公开(公告)号：US20030211328A1

公开(公告)日：2003-11-13

申请号：US10214640

申请日：2002-08-09

Applicant: Fujitsu Limited

Inventor： Nawalage Florence Cooray ,  Koji Tsukamoto ,  Takeshi Ishitsuka

IPC: B32B027/38

CPC classification number: H05K3/4661 ,  H05K1/0373 ,  H05K3/4602 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31511 ,  Y10T428/31515

Abstract: A halogen-free, flame-retardant insulating epoxy resin composition which comprises (1) an epoxy resin, (2) a curing agent for the epoxy resin, (3) a phosphate of a resorcinol type, (4) aluminum hydroxide, and (5) a cure accelerator for the epoxy resin. The composition displays necessary flame retardant properties and sufficient insulating properties after the formation of an insulating layer in a circuit board, withstands a plating process, and does not cause the bleedout of the insulation layer formed. A circuit board with flame retardant properties comprising insulation layers formed of the epoxy resin composition is also disclosed.

Abstract translation: 一种无卤阻燃绝缘环氧树脂组合物，其包含（1）环氧树脂，（2）环氧树脂固化剂，（3）间苯二酚型磷酸盐，（4）氢氧化铝和（ 5）环氧树脂的固化促进剂。 该组合物在电路板中形成绝缘层之后显示必要的阻燃性能和足够的绝缘性能，经受电镀工艺，并且不会导致形成的绝缘层的渗出。 还公开了包含由环氧树脂组合物形成的绝缘层的阻燃性能的电路板。

公开(公告)号：US20020132898A1

公开(公告)日：2002-09-19

申请号：US09748261

申请日：2000-12-27

Applicant: TDK CORPORATION

Inventor： Minoru Takaya ,  Hisashi Kobuke ,  Toshikazu Endo ,  Seiji Takahara ,  Toshiyuki Abe ,  Hiroshige Ohkawa ,  Masami Sasaki ,  Kenichi Kawabata

IPC: C08K003/34 ,  C08K003/40 ,  C08F016/12 ,  B32B018/00 ,  B32B027/30

CPC classification number: H01P5/185 ,  H01B3/442 ,  H01P1/203 ,  H01P1/20345 ,  H01P1/2056 ,  H01P5/10 ,  H01P5/187 ,  H01P7/04 ,  H01P7/082 ,  H01P7/084 ,  H01Q1/38 ,  H05K1/024 ,  H05K1/0326 ,  H05K1/0373 ,  H05K1/162 ,  H05K1/165 ,  H05K9/0075 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/086 ,  Y10T428/31692 ,  Y10T428/31855

Abstract: A composite dielectric material comprising a resin resulting from a polyvinylbenzyl ether compound and a dielectric ceramic powder dispersed therein is useful in the high-frequency region. A composite magnetic material comprising a polyvinylbenzyl ether compound and a magnetic powder is also provided as well as a flame retardant material comprising a polyvinylbenzyl ether compound and a flame retardant. These materials may be used in the fabrication of substrates, prepreg sheets, coated metal foils, molded items, and metal foil-clad substrates.

Abstract translation: 包含由聚乙烯基苄基醚化合物和分散在其中的介电陶瓷粉末产生的树脂的复合电介质材料可用于高频区域。 还提供了包含聚乙烯基苄基醚化合物和磁性粉末的复合磁性材料以及包含聚乙烯基苄基醚化合物和阻燃剂的阻燃材料。 这些材料可用于制造基材，预浸薄片，涂覆金属箔，模塑制品和覆盖金属箔的基板。

公开(公告)号：US06180250B2

公开(公告)日：2001-01-30

申请号：US08994967

申请日：1997-12-19

Applicant: Michitoshi Arata ,  Shigeo Sase ,  Nozomu Takano ,  Tomio Fukuda

Inventor： Michitoshi Arata ,  Shigeo Sase ,  Nozomu Takano ,  Tomio Fukuda

IPC: B32B1504

CPC classification number: H05K1/0373 ,  B32B15/08 ,  C08G59/08 ,  C08G59/3218 ,  C08K5/0008 ,  C08L63/04 ,  H01L23/145 ,  H01L2924/0002 ,  H05K2201/012 ,  H05K2203/122 ,  Y10T428/31678 ,  C08L61/04 ,  H01L2924/00

