公开(公告)号：US09936579B2

公开(公告)日：2018-04-03

申请号：US14163852

申请日：2014-01-24

Applicant: Apple Inc.

Inventor： Sunil M. Akre ,  Shawn X. Arnold

IPC: H05K3/30 ,  H01F27/29 ,  H01F27/02 ,  H01F27/24 ,  H05K1/14 ,  H05K1/16 ,  H05K1/18

CPC classification number: H05K1/141 ,  H05K1/144 ,  H05K1/165 ,  H05K1/185 ,  H05K2201/086 ,  Y10T29/4913

Abstract: Embedded PCB (printed circuit board) is used for the packaging and assembly of a low profile power conversion system module that can be employed in space constrained environment of small computer/electronic systems. The low profile power conversion system module includes an embedded PCB, a power silicon device embedded within the PCB, a magnetic component which is either embedded within the PCB or disposed on the PCB, and input/output terminals disposed on the side of the embedded PCB. The embedded PCB and the magnetic component are thin planar shaped to save vertical space. The low profile power conversion system module can be placed inside a cavity formed in the system PCB to save even more vertical space.

公开(公告)号：US09907184B2

公开(公告)日：2018-02-27

申请号：US14845631

申请日：2015-09-04

Applicant: SUMIDA ELECTRIC (H.K.) COMPANY LIMITED

Inventor： Hongnian Zhang ,  Yanfei Liu ,  Douglas James Malcolm

IPC: H05K3/30 ,  H05K3/28 ,  H01F27/02

CPC classification number: H05K3/284 ,  H01F27/022 ,  H01F41/005 ,  H05K2201/086 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/1105 ,  Y10T29/49146

Abstract: A power supply module and its manufacturing method are disclosed. The manufacturing method for the power supply module includes: configuring a coil such that coil terminals are configured by way of electrical connection in the preset circuit connection configuration of the connector; preparing a mold cavity, and placing the connector housed with the coil and the electronic components into the mold cavity; making a magnetic mixture, and filling the mold cavity where the connector is placed with the magnetic mixture to form a magnetic body under pressure, wherein the magnetic body encapsulates at least the coil, the electronic components and a portion of the connector adapted to house the coil and the electronic components, and the terminal is exposed outside the magnetic body; demolding the magnetic body from the mold cavity; and increasing the temperature of the demolded magnetic body by heating. In this way, the molding pressure for forming the power supply module is lower and the manufactured power supply module has good performance of heat transfer.

公开(公告)号：US09871325B2

公开(公告)日：2018-01-16

申请号：US14996692

申请日：2016-01-15

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： Sandeep Patel ,  Bruce Allen Champion ,  Linda Ellen Shields ,  Michael John Phillips ,  Thomas Taake de Boer ,  John Joseph Consoli

IPC: H01R13/66 ,  H01R13/6473 ,  H01R12/72

CPC classification number: H01R13/6473 ,  H01R12/721 ,  H01R12/724 ,  H01R13/6471 ,  H01R24/60 ,  H05K1/0233 ,  H05K1/115 ,  H05K1/117 ,  H05K2201/086 ,  H05K2201/10189

Abstract: An interconnect system includes a circuit board including a substrate having a first surface and a second surface opposite the first surface, a plurality of signal conductors and a plurality of ground conductors including respective contact pads in a mating area of the substrate for engaging corresponding contacts of an electrical connector, and a plurality of ground vias extending at least partially through the substrate between the first and second surfaces. The ground vias are coupled to corresponding ground conductors. The ground vias include lossy plugs at least partially filling the ground vias. The lossy plugs are manufactured from lossy material capable of absorbing electrical resonance propagating through the substrate.

公开(公告)号：US09854671B1

公开(公告)日：2017-12-26

申请号：US15410745

申请日：2017-01-19

Applicant: Unimicron technology Corp.

