公开(公告)号：US6132851A

公开(公告)日：2000-10-17

申请号：US267877

申请日：1994-06-28

Applicant: Charles A. Poutasse

Inventor： Charles A. Poutasse

IPC: B32B15/08 ,  C08G59/02 ,  C08G59/06 ,  C08G59/14 ,  C08G59/40 ,  C09J163/00 ,  H05K3/02 ,  H05K3/38 ,  B32B3/00

CPC classification number: H05K3/386 ,  C08G59/02 ,  C08G59/06 ,  C08G59/40 ,  C09J163/00 ,  H05K2201/0239 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0315 ,  H05K2203/0723 ,  H05K3/022 ,  H05K3/384 ,  H05K3/385 ,  H05K3/389 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/30

Abstract: This invention relates to an adhesive composition, comprising: (A) at least one phenolic resole resin; and (B) the product made by reacting (B-1) at least one difunctional epoxy resin, with (B-2) at least one compound represented by the formula ##STR1## wherein in Formulae (I) and (II): G, T and Q are each independently functional groups selected from the group consisting of COOH, OH, SH, NH.sub.2, NHR.sup.1, (NHC(.dbd.NH)).sub.m NH.sub.2, R.sup.2 COOH, NR.sup.1.sub.2, C(O)NHR.sup.1, R.sup.2 NR.sup.1.sub.2, R.sup.2 OH, R.sup.2 SH, R.sup.2 NH.sub.2 and R.sup.2 NHR.sup.1, wherein R.sup.1 is a hydrocarbon group, R.sup.2 is an alkylene or alkylidene group and m is a number in the range of 1 to about 4; T can also be R.sup.1, OR.sup.1 or SO.sub.2 C.sub.6 H.sub.4 --NH.sub.2 ; and Q can also be H. The invention also relates to copper foils having the foregoing adhesive composition adhered to at least one side thereof to enhance the adhesion between said foils and dielectric substrates. The invention also relates to laminates comprising copper foil, a dielectric substrate, and an adhesion-promoting layer comprising the foregoing adhesive composition disposed between and adhered to the foil and the substrate.

Abstract translation: 本发明涉及粘合剂组合物，其包含：（A）至少一种酚醛树脂; 和（B）通过使（B-1）至少一种双官能环氧树脂与（B-2）至少一种由下式表示的化合物反应制备的产物：其中在式（I）和（II）中：G，T和 Q独立地为选自COOH，OH，SH，NH 2，NHR 1，（NHC（= NH））m NH 2，R 2 COOH，NR 12，C（O）NHR 1，R 2 NR 12，R 2 OH，R 2 NH，R 2 NH 2和R 2 NH 其中R1为烃基，R2为亚烷基或亚烷基，m为1〜4的数; T也可以是R1，OR1或SO2C6H4-NH2; 并且Q也可以是H.本发明还涉及具有粘附到其至少一个侧面的上述粘合剂组合物的铜箔，以增强所述箔和电介质基底之间的粘附。 本发明还涉及包含铜箔，电介质基底和包含上述粘合剂组合物的粘合促进层的层压体，所述粘合剂组合物设置在箔和衬底之间并粘附到箔和衬底上。

公开(公告)号：US5874009A

公开(公告)日：1999-02-23

申请号：US514739

申请日：1995-08-14

Applicant: Teiichi Inada ,  Yoshiyuki Tsuru ,  Shin Takanezawa

Inventor： Teiichi Inada ,  Yoshiyuki Tsuru ,  Shin Takanezawa

IPC: C08L13/00 ,  C08L33/08 ,  C08L63/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/46 ,  B32B7/12 ,  B32B27/04 ,  B32B27/38

CPC classification number: H05K3/4673 ,  C08L13/00 ,  C08L33/08 ,  C08L63/00 ,  H05K3/002 ,  H05K3/4655 ,  H05K2201/0133 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/063 ,  H05K2203/0759 ,  H05K2203/0783 ,  H05K2203/122 ,  H05K3/4644 ,  H05K3/4652

Abstract: A multilayered printed circuit board is produced by (a) forming a resin layer on an inner circuit substrate and abrading it to expose the circuit conductors, (b) contacting a copper foil having a layer of insulating adhesive composed of an epoxy resin, a carboxylic acid-containing acrylic or acrylonitrile-butadiene rubber, a curing agent and accelerator with the resin layer and exposed circuit conductors, (c) removing portions necessary for connection with the copper foil and insulating adhesive exposed to the holes by etching, (d) connecting the copper foil with circuits exposed to the holes and forming a surface circuit by processing the outer layer of the copper foil, and (e) repeating steps (a) to (d) to obtained a multilayered structure.