Abstract: To provide an epoxy resin composition for printed circuit boards which demonstrates little tendency to absorb moisture, high heat-resistance, favorable high temperature properties, resistance to metal migration, favorable anti-fade property at high temperatures, high Tg, high electric insulating performance and resistance against peeling of the copper foil when formed into a printed circuit board, there is provided epoxy resin composition for printed circuit boards, comprising: (a) epoxy resin obtained by glycidyl etherifying a condensation product of a phenol and hydroxybenzaldehyde; (b) a condensation product of bisphenol A and formaldehyde; (c) a flame retardant; (d) a curing agent; (e) one or both of a phenol antioxidant and an organic sulfur compound antioxidant; and (f) a urea derivative. This composition is highly suitable as a material for manufacturing epoxy resin prepreg in general and printed circuit boards.

Abstract translation: 本发明提供一种印刷电路板用环氧树脂组合物，其耐湿性，耐热性，耐高温性，耐金属迁移性，耐高温下的抗褪色性，高Tg，高绝缘性， 提供了形成印刷电路板时的铜箔的剥离性，提供了用于印刷电路板的环氧树脂组合物，其包含：（a）通过缩水甘油醚醚化苯酚和羟基苯甲醛的缩合产物得到的环氧树脂; （b）双酚A和甲醛的缩合产物; （c）阻燃剂; （d）固化剂; （e）苯酚抗氧化剂和有机硫化合物抗氧化剂中的一种或两种; 和（f）尿素衍生物。 该组合物作为一般制造环氧树脂预浸料和印刷电路板的材料是非常适合的。

公开(公告)号：US4975319A

公开(公告)日：1990-12-04

申请号：US332070

申请日：1989-04-03

Applicant: Erik W. Walles ,  John H. Lupinski ,  Mark Markovitz ,  Robert E. Colborn ,  James R. Presley ,  Michael J. Davis ,  Michael G. Minnick ,  Steven J. Kubisen, Jr. ,  John E. Hallgren ,  Donald A. Bolon ,  Victoria J. Eddy ,  Patricia C. Irwin

Inventor： Erik W. Walles ,  John H. Lupinski ,  Mark Markovitz ,  Robert E. Colborn ,  James R. Presley ,  Michael J. Davis ,  Michael G. Minnick ,  Steven J. Kubisen, Jr. ,  John E. Hallgren ,  Donald A. Bolon ,  Victoria J. Eddy ,  Patricia C. Irwin

IPC: C08G59/06 ,  C08G59/38 ,  C08L63/00 ,  C08L71/12 ,  H05K1/03

CPC classification number: H05K1/0373 ,  C08G59/063 ,  C08G59/38 ,  C08L63/00 ,  C08L71/123 ,  H05K2201/012 ,  H05K2203/121 ,  Y10S428/901 ,  Y10S428/92 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31678 ,  Y10T442/2566 ,  Y10T442/2713

Abstract: Curable compositions containing a reaction product of at least one bisphenol polyglycidyl ether, at least one epoxidized novolak and at least one brominated bisphenol, in combination with a polyphenylene ether and further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and having excellent physical and electrical properties.

Abstract translation: 含有至少一种双酚多缩水甘油醚，至少一种环氧化酚醛清漆和至少一种溴化双酚的聚对苯二甲酸乙二醇酯和包括特定催化剂和硬化剂在内的其它组分的反应产物的可固化组合物可用于制备有用的层压材料 作为印刷电路板，具有优异的物理和电学性能。

公开(公告)号：US4421877A

公开(公告)日：1983-12-20

申请号：US415096

申请日：1982-09-07

Applicant: William M. Alvino

Inventor： William M. Alvino

IPC: C08G59/40 ,  C08G59/62 ,  C08J3/03 ,  H05K1/03 ,  B05D3/02 ,  C08L63/02 ,  C09J5/02

CPC classification number: C08J3/03 ,  C08G59/4021 ,  C08G59/621 ,  H05K1/0326 ,  H05K1/0373 ,  C08J2363/00 ,  H05K2201/012 ,  H05K2203/122 ,  Y10S428/901

Abstract: Aqueous emulsions of epoxy resins, which can be used to treat glass cloth used in the preparation of printed circuit board laminates, are produced by combining an epoxy resin and a flame retardant phenol, such as tetrabromobisphenol A, with a selected nonionic surface active agent, such as an alkylaryl polyether alcohol, monomethylol dicyandiamide curing agent and, if needed, a catalyst.

