公开(公告)号：US20240279050A1

公开(公告)日：2024-08-22

申请号：US18024565

申请日：2022-06-29

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zibo CAO ,  Yingli SHI ,  Jingwen GUO ,  Chunxin LI ,  Qianhong WU ,  Jianyun ZHAO ,  Jianxing LIU ,  Feng QU

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0072 ,  B81C1/00142 ,  B81B2201/018 ,  B81B2203/0109 ,  B81B2203/0127 ,  B81B2203/04 ,  B81B2203/053

Abstract: The present disclosure provides an MEMS switch device and an electronic apparatus. The MEMS switch device includes a base substrate, a membrane bridge structure, and a first ground line, a signal line and a second ground line sequentially arranged on a first side surface of the base substrate at intervals; the membrane bridge structure has a first end electrically connected to the first ground line, and a second end, opposite to the first end, electrically connected to the second ground line; and the membrane bridge structure includes a membrane bridge body structure and at least one protruding structure on the membrane bridge body structure, where the protruding structure protrudes from the membrane bridge body structure in a direction perpendicular to the first side surface of the base substrate.

公开(公告)号：US20190237654A1

公开(公告)日：2019-08-01

申请号：US16379107

申请日：2019-04-09

Applicant: Infineon Technologies AG

Inventor： Christoph Glacer

IPC: H01L41/08 ,  B81B7/00 ,  H02N1/00 ,  H05B1/02

CPC classification number: H01L41/0805 ,  B81B7/0087 ,  B81B2201/018 ,  H02N1/006 ,  H05B1/0288

Abstract: According to various embodiments, a MEMS device includes a substrate, an electrically movable heating element having a first node coupled to a first terminal of a first voltage source and the second node coupled to a reference voltage source, a first anchor anchoring the first node and a second anchor anchoring the second node of the electrically movable heating element to the substrate, and a cavity between the first anchor and the second anchor and between the electrically movable heating element and the substrate.

公开(公告)号：US20180197828A1

公开(公告)日：2018-07-12

申请号：US15863133

申请日：2018-01-05

Applicant: University of Florida Research Foundation, Incorporated

Inventor： Swarup Bhunia ,  Haoting Shen ,  Mark M. Tehranipoor ,  Domenic J. Forte ,  Navid Asadizanjani

IPC: H01L23/00 ,  B81B7/00 ,  H01L23/522 ,  H01L23/525 ,  H01L23/528 ,  H01L23/532 ,  H01H59/00 ,  H01H29/02

CPC classification number: H01L23/573 ,  B81B7/0012 ,  B81B2201/01 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2207/07 ,  H01H29/02 ,  H01H59/0009 ,  H01L23/5228 ,  H01L23/525 ,  H01L23/5252 ,  H01L23/528 ,  H01L23/53238

Abstract: A semiconductor device can include a first metal trace, a first via disposed on the first metal trace, a second metal trace disposed on the first via, and an insulator interposed between the first metal trace and the first via. The insulator can be configured to lower an energy barrier or redistribute structure defects or charge carriers, such that the first metal trace and the first via are electrically connected to each other when power is applied. The semiconductor device can further include a dummy via disposed on the first metal trace.

公开(公告)号：US20180174021A9

公开(公告)日：2018-06-21

申请号：US14273540

申请日：2014-05-08

Applicant: Cornell University

Inventor： Amit Lal ,  Serhan Ardanuc ,  Jason T. Hoople ,  Justin C. Kuo

IPC: G06N3/04 ,  B81B3/00 ,  H01J49/02 ,  G06K9/00 ,  G01S7/521 ,  G01S15/02

CPC classification number: G06N3/04 ,  B81B3/0021 ,  B81B2201/018 ,  B81B2201/0214 ,  B81B2201/0285 ,  B81B2203/04 ,  G01S7/52079 ,  G01S7/521 ,  G01S15/02 ,  G01S15/8925 ,  G06K9/0002 ,  G06N3/0635 ,  H01H1/0094 ,  H01J49/025

Abstract: Techniques, systems, and devices are described for implementing for implementing computation devices and artificial neurons based on nanoelectromechanical (NEMS) systems. In one aspect, a nanoelectromechanical system (NEMS) based computing element includes: a substrate; two electrodes configured as a first beam structure and a second beam structure positioned in close proximity with each other without contact, wherein the first beam structure is fixed to the substrate and the second beam structure is attached to the substrate while being free to bend under electrostatic force. The first beam structure is kept at a constant voltage while the other voltage varies based on an input signal applied to the NEMS based computing element.

