公开(公告)号：US20100089627A1

公开(公告)日：2010-04-15

申请号：US12333014

申请日：2008-12-11

Applicant: Han-Pei Huang ,  Cheng-Hung Yu

Inventor： Han-Pei Huang ,  Cheng-Hung Yu

IPC: H05K1/00 ,  C08J7/18 ,  B05D5/12 ,  C25D5/02 ,  B32B37/14 ,  H05K3/12 ,  H05K1/11

CPC classification number: H05K3/4644 ,  B33Y10/00 ,  B33Y80/00 ,  H05K1/0284 ,  H05K3/046 ,  H05K3/06 ,  H05K3/185 ,  H05K3/205 ,  H05K3/386 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/0108 ,  H05K2203/013 ,  H05K2203/107 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A multilayer three-dimensional circuit structure and a manufacturing method thereof are provided in the present invention. The manufacturing method includes following steps. First, a three-dimensional insulating structure is provided. A first three-dimensional circuit structure is then formed on a surface of the three-dimensional insulating structure. Next, an insulating layer covering the first three-dimensional circuit structure is formed. Thereafter, a second three-dimensional circuit structure is formed on the insulating layer. Subsequently, at least a conductive via penetrating the insulating layer is formed for electrically connecting the second three-dimensional circuit structure and the first three-dimensional circuit structure.

Abstract translation: 本发明提供了一种多层三维电路结构及其制造方法。 制造方法包括以下步骤。 首先，提供三维绝缘结构。 然后在三维绝缘结构的表面上形成第一三维电路结构。 接下来，形成覆盖第一三维电路结构的绝缘层。 此后，在绝缘层上形成第二三维电路结构。 随后，至少形成了穿过绝缘层的导电通孔，用于电连接第二三维电路结构和第一三维电路结构。

公开(公告)号：US20090292051A1

公开(公告)日：2009-11-26

申请号：US12468420

申请日：2009-05-19

Applicant: Yanjun (Frank) Li ,  Jiru Meng ,  David Xiangping Zou

Inventor： Yanjun (Frank) Li ,  Jiru Meng ,  David Xiangping Zou

IPC: C08K3/34 ,  C08L77/00 ,  C08K3/10 ,  C08K3/38 ,  C08K3/00 ,  C08K3/28

CPC classification number: C23C18/204 ,  B41M5/267 ,  C08K3/01 ,  C08K3/34 ,  C23C18/1641 ,  H05K1/0373 ,  H05K3/185 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2203/107

Abstract: High dielectric constant thermoplastic compositions that are capable of being used in a laser direct structuring process. The compositions include a thermoplastic base resin, a laser direct structuring additive, and at least one ceramic filler. The compositions provide a high dielectric constant, low loss tangent thermoplastic composition. The compositions can be used in a variety of applications such as personal computers, notebook and portable computers, cell phone antennas and other such communications equipment, medical applications, RFID applications, and automotive applications.

Abstract translation: 能够用于激光直接结构化工艺的高介电常数热塑性组合物。 组合物包括热塑性基础树脂，激光直接结构化添加剂和至少一种陶瓷填料。 组合物提供高介电常数，低损耗切线热塑性组合物。 组合物可以用于各种应用，例如个人计算机，笔记本和便携式计算机，蜂窝电话天线和其它这样的通信设备，医疗应用，RFID应用和汽车应用。

公开(公告)号：US20080261396A1

公开(公告)日：2008-10-23

申请号：US12061768

申请日：2008-04-03

Applicant: Takaharu YAMANO

Inventor： Takaharu YAMANO

IPC: H01L21/4763 ,  H01L21/44

CPC classification number: H01L21/76898 ,  H01L23/481 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1461 ,  H05K1/0306 ,  H05K3/007 ,  H05K3/205 ,  H05K3/423 ,  H05K3/4605 ,  H05K3/4661 ,  H05K2201/0236 ,  H05K2201/09563 ,  H05K2201/09581 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0723 ,  H05K2203/0733 ,  H05K2203/1105 ,  H05K2203/1383 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A disclosed substrate is composed of a base member having a through-hole, a penetrating via provided in the through-hole, and a wiring connected to the penetrating via. The penetrating via includes a penetrating part having two ends on both sides of the base member, which is provided in the through-hole, a first protrusion protruding from the base member, which is formed on a first end of the penetrating part so as to be connected to the wiring, and a second protrusion protruding from the base member, which is formed on a second end of the penetrating part. The first protrusion and second protrusion are wider than a diameter of the through-hole.

