公开(公告)号：US5546279A

公开(公告)日：1996-08-13

申请号：US338013

申请日：1994-11-10

Applicant: Keiji Aota ,  Masaaki Ooga ,  Yasunobu Tagusa

Inventor： Keiji Aota ,  Masaaki Ooga ,  Yasunobu Tagusa

IPC: H01R11/01 ,  H01L21/60 ,  H01L23/498 ,  H05K1/02 ,  H05K1/14 ,  H05K3/32 ,  H05K3/36 ,  H05K1/00 ,  H01R4/58 ,  H01R13/40 ,  H05K1/11

CPC classification number: H01L24/32 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/83 ,  H05K3/361 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K1/0269 ,  H05K2201/09145 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/10681 ,  H05K3/321 ,  H05K3/323

Abstract: A flexible wiring board is adapted to be connected with a circuit board by means of an anisotropic conductive film. A flexible substrate of the flexible wiring board is mounted with an integrated circuit and has a generally rectangular connection portion. The connection portion includes a first edge of the substrate and parts of second and third edges adjoining the first edge of the substrate. A plurality of connection terminals are provided in the connection portion of the substrate. These connection terminals extend perpendicular to and arranged along the first edge of the substrate. Opposite end parts including the parts of the second and third edges of the connection portion do not extend beyond the connection terminals located closest to the second and third edges, respectively.

Abstract translation: 柔性布线板适于通过各向异性导电膜与电路板连接。 柔性布线板的柔性基板安装有集成电路并且具有大致矩形的连接部分。 连接部分包括基板的第一边缘和与基板的第一边缘邻接的第二和第三边缘的部分。 多个连接端子设置在基板的连接部分中。 这些连接端子垂直于衬底的第一边缘延伸并布置。 包括连接部分的第二和第三边缘部分的相对端部分别不延伸超过最靠近第二和第三边缘的连接端子。

公开(公告)号：US5522683A

公开(公告)日：1996-06-04

申请号：US346183

申请日：1994-11-22

Applicant: Masakazu Kakimoto ,  Takashi Suzuki

Inventor： Masakazu Kakimoto ,  Takashi Suzuki

IPC: B23B41/00 ,  B23Q17/24 ,  H05K1/02 ,  H05K3/00 ,  B23B49/00

CPC classification number: B23Q17/24 ,  B23B41/00 ,  H05K3/0008 ,  H05K1/0269 ,  H05K2201/09918 ,  H05K3/0047 ,  Y10T408/175 ,  Y10T408/21 ,  Y10T408/50

Abstract: Disclosed is a drilling apparatus intended to obtain an image of a drilling mark for detecting the center of the drilling mark, irrespective of the material of a work (transparent material or nontransparent material). The drilling apparatus includes: a working table on which a work having a drilling mark is set; a lower lighting element provided under the working table for emitting a light to the drilling mark through a drill port; an upper lighting element for emitting a light to the drilling mark from the upper side; a camera unit provided on the working table for receiving a transmission image of the drilling mark emitted by the lower lighting element and a reflection image of the drilling mark emitted by the upper lighting element; an image processing unit for processing an image signal received by the camera unit into a binary signal and searching the binary image for detecting the center of the drilling mark; a drill; and a feed mechanism communicating with to the image processing apparatus and the drill for correctively moving the drill to the center position of the drilling mark in the X and Y directions and allowing the drill to drill the work at the center of the drilling mark, wherein the lower lighting element and the upper lighting element are switchable to each other.

Abstract translation: 公开了一种用于获得用于检测钻孔中心的钻孔图像的钻孔设备，而与工件的材料（透明材料或非透明材料）无关。 钻孔装置包括：设置有具有钻痕的工件的工作台; 设置在工作台下方的下部照明元件，用于通过钻孔向钻孔发射光; 用于从上侧向所述钻孔发射光的上部照明元件; 设置在工作台上的相机单元，用于接收由下部照明元件发射的钻孔的透射图像和由上部照明元件发射的钻孔的反射图像; 图像处理单元，用于将由相机单元接收的图像信号处理为二进制信号，并搜索二进制图像以检测钻孔的中心; 一个钻孔机; 以及与图像处理装置和钻头通信的进给机构，用于将钻头在X和Y方向上正确地移动到钻孔的中心位置，并允许钻头在钻孔的中心钻孔工件，其中 下部照明元件和上部照明元件可彼此切换。

