公开(公告)号：US06452111B1

公开(公告)日：2002-09-17

申请号：US09976162

申请日：2001-10-15

Applicant: Hiroyuki Kumakura

Inventor： Hiroyuki Kumakura

IPC: H05K102

CPC classification number: H01L24/83 ,  H01L21/563 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/0401 ,  H01L2224/09102 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/83101 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/3011 ,  H05K1/189 ,  H05K3/323 ,  H05K13/046 ,  H05K2201/0257 ,  H05K2201/10674 ,  Y10T29/4913 ,  Y10T428/28 ,  H01L2924/00

Abstract: Provided is an electrically conductive adhesive capable of reliably connecting a semiconductor element and a flexible wiring board without causing short circuits. When electrically conductive adhesives of the present invention containing conductive particles having an average diameter of from 10 nm or more to 90 nm or less are used to connect a flexible wiring board and a semiconductor element, the signal part of a wiring film under a protective film is protected and no short circuit occurs in wiring films of the resulting electric device because conductive particles do not break through the protective film of the semiconductor element.

Abstract translation: 提供一种能够可靠地连接半导体元件和柔性布线板而不引起短路的导电粘合剂。 当使用包含平均直径为10nm以上且90nm以下的导电性粒子的本发明的导电性粘合剂来连接柔性布线基板和半导体元件时，保护膜下方的配线膜的信号部 被保护，并且由于导电颗粒不会穿过半导体元件的保护膜而导致所得电子器件的布线膜不发生短路。

公开(公告)号：US20020070048A1

公开(公告)日：2002-06-13

申请号：US09976162

申请日：2001-10-15

Applicant: SONY CHEMICALS CORP.

Inventor： Hiroyuki Kumakura

IPC: H02G003/08

CPC classification number: H01L24/83 ,  H01L21/563 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/0401 ,  H01L2224/09102 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/83101 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/3011 ,  H05K1/189 ,  H05K3/323 ,  H05K13/046 ,  H05K2201/0257 ,  H05K2201/10674 ,  Y10T29/4913 ,  Y10T428/28 ,  H01L2924/00

Abstract: Provided is an electrically conductive adhesive capable of reliably connecting a semiconductor element and a flexible wiring board without causing short circuits. When electrically conductive adhesives of the present invention containing conductive particles having an average diameter of from 10 nm or more to 90 nm or less are used to connect a flexible wiring board and a semiconductor element, the signal part of a wiring film under a protective film is protected and no short circuit occurs in wiring films of the resulting electric device because conductive particles do not break-through the protective film of-the semiconductor element.

Abstract translation: 提供一种能够可靠地连接半导体元件和柔性布线板而不引起短路的导电粘合剂。 当使用包含平均直径为10nm以上且90nm以下的导电性粒子的本发明的导电性粘合剂来连接柔性布线基板和半导体元件时，保护膜下方的配线膜的信号部 被保护，并且由于导电颗粒不穿透半导体元件的保护膜，所以得到的电子器件的布线膜不会发生短路。

公开(公告)号：US06376052B1

公开(公告)日：2002-04-23

申请号：US09556860

申请日：2000-04-21

Applicant: Motoo Asai ,  Ken-ichi Shimada ,  Kouta Noda ,  Takashi Kariya ,  Hiroshi Segawa

Inventor： Motoo Asai ,  Ken-ichi Shimada ,  Kouta Noda ,  Takashi Kariya ,  Hiroshi Segawa

IPC: B32B300

CPC classification number: B32B3/00 ,  H05K3/0094 ,  H05K3/383 ,  H05K3/384 ,  H05K3/385 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  Y10S428/901 ,  Y10T428/24917

Abstract: A multilayer printed wiring board is composed of a substrate provided with through-holes, and a wiring board formed on the substrate through the interposition of an interlaminar insulating resin layer, the through-holes having a roughened internal surface and being filled with a filler, an exposed part of the filler in the through-holes being covered with a through-hole-covering conductor layer, and a viahole formed just thereabove being connected to the through-hole-covering conductor layer. Without peeling between the through-holes and the filler, this wiring board has a satisfactory connection reliability between the through-holes and the internal layer circuit and provides a high density wiring.