Abstract translation: 所公开的基板由具有通孔的基部构件，设置在通孔中的贯通孔以及与贯通孔连接的配线构成。 贯通孔包括贯通部，该贯通部在基部构件的两侧设置有设置在贯通孔中的两端，从基体突出的第一突起，该第一突起形成在贯通部的第一端上，从而 连接到布线，以及形成在穿透部的第二端上的从基部构件突出的第二突起。 第一突起和第二突起比通孔的直径宽。

公开(公告)号：US07144679B2

公开(公告)日：2006-12-05

申请号：US10450048

申请日：2001-12-28

Applicant: Shinya Izumida ,  Koji Itoh ,  Minoru Oyama ,  Atsushi Suzuki

Inventor： Shinya Izumida ,  Koji Itoh ,  Minoru Oyama ,  Atsushi Suzuki

IPC: G03C1/725 ,  G03C1/735 ,  G03C1/74 ,  C08F2/46

CPC classification number: H05K3/387 ,  C08K5/0025 ,  C08K5/0091 ,  C09D179/08 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/2033 ,  C23C18/30 ,  H05K1/0346 ,  H05K3/181 ,  H05K3/185 ,  H05K3/386 ,  H05K2201/0154 ,  H05K2201/0236 ,  H05K2203/0709 ,  C08L79/04 ,  C08L79/08

Abstract: Laminates for electronic components are produced by applying a polyimide resin precursor solution containing a palladium compound on a polyimide substrate, drying the resulting coating to form a polyimide resin precursor layer, irradiating this layer with ultraviolet rays in the presence of a hydrogen donor to form nuclei for primer plating, forming a metal primer layer by electroless plating, and converting the polyimide resin precursor layer into a polyimide resin layer through imidation by heating either after or before the formation of a surface plating layer. The invention provides laminates for electronic components which are extremely improved in adhesion to metal layers without impairing the characteristics inherent in the substrate and are excellent in insulating properties, and polyimide resin precursor resin solution to be used in the production of the laminates.

Abstract translation: 电子部件用层叠体通过在聚酰亚胺基板上涂布含有钯化合物的聚酰亚胺树脂前体溶液进行干燥而形成聚酰亚胺树脂前体层，在氢供体存在下照射紫外线，形成核 用于底漆电镀，通过无电解电镀形成金属底漆层，并且在形成表面镀层之后或之后通过加热将聚酰亚胺树脂前体层转化成聚酰亚胺树脂层。 本发明提供了电子部件的层叠体，其极大地改善了与金属层的粘附性，而不损害基板固有的特性，绝缘性能优异，并且用于制造层压体的聚酰亚胺树脂前体树脂溶液。

公开(公告)号：US20060014083A1

公开(公告)日：2006-01-19

申请号：US11070028

申请日：2005-03-01

Applicant: Robert Carlson

Inventor： Robert Carlson

IPC: G03F1/00 ,  G03G17/04

CPC classification number: G03F1/60 ,  B81B2201/058 ,  B81C1/00182 ,  G03F1/50 ,  H05K1/0283 ,  H05K1/032 ,  H05K3/102 ,  H05K3/184 ,  H05K2201/0133 ,  H05K2201/0162 ,  H05K2201/0236 ,  H05K2203/095 ,  H05K2203/1173

Abstract: The present invention provides methods and systems for fabricating electronic and/or microfluidic structures on elastomeric substrates. In one method, a protective structure is positioned onto a portion of a surface of the hydrophobic substrate. An unprotected portion of the surface is activated to become hydrophilic, wherein the protected portion of the surface of the substrate remains hydrophobic. The protective structure is removed from the surface of the substrate and material is deposited on the hydrophobic portion to form a structure on the substrate.