公开(公告)号：US5111406A

公开(公告)日：1992-05-05

申请号：US462393

申请日：1990-01-05

Applicant: Julie C. Zachman ,  Robert A. Kuntz ,  Steven R. Smith ,  James S. Hudzik

Inventor： Julie C. Zachman ,  Robert A. Kuntz ,  Steven R. Smith ,  James S. Hudzik

IPC: B23Q17/22 ,  H05K1/02 ,  H05K3/00 ,  H05K3/46

CPC classification number: H05K3/4638 ,  B23Q17/22 ,  H05K3/0008 ,  H05K1/0269 ,  H05K2201/09781 ,  H05K2201/09918 ,  Y10T408/03 ,  Y10T408/21

Abstract: In order to correct for misregistration of solder pads in multilayer board (MLB) panels and determine drill target locations through vertical stacks of the solder pads, a fixture is prepared with fixture holes arranged in a pattern that corresponds with the locations of fiducial pads that are located on the MLB panel. The fixture has tooling pins that engage with tooling holes in the MLB panel to hold the MLB panel in an absolute position relative to the fixture. An x-ray inspection system views the superimposed image of a selected fixture hole and a corresponding fiducial pad that is visible within the boundary of the fixture hole. A software routine is then used to compute the offset between the fixture hole and the fiducial pad. The process is then repeated for the remaining sample of fixture holes and fiducial pads. The results are then fitted and then sent to a drilling machine to determine a position for the drilled holes in the MLB panel that compensates for the misregistration of the solder pads.

Abstract translation: 为了纠正多层板（MLB）面板中焊盘的对准错误，并通过焊盘的垂直叠层来确定钻头目标位置，准备一个固定孔，该固定孔以对应于基准焊盘位置的图案 位于MLB面板上。 夹具具有与MLB面板中的工具孔接合的工具销，以将MLB面板固定在相对于夹具的绝对位置。 X射线检查系统观察所选夹具孔的叠加图像和在固定孔的边界内可见的相应基准垫。 然后使用软件程序来计算固定孔和基准垫之间的偏移。 然后对剩余的固定孔和基准垫样品重复该过程。 然后将结果安装，然后发送到钻孔机器，以确定MLB面板中钻孔的位置，以补偿焊盘的对准。

公开(公告)号：US5053921A

公开(公告)日：1991-10-01

申请号：US601927

申请日：1990-10-23

Applicant: Gregory H. Nelson ,  Steven C. Lockard

Inventor： Gregory H. Nelson ,  Steven C. Lockard

IPC: H01L21/60 ,  H01L21/48 ,  H01L23/14 ,  H01L23/498 ,  H01L23/64 ,  H05K3/00 ,  H05K3/20 ,  H05K3/38 ,  H05K3/46

CPC classification number: H05K3/4655 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/142 ,  H01L23/49822 ,  H01L23/49894 ,  H01L23/642 ,  H05K3/205 ,  H05K3/4673 ,  B23K2203/05 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09918 ,  H05K2203/0152 ,  H05K2203/0726 ,  H05K2203/107 ,  H05K3/0017 ,  H05K3/0035 ,  H05K3/386 ,  H05K3/4644 ,  H05K3/4652

Abstract: An interconnect device for electronic components, such as integrated circuits, multichip modules and the like, and the method of manufacture thereof are presented. The interconnect device has at least three layers of circuitry, one for signal transmission and two for voltage planes (power and ground). The interconnect device is made by a processing on a stainless steel carrier plate to achieve high lead count capability with fine line widths and spacing, as well as precise registration layer to layer. Laser drilling is used to define interconnect vias between signal and voltage (power and ground) plane layers.

Abstract translation: 本发明提供了一种用于电子部件的互连装置，例如集成电路，多芯片模块等及其制造方法。 互连器件具有至少三层电路，一层用于信号传输，另一层用于电压平面（电源和接地）。 互连器件是通过在不锈钢载体板上的加工制成的，以实现高引线数能力，具有精细的线宽和间距，以及精确的配准层到层。 激光钻孔用于定义信号和电压（电源和接地）平面层之间的互连通孔。

公开(公告)号：US5049974A

公开(公告)日：1991-09-17

申请号：US534038

申请日：1990-06-29

Applicant: Gregory H. Nelson ,  Sanford Lebow ,  Eugene Nogavich

Inventor： Gregory H. Nelson ,  Sanford Lebow ,  Eugene Nogavich

IPC: H01L23/14 ,  H01L23/498 ,  H05K3/00 ,  H05K3/20 ,  H05K3/38 ,  H05K3/46

CPC classification number: H05K3/4673 ,  H01L23/142 ,  H01L23/49894 ,  H05K3/205 ,  H05K3/4655 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09918 ,  H05K2203/0152 ,  H05K2203/0726 ,  H05K2203/107 ,  H05K3/0017 ,  H05K3/0035 ,  H05K3/386 ,  H05K3/4644 ,  H05K3/4652