Abstract translation: 多层印刷布线板由设置有通孔的基板和通过插入层间绝缘树脂层而形成在基板上的布线板，所述通孔具有粗糙的内表面并填充有填料， 通孔中的填充物的暴露部分被覆盖有通孔覆盖导体层，并且形成在其上方的通孔连接到通孔覆盖导体层。在通孔和 填充物，该布线板在通孔和内层电路之间具有令人满意的连接可靠性，并且提供高密度布线。

公开(公告)号：US06376049B1

公开(公告)日：2002-04-23

申请号：US09341689

申请日：1999-07-23

Applicant: Motoo Asai ,  Kenichi Shimada ,  Kouta Noda ,  Takashi Kariya ,  Hiroshi Segawa

Inventor： Motoo Asai ,  Kenichi Shimada ,  Kouta Noda ,  Takashi Kariya ,  Hiroshi Segawa

IPC: B32B300

CPC classification number: B32B3/00 ,  H05K3/0094 ,  H05K3/383 ,  H05K3/384 ,  H05K3/385 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  Y10S428/901 ,  Y10T428/24917

Abstract: A multilayer printed wiring board is composed of a substrate provided with through-holes, and a wiring board formed on the substrate through the interposition of an interlaminar insulating resin layer, the through-holes having a roughened internal surface and being filled with a filler, an exposed part of the filler in the through-holes being covered with a through-hole-covering conductor layer, and a viahole formed just thereabove being connected to the through-hole-covering conductor layer. Without peeling between the through-holes and the filler, this wiring board has a satisfactory connection reliability between the through-holes and the internal layer circuit and provides a high density wiring.

Abstract translation: 多层印刷布线板由设置有通孔的基板和通过插入层间绝缘树脂层而形成在基板上的布线板，所述通孔具有粗糙的内表面并填充有填料， 通孔中的填充物的暴露部分被覆盖有通孔覆盖导体层，并且形成在其上方的通孔连接到通孔覆盖导体层。 在通孔和填料之间不剥离，该布线板在通孔和内层电路之间具有令人满意的连接可靠性，并提供高密度布线。

公开(公告)号：US20010006455A1

公开(公告)日：2001-07-05

申请号：US09731898

申请日：2000-12-08

Inventor： Akira Fukunaga ,  Hiroshi Nagasawa

IPC: H05K001/11

CPC classification number: H05K3/3436 ,  H01L24/11 ,  H01L24/13 ,  H01L24/742 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/11505 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29316 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/83815 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/095 ,  H05K2201/0257 ,  H05K2201/10674 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53178

Abstract: A method and a structure is provided for mounting a semiconductor device by the bump technique using compound metallic ultra-fine particles each comprising a core portion consisting substantially of a metallic component, and a coating layer chemically bound to the core portion and comprising an organic substance. The method and the structure are characterized by using one of, or a combination of, the following two bump technologies: 1) Forming under bump metals from the compound metallic ultra-fine particles, and forming ordinary solder balls on the under bump metals. 2) Using paste balls comprising the compound metallic ultra-fine particles, instead of ordinary solder balls.