Abstract translation: 本发明提供了用于在弹性体基底上制造电子和/或微流体结构的方法和系统。 在一种方法中，将保​​护结构定位在疏水性基材表面的一部分上。 表面的无保护部分被活化以变得亲水，其中基底表面的受保护部分保持疏水性。 保护结构从衬底的表面去除，并且材料沉积在疏水部分上以在衬底上形成结构。

公开(公告)号：US20050233593A1

公开(公告)日：2005-10-20

申请号：US11156544

申请日：2005-06-21

Applicant: Magall Brunet ,  Andrew Connell ,  Paul McCloskey ,  Terence O'Donnell ,  Stephen O'Reilly ,  Sean O'Mathuna

Inventor： Magall Brunet ,  Andrew Connell ,  Paul McCloskey ,  Terence O'Donnell ,  Stephen O'Reilly ,  Sean O'Mathuna

IPC: C23C18/18 ,  C23C26/00 ,  C25D1/12 ,  C25D15/00 ,  G11B5/31 ,  H01F17/00 ,  H01F27/28 ,  H05K1/02 ,  H05K3/18 ,  H01L21/302

CPC classification number: C23C26/00 ,  C23C18/1865 ,  C23C18/1879 ,  C25D1/12 ,  C25D15/00 ,  G11B5/3143 ,  H01F17/0006 ,  H01F27/2804 ,  H05K1/0219 ,  H05K1/0233 ,  H05K3/181 ,  H05K2201/0236 ,  H05K2201/083 ,  H05K2201/09809 ,  H05K2203/0723 ,  H05K2203/135

Abstract: An insulating layer (5) and a conductive seed layer (6) are applied to a substrate (1) in a simple process. A photo resist with palladium chloride are provided in a bath for electrophoretic deposition onto the substrate. The photo resist is an insulator and the palladium chloride is a catalyst. The layer is heated with UV to cure it. The layer is plasma etched to expose more of the palladium chloride, which acts as a catalyst for electrodes plating of the conductive seed layer. A thicker conductive layer (7) is then electroplated onto the seed layer. These steps may be repeated for successive insulating and/or conductive layers.

Abstract translation: 绝缘层（5）和导电种子层（6）以简单的方法施加到基板（1）上。 在用于电泳沉积到基底上的浴中提供了氯化钯的光致抗蚀剂。 光致抗蚀剂是绝缘体，氯化钯是催化剂。 该层用UV加热以固化。 该层被等离子体蚀刻以暴露更多的氯化钯，其作为导电种子层的电极电镀的催化剂。 然后将更厚的导电层（7）电镀到种子层上。 对于连续的绝缘和/或导电层可以重复这些步骤。

公开(公告)号：US06706326B1

公开(公告)日：2004-03-16

申请号：US09673832

申请日：2000-09-01

Applicant: Matty J. Hartogs ,  Jan J. M. Hendriks ,  Joachim Heyer ,  Uwe Pingler

Inventor： Matty J. Hartogs ,  Jan J. M. Hendriks ,  Joachim Heyer ,  Uwe Pingler

IPC: B05D310

CPC classification number: C23C18/22 ,  C23C18/1641 ,  C23C18/24 ,  C23C18/30 ,  C23C18/31 ,  H05K1/0373 ,  H05K3/181 ,  H05K2201/0236 ,  H05K2203/0789 ,  H05K2203/0793

Abstract: A process for the deposition of a metal on surfaces of a shaped plastic body. A catalyst for metal deposition is incorporated into a shaped body. After removing material from a surface of the body and activating the catalyst with an acid, metal is deposited on the surface by an electroless metal deposition process.

Abstract translation: 一种用于在成形塑料体的表面上沉积金属的方法。 用于金属沉积的催化剂被结合到成型体中。 在从身体表面去除材料并用酸活化催化剂之后，通过无电金属沉积工艺将金属沉积在表面上。

公开(公告)号：US20030128496A1

公开(公告)日：2003-07-10

申请号：US10268270

申请日：2002-10-10

Applicant: Shipley Company, L.L.C.

