公开(公告)号：US06780001B2

公开(公告)日：2004-08-24

申请号：US09795772

申请日：2001-02-27

Applicant: Benjamin N. Eldridge ,  Stuart W. Wenzel

Inventor： Benjamin N. Eldridge ,  Stuart W. Wenzel

IPC: B29C4302

CPC classification number: G01R3/00 ,  B33Y80/00 ,  B81B2203/0118 ,  B81C1/00611 ,  B81C2201/0108 ,  B81C2201/0125 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/07342 ,  H01L23/4822 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/24 ,  H01R13/2407 ,  H05K3/4092 ,  H05K7/1069 ,  H01L2924/00

Abstract: A forming tool with one or more embossing tooth, and preferably, a plurality of such embossing teeth, arranged on a substantially planar substrate, is disclosed. Each embossing tooth is configured for forming a sacrificial layer to provide a contoured surface for forming a microelectronic spring structure. Each embossing tooth has a protruding area corresponding to a base of a microelectronic spring, and a sloped portion corresponding to a beam contour of a microelectronic spring. Numerous methods for making a forming tool are also disclosed. The methods include a material removal method, a molding method, a repetitive-stamping method, tang-bending methods, and segment-assembly methods.

Abstract translation: 公开了一种具有一个或多个压花齿的成形工具，优选地，布置在基本平坦的基底上的多个这样的压花齿。 每个压花齿构造成用于形成牺牲层以提供用于形成微电子弹簧结构的轮廓表面。 每个压花齿具有对应于微电子弹簧的基部的突出区域和对应于微电子弹簧的光束轮廓的倾斜部分。 还公开了用于制造成形工具的许多方法。 这些方法包括材料去除方法，成型方法，重复冲压方法，弯曲方法和段组装方法。

公开(公告)号：US20040012298A1

公开(公告)日：2004-01-22

申请号：US10291125

申请日：2002-11-08

Applicant: Coventor, Inc.

Inventor： Shawn Jay Cunningham ,  Dana Richard DeReus ,  Subham Sett ,  John Richard Gilbert

IPC: H02N010/00

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: MEMS Device having Electrothermal Actuation and Release and Method for Fabricating. According to one embodiment, a microscale switch is provided and can include a substrate and a stationary electrode and stationary contact formed on the substrate. The switch can further include a movable microcomponent suspended above the substrate. The microcomponent can include a structural layer including at least one end fixed with respect to the substrate. The microcomponent can further include a movable electrode spaced from the stationary electrode and a movable contact spaced from the stationary electrode. The microcomponent can include an electrothermal component attached to the structural layer and operable to produce heating for generating force for moving the structural layer.

Abstract translation: 具有电热驱动和释放的MEMS器件和制造方法。 根据一个实施例，提供微型开关，并且可以包括形成在基板上的基板和固定电极和固定触点。 开关还可以包括悬浮在基板上方的可移动的微型部件。 微组件可以包括包括相对于基底固定的至少一个端部的结构层。 微型部件还可以包括与固定电极间隔开的可动电极和与固定电极间隔开的可动触头。 微组件可以包括附接到结构层的电热组件，并且可操作以产生用于产生用于移动结构层的力的加热。

公开(公告)号：US20030228411A1

公开(公告)日：2003-12-11

申请号：US10391122

申请日：2003-03-18

Inventor： Yu-Chong Tai ,  Qing He

IPC: B05D005/12 ,  H01L021/00

CPC classification number: B81C1/00333 ,  B01L3/502707 ,  B01L2200/0668 ,  B01L2200/12 ,  B01L2300/0896 ,  B81C1/00182 ,  B81C1/00476 ,  B81C2201/0108 ,  B82Y30/00 ,  G01N30/6095 ,  G01N2030/562 ,  G01N2030/6056

Abstract: MEMs devices are integrally fabricated with included micro or nanoparticles by providing a mixture of a sacrificial material and a multiplicity of particles, disposing the mixture onto a substrate, fabricating a MEMs structure on the substrate including at least part of the mixture, so that at least some of the mixture is enclosed in the MEMs structure, removing the sacrificial material, and leaving at least some of the multiplicity of particles substantially free and enclosed in the MEMs structure. The step of fabricating a MEMs structure is quite general and is contemplated as including one or a multiplicity of additional steps for creating some type of structure in which the particles, which may be microbeads or nanobeads, are included. A wide variety of useful applications for MEMs integrated with micro or nanoparticles are available.

