Abstract:
Disclosed is a multi-layer adhesive film including a heat curable adhesive film and a first tacky adhesive composition disposed on the first major surface of the heat curable adhesive film. The heat curable adhesive film includes a surface-deactivated solid isocyanate and a polyurethane that includes functional groups that are reactive with isocyanate. A method of making an article that includes the multi-layer adhesive film and article made thereby are also disclosed.
Abstract:
A flashing laminate includes a non-reinforced thermoplastic sheet having a bottom surface, a first longitudinal edge, and a second longitudinal edge. The flashing laminate also includes an adhesive layer on a longitudinally extending portion of the bottom surface adjacent to one of the longitudinal edges. In one or more embodiments, the laminate also includes a release liner positioned over the adhesive tape.
Abstract:
The invention relates to a touch screen protector for a hand held electronic device having a front face that includes a touch screen portion and a non-functional band. The touch screen protector of the invention comprises a film having front and back sides, an outer perimeter that corresponds to that of the device, and a transparent window; an exposed adhesive or adhesive/spacer provided along the outer perimeter of the film surrounding the transparent window, and multiple dots arranged in a prescribed pitch and present on the back side of the film at a density which is sufficiently high to reduce interference patterns when the transparent window of the protector is pressed against the touch screen portion for operation of the electronic device.
Abstract:
A flashing laminate includes a non-reinforced thermoplastic sheet having a bottom surface, a first longitudinal edge, and a second longitudinal edge. The flashing laminate also includes an adhesive layer on a longitudinally extending portion of the bottom surface adjacent to one of the longitudinal edges. In one or more embodiments, the laminate also includes a release liner positioned over the adhesive tape.
Abstract:
Methods of making cut adhesive articles are described. The methods involve: providing a crosslinked pressure sensitive adhesive layer disposed on a substrate, embossing a surface of the crosslinked pressure sensitive adhesive layer to form a microstructured crosslinked pressure sensitive adhesive layer having a microstructured adhesive surface, and die cutting the microstructured crosslinked pressure sensitive adhesive layer.
Abstract:
Stretch release articles and fasteners comprising an elastic backing having pressure sensitive adhesive on one side of the elastic backing and bonds or bond elements not formed from pressure sensitive adhesive on the other side of the elastic backing. The pattern of pressure sensitive adhesive on the one side and the pattern of bonds or bonding elements on the other side do not substantially overlap when projected onto a common reference plane that is coplanar with the elastic backing. The stretch release articles and fasteners can be used in a variety of applications, including medical, industrial and consumer products.
Abstract:
A dicing die-bonding film and a method of forming a groove in a dicing die-bonding film, the film including a base film; a pressure-sensitive adhesive layer stacked on the base film; and a bonding layer stacked on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer includes a first region overlapping with the bonding layer, and a second region not overlapping with the bonding layer, the second region including a third region adjacent to the first region, and a fourth region adjacent to the third region and having a groove formed therein.
Abstract:
In a wafer processing tape, circular or tongue-shaped notched parts facing the center of an adhesive layer, as seen in a plan view, are formed so as to correspond to a pasting region to a wafer ring to a depth that reaches a release substrate from the side of a base material film. Due to the formation of the notched parts, when a peeling force acts on the wafer processing tape, portions of a tacky material layer and the base material film which are more outward than the notched parts are peeled off first, and a portion that is more inward than the notched parts remains on the wafer ring in a protruding state. Accordingly, a peeling strength between the wafer processing tape and the wafer ring can be increased and the wafer processing tape can be suppressed from being peeled off from the wafer ring during processes.
Abstract:
The manufacturing of articles relies on the bonding of two or more components to form some forms of the articles, such as a shoe sole bonded with a shoe upper. The bonding may be achieved with an adhesive particulate that is applied to a surface of a substrate. The adhesive particulate is selectively fused to the substrate with a controlled energy source having multiple energy emitters individually controllable, such as a laser array. The selective application of laser energy allows for specific geometric structures of adhesive particulate to be formed on the substrate. The substrate having the fused adhesive particulate is mated with another component allowing the fused adhesive particulate to bond the first substrate and the second component.
Abstract:
The manufacturing of articles relies on the bonding of two or more components to form some forms of the articles, such as a shoe sole bonded with a shoe upper. The bonding may be achieved with an adhesive particulate that is applied to a surface of a substrate. The adhesive particulate is selectively fused to the substrate with a controlled energy source, such as a laser. The selective application of laser energy allows for specific geometric structures of adhesive particulate to be formed on the substrate. The substrate having the fused adhesive particulate is mated with another component allowing the fused adhesive particulate to bond the first substrate and the second component.