation: 包括设置在图案的第一部分中的高速发射器触点的接触图案，其中高速发射器触点设置在相邻发射机差分对的第一有序通道中。 高速接收器触点设置在图案的第二部分中，其中图案的第一部分不与图案的第二部分分散，并且高速接收器触点设置在相邻接收器差分对的第一有序通道中。 在图案的第一部分和图案的第二部分之间设置至少一条其他触点的一条直线，其他触点不包含任何高速发送器触点和高速接收器触点。 低速IO触点设置在图案的第三部分中。 订购的第一个通道按照发送器差分对路由到的印刷电路板上的连接器或其他部件的发射器通道的顺序进行排序，并且第二个有序通道被排序以匹配连接器的接收器通道的顺序 或接收器差分对路由到的印刷电路板上的另一部件。

公开(公告)号：US20080176471A1

公开(公告)日：2008-07-24

申请号：US12005592

申请日：2007-12-26

Applicant: Masao Ogihara ,  Kazunori Nakajima

Inventor： Masao Ogihara ,  Kazunori Nakajima

IPC: D03D13/00

CPC classification number: D03D9/00 ,  D03D15/0011 ,  H05K1/0218 ,  H05K1/024 ,  H05K1/0366 ,  H05K2201/029 ,  H05K2201/0715 ,  H05K2201/09236 ,  Y10T442/3179

Abstract: According to the present invention, variations in characteristic impedance and transmission loss of a signal wiring in a glass cloth wiring substrate can be reduced. There is provided a glass cloth wiring substrate in which signal wirings, plural glass cloth layers, and conductor faces are laminated, and spaces between the signal wirings, the plural glass cloth layers, and the conductor faces are impregnated with resin, wherein the glass cloth layers are formed by weaving bundles of glass fibers in a lattice shape, and the adjacent glass cloth layers are laminated on each other while rotating the warp-weft directions of the glass fibers by a predetermined angle with respect to each other. It is preferable that the rotation angle of the warp-weft directions of the glass fibers of the adjacent glass cloth layers falls within a range from 30 to 60 degrees.

Abstract translation: 根据本发明，可以降低玻璃布线基板中的信号布线的特性阻抗和传输损耗的变化。 提供了层叠有信号布线，多个玻璃布层和导体面的玻璃布布线基板，信号布线，多个玻璃布层和导体面之间的空间用树脂浸渍，其中玻璃布 通过编织格子状的玻璃纤维束形成层，并且相邻的玻璃布层彼此层叠，同时使玻璃纤维的经纬方向相对于彼此旋转预定角度。 相邻玻璃布层的玻璃纤维的经向方向的旋转角度优选为30〜60度的范围。

公开(公告)号：US07403080B2

公开(公告)日：2008-07-22

申请号：US11504722

申请日：2006-08-16

Applicant: Hiroshi Kanno ,  Kazuyuki Sakiyama ,  Ushio Sangawa ,  Tomoyasu Fujishima

Inventor： Hiroshi Kanno ,  Kazuyuki Sakiyama ,  Ushio Sangawa ,  Tomoyasu Fujishima

IPC: H01P3/08

CPC classification number: H01P1/201 ,  H01P1/203 ,  H05K1/0219 ,  H05K1/0237 ,  H05K2201/09236 ,  H05K2201/09781

Abstract: A transmission line apparatus includes: a substrate 101 with a ground conductor plane; and first and second signal strips 102a, 102b supported on the substrate 101 in parallel with each other. The apparatus further includes at least one additional capacitance element 301 that connects the first and second signal strips 102a, 102b together. The element 301 includes: a first additional conductor 303 spaced from the first signal strip 102a; a second additional conductor 305 spaced from the second signal strip 102b; and a third additional conductor 307 connected to the first and second additional conductors 303, 305 at respective points. When measured in a signal transmission direction, the smallest width W3a of the third additional conductor 307 is shorter than the length L1 or L2 of the first or second additional conductor 303 or 305. And the additional capacitance element 301 has a resonant frequency that is higher than the frequency of a signal being transmitted.

Abstract translation: 传输线装置包括：具有接地导体平面的基板101; 以及彼此平行地支撑在基板101上的第一和第二信号条102a，102b。 该装置还包括将第一和第二信号条带102a，102b连接在一起的至少一个附加电容元件301。 元件301包括：与第一信号条102a间隔开的第一附加导体303; 与第二信号条带102b间隔开的第二附加导体305; 以及在各个点处连接到第一和第二附加导体303,305的第三附加导体307。 当在信号传输方向上测量时，第三附加导体307的最小宽度W 3 a比第一或第二附加导体303或305的长度L 1或L 2短。 并且附加电容元件301具有高于正被发送的信号的频率的谐振频率。

公开(公告)号：US20080166919A1

公开(公告)日：2008-07-10

申请号：US12053154

申请日：2008-03-21

Applicant: Peter Bresche ,  Ulrich Hetzer

Inventor： Peter Bresche ,  Ulrich Hetzer

IPC: H01R13/66

CPC classification number: H05K1/162 ,  H01R13/6466 ,  H01R13/6473 ,  H05K1/0237 ,  H05K3/027 ,  H05K2201/09236 ,  H05K2203/171 ,  H05K2203/175 ,  Y10S439/941 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49174