Abstract translation: 通过提供牺牲材料和多个颗粒的混合物将MEM装置与包含的微型或纳米颗粒整体制造，将混合物设置在衬底上，在包括至少部分混合物的衬底上制造MEM结构，使得至少 一些混合物被包封在MEMs结构中，去除牺牲材料，并且使至少一些多个颗粒基本上自由并且封闭在MEM结构中。 制造MEMs结构的步骤是相当普遍的，并且被设想为包括用于产生某些类型的结构的一个或多个附加步骤，其中可以包括可以是微珠或纳米珠的颗粒。 可以使用与微型或纳米颗粒集成的MEM的各种有用的应用。

公开(公告)号：US06583920B2

公开(公告)日：2003-06-24

申请号：US09995956

申请日：2001-11-29

Applicant: Yong-seop Yoon ,  Hyung Choi

Inventor： Yong-seop Yoon ,  Hyung Choi

IPC: G02B2600

CPC classification number: B81C1/00142 ,  B81B2201/042 ,  B81C2201/0108

Abstract: A method of manufacturing a micromirror actuator includes forming a trench on a substrate by etching, laminating a film-type organic layer on the substrate to cover but not fill the trench so that the trench is maintained hollow, and depositing and patterning a metal layer on the film-type organic layer and removing the film-type organic layer. According to the method of manufacturing a micromirror actuator, a micromirror can be easily planarized by laminating the film-type organic layer on the substrate including the trench, which reduces the cost of manufacturing the micromirror actuator and increases a reflectivity of the micromirror actuator by increasing the flatness level of the micromirror so as to enhance an optical transmission efficiency.

公开(公告)号：US20030010746A1

公开(公告)日：2003-01-16

申请号：US09902116

申请日：2001-07-10

Inventor： David Gutierrez ,  Vincent K. Luciani ,  Mary C. Burgess

IPC: B81C001/00

CPC classification number: B81C1/00476 ,  B81C2201/0108

Abstract: A method for using an organic dielectric as a sacrificial layer for forming suspended or otherwise spaced structures. The use of an organic dielectric has a number of advantages, including allowing use of an organic solvent or etch to remove the sacrificial layer. Organic solvents only remove organic materials, and thus do not affect or otherwise damage non-organic layers such as metal layers. This may reduce or eliminate the need for the rinsing and drying steps often associated with the use of acidic etchants such as Hydrofluoric Acid.

Abstract translation: 一种使用有机电介质作为牺牲层的方法，用于形成悬浮或其他间隔结构。 有机电介质的使用具有许多优点，包括允许使用有机溶剂或蚀刻去除牺牲层。 有机溶剂仅除去有机物质，因此不会影响或以其他方式损坏金属层等非有机层。 这可以减少或消除通常与使用酸性蚀刻剂如氢氟酸相关的漂洗和干燥步骤的需要。

公开(公告)号：US6008138A

公开(公告)日：1999-12-28

申请号：US814760

申请日：1997-03-07

Applicant: Franz Laermer ,  Andrea Schilp

Inventor： Franz Laermer ,  Andrea Schilp

IPC: B81B3/00 ,  H01L21/302

CPC classification number: B81B3/0051 ,  B81B2203/053 ,  B81C2201/0108

Abstract: A process for structuring a movable element out of a membrane region. A sacrificial layer and a sealing layer are applied to the underside of the membrane region. Following removal of the sacrificial layer, sealing layer forms a limit stop and a seal for the movement of the movable element.

Abstract translation: 一种用于从膜区域构造可移动元件的工艺。 将牺牲层和密封层施加到膜区域的下侧。 在去除牺牲层之后，密封层形成限位挡块和用于可移动元件运动的密封件。