Abstract translation: 提供了一种方法和结构，用于通过凸块技术来安装半导体器件，所述复合金属超细颗粒各自包括基本上由金属组分组成的芯部分，以及化学键合到芯部分并且包含有机物质 。 该方法和结构的特征在于使用以下两种凸块技术之一或其组合：1）从复合金属超细颗粒形成凸块下金属，并在凸块下金属上形成普通焊球。 2）使用包含复合金属超细颗粒的糊球代替普通焊球。

公开(公告)号：US5870274A

公开(公告)日：1999-02-09

申请号：US880661

申请日：1997-06-23

Applicant: Gregory L. Lucas

Inventor： Gregory L. Lucas

IPC: H05K1/03 ,  H05K1/16 ,  H05K3/38 ,  H05K3/46 ,  H01G4/06 ,  B32B9/00 ,  H01G4/20

CPC classification number: H05K3/4641 ,  H05K1/0373 ,  H05K1/162 ,  H05K1/0366 ,  H05K2201/015 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K3/385 ,  H05K3/386 ,  H05K3/4611 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49144

Abstract: An in situ method for forming a bypass capacitor element internally within a PCB including the steps of arranging one or more uncured dielectric sheets with conductive foils on opposite sides thereof and laminating the conductive foils to the dielectric sheet simultaneously as the PCB is formed by a final lamination step, the conductive foils preferably being laminated to another layer of the PCB prior to their arrangement adjacent the dielectric sheet or sheets, the dielectric foils even more preferably being initially laminated to additional dielectric sheets in order to form multiple bypass capacitive elements as a compound subassembly within the PCB. A number of different dielectric materials and resins are disclosed for forming the capacitor element. A dielectric component in the capacitor element preferably includes dielectric material and thermally responsive material, the thermally responsive material either forming a carrier for the dielectric material or formed as two separate sheets on opposite sides of a sheet of the dielectric material.

Abstract translation: 一种用于在PCB内部形成旁路电容器元件的原位方法，包括以下步骤：在导电箔的相对侧上布置一个或多个未固化的电介质片，同时将导电箔层压到电介质片上， 层压步骤，导电箔优选地在邻近电介质片或片之前层压到PCB的另一层上，电介质箔甚至更优选最初层压到附加的电介质片上，以形成多个旁路电容元件作为化合物 PCB内的子组件。 公开了用于形成电容器元件的许多不同介电材料和树脂。 电容器元件中的电介质元件优选地包括电介质材料和热响应材料，该热响应材料形成用于电介质材料的载体或者在电介质材料片的相对侧上形成为两个分开的片。

公开(公告)号：US5800575A

公开(公告)日：1998-09-01

申请号：US147671

申请日：1993-11-03

Applicant: Gregory L. Lucas

Inventor： Gregory L. Lucas

IPC: H05K1/03 ,  H05K1/16 ,  H05K3/38 ,  H05K3/46 ,  H01G4/40

CPC classification number: H05K3/4641 ,  H05K1/0373 ,  H05K1/162 ,  H05K1/0366 ,  H05K2201/015 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K3/385 ,  H05K3/386 ,  H05K3/4611 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49144

Abstract: An in situ method for forming a bypass capacitor element internally within a PCB comprising the steps of arranging one or more uncured dielectric sheets with conductive foils on opposite sides thereof and laminating the conductive foils to the dielectric sheet simultaneously as the PCB is formed by a final lamination step, the conductive foils preferably being laminated to another layer of the PCB prior to their arrangement adjacent the dielectric sheet or sheets, the dielectric foils even more preferably being initially laminated to additional dielectric sheets in order to form multiple bypass capacitive elements as a compound subassembly within the PCB. A number of different dielectric materials and resins are disclosed for forming the capacitor element. A dielectric component in the capacitor element preferably includes dielectric material and thermally responsive material, the thermally responsive material either forming a carrier for the dielectric material or formed as two separate sheets on opposite sides of a sheet of the dielectric material.