Abstract: The invention relates to a method for high-frequency tuning a high-frequency plug connector, comprising a printed circuit board that has both contact points for high-frequency contacts as well as contact points for insulation displacement contacts. Each contact point for the high-frequency contacts is connected to one respective contact point for the insulation displacement contacts. Capacitive couplings, which cause a near-end crosstalk, occur between the high-frequency contacts. At least one first conductor path, which is connected on only one side to a contact point of an electrical contact, is situated on the printed circuit board that, together with at least one second conductor path, which is situated on and/or in the printed circuit board, forms a capacitor. At least one frequency-dependent parameter of the device is measured, and this frequency-dependent parameter is compared to a set parameter and, according to on a difference between the two, the conductor path that is contacted on one side is partially removed or completely separated.

Abstract translation: 本发明涉及一种用于高频调谐高频插头连接器的方法，包括具有用于高频触点的接触点和用于绝缘位移触点的接触点的印刷电路板。 用于高频触点的每个接触点连接到用于绝缘位移触点的一个相应接触点。 在高频触点之间发生电容耦合，导致近端串扰。 至少一个仅在一侧连接到电触点的接触点的第一导体路径位于印刷电路板上，该导体路径与至少一个第二导体路径一起位于和/或位于 印刷电路板，形成电容器。 测量器件的至少一个与频率相关的参数，并将该频率相关参数与设定参数进行比较，并且根据两者之间的差异，在一侧接触的导体路径被部分去除或完全 分开

公开(公告)号：US20080160681A1

公开(公告)日：2008-07-03

申请号：US12017020

申请日：2008-01-19

Applicant: Anthony A. Anthony ,  William M. Anthony

Inventor： Anthony A. Anthony ,  William M. Anthony

IPC: H01L23/528 ,  H01L21/82 ,  H05K7/02

CPC classification number: H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/552 ,  H01L23/66 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/023 ,  H05K1/0237 ,  H05K2201/09236 ,  H05K2201/10378 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49204 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The present invention relates to an interposer substrate for interconnecting between active electronic componentry such as but not limited to a single or multiple integrated circuit chips in either a single or a combination and elements that could comprise of a mounting substrate, substrate module, a printed circuit board, integrated circuit chips or other substrates containing conductive energy pathways that service an energy utilizing load and leading to and from an energy source. The interposer will also possess a multi-layer, universal multi-functional, common conductive shield structure with conductive pathways for energy and EMI conditioning and protection that also comprise a commonly shared and centrally positioned conductive pathway or electrode of the structure that can simultaneously shield and allow smooth energy interaction between grouped and energized conductive pathway electrodes containing a circuit architecture for energy conditioning as it relates to integrated circuit device packaging. The invention can be employed between an active electronic component and a multilayer circuit card. A method for making the interposer is not presented and can be varied to the individual or proprietary construction methodologies that exist or will be developed.

Abstract translation: 本发明涉及用于将活性电子元件（例如但不限于单个或多个集成电路芯片）单元或组合中的互连的插入器基板以及可以包括安装基板，基板模块，印刷电路 板，集成电路芯片或其他包含导电能量路径的基板，其能够利用负载和通向能量源的能量。 插入器还将具有多层通用多功能通用导电屏蔽结构，其具有用于能量和EMI调节和保护的导电路径，其还包括可共同屏蔽的结构的共同共享和中心定位的导电路径或电极， 允许包含用于能量调节的电路架构的组合和通电的导电路径电极之间的平滑的能量相互作用，因为它涉及集成电路器件封装。 本发明可以用于有源电子部件和多层电路卡之间。 不提供制作插入器的方法，并且可以根据现有或将要开发的个人或专有的施工方法来改变。

公开(公告)号：US20080159688A1

公开(公告)日：2008-07-03

申请号：US11965313

申请日：2007-12-27

Applicant: Michael W. Schellinger ,  Rachid M. Alameh ,  Thomas J. Pack ,  Louis J. Vannatta

Inventor： Michael W. Schellinger ,  Rachid M. Alameh ,  Thomas J. Pack ,  Louis J. Vannatta

IPC: G02B6/12 ,  B05D5/12

CPC classification number: H05K1/0274 ,  H05K2201/09236 ,  H05K2201/09881

Abstract: A circuit substrate, which supports optically and electrically conveyed signals, and method for forming the same are provided. The circuit substrate includes a substrate upon which one or more electrically conductive traces are formed, where the electrically conductive traces have areas of isolation between adjacent ones of the electrically conductive traces. The circuit substrate further includes one or more optical waveguides, where the one or more optical waveguides are in the same plane as the one or more electrically conductive traces. The optical waveguides are formed using an optically transmissive material, which is deposited in the areas of isolation between the electrical traces.

Abstract translation: 提供支持光学和电输送信号的电路基板及其形成方法。 电路衬底包括其上形成有一个或多个导电迹线的衬底，其中导电迹线在相邻的导电迹线之间具有隔离区域。 电路基板还包括一个或多个光波导，其中一个或多个光波导处于与一个或多个导电迹线相同的平面中。 使用光学透射材料形成光波导，该材料沉积在电迹线之间的隔离区域中。