公开(公告)号：US09767966B2

公开(公告)日：2017-09-19

申请号：US14202437

申请日：2014-03-10

Applicant: FUJITSU LIMITED

Inventor： Hiroaki Inoue ,  Xiaoyu Mi

IPC: H01H1/00 ,  H01G5/16 ,  B81B3/00 ,  H01H59/00

CPC classification number: H01H1/0036 ,  B81B3/0072 ,  B81B3/0097 ,  B81B2201/018 ,  B81B2203/0118 ,  H01G5/16 ,  H01H59/0009

Abstract: On seed metal layer of first metal, pedestal and counter electrode are formed of second metal by plating, adjacent to free space region. The free space region is filled with first sacrificial layer. By using resist pattern, second sacrificial metal layer is formed, extending from the first sacrificial layer to a portion of the pedestal, and lower structure of third metal is formed on the second sacrificial layer, by contiguous plating, exposing a portion of the pedestal not formed with the second sacrificial layer, the third metal having composition and thermal expansion coefficient equivalent to the second metal. Upper structure of fourth metal having composition and thermal expansion coefficient equivalent to the second and third metals is formed on the pedestal and the lower structure by plating. The first and second sacrificial layers are removed, leaving an electric equipment with a movable portion.

公开(公告)号：US09378907B2

公开(公告)日：2016-06-28

申请号：US13717479

申请日：2012-12-17

Applicant: Broadcom Corporation

Inventor： Ahmadreza Rofougaran

IPC: H01H29/00 ,  H01H29/02 ,  B81B3/00 ,  H01G5/013 ,  H01H1/00

CPC classification number: H01H29/004 ,  B81B3/0032 ,  B81B2201/018 ,  H01G5/0132 ,  H01H1/0036 ,  H01H2029/008

Abstract: A liquid micro-electro-mechanical system (MEMS) component includes a board, a channel frame, a flexible channel side, a liquid droplet, and one or more conductive elements. The channel frame is within the board and mates with the flexible channel side to form a channel within the board. The liquid droplet is contained within the channel. When a pressure is applied to the flexible side, the shape of the liquid droplet is changed with respect to the one or more conductive elements thereby changing an operational characteristic of the liquid MEMS component.

Abstract translation: 液体微电子机械系统（MEMS）部件包括板，通道框架，柔性通道侧，液滴和一个或多个导电元件。 通道框架在板内，并与柔性通道侧配合，以在板内形成通道。 液滴包含在通道内。 当向柔性侧施加压力时，相对于一个或多个导电元件改变液滴的形状，从而改变液体MEMS部件的操作特性。

公开(公告)号：US09156681B2

公开(公告)日：2015-10-13

申请号：US13963409

申请日：2013-08-09

Applicant: DONGBU HITEK CO., LTD.

Inventor： Chung Kyung Jung ,  Ki Jun Yun ,  Oh Jin Jung ,  Sang Wook Ryu ,  Seong Hun Jeong ,  Sung Wook Joo

IPC: H01L21/00 ,  B81C1/00 ,  B81B3/00

CPC classification number: B81C1/00015 ,  B81B3/0018 ,  B81B2201/018 ,  B81C1/00801 ,  B81C2201/014

Abstract: Method for manufacturing a semiconductor device includes the steps of forming a lower electrode pattern on a substrate, forming a first interlayer insulating layer on the lower electrode pattern, forming an upper electrode pattern on the first interlayer insulating layer, forming a second interlayer insulating layer on the upper electrode pattern, forming an etch blocking layer on a side of the upper electrode pattern, wherein the etch blocking layer passes through the first interlayer insulating layer, forming a cavity which exposes the side of the etch blocking layer by etching the second interlayer insulating layer, and forming a contact ball in the cavity.

Abstract translation: 制造半导体器件的方法包括以下步骤：在衬底上形成下电极图案，在下电极图案上形成第一层间绝缘层，在第一层间绝缘层上形成上电极图案，在第一层间绝缘层上形成第二层间绝缘层 所述上电极图案在所述上电极图案的一侧上形成蚀刻阻挡层，其中所述蚀刻阻挡层穿过所述第一层间绝缘层，形成通过蚀刻所述第二层间绝缘体而暴露所述蚀刻阻挡层侧的空腔 并且在空腔中形成接触球。

公开(公告)号：US09048523B2

公开(公告)日：2015-06-02

申请号：US14001602

申请日：2012-03-20

Applicant: Christophe Pavageau

Inventor： Christophe Pavageau

IPC: H01P1/15 ,  H01H59/00 ,  H01P1/12 ,  H01P3/00 ,  H01H1/00 ,  H01H1/20

CPC classification number: H01P1/15 ,  B81B5/00 ,  B81B2201/018 ,  H01H1/0036 ,  H01H1/20 ,  H01H59/0009 ,  H01H2001/0063 ,  H01H2001/0084 ,  H01H2059/0072 ,  H01P1/127 ,  H01P3/003

Abstract: The RF MEMS crosspoint switch comprising a first transmission line and a second transmission line that crosses the first transmission line; the first transmission line comprises two spaced-apart transmission line portions, and a switch element that permanently electrically connects the two spaced-apart transmission line portions; the second transmission line crosses the first transmission line between the two spaced-apart transmission line portions; the RF MEMS crosspoint switch further comprises actuation means for actuating the switch element at least between a first position, in which the switch element is electrically connecting the two spaced-apart transmission line portions of the first transmission line and the first and second transmission lines are electrically disconnected, and a second position, in which the switch element is electrically connecting the two spaced-apart transmission line portions of the first transmission line and is also electrically connecting the two transmission lines together.

