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公开(公告)号：US5268819A
公开(公告)日：1993-12-07
申请号：US848647
申请日：1992-03-09
Applicant: Pekka S. Lonka
Inventor： Pekka S. Lonka
CPC classification number: H01R12/52 , H05K3/368 , H05K1/144 , H05K2201/0949 , H05K2201/10333 , H05K2201/10424 , H05K2201/10962 , H05K3/3447
Abstract: A printed circuit board upon which are mounted a number of electronic components is provided with a connector strip for electrically coupling the components to respective components on a second circuit board located underneath. The strip comprises a body portion and pins projecting thereform. The pins have a stepwise configuration with a first end portion extending through apertures in the upper circuit board and connected to a second connector strip on the second circuit board, a second end portion extending through the body portion, and a middle portion which abuts the surface of the upper circuit board and by which the strip is connected to the upper circuit board by means of a solder joint. Components on the upper circuit board are electrically coupled by means of tracks which are connected to the components at one end by a solder joint and at the other end by a solder joint, via pins, to the second connector strip and tracks on the lower circuit board.
Abstract translation: 安装有多个电子部件的印刷电路板设置有用于将部件电耦合到位于下方的第二电路板上的相应部件的连接器条。 条带包括主体部分和在其上突出的销。 所述销具有逐步构造，所述第一端部延伸穿过所述上部电路板中的孔并且连接到所述第二电路板上的第二连接器条，延伸穿过所述主体部分的第二端部，以及邻接所述表面的中间部分 的上部电路板，并且该带通过焊接接头连接到上部电路板。 上部电路板上的部件通过轨道电连接，该轨道在一端通过焊接接头连接到部件，另一端通过引脚通过焊接点连接到第二连接器条，并且在下部电路 板。
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公开(公告)号：US5176254A
公开(公告)日：1993-01-05
申请号：US860582
申请日：1992-03-27
Applicant: Dale P. Caravona
Inventor： Dale P. Caravona
CPC classification number: B65D73/02 , B65D65/46 , H01R12/58 , H05K3/306 , H01R43/205 , H05K2201/10303 , H05K2201/10333 , H05K2201/10424 , H05K2203/0195 , H05K2203/0769 , H05K2203/0786
Abstract: A system for supporting a plurality of terminals to be inserted into an electrical circuit board utilizes a body of molded, water soluble, polymeric material closely encasing portions only of the terminals.
Abstract translation: 用于支撑要插入到电路板中的多个端子的系统利用仅封装端子部分的模制的，可水溶的聚合材料体。
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公开(公告)号：US5061989A
公开(公告)日：1991-10-29
申请号：US498273
申请日：1990-03-22
Applicant: Yao T. Yen , Joonees K. Chay
Inventor： Yao T. Yen , Joonees K. Chay
CPC classification number: H05K7/1084 , H05K1/141 , H05K2201/049 , H05K2201/10333 , H05K2201/10704
Abstract: Disclosed herein is a mechanical translator for use in replacing one semiconductor chip with another. A translator allows a first semiconductor chip to be replaced with second semiconductor chip. The translator includes a module having a first surface with a plurality of pins in a first pattern that is compatible with the contact pins of the first semiconductor chip and having a plurality of electrically conductive pads in a second pattern that is compatible with the contact pins of the second semiconductor. The module includes translating semiconductor logic for translating the electrical signals designed to be supplied to and received from the first second semiconductor chip to be compatible with the electronic signals supplied to and received from the second semiconductor chip. The electrical pads are appropriately connected to the translating logic. Also included is an adapter having pattern of pins and sockets compatible with the pattern of pins and sockets of the replacing semiconductor chip. The adapter is connectable in piggy back fashion with the module.
Abstract translation: 这里公开了一种用于将另一个半导体芯片替换的机械转换器。 翻译器允许用第二半导体芯片替换第一半导体芯片。 所述转换器包括具有第一表面的模块，所述第一表面具有第一图案中的多个销，所述第一图案与所述第一半导体芯片的所述接触销相兼容，并且具有与第二图案中的所述接触销相兼容的第二图案中的多个导电焊盘 第二个半导体。 该模块包括转换半导体逻辑，用于转换被设计为提供给第一第二半导体芯片并从第一第二半导体芯片接收的电信号，以与提供给第二半导体芯片并从第二半导体芯片接收的电子信号兼容。 电焊盘适当地连接到平移逻辑。 还包括具有与替换半导体芯片的引脚和插座的图案兼容的引脚和插座的图案的适配器。 该适配器可以以背部式与模块连接。
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154.发明授权
公开(公告)号：US4868980A
公开(公告)日：1989-09-26
申请号：US217808
申请日：1988-07-12
Applicant: Grady A. Miller, Jr.