Abstract translation: 可用于处理用于制备印刷电路板层压体的玻璃布的环氧树脂的水性乳液通过将环氧树脂和诸如四溴双酚A的阻燃酚与选择的非离子表面活性剂组合而制备， 例如烷基芳基聚醚醇，单羟甲基双氰胺固化剂和如果需要的催化剂。

公开(公告)号：US4323659A

公开(公告)日：1982-04-06

申请号：US212801

申请日：1980-12-04

Applicant: Masanao Watanabe ,  Keiichi Naito ,  Tooru Odajima ,  Yoshio Fujiwara

Inventor： Masanao Watanabe ,  Keiichi Naito ,  Tooru Odajima ,  Yoshio Fujiwara

IPC: C08G59/00 ,  C08G59/20 ,  C08G59/30 ,  C08G59/40 ,  C08G59/62 ,  C08L33/00 ,  C08L33/02 ,  C08L63/00 ,  C09J133/04 ,  C09J163/00 ,  C09J163/02 ,  C09J163/04 ,  H01B3/40 ,  H05K1/00 ,  H05K3/38

CPC classification number: H05K3/386 ,  C08G59/62 ,  C08L63/00 ,  C09J163/00 ,  C09J163/04 ,  H01B3/40 ,  H05K1/0393 ,  H05K2201/012 ,  H05K2201/0355

Abstract: The non-flammable adhesive compositions contain 100 parts by weight of a brominated epoxy resin such as a bisphenol type brominated epoxy resin or a novolak type brominated epoxy resin; 40-80 parts by weight of an acrylic copolymer and 5-20 parts by weight of a brominated polyvinyl phenol, said acrylic copolymer being prepared by copolymerizing (a) 5-35% by weight of acrylonitrile, (b) 0.5-10% by weight of an ethylenically unsaturated compound having at least one functional group selected from carboxyl, hydroxyl and epoxy group, and (c) substantially the balance of an ester obtainable from an alcohol having from 1 to 6 carbon atoms and acrylic acid and/or methacrylic acid.

Abstract translation: 不燃性粘合剂组合物含有100重量份溴化环氧树脂如双酚型溴化环氧树脂或酚醛清漆型溴化环氧树脂; 40-80重量份的丙烯酸共聚物和5-20重量份的溴化聚乙烯基苯酚，所述丙烯酸共聚物通过（a）5-35重量％的丙烯腈，（b）0.5-10重量％的 具有至少一个选自羧基，羟基和环氧基的官能团的烯键式不饱和化合物的重量，和（c）可从具有1至6个碳原子的醇和丙烯酸和/或甲基丙烯酸获得的基本上余量的 。

公开(公告)号：US4311749A

公开(公告)日：1982-01-19

申请号：US937198

申请日：1978-08-28

Applicant: Takashi Hiraiwa ,  Yuichi Fujita

Inventor： Takashi Hiraiwa ,  Yuichi Fujita

IPC: H05K1/00 ,  H05K1/03 ,  H05K3/06 ,  H05K3/28 ,  H05K3/38

CPC classification number: H05K1/0373 ,  H05K3/281 ,  H05K3/381 ,  H05K1/036 ,  H05K1/0393 ,  H05K2201/012 ,  H05K2203/097 ,  H05K2203/122 ,  H05K3/06 ,  H05K3/386 ,  Y10S428/901 ,  Y10S428/921 ,  Y10T428/24917 ,  Y10T428/31681 ,  Y10T428/31692 ,  Y10T428/31699

Abstract: A flexible printed circuit board having excellent flame proofness and a very little danger of causing a fire can be produced by subjecting a substrate or an insulating film consisting of a flexible resin film to surface treatment to provide a surface tension of 36 dyne/cm or more and then forming a resin film containing a flame retardant on the treated surface of said substrate or insulating film.