Inventor： Wei-Ti Lin ,  Chun-Hsien Chien ,  Yu-Chung Hsieh ,  Yu-Hua Chen

IPC: H05K3/42 ,  H05K1/11 ,  H05K1/16 ,  H05K3/40 ,  H01F27/28 ,  H01F27/24

CPC classification number: H05K1/115 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/24 ,  H01F27/2804 ,  H01F2017/002 ,  H01F2027/2809 ,  H05K1/036 ,  H05K1/0366 ,  H05K1/165 ,  H05K3/4076 ,  H05K3/42 ,  H05K3/423 ,  H05K3/426 ,  H05K3/4644 ,  H05K2201/0187 ,  H05K2201/0195 ,  H05K2201/086 ,  H05K2201/0959

Abstract: A circuit board includes a substrate, a first magnetic structure, a first dielectric layer and an inductive coil. The substrate has a top surface and a bottom surface. The first magnetic structure is disposed on the top surface of the substrate. The first dielectric layer covers the substrate and the first magnetic structure. The inductive coil includes a first interconnect, a second interconnect and a plurality of conductive pillars. The first interconnect is disposed on the first dielectric layer. The second interconnect is disposed on the bottom surface of the substrate. The conductive pillars connect the first interconnect and the second interconnect. The first interconnect, the second interconnect and the conductive pillars form a helical structure surrounding the first magnetic structure.

公开(公告)号：US09831788B2

公开(公告)日：2017-11-28

申请号：US15034422

申请日：2014-11-21

Applicant: THALES

Inventor： Kevin Guepratte ,  Hervé Stephan

IPC: H02M3/335 ,  H01F27/24 ,  H05K1/18 ,  H05K1/02 ,  H05K1/16 ,  H02M3/28 ,  H01F27/28

CPC classification number: H02M3/33576 ,  H01F27/24 ,  H01F27/2804 ,  H01F2027/2819 ,  H02M3/28 ,  H02M3/335 ,  H05K1/0233 ,  H05K1/165 ,  H05K1/181 ,  H05K2201/086

Abstract: An electronic board, in particular for a power electronics circuit such as a converter, comprises: a planar substrate having a first side and a second side opposite the first side; at least two magnetic core elements, called the first elements, arranged on the first side of the substrate and each having at least two legs passing through the substrate; and at least two windings, arranged around at least one leg of each first magnetic core; wherein: it also comprises a second magnetic core element in the form of a plate, arranged on the second side of the substrate and in contact with respective ends of the legs of at least two first elements; the first elements, the windings and the second element forming at least two mutually decoupled magnetic circuits.

公开(公告)号：US20170339791A1

公开(公告)日：2017-11-23

申请号：US15669187

申请日：2017-08-04

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Toshiro Adachi

IPC: H05K1/18 ,  H05K1/16 ,  H01F27/28

CPC classification number: H05K1/182 ,  H01F17/0033 ,  H01F17/062 ,  H01F27/2804 ,  H01F27/2895 ,  H01F2017/0086 ,  H01F2027/065 ,  H01F2027/2809 ,  H05K1/165 ,  H05K1/185 ,  H05K2201/086 ,  H05K2201/10015

Abstract: A module includes a wiring board, an insulating layer that is laminated on the bottom surface of the wiring board, a ring-shaped coil core that is embedded in the insulating layer, a coil electrode that is wound around the coil core, electronic components that are disposed in an inner region surrounded by the coil core in the insulating layer, and an electronic component that is mounted on or in the top surface of the wiring board. With this configuration, the areas of main surfaces of the wiring board and main surfaces of the insulating layer are not large, whereas if the electronic components were mounted on or in the top surface of the wiring board, the areas of the main surfaces of the wiring board and the main surfaces of the insulating layer would be large, and a reduction in the size of the module can be facilitated.

公开(公告)号：US20170307412A1

公开(公告)日：2017-10-26

申请号：US15493650

申请日：2017-04-21

Applicant: KSR IP Holdings, LLC

Inventor： Ryan W. Elliott ,  Lingmin Shao ,  Shaun Fuller ,  Benjamin Scott Hill

IPC: G01D5/20 ,  H05K1/18

CPC classification number: G01D5/204 ,  G01D5/2241 ,  H05K1/165 ,  H05K1/181 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2201/10151

Abstract: An inductor sensor assembly for determining to position of object includes a layer of ferrite overlaying exciting and receiving coils formed on a substrate. A magnet attached to the target produces a virtual coupler in an area of ferrite overlaying the coils. An application for a shock absorber includes a sensor module mounted in a recess in a dust cover and a magnet mounted to a cylinder tube of the shock absorber.