Inventor： Grady A. Miller, Jr.
CPC classification number: H05K3/222 , H05K1/029 , H05K1/0231 , H05K1/0287 , H05K1/0298 , H05K2201/10287 , H05K2201/10333 , H05K2201/10689 , Y10T29/49162
Abstract: A printed circuit board for mounting and connecting a plurality of semiconductor devices is disclosed and includes a planar insulating substrate having multiple conductive layers disposed in overlying relationship within the planar substrate. A plurality of parallel rows of apertures for wire-wrap, quick-connect or stitch-wire contacts are provided for mounting integrated circuits. One side of the printed circuit board includes a plurality of power and ground connections disposed between each pair of parallel rows of apertures so that filter capacitors may be mounted under each integrated circuit, thereby conserving printed circuit board space. In a preferred mode of the present invention, alternate ones of the conductive layers are coupled to a source of electrical power while all remaining conductive layers are grounded. At least two adjacent conductive layers are then utilized to minimize parasitic capacitance by completely surrounding each aperture with a portion of conductive material.
Abstract translation: 公开了一种用于安装和连接多个半导体器件的印刷电路板，并且包括在平面基板内以覆盖关系设置的多个导电层的平面绝缘基板。 为了安装集成电路，提供了多个平行的用于电线缠绕，快速连接或针脚接触的孔。 印刷电路板的一侧包括设置在每对平行排孔之间的多个电源和接地连接，使得滤波电容器可以安装在每个集成电路下，从而节省印刷电路板空间。 在本发明的优选模式中，替代的导电层耦合到电源，而所有剩余的导电层都接地。 然后通过用导电材料的一部分完全围绕每个孔，至少使用两个相邻的导电层来最小化寄生电容。
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155.发明授权
公开(公告)号：US4791722A
公开(公告)日：1988-12-20
申请号：US945222
申请日：1986-12-23
Applicant: Grady A. Miller, Jr.
Inventor： Grady A. Miller, Jr.
CPC classification number: H05K3/222 , H05K1/029 , H05K1/0231 , H05K1/0287 , H05K1/0298 , H05K2201/10287 , H05K2201/10333 , H05K2201/10689 , Y10T29/49162
Abstract: A printed circuit for mounting and connecting a plurality of semiconductor devices is disclosed and includes a planar insulating substrate having multiple conductive layers disposed in overlying relationship within the planar substrate. A plurality of parallel rows of apertures for wire wrap, quick connect or stitch wire contacts are provided for mounting integrated circuit. One side of the printed circuit board includes a plurality of power and ground connections disposed between each pair of parallel rows of apertures so that filter capacitors may be mounted under each integrated circuit, thereby conserving printed circuit board space. In a preferred mode of the present invention, alternate ones of the conductive layers are coupled to a source of electrical power while all remaining conductive layers are gounded. At least two adjacent conductive layers are then utilized to minimize parasitic capacitance by completely surrounding each aperture with a portion of conductive material.