Abstract translation: RF MEMS交叉点开关包括穿过第一传输线的第一传输线和第二传输线; 第一传输线包括两个间隔开的传输线部分，以及将两个间隔开的传输线部分永久地电连接的开关元件; 第二传输线在两个间隔开的传输线部分之间穿过第一传输线; RF MEMS交叉点开关还包括用于至少在第一位置之间致动开关元件的致动装置，其中开关元件电连接第一传输线的两个间隔开的传输线部分和第一和第二传输线 以及第二位置，其中开关元件电连接第一传输线的两个间隔开的传输线部分，并且还将两个传输线电连接在一起。

公开(公告)号：US20140355381A1

公开(公告)日：2014-12-04

申请号：US14273540

申请日：2014-05-08

Applicant: Cornell University

Inventor： Amit Lal ,  Serhan Ardanuc ,  Jason T. Hoople ,  Justin C. Kuo

IPC: G06N3/04 ,  G01S15/02 ,  G06K9/00 ,  G01S7/521 ,  B81B3/00 ,  H01J49/02

CPC classification number: G06N3/04 ,  B81B3/0021 ,  B81B2201/018 ,  B81B2201/0214 ,  B81B2201/0285 ,  B81B2203/04 ,  G01S7/52079 ,  G01S7/521 ,  G01S15/02 ,  G01S15/8925 ,  G06K9/0002 ,  G06N3/0635 ,  H01H1/0094 ,  H01J49/025

Abstract: Techniques, systems, and devices are described for implementing for implementing computation devices and artificial neurons based on nanoelectromechanical (NEMS) systems. In one aspect, a nanoelectromechanical system (NEMS) based computing element includes: a substrate; two electrodes configured as a first beam structure and a second beam structure positioned in close proximity with each other without contact, wherein the first beam structure is fixed to the substrate and the second beam structure is attached to the substrate while being free to bend under electrostatic force. The first beam structure is kept at a constant voltage while the other voltage varies based on an input signal applied to the NEMS based computing element.

Abstract translation: 描述技术，系统和设备用于实现用于实现基于纳米机电（NEMS）系统的计算设备和人造神经元。 一方面，一种基于纳米机电系统（NEMS）的计算元件包括：基板; 配置为第一光束结构的两个电极和彼此紧密接近而没有接触地定位的第二光束结构，其中第一光束结构固定到基底，而第二光束结构附着到基底上同时在静电下自由弯曲 力。 第一光束结构保持在恒定电压，而另一电压基于施加到基于NEMS的计算元件的输入信号而变化。

公开(公告)号：US20140238828A1

公开(公告)日：2014-08-28

申请号：US14240670

申请日：2012-09-04

Applicant: Robertus Petrus Van Kampen ,  Anartz Unamuno ,  Richard L. Knipe ,  Roberto Gaddi ,  Rashed Mahameed

Inventor： Robertus Petrus Van Kampen ,  Anartz Unamuno ,  Richard L. Knipe ,  Roberto Gaddi ,  Rashed Mahameed

IPC: H01H59/00 ,  B81B3/00

CPC classification number: H01H59/0009 ,  B81B3/0097 ,  B81B7/04 ,  B81B2201/018 ,  B81B2203/0109 ,  B81B2203/0118 ,  B81B2203/0172 ,  B81B2203/0307

Abstract: The present invention generally relates to a MEMS device having a plurality of cantilevers that are coupled together in an anchor region and/or by legs that are coupled in a center area of the cantilever. The legs ensure that each cantilever can move/release from above the RF electrode at the same voltage. The anchor region coupling matches the mechanical stiffness in all sections of the cantilever so that all of the cantilevers move together.

Abstract translation: 本发明一般涉及具有多个悬臂的MEMS装置，所述多个悬臂在锚定区域中耦合在一起，和/或通过腿连接在悬臂的中心区域中。 腿部确保每个悬臂可以在相同电压下从RF电极上方移动/释放。 锚定区域联接器匹配悬臂的所有部分中的机械刚度，使得所有悬臂移动在一起。