Inventor： Craig S. Allen ,  Maria Anna Rzeznik ,  David L. Jacques

IPC: H01G004/228

CPC classification number: H01G4/06 ,  H05K1/162 ,  H05K3/181 ,  H05K3/381 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0212 ,  H05K2201/0236 ,  H05K2201/0355 ,  H05K2203/0773

Abstract: Dielectric structures particularly suitable for use in capacitors and having a textured surface are provided, together with methods of forming these structures. Such dielectric structures show increased adhesion of subsequently applied conductive layers.

Abstract translation: 提供特别适用于电容器并具有纹理表面的电介质结构以及形成这些结构的方法。 这种介电结构显示随后施加的导电层的附着力增加。

公开(公告)号：US06292139B1

公开(公告)日：2001-09-18

申请号：US09291848

申请日：1999-04-14

Applicant: Keizo Yamamoto ,  Kazuhisa Yamaki ,  Yuichi Kushihi

Inventor： Keizo Yamamoto ,  Kazuhisa Yamaki ,  Yuichi Kushihi

IPC: H01Q124

CPC classification number: H01Q1/38 ,  H01F41/046 ,  H01L21/4846 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/0373 ,  H05K3/0014 ,  H05K3/182 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/1476 ,  H01L2924/00

Abstract: The invention provides an electronic part comprising an electronic-part body comprising: composite-material body made of synthetic resin in which ceramic powder as a functional material and a catalytic agent to make plating practicable are dispersed; and a layer of composite material of synthetic resin in which ceramic powder as a functional material is dispersed, said layer covering the external surface of said composite-material body except the portion in which an electrode is to be disposed; and an electrode disposed on the external surface of said electronic-part body. The above described electronic part is excellent in the freedom of shape, high in dimensional accuracy, and it is easy to realize the intended electrical characteristics.

Abstract translation: 本发明提供一种电子部件，其包括：电子部件体，包括：由合成树脂制成的复合材料体，其中分散作为功能材料的陶瓷粉末和使电镀可行的催化剂; 以及分散有作为功能材料的陶瓷粉末的合成树脂复合材料层，所述层覆盖除了要设置电极的部分之外的所述复合材料体的外表面; 以及设置在所述电子部件主体的外表面上的电极。 上述电子部件的形状自由度高，尺寸精度高，容易实现预期的电气特性。

公开(公告)号：US5904954A

公开(公告)日：1999-05-18

申请号：US722093

申请日：1996-10-17

Applicant: Robert Cassat ,  Jean-Paul Faure

Inventor： Robert Cassat ,  Jean-Paul Faure

IPC: B32B5/28 ,  B32B5/24 ,  B32B15/08 ,  B32B27/36 ,  H05K1/00 ,  H05K1/03 ,  H05K3/06 ,  B05D1/14

CPC classification number: B32B5/24 ,  H05K1/036 ,  H05K1/0393 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0236 ,  H05K2201/0278 ,  Y10T428/23943 ,  Y10T428/23986

Abstract: A composite material and a method for making same are disclosed. A composite article including an electrically and/or thermally insulating substrate and protective layers on each side thereof is particularly disclosed. Said material includes protective layers consisting of fibers of a heat-stable material flocked onto the insulating substrate, and heat-stable coating resin. The resulting protective layer has improved protective properties, particularly moisture-proofness. The composite material may also be used as a metal layer carrier for forming flexible printed electrical circuits.

Abstract translation: PCT No.PCT / FR95 / 00505 Sec。 371日期1996年10月17日第 102（e）日期1996年10月17日PCT提交1995年4月18日PCT公布。 公开号WO95 / 28278 日期：1995年10月26日公开了一种复合材料及其制造方法。 特别公开了一种复合制品，其包括电隔离和/或隔热基板及其每侧的保护层。 所述材料包括由嵌入到绝缘基板上的热稳定材料的纤维构成的保护层和热稳定的涂布树脂。 所得到的保护层具有改进的保护性能，特别是防潮性。 复合材料也可以用作用于形成柔性印刷电路的金属层载体。