Abstract translation: 公开了一种用于安装和连接多个半导体器件的印刷电路，并且包括在平面基板内以覆盖关系设置的多个导电层的平面绝缘基板。 为了安装集成电路，提供多个平行的用于线缠绕，快速连接或针迹线接触的孔。 印刷电路板的一侧包括设置在每对平行排孔之间的多个电源和接地连接，使得滤波电容器可以安装在每个集成电路下，从而节省印刷电路板空间。 在本发明的优选模式中，替代的导电层被耦合到电源上，同时所有剩余的导电层都被压扁。 然后通过用导电材料的一部分完全围绕每个孔，至少使用两个相邻的导电层来最小化寄生电容。
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Patent Agency Ranking
公开(公告)号：US4580857A
公开(公告)日：1986-04-08
申请号：US660347
申请日：1984-10-12
Applicant: William E. Stepan
Inventor： William E. Stepan
CPC classification number: H01R12/718 , H05K3/366 , H05K2201/10303 , H05K2201/10333 , H05K2201/10386 , H05K2201/10962 , H05K3/3447
Abstract: A circuit terminating clip for mechanically retaining and electrically connecting a planer substrate such as a thick/thin film circuit to a printed wiring card. The terminating clip is characterized by a terminating body having planer sidewalls defining a hollow interconnecting post receiving area therebetween. A substrate spring member extends from a bottom edge of a front wall of the terminating body arranged to accept the edge of the substrate, connecting the substrate to the terminating body. A terminating pad member extending from the top edge of the front wall of the terminating body is soldered to the substrate retaining the terminating body to the substrate. Post spring members extending inwardly into the post receiving area engage an interconnection post which extends from the printed wiring card thereby retaining the terminating body to the printed wiring card.
Abstract translation: 一种电路端接夹，用于将诸如厚/薄膜电路的平面基板机械地保持并电连接到印刷线路卡。 端接夹的特征在于端接体具有限定其间的中空互连柱接收区域的平面侧壁。 衬底弹簧构件从端接体的前壁的底部边缘延伸，该底部边缘布置成接受衬底的边缘，将衬底连接到终端体。 从端接体的前壁的顶部边缘延伸的端接垫构件被焊接到将端接体保持在衬底上的衬底上。 向内延伸到柱接收区域的后弹簧构件接合从印刷线路卡延伸的互连柱，从而将端接体保持在印刷线路卡上。
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公开(公告)号：US4489999A
公开(公告)日：1984-12-25
申请号：US466467
申请日：1983-02-15
Applicant: Jay J. Miniet
Inventor： Jay J. Miniet
CPC classification number: H05K1/142 , H05K7/1053 , H05K2201/10333 , H05K2201/10681 , H05K3/4691 , Y10T29/49153
Abstract: The integral interconnect socket and flexible board assembly accepts an electronic module having a plurality of leads arranged in a predetermined pattern. The assembly includes a flexible printed circuit (PC) board having a plurality of conductors and a first set of holes disposed to respectively intersect the conductors. A substantially rigid platform is mounted to the PC board and has a second set of holes. The first and second set of holes are in alignment and define common apertures arranged in the predetermined pattern to receive the leads of the modules. A layer of metal plating formed within the apertures makes electrical connections with the respective conductors. Jacks are mounted to each aperture for receiving the leads and making electrical connections between the leads and the conductors.
Abstract translation: 整体互连插座和柔性板组件接受具有以预定图案布置的多个引线的电子模块。 组件包括具有多个导体的柔性印刷电路板（PC）板和分别设置成分别与导体相交的第一组孔。 基本上刚性的平台安装在PC板上并具有第二组孔。 第一和第二组孔对准并且限定以预定图案布置的公共孔，以接收模块的引线。 形成在孔内的金属电镀层与各导体电连接。 千斤顶安装到每个孔口以接收引线并且在引线和导体之间进行电连接。
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公开(公告)号：US4247981A
公开(公告)日：1981-02-03
申请号：US49265
申请日：1979-06-18
Applicant: Jay A. Walters
Inventor： Jay A. Walters
CPC classification number: H05K3/321 , H01R12/58 , H05K1/095 , H05K2201/10333 , H05K2203/1453 , Y10T29/49139 , Y10T29/49153
Abstract: Interconnect sockets (10) are assembled with substrates, such as printed circuit cards (12), to connect the leads (17) of electrical components (18) to conductive pads (14) deposited on the substrate. Each socket has an end section (19)inserted into a mounting hole (11) in the substrate, for gripping portions of the walls of the hole to mount the socket to the board; a midsection (13) for contacting the conductive pad; and a lead-engaging section (16) for gripping the component lead and connecting it to the pad through the socket. Preferably, the socket is a tubular member of a conductively plated spring metal, with spring members (20, 22, 30) for resiliently engaging the walls of the hole, the contact pad, and the lead. The sockets are especially useful with thermosetting conductive-particle/resin conductors, such as silver-epoxy or -acrylic resin "thick-film " conductive inks.This divisional application relates particularly to methods of assembling such sockets with printed circuits having flowable, heat-curable conductive pads (14), wherein each socket is first fastened in the mounting hole so that a contact section (13) of the socket compresses the pad, after which the pad is heated to cure the conductive patterns and to bond the contact section of the socket to the pad.