Abstract: An interconnect device for electronic components, such as integrated circuits, multichip modules and the like, and the method of manufacture of such components are presented. The interconnect device has two layers of circuitry, one for signal transmission and one for voltage plane. The interconnect device is made by a processing on a stainless steel carrier plate to achieve high lead count capability with fine line widths and spacing, as well as precise registration layer to layer. Laser drilling is used to define interconnect vias between signal and voltage (power or ground) plane layers.

Abstract translation: 提出了一种用于诸如集成电路，多芯片模块等的电子部件的互连装置及其制造方法。 互连设备具有两层电路，一层用于信号传输，另一层用于电压平面。 互连器件是通过在不锈钢载体板上的加工制成的，以实现高引线数能力，具有精细的线宽和间距，以及精确的配准层到层。 激光钻孔用于定义信号和电压（电源或接地）平面层之间的互连通孔。

公开(公告)号：US5010757A

公开(公告)日：1991-04-30

申请号：US471308

申请日：1990-01-29

Applicant: David A. Fishman ,  Jon D. Hone

Inventor： David A. Fishman ,  Jon D. Hone

IPC: H05K1/00 ,  H05K1/02

CPC classification number: H05K1/0269 ,  H05K1/0393 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/09781 ,  H05K2201/09918

Abstract: Method of forming shallow fiducial dimples upon a thin flexible electrical circuit having a first deflectable substrate overlaying a second substrate have recesses therein to be aligned with the dimples, including providing a first support member having resilient cylindrical rubber pads affixed thereto, providing a second support member, positioning the flexible electrical circuit between the first and second support members so that the resilient pads are aligned with the recesses within the second substrate; and applying a sufficient opposing force to the first and second members to cause the first substrate to be deflected by the pads into the recesses to form the dimples.

Abstract translation: 在具有覆盖第二基板的第一可偏转基板的薄柔性电路上形成浅基准凹坑的方法在其中具有与凹坑对准的凹部，包括提供具有固定到其上的弹性圆柱形橡胶垫的第一支撑构件，提供第二支撑构件 将柔性电路定位在第一和第二支撑构件之间，使得弹性垫与第二基板内的凹槽对准; 以及向所述第一和第二构件施加足够的相反的力，以使所述第一基板被所述垫偏转到所述凹部中以形成所述凹坑。

公开(公告)号：US4817477A

公开(公告)日：1989-04-04

申请号：US944467

申请日：1986-12-19

Applicant: Jack K. Emery ,  Michael B. Dent

Inventor： Jack K. Emery ,  Michael B. Dent

IPC: H05K3/46 ,  B26F1/02 ,  G06T3/00 ,  H05K1/02 ,  H05K3/00 ,  B26D5/32 ,  B26D5/34

CPC classification number: H05K3/0008 ,  H05K1/0269 ,  H05K2201/09918 ,  H05K3/0002 ,  H05K3/005 ,  Y10T83/0448 ,  Y10T83/06 ,  Y10T83/2024 ,  Y10T83/446 ,  Y10T83/531 ,  Y10T83/533 ,  Y10T83/543 ,  Y10T83/6572

Abstract: A method of punching patterns of holes in printed circuit boards and sheets of material used in the manufacture of printed circuit boards. Each hole pattern punched is precisely positioned with respect to the metallized circuitry or the photographic image of the circuitry on each sheet of material. This method is accomplished with the use of an optical registration punch which automatically positions each sheet of material and punches a pattern of holes therein at a precise position with respect to the circuitry or the image of the circuitry on each sheet of material.