公开(公告)号：US09781834B1

公开(公告)日：2017-10-03

申请号：US15408096

申请日：2017-01-17

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Hao Wu ,  Michael Lekas

IPC: H01L23/49 ,  H05K1/18 ,  H01L23/522 ,  H01L23/498 ,  H01F27/28 ,  H03H7/38

CPC classification number: H03H7/38 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/2823 ,  H01L23/49822 ,  H01L23/5227 ,  H05K1/0233 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/165 ,  H05K1/181 ,  H05K2201/086 ,  Y02P70/611

Abstract: An integrated passive device and assemblies containing the same are disclosed. The integrated passive device can include a thin-film magnetic inductor. Various configurations of electrically connecting an integrated passive device to a processor and/or an interposer such as a chip-scale package are also disclosed. An inductor on an integrated passive device can configured and arranged such that it is magnetically coupled to an inductor on a structure such as a processor chip or a system on a chip.

公开(公告)号：US09743523B2

公开(公告)日：2017-08-22

申请号：US14512514

申请日：2014-10-13

Applicant: TRIPOD TECHNOLOGY CORPORATION

Inventor： Bo-Shiung Huang ,  Wei-Hsiung Yang ,  Han-Ching Shih ,  Cheng-Feng Lin

IPC: H05K1/03 ,  H05K1/18 ,  H01F27/28 ,  H01F41/04 ,  H05K3/46 ,  H05K1/11 ,  H05K3/42 ,  H01F17/00 ,  H01F17/06 ,  H05K1/16 ,  H05K3/00 ,  H05K1/02

CPC classification number: H05K1/181 ,  H01F17/0006 ,  H01F17/06 ,  H01F27/2804 ,  H01F41/046 ,  H05K1/0272 ,  H05K1/0366 ,  H05K1/115 ,  H05K1/165 ,  H05K3/0044 ,  H05K3/0052 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4655 ,  H05K3/4697 ,  H05K2201/0187 ,  H05K2201/0275 ,  H05K2201/086 ,  H05K2201/09036 ,  H05K2201/1003 ,  H05K2203/1178 ,  Y10T29/302 ,  Y10T29/49165

Abstract: A printed circuit board package structure includes a substrate, plural ring-shaped magnetic elements, a support layer, and first conductive layers. The substrate has two opposite first and second surfaces, first ring-shaped recesses, and first grooves. Each of the first ring-shaped recesses is communicated with another first ring-shaped recess through at least one of the first grooves, and at least two of the first ring-shaped recesses are communicated with a side surface of the substrate through the first grooves to form at least two openings. The ring-shaped magnetic elements are respectively located in the first ring-shaped recesses. The support layer is located on the first surface, and covers the first ring-shaped recesses and the first grooves. The support layer and the substrate have through holes. The first conductive layers are respectively located on surfaces of support layer and substrate facing the through holes.

公开(公告)号：US20170207579A1

公开(公告)日：2017-07-20

申请号：US14996692

申请日：2016-01-15

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： Sandeep Patel ,  Bruce Allen Champion ,  Linda Ellen Shields ,  Michael John Phillips ,  Thomas Taake de Boer ,  John Joseph Consoli

IPC: H01R13/6473 ,  H01R12/72

CPC classification number: H01R13/6473 ,  H01R12/721 ,  H01R12/724 ,  H01R13/6471 ,  H01R24/60 ,  H05K1/0233 ,  H05K1/115 ,  H05K1/117 ,  H05K2201/086 ,  H05K2201/10189

Abstract: An interconnect system includes a circuit board including a substrate having a first surface and a second surface opposite the first surface, a plurality of signal conductors and a plurality of ground conductors including respective contact pads in a mating area of the substrate for engaging corresponding contacts of an electrical connector, and a plurality of ground vias extending at least partially through the substrate between the first and second surfaces. The ground vias are coupled to corresponding ground conductors. The ground vias include lossy plugs at least partially filling the ground vias. The lossy plugs are manufactured from lossy material capable of absorbing electrical resonance propagating through the substrate.