公开(公告)号：US12119756B2

公开(公告)日：2024-10-15

申请号：US17913451

申请日：2020-04-20

Applicant: Hitachi Industrial Equipment Systems Co., Ltd.

Inventor： Fumihiro Sato ,  Keisuke Tanabe ,  Koji Hamano ,  Kiyotaka Tomiyama ,  Hiroyoshi Miyazaki

IPC: H02M7/00 ,  H02M5/458 ,  H05K1/02 ,  H05K1/14

CPC classification number: H02M7/003 ,  H02M5/458 ,  H05K1/0213 ,  H05K1/141 ,  H05K2201/044

Abstract: Provided is a power conversion device which comprises a main circuit board, a first board, and a second board and which has a reduced size. The main circuit board has a rectifier circuit and an inverter circuit which are disposed in a high-power section, the rectifier circuit rectifying AC voltage and The second board is provided with a The first board is connected to the main circuit board and to the second board, and is provided with: a first circuit disposed in a low-power section. The second board is provided with a second circuit disposed in a low-power section. section from each other in a reinforced manner; an insulating transformer disposed in the reinforced insulation region and constituting a constituent component of a power supply circuit for receiving the DC voltage and supplying power to the first circuit and to the second circuit; and an insulating element disposed in the reinforced insulation region and allowing a signal to be exchanged between the first circuit and the second circuit.

公开(公告)号：US20230276573A1

公开(公告)日：2023-08-31

申请号：US18313180

申请日：2023-05-05

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Osamu MIKI ,  Tatsuya HOSOTANI

IPC: H05K1/14 ,  H05K1/18 ,  H02M3/00

CPC classification number: H05K1/14 ,  H02M3/003 ,  H05K1/181 ,  H05K2201/044

Abstract: A circuit module includes a circuit module substrate having an area smaller than a large-scale circuit board, an electronic circuit component mounted on the circuit module substrate, a connection pin provided to the circuit module substrate, and a circuit-module-substrate-side fitting structure part provided to the circuit module substrate. A pin receptacle and the connection pin are electrically connected to each other. A non-conductive thermal adhesive layer is formed between a surface of the circuit module substrate and a surface of a base material of the large-scale circuit board facing to each other, the non-conductive thermal adhesive layer electrically insulating and thermally joining the surfaces by a non-conductive thermally conductive material.

公开(公告)号：US20160359426A1

公开(公告)日：2016-12-08

申请号：US15103617

申请日：2014-12-11

Applicant: ROMPOWER ENERGY SYSTEMS INC.

Inventor： Ionel Jitaru ,  Ian Poynton ,  Enrique Velasco

IPC: H02M7/00 ,  H02M7/21 ,  H05K1/14 ,  H05K1/02 ,  H05K9/00 ,  H05K1/18

CPC classification number: H02M7/003 ,  H02M7/21 ,  H05K1/0203 ,  H05K1/0256 ,  H05K1/14 ,  H05K1/181 ,  H05K3/366 ,  H05K9/0071 ,  H05K2201/042 ,  H05K2201/044 ,  H05K2201/047 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/0999 ,  H05K2201/10015 ,  H05K2201/10166

Abstract: Meeting todays requirement in power supply technology demands significant technological advancement in optimizing circuit topology, components and materials, thermal and packaging designs. These requirements are being pushed mainly by continuously increasing power density and efficiency requirements. Ultimately, these trends will come to a point whereby limitations from the above mentioned technological advancements is dependent on one of the above, which is the packaging design. To realize this dependence, we need to look at the growing power systems for modern equipment out there. Let us enumerate some of the available AC adapters in terms of power densities of a 45 W adapter. Firstly, square type architecture introduced by Apple is about 7 W/in3, considering the packaging has a profile limitation whereby its AC plug is removable thus occupying relatively bigger chunk of the volume. The next one is by Asus of similar profile to Apple incorporating the AC Plug eliminating the socket assembly in the packaging; which packs about 9 W/in3. Lastly, the typical rectangular profile by Eos which is about 7 W/in3. As for this particular embodiment it is about 40% smaller in profile, in contrast to the 45 W Apple packaging, with increase power density of about 12 W/in3. Packaging design method plays a great role in achieving the above requirements for a very high density converters.

Abstract translation: 电源技术的今天要求在优化电路拓扑，组件和材料，热和封装设计方面需要显着的技术进步。 这些要求主要是通过不断提高功率密度和效率要求来推动的。 最终，这些趋势将会出现，上述技术进步的限制取决于上述之一，即包装设计。 为了实现这种依赖，我们需要看现在的设备不断增长的电力系统。 在45 W适配器的功率密度方面，我们列举一些可用的交流适配器。 首先，Apple推出的Square型架构约为7W / in3，考虑到封装具有配置限制，其AC插头可拆卸，因此占据相对较大的块体积。 接下来的一个是华硕与苹果相似的配置，包括交流插头，消除了包装中的插座组件; 其中包装约9 W / in3。 最后，Eos的典型矩形轮廓约为7 W / in3。 对于这个特定的实施例，与45W苹果包装相比，其功率密度增加约为12W / in3，约为40％。 包装设计方法对于实现上述高密度转换器的要求起着重要作用。