公开(公告)号：US4790694A

公开(公告)日：1988-12-13

申请号：US916779

申请日：1986-10-09

Applicant: John W. Wilent ,  Robert F. Benson ,  Robert A. Sparks

Inventor： John W. Wilent ,  Robert F. Benson ,  Robert A. Sparks

IPC: B23B49/00 ,  H05K3/00 ,  H05K3/46 ,  B23C3/00

CPC classification number: H05K3/4638 ,  H05K2201/09918 ,  H05K2201/10204 ,  H05K3/0008 ,  H05K3/0047 ,  H05K3/4611 ,  Y10T408/03 ,  Y10T408/08 ,  Y10T408/21 ,  Y10T83/178

Abstract: A method and apparatus for optimizing the drilling position of a multi-layer printed circuit board prior to drilling. A template having precisely located target holes and fixture reference marks provides initial coordinate reference information for multi-layer printed circuit boards to be inspected by x radiation. Each board is processed by insertion into a holding fixture, examination of four quadrant target areas using x-ray sources and detectors, digitization of the target area images in each quadrant, and computaton of the optimum board position in a follow-on drilling apparatus. After optimization, three reference holes are punched along one edge of the board to provide accurate fiducial positioning marks when the board is placed in the drilling apparatus.

Abstract translation: 一种用于在钻孔之前优化多层印刷电路板的钻孔位置的方法和装置。 具有精确定位的目标孔和夹具参考标记的模板提供了要被x辐射检查的多层印刷电路板的初始坐标参考信息。 每个板通过插入固定夹具进行处理，使用X射线源和检测器检查四个象限目标区域，在每个象限中对目标区域图像进行数字化，以及在后续钻孔设备中计算最佳板位置。 优化后，沿着板的一个边缘冲切三个参考孔，当板放置在钻孔装置中时，提供准确的基准定位标记。

公开(公告)号：US4481533A

公开(公告)日：1984-11-06

申请号：US325566

申请日：1981-11-27

Applicant: Donald R. Alzmann ,  Michael Angelo ,  Paul R. Waldner

Inventor： Donald R. Alzmann ,  Michael Angelo ,  Paul R. Waldner

IPC: B26D7/01 ,  H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  H05K13/00 ,  H04N7/00

CPC classification number: B26D7/018 ,  B26D7/015 ,  H05K13/0061 ,  H05K3/0002 ,  H05K3/0008 ,  H05K1/0269 ,  H05K2201/09918 ,  H05K2203/056 ,  H05K3/005 ,  H05K3/4611

Abstract: Method and apparatus for effecting operations, such as punching holes in sheets of material at precise locations thereon. Each sheet has a reference marking thereon and is placed on a receiver one by one and is held in fixed position on the receiver. A T.V. camera views each sheet to detect the reference marking thereon and a visual display of the marking is produced on a T.V. monitor. Also produced on the monitor is a cross-hair grating with a coincident shaded box. The cross-hair grating is first aligned with a marking reference on a master sheet to establish a fixed relation between the cross-hair and the marking reference on the master sheet and thereby between the cross-hair and the operating system, for example, the punches for punching holes in the sheets. The master sheet is removed and the sheets to be punched are placed one by one on the receiver which is moved to align the reference marking on each sheet, as viewed on the monitor with the cross-hair grating thereon.

Abstract translation: 用于进行操作的方法和装置，例如在其上的精确位置处冲压材料片中的孔。 每张纸上都有一个参考标记，并逐个放置在接收器上，并被固定在接收器上。 T.V.相机查看每张纸以检测其上的参考标记，并且在T.V.监视器上产生标记的视觉显示。 在监视器上也产生的是具有重合阴影盒的十字头光栅。 十字头光栅首先与母板上的标记基准对准，以在母板上，从而在十字线和操作系统之间建立十字线和标记基准之间的固定关系，例如， 用于在床单上冲孔。 拆下母版，将待冲压的片材一个接一个地放置在接收器上，移动器将其移动以使每个片材上的参考标记对齐，如在显示器上用十字头光栅在其上观察。

公开(公告)号：US10085345B2

公开(公告)日：2018-09-25

申请号：US14467079

申请日：2014-08-25

Applicant: GE Embedded Electronics Oy

Inventor： Risto Tuominen ,  Petteri Palm

IPC: H01K1/18 ,  H01L23/538 ,  H05K1/18 ,  H01L23/552 ,  H01L23/00 ,  H01L25/10 ,  H01L25/00 ,  H01L23/544 ,  H05K1/02 ,  H05K3/46 ,  H01L23/29 ,  H05K3/28

CPC classification number: H05K1/189 ,  H01L23/295 ,  H01L23/5387 ,  H01L23/5389 ,  H01L23/544 ,  H01L23/552 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2224/82106 ,  H01L2224/82132 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/0269 ,  H05K1/188 ,  H05K3/284 ,  H05K3/4611 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/042 ,  H05K2201/056 ,  H05K2201/09918 ,  H05K2201/10674 ,  H05K2203/063 ,  H05K2203/166 ,  H01L2924/00

Abstract: The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.