Abstract translation: 柔性印刷电路板具有优异的防火性和很小的火灾危险，可以通过对由柔性树脂膜构成的基板或绝缘膜进行表面处理，以提供36达因/厘米或更高的表面张力 然后在所述基板或绝缘膜的处理表面上形成含有阻燃剂的树脂膜。

公开(公告)号：US4031313A

公开(公告)日：1977-06-21

申请号：US546810

申请日：1975-02-03

Applicant: Arnold Franz ,  Dirk Huthwelker ,  Lothar Jacob

Inventor： Arnold Franz ,  Dirk Huthwelker ,  Lothar Jacob

IPC: B32B15/04 ,  B29C67/00 ,  B29D1/00 ,  B32B15/08 ,  B32B37/00 ,  H01B5/14 ,  H05K1/03 ,  H05K1/00 ,  B32B15/02

CPC classification number: H01B5/14 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/036 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0145 ,  Y10S428/901 ,  Y10S428/92 ,  Y10T428/24917 ,  Y10T428/24967 ,  Y10T428/265 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31529 ,  Y10T428/31627 ,  Y10T428/31649 ,  Y10T428/31688 ,  Y10T428/31699 ,  Y10T428/31935 ,  Y10T428/31949 ,  Y10T428/31964 ,  Y10T428/31967

Abstract: A laminated material comprises a substrate material containing resin-impregnated layers, a metal foil disposed on said substrate and an arc-retardant layer arranged between the metal foil and the substrate material. The arc-retardant layer is an arc-retardant, crosslinked heat-stable synthetic resinous material consisting of from about 60 to 100% by weight of a heat-stable resin which is free of aromatic groupings or heterocyclic rings containing at least one heteroatom and conjugated double bonds and which is not converted to a graphite-containing structure upon being thermally decomposed.

Abstract translation: 叠层材料包括含有树脂浸渍层的基底材料，设置在所述基底上的金属箔和布置在金属箔和基底材料之间的阻燃层。 阻燃层是阻燃交联的热稳定合成树脂材料，由约60至100重量％的不含芳族基团的热稳定性树脂或含有至少一个杂原子的杂环和共轭 双键，并且在热分解时不转化为含石墨的结构。

公开(公告)号：US3888942A

公开(公告)日：1975-06-10

申请号：US42451773

申请日：1973-12-13

Applicant: GEN ELECTRIC

Inventor： TSEN LO KWANG

IPC: C08G59/22 ,  C08G59/42 ,  C08J5/24 ,  C08L63/00 ,  H05K1/03 ,  C03C25/02

CPC classification number: B32B17/10 ,  B32B27/38 ,  B32B2315/08 ,  B32B2363/00 ,  C08G59/226 ,  C08G59/42 ,  C08J5/24 ,  C08J2363/00 ,  C08L63/00 ,  H05K1/0326 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/068 ,  Y10S525/93 ,  C08L2666/22

Abstract: A particular mixture of epoxy resins and phenoxy resin along with curing agents, fillers and the like provides laminates for circuit boards characterized particularly by an improved Z-axis coefficient of expansion along with other desirable properties.

公开(公告)号：US3666617A

公开(公告)日：1972-05-30

申请号：US3666617D

申请日：1970-05-22

Applicant: HOOKER CHEMICAL CORP

Inventor： MARCINIAK HARRY W

IPC: H05K1/03 ,  B32B15/08 ,  H05K1/00

CPC classification number: B32B15/14 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2307/3065 ,  B32B2457/08 ,  H05K1/036 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2203/122 ,  Y10S428/921 ,  Y10T428/31522 ,  Y10T428/31681 ,  Y10T428/31688

Abstract: A FIRE RETARDANT, NON-BLISTERING LAMINATE IS PRODUCED BY IMPREGNATING THE UPPERMOST PLY OF A MULTI-PLY LAMINATE WITH A RESIN IN WHICH THE FIRE RETARDANT ADDITIVE IS ABSENT. IF FIRE RETARDANT REQUIREMENTS PERMIT, ONE OR MORE ADDITIONAL PLIES CAN BE ADDITIVE-FREE IN ORDER TO PROVIDE IMPROVED STRENGTH, ECONOMY OR FOR OTHER PURPOSES.