公开(公告)号：US09380704B2

公开(公告)日：2016-06-28

申请号：US14008575

申请日：2012-03-30

Applicant: Kazuhiro Kashiwakura

Inventor： Kazuhiro Kashiwakura

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H01R13/66 ,  H05K7/14 ,  H01R12/50 ,  H04Q1/02 ,  H05K1/02 ,  H05K3/30 ,  H04L25/02

CPC classification number: H05K1/18 ,  H01R13/6616 ,  H01R13/6625 ,  H01R13/6658 ,  H01R23/7073 ,  H04L25/0298 ,  H04Q1/15 ,  H05K1/0231 ,  H05K1/0245 ,  H05K1/0246 ,  H05K1/0251 ,  H05K1/14 ,  H05K1/141 ,  H05K3/306 ,  H05K7/1439 ,  H05K2201/044 ,  H05K2201/09618 ,  H05K2201/10015 ,  Y10T29/49128

Abstract: A through-hole stub AC termination circuit including a resistor and a capacitor, is connected to an open end of a stub of a through-hole provided in a circuit board.

Abstract translation: 包括电阻器和电容器的通孔短路AC终端电路连接到设置在电路板中的通孔的短截线的开口端。

公开(公告)号：US09325146B2

公开(公告)日：2016-04-26

申请号：US12874011

申请日：2010-09-01

Applicant: Richard C. A. Pitwon

Inventor： Richard C. A. Pitwon

IPC: H01S3/091 ,  H01S3/063 ,  H01S3/0941 ,  H01S3/17 ,  H01S3/0933 ,  H01S3/094 ,  H01S3/16 ,  H01S3/23 ,  H01S5/40 ,  H05K1/02 ,  H05K1/14 ,  G02B6/12 ,  G02B6/122

CPC classification number: H01S3/091 ,  G02B6/12004 ,  G02B6/1221 ,  H01S3/0637 ,  H01S3/0933 ,  H01S3/094049 ,  H01S3/0941 ,  H01S3/1603 ,  H01S3/1605 ,  H01S3/1606 ,  H01S3/168 ,  H01S3/178 ,  H01S3/2308 ,  H01S3/2383 ,  H01S5/4031 ,  H05K1/0274 ,  H05K1/142 ,  H05K2201/044

Abstract: The invention provides an amplification module for an optical printed circuit board, the optical printed circuit board comprising plural polymer waveguide sections from independent waveguides, each of the sections being doped with an amplifying dopant, wherein the plural waveguide sections are routed so as to pass through an amplification zone in which the plural polymer waveguide sections are arranged close or adjacent to one another, the amplification module comprising: a pump source comprising plural light sources arranged to provide independently controllable levels of pump radiation to each of the plural waveguide sections. In an embodiment, the amplification module also includes plural polymer waveguide sections corresponding to the plural polymer waveguides of the printed circuit board on which in use the amplification module is to be arranged, each of the sections being doped with an amplifying dopant.

Abstract translation: 本发明提供了一种用于光学印刷电路板的放大模块，该光学印刷电路板包括来自独立波导的多个聚合物波导部分，每个部分掺杂有放大掺杂剂，其中多个波导部分被路由以便通过 其中所述多个聚合物波导部分彼此靠近或相邻地布置的放大区域，所述放大模块包括：泵浦源，包括多个光源，所述泵浦源布置成向所述多个波导段中的每一个提供独立可控的泵浦辐射水平。 在一个实施例中，放大模块还包括对应于印刷电路板的多个聚合物波导的多个聚合物波导部分，在其上使用放大模块来布置每个部分，每个部分掺杂有放大掺杂剂。

公开(公告)号：US20160013570A1

公开(公告)日：2016-01-14

申请号：US14794313

申请日：2015-07-08

Applicant: Rupert Fry, JR. ,  Charles Copper

Inventor： Rupert Fry, JR. ,  Charles Copper

IPC: H01R12/70 ,  H01R43/20

CPC classification number: H01R12/7076 ,  H01R12/724 ,  H01R12/737 ,  H01R24/84 ,  H01R43/205 ,  H05K3/366 ,  H05K2201/044 ,  H05K2201/10189

Abstract: In accordance with one embodiment, an electrical connecter system can include an electrical signal connector and an electrical power connector. The electrical signal connector and the electrical power connector can be mounted on opposed surfaces of a printed circuit board. The electrical power connector can be constructed as a hermaphroditic power connector that includes at least one header power contact supported by a connector housing, and at least one receptacle power contact supported by the connector housing.

