Abstract:
Embodiments of the present invention relate to circuit layouts that are compatible with printing electronic inks, printed circuits formed by printing an electronic ink or a combination of printing and conventional blanket deposition and photolithography, and methods of forming circuits by printing electronic inks onto structures having print-compatible shapes. The layouts include features having (i) a print-compatible shape and (ii) an orientation that is either orthogonal or parallel to the orientation of every other feature in the layout.
Abstract:
A highly reliable electrostatic-capacitive-type display device with a touch panel which allows a user to perform finger touch inputting and exhibits excellent detection sensitivity is provided. A transparent conductive film is formed above a back surface of an electrostatic-capacitive-type touch panel so as to block noises generated by a display device. A conductive member is provided to supply a voltage to a transparent conductive film formed above a back surface of the touch panel. An electrode which is formed on the electrostatic-capacitive-type touch panel is divided in accordance with a ratio between the number of X electrodes and the number of Y electrodes. A floating electrode is formed in a gap defined between the electrodes so as to adjust an area of the electrode. Due to the shrinkage of the area of the electrode, it is possible to lower a noise level to a level equal to or lower than a signal level. Accordingly, an S/N ratio is increased thus enhancing detection sensitivity. Further, lines are branched on a flexible printed circuit board and intersecting lines are formed on a back surface of the flexible printed circuit board, and the intersecting lines are made to orthogonally intersect with lines formed on a front surface of the flexible printed circuit board thus lowering line capacitance.
Abstract:
A printed circuit board includes at least two conductive traces, each having a first portion and a second portion. The printed circuit board also includes a cross-over section that includes two electrically conductive portions, each connecting electrically to the first and second portions of a corresponding one of the conductive traces, such that the conductive traces in their first portions lie on opposite sides of each other as they do in their second portions.
Abstract:
A circuit board (10) for reducing a variation in impedance of signal traces thereon includes a first signal plane (30) and a second signal plane (50). The first signal plane includes a first signal trace (31) arranged thereon. The first signal trace has a first width. The second signal plane includes a plurality of second signal traces (51) arranged thereon. An orthographic projection of the first signal trace onto the second signal plane crosses the second signal traces. A width of the first signal trace at positions where the orthographic projection thereof onto the second signal plane at the intersections with the second signal traces transitions to a second width less than the first width of the first signal trace.
Abstract:
To provide an electron source including: a wiring board having: a substrate having a groove on its surface; a conductive wire containing a metal which is arranged along the groove in the groove; and a wiring which is arranged above the wire crossing the wire; and an electron-emitting device which is arranged on the wiring board and is electrically connected to the conductive wire and the wiring; wherein the wire has an oxide layer of the metal contained in the wire on its surface.
Abstract:
The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing, and a plurality of wire termination contacts for terminating wires to the jack. The jack further includes a circuit board that electrically connects the contact springs to the wire termination contacts. The circuit board includes first and second conductive layers separated by a relatively thin dielectric layer. The first and second conductive layers include a crosstalk compensation arrangement having spaced-apart capacitor members. The relatively thin dielectric layer allows a high level of capacitance to be generated between the capacitor members.
Abstract:
A printed circuit board having via arrangements for reducing crosstalk is disclosed. The printed circuit board includes a first layer and a second layer. The printed circuit board also includes a first via and a second via, both traveling from the first layer to the second layer. The first via is orthogonal to the second via in a three dimensional space. In addition, the printed circuit board may include a third via traveling from the first layer to the second layer, and the third via is orthogonal to the first and second vias in the three dimensional space.
Abstract:
For electrical matching of an electrical component, a network with a transformation line is proposed which is realized in or on a substrate, preferably a ceramic substrate. The network has a prescribed electrical length for achieving a desired phase shift, and comprises at least two electrical conductors (LE) each of which has a bent-over configuration (e.g. Greek fret pattern) comprising straight segments joined [sic] at right angles, in a respective conductor plane for the given conductor (LE), and which conductors (LE) are interconnected. Mutually parallel conductor segments disposed in different conductor planes partially overlap and are thereby mutually capacitively coupled, with the capacitive coupling being adjustable by adjusting of individual overlap areas, so as to achieve the prescribed electrical length and prescribed impedance of the transformation line.
Abstract:
A communications connector includes: a dielectric mounting substrate; at least four pairs of conductors mounted on the mounting substrate, each of the conductors including a free end segment, each of the free end segments being positioned in side-by-side and generally parallel relationship; and at least four pairs of terminals mounted on the mounting substrate, wherein each of the pairs of terminals is electrically connected to a respective pair of conductors. A first pair of conductor free end segments is immediately adjacent each other, a second pair of conductor free end segments is immediately adjacent each other and positioned one side of the first pair, a fourth pair of conductor free end segments is immediately adjacent each other and positioned on an opposite side of the first pair, and a third pair of conductor free end segments sandwiches the first pair, with one of the conductor free end segments of the third pair being disposed between the first and second pairs, and the other of the conductor free end segments being disposed between the first and fourth pairs. Each of the first, second and fourth pairs of conductors includes a crossover between the conductors of the pairs, and wherein the third pair of conductors includes two crossovers between its conductors.
Abstract:
A communications jack assembly includes: a jack frame having a plug aperture; a dielectric mounting substrate attached to the jack frame; and a plurality of conductors engaged with the mounting substrate, each of the conductors including a fixed end portion mounted with the mounting substrate and a free end portion extending into the plug aperture for electrical contact with a mating plug, each of the free end portions having substantially the same profile and being substantially transversely aligned in side-by-side relationship. A first pair of conductors is sandwiched inside a second pair of conductors. The second pair of conductors includes a crossover, the positioning of crossover being selected to provide differential to common mode crosstalk compensation.