Abstract translation: 互连插座（10）与诸如印刷电路卡（12）的基板组装以将电气部件（18）的引线（17）连接到沉积在基板上的导电焊盘（14）。 每个插座具有插入基板中的安装孔（11）中的端部（19），用于抓住孔的壁部分以将插座安装到板上; 用于接触导电垫的中央部（13）; 以及用于夹持部件引线并通过插座将其连接到焊盘的引线接合部分（16）。 优选地，插座是导电电镀弹簧金属的管状构件，其具有用于弹性地接合孔，接触垫和引线的壁的弹簧构件（20,22,30）。 插座对于热固性导电颗粒/树脂导体，例如银环氧树脂或丙烯酸树脂“厚膜”导电油墨是特别有用的。 该分案申请特别涉及将具有可流动的可热固化的导电焊盘（14）的印刷电路组装这种插座的方法，其中每个插座首先被紧固在安装孔中，使得插座的接触部分（13）压缩垫 之后，焊盘被加热以固化导电图案并将插座的接触部分接合到焊盘。
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159.发明授权
公开(公告)号：US4242720A
公开(公告)日：1980-12-30
申请号：US831895
申请日：1977-09-09
Applicant: Donn Moore
Inventor： Donn Moore
CPC classification number: H05K1/0246 , H05K3/222 , H05K1/0218 , H05K1/0287 , H05K1/167 , H05K2201/0715 , H05K2201/10174 , H05K2201/10287 , H05K2201/10303 , H05K2201/10333 , H05K2201/10689
Abstract: A logic card for interconnection of integrated circuits comprises a laminate for supporting integrated circuit devices. The laminate includes a relatively highly conductive layer. A selected plurality of holes are formed through the laminate in selected patterns at each of a plurality of stations on the laminate. A conductor is disposed in each of the holes. The conductors comprise, in each pattern, first and second groups of conductors. The conductors in each first group have one end effectively exposed on one side of the laminate and the conductors in each second group in each pattern have their opposite ends effectively exposed on opposite sides of the laminate, thus adapting the conductors for connection thereto of either or both of a lead from an integrated circuit and a conductor wire. Coupling means are located internally of the laminate for coupling the conductive layer to the in-hole conductors of the first group in each pattern and defining between the conductive layer and each said conductor a transmission line termination device.
Abstract translation: 用于集成电路互连的逻辑卡包括用于支撑集成电路器件的叠层。 层压体包括相对高导电性的层。 在层压板上的多个工位中的每一个台阶上，选定的多个孔以选定的图案形成穿过层叠体。 导体设置在每个孔中。 导体在每个图案中包括第一组和第二组导体。 每个第一组中的导体具有有效地暴露在层压体的一侧上的导体，并且每个图案中的每个第二组中的导体的相对端部有效地暴露在层叠体的相对侧上，从而使导体与其中的一个或 来自集成电路的导线和导线。 耦合装置位于层压板的内部，用于将导电层连接到每个图案中的第一组的空穴导体，并且在导电层和每个所述导体之间限定传输线终端装置。
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公开(公告)号：US3832603A
公开(公告)日：1974-08-27
申请号：US33967373
申请日：1973-03-09
Applicant: CONTROL DATA CORP
CPC classification number: H01R12/523 , H05K3/308 , H05K3/368 , H05K2201/096 , H05K2201/10333 , H05K2201/10962
Abstract: Circuit elements on circuit boards of a stacked assembly are electrically interconnected by interconnect devices located in a pseudo-random array on the boards. The interconnect devices include rigid, elongated members extending through the region separating adjacent circuit boards and assembled to receiver means, such as recesses, located in housings supported by an adjacent circuit board.
Abstract translation: 层叠组件的电路板上的电路元件通过位于板上的伪随机阵列中的互连装置电互连。 互连装置包括延伸穿过隔离相邻电路板的区域的刚性的细长构件，并组装到位于由相邻电路板支撑的壳体中的接收装置，例如凹部。
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