Abstract translation: 用于在PCB内部形成旁路电容器元件的原位方法包括以下步骤：在导电箔的相对侧上布置一个或多个未固化的电介质片，并且当导电箔同时由PCB形成时，将导电箔层压到电介质片上 层压步骤，导电箔优选地在邻近电介质片或片之前层压到PCB的另一层上，电介质箔甚至更优选最初层压到附加的电介质片上，以形成多个旁路电容元件作为化合物 PCB内的子组件。 公开了用于形成电容器元件的许多不同介电材料和树脂。 电容器元件中的电介质元件优选地包括电介质材料和热响应材料，该热响应材料形成用于电介质材料的载体或者在电介质材料片的相对侧上形成为两个分开的片。

公开(公告)号：US20240237319A9

公开(公告)日：2024-07-11

申请号：US18369689

申请日：2023-09-18

Applicant: Michael M. Salour ,  De Yu Zang ,  James G. Grote

Inventor： Michael M. Salour ,  De Yu Zang ,  James G. Grote

IPC: H05K9/00 ,  C09D5/32 ,  C09D199/00 ,  H05K1/02 ,  H05K3/12

CPC classification number: H05K9/0083 ,  C09D5/32 ,  C09D199/00 ,  H05K1/0216 ,  H05K3/1283 ,  H05K9/009 ,  H05K1/0209 ,  H05K9/0022 ,  H05K2201/0257

Abstract: An electromagnetic interference (EMI) shielded device which includes an object to be shielded and an EMI shielding material encompassing the object. The EMI shielding material is made up of, but not limited to a broadband biopolymer or polymer dissolved in organic solvents and shielding guest material. The specific makeup of the shielding material and fabrication procedure of the shielding material is also included herein.

公开(公告)号：US11993719B2

公开(公告)日：2024-05-28

申请号：US16759227

申请日：2018-10-26

Applicant: NATIONAL RESEARCH COUNCIL OF CANADA

Inventor： Chantal Paquet ,  Jacques Lefebvre ,  Jingwen Guan ,  Patrick Roland Lucien Malenfant ,  Benoit Simard ,  Yadienka Martinez-Rubi ,  Arnold Kell ,  Xiangyang Liu

IPC: C09C3/10 ,  B41M3/00 ,  B41M7/00 ,  C09D11/037 ,  C09D11/322 ,  C09D11/52 ,  H05K1/03 ,  H05K1/09 ,  H05K3/12

CPC classification number: C09C3/10 ,  B41M3/006 ,  B41M7/0081 ,  C09D11/037 ,  C09D11/322 ,  C09D11/52 ,  H05K1/0353 ,  H05K1/097 ,  H05K3/1283 ,  C01P2004/13 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2203/1131

Abstract: A composite includes a plastic substrate and an electrical insulator layer formed on the plastic substrate. The electrical insulator layer contains boron nitride nanotubes (BNNTs), which may be unmodified or modified BNNTS. The composite is suitable for use in making printed electronic devices. A process includes providing a plastic substrate and forming on at least a portion of a surface of the plastic substrate a layer that contains the BNNTs. A metallic ink trace is formed on a portion of the layer, such that the metallic ink trace is spaced-apart from the substrate. Using photonic or thermal sintering techniques, the metallic ink trace is then sintered.

公开(公告)号：US20180235074A1

公开(公告)日：2018-08-16

申请号：US15861676

申请日：2018-01-04

Applicant: Amazing Cool Technology Corp

Inventor： Yang-Ming SHIH ,  Hung-Yun Hsu

IPC: H05K1/02

CPC classification number: H05K1/0206 ,  H05K1/0209 ,  H05K2201/0257 ,  H05K2201/0323 ,  H05K2201/06 ,  H05K2201/09781

Abstract: A radiative cooling structure for a printed circuit includes a circuit board and a cooling structure. A printed circuit is disposed on the circuit board. The printed circuit includes a plurality of printed leads and a thermal conductive area. The printed leads are connected to the thermal conductive area. A cooling structure covers the thermal conductive area. The cooling structure covers the thermal conductive area, and the cooling structure incudes a thermal radiation layer. Heat generated by heat sources on the circuit board is transferred to the thermal conductive area via the printed circuit. The cooling structure radiates the heat into surrounding space by radiation.