Abstract translation: 根据一个实施例，电连接器系统可以包括电信号连接器和电力连接器。 电信号连接器和电源连接器可以安装在印刷电路板的相对表面上。 电源连接器可以构造为阴模电力连接器，其包括由连接器壳体支撑的至少一个插头电源接头和由连接器壳体支撑的至少一个插座电源触头。

公开(公告)号：US09215808B2

公开(公告)日：2015-12-15

申请号：US13146646

申请日：2009-01-31

Applicant: Ralph W. Conway ,  Samuel Chau

Inventor： Ralph W. Conway ,  Samuel Chau

IPC: H05K5/00 ,  H05K5/04 ,  H05K5/06 ,  H05K1/14 ,  G06F13/40

CPC classification number: H05K1/142 ,  G06F13/409 ,  H05K2201/044 ,  H05K2201/09145 ,  H05K2201/10189 ,  Y10T29/49126

Abstract: A motherboard has a cut-away so that it deviates from its rectangular outline. The motherboard has a connector disposed along one side for physically and electrically connecting the motherboard to a motherboard extender. A method includes physically and electrically connecting a motherboard extender to a motherboard so that a tab of said motherboard extender and an overlapping expansion-card connector extend into the cut-away.

Abstract translation: 主板有一个切口，使其偏离其矩形轮廓。 主板具有沿着一侧设置的连接器，用于将母板物理和电连接到主板扩展器。 一种方法包括将主板扩展器物理上和电气地连接到主板，使得所述主板扩展器的标签和重叠的扩展卡连接器延伸到切割部分中。

公开(公告)号：US20150351233A1

公开(公告)日：2015-12-03

申请号：US14294865

申请日：2014-06-03

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Eric C. Peterson ,  Christian L. Belady

IPC: H05K1/02 ,  H05K1/14

CPC classification number: H05K1/0278 ,  G06F1/185 ,  H05K1/141 ,  H05K1/147 ,  H05K3/4691 ,  H05K2201/044

Abstract: A flexible midplane comprises: a printed circuit board including: a middle section and at least one side section; and a flexible region disposed between the middle section and each side section; wherein each flexible region permits the corresponding side section to be bent in relation to the middle section.

Abstract translation: 柔性中平面包括：印刷电路板，包括：中间部分和至少一个侧部分; 以及设置在中间部分和每个侧部分之间的柔性区域; 其中每个柔性区域允许相应的侧部部分相对于中间部分弯曲。

公开(公告)号：US20150245525A1

公开(公告)日：2015-08-27

申请号：US14191395

申请日：2014-02-26

Applicant: Samsung Electronics, Ltd.

Inventor： Zhan Ping

IPC: H05K7/10 ,  H05K3/30 ,  H05K1/18

CPC classification number: H05K7/10 ,  G06F13/409 ,  G11C5/04 ,  H05K1/141 ,  H05K1/18 ,  H05K3/30 ,  H05K3/366 ,  H05K2201/044 ,  H05K2201/10159 ,  H05K2201/10325 ,  Y10T29/4913

Abstract: Exemplary embodiments include a socket interposer having a first plurality of connectors, at least one of on-board memory socket and a memory. The first plurality of connectors is configured to fit with a first form factor of a memory socket on a server board. The at least one on-board memory socket includes at least a second plurality of connectors and has a second form factor configured for a memory module having a first memory type. The memory has a second memory type different from the first memory type of the memory module.

Abstract translation: 示例性实施例包括具有第一多个连接器，车载存储器插槽和存储器中的至少一个的插座插入器。 第一组多个连接器配置成与服务器主板上的存储器插槽的第一外形尺寸相匹配。 所述至少一个板载存储器插座包括至少第二多个连接器，并且具有被配置用于具有第一存储器类型的存储器模块的第二形状因数。 存储器具有与存储器模块的第一存储器类型不同的第二存储器类型。

公开(公告)号：US09060443B2

公开(公告)日：2015-06-16

申请号：US13727523

申请日：2012-12-26

Applicant: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD. ,  HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： Li-Ren Fu

IPC: H05K5/02 ,  H05K7/14

CPC classification number: H05K7/1487 ,  H05K5/0217 ,  H05K2201/044

Abstract: A mounting apparatus is used for mounting a backplane in a chassis. The backplane defines a number of locking slots in opposite sides and a through hole in a middle portion. The mounting apparatus includes a bracket and a locking member pivotably mounted to the chassis. The bracket includes a bottom plate fixed on the bottom wall, and a side plate and a flange extending up from the bottom plate. The bottom plate defines a slide slot. The side plate and the flange each form a number of retaining tabs. A post extends on the locking member and extends through the slide slot and the through hole. The circuit board is set on the bottom plate, with the locking slots aligned with the retaining tabs. The locking member is rotated, the post drives the circuit board to move, until the retaining tabs retain a top surface of the backplane.

Abstract translation: 安装装置用于将背板安装在底盘中。 背板在相对侧限定了多个锁定槽和中间部分中的通孔。 安装装置包括支架和可枢转地安装到底盘的锁定构件。 支架包括固定在底壁上的底板和从底板向上延伸的侧板和凸缘。 底板限定滑槽。 侧板和凸缘均形成多个保持片。 柱在锁定构件上延伸并延伸穿过滑槽和通孔。 电路板设置在底板上，锁定槽与固定片对齐。 锁定构件旋转，柱子驱动电路板移动，直到固定翼片保持背板的顶表面。