Abstract translation: 通过（a）在内部电路基板上形成树脂层并研磨以暴露电路导体，（b）使具有由环氧树脂，羧酸的绝缘粘合剂层的铜箔接触而制造多层印刷电路板 含酸的丙烯酸或丙烯腈 - 丁二烯橡胶，具有树脂层和暴露的电路导体的固化剂和加速剂，（c）去除与铜箔连接所需的部分和通过蚀刻暴露于孔的绝缘胶，（d）连接 具有暴露于孔的电路的铜箔，通过加工铜箔的外层形成表面电路，以及（e）重复步骤（a）至（d）以获得多层结构。

公开(公告)号：US5374469A

公开(公告)日：1994-12-20

申请号：US945929

申请日：1992-09-17

Applicant: Atsushi Hino ,  Amane Mochizuki ,  Kazuo Ouchi ,  Shoji Morita ,  Toshiki Naito ,  Kazumi Higashi ,  Masako Maeda ,  Masayuki Kaneto ,  Munekazu Tanaka ,  Masakazu Sugimoto

Inventor： Atsushi Hino ,  Amane Mochizuki ,  Kazuo Ouchi ,  Shoji Morita ,  Toshiki Naito ,  Kazumi Higashi ,  Masako Maeda ,  Masayuki Kaneto ,  Munekazu Tanaka ,  Masakazu Sugimoto

IPC: H05K1/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/20 ,  H05K3/28 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  B32B9/00

CPC classification number: H05K3/4635 ,  H05K1/036 ,  H05K3/205 ,  H05K3/281 ,  H05K3/4007 ,  H05K3/421 ,  H05K3/4617 ,  H05K3/4632 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K1/0346 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/068 ,  H05K2201/09481 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0376 ,  H05K2203/063 ,  H05K2203/0726 ,  H05K2203/0733 ,  H05K2203/107 ,  H05K2203/1572 ,  H05K3/0035 ,  H05K3/28 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4647 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24942 ,  Y10T428/31721

Abstract: A flexible printed substrate imparted with an adhesive property for loading on an external substrate, a double printed substrate having formed on both surfaces thereof a metal layer or a wiring circuit, and a multilayer substrate having a multilayer structure are disclosed. The flexible printed substrate comprises an insulating resin layer comprising a low-linear expansion polyimide resin layer and a thermoplastic polyimide resin layer, and a metal layer or a wiring circuit formed on the low-linear expansion polyimide resin layer of the insulating resin layer, wherein a mixed region of the polyimide resin components is formed in the interface between the low-linear expansion polyimide resin layer and the thermoplastic polyimide resin layer.

Abstract translation: 公开了一种赋予外部基板的粘合性的柔性印刷基板，在其两面形成金属层或布线电路的双面印刷基板以及具有多层结构的多层基板。 柔性印刷基板包括绝缘树脂层，其包含低线膨胀聚酰亚胺树脂层和热塑性聚酰亚胺树脂层，以及形成在绝缘树脂层的低线性膨胀聚酰亚胺树脂层上的金属层或布线电路，其中 在低线膨胀聚酰亚胺树脂层和热塑性聚酰亚胺树脂层之间的界面形成聚酰亚胺树脂成分的混合区域。

公开(公告)号：US5089346A

公开(公告)日：1992-02-18

申请号：US495362

申请日：1990-03-16

Applicant: Junichi Imaizumi ,  Hiroshi Nomura ,  Kouichi Nagao ,  Masakatsu Suzuki ,  Koushi Sakairi ,  Eikichi Satou

Inventor： Junichi Imaizumi ,  Hiroshi Nomura ,  Kouichi Nagao ,  Masakatsu Suzuki ,  Koushi Sakairi ,  Eikichi Satou

IPC: B32B7/12 ,  C08G73/12 ,  C08L79/08 ,  H01B3/30 ,  H05K1/00 ,  H05K1/03 ,  H05K3/28 ,  H05K3/38 ,  H05K3/46

CPC classification number: H05K3/28 ,  B32B7/12 ,  C08G73/12 ,  C08L79/085 ,  H01B3/306 ,  H05K3/281 ,  H05K3/386 ,  H05K1/036 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0759 ,  H05K2203/095 ,  H05K3/4611 ,  H05K3/4635 ,  Y10T428/31681

Abstract: A heat resistant adhesive composition comprising a specific polyamic acid solution and a bis-maleimide compound exhibits flexibility and excellent heat resistance after bonding two material bodies, and therefore, it can be suitably used for producing of flexible metal-clad laminates, double-sided flexible metal-clad laminates, and multilayer printed circuit boards, and for attaching coverlay films to printed circuit boards.

公开(公告)号：US5066691A

公开(公告)日：1991-11-19

申请号：US442637

申请日：1989-11-29

Applicant: Toshihisa Kumakura ,  Ken Nanaumi ,  Ryoichi Ikezawa ,  Hideki Eriguchi

Inventor： Toshihisa Kumakura ,  Ken Nanaumi ,  Ryoichi Ikezawa ,  Hideki Eriguchi

IPC: C09J115/00 ,  C09J129/14 ,  C09J163/08 ,  H05K3/38

CPC classification number: H05K3/386 ,  C09J115/00 ,  C09J129/14 ,  C09J163/08 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/0358

Abstract: An adhesive composition for metal-clad laminates which comprises:(a) 100 parts by weight of a polyvinylbutyral having an average polymerization degree of from 500 to 3,000 and a degree of butyralization of at least 60 mol %,(b) from 10 to 200 parts by weight of an epoxidized polybutadiene per 100 parts by weight of the polyvinylbutyral, the epoxidized polybutadiene having a number average molecular weight of from 1,000 to 10,000 and an epoxy equivalent weight of from 200 to 2,000, and(c) from 1 to 10 parts by weight of a hardener for the epoxidized polybutadiene per 100 parts by weight of the epoxidized polybutadiene.

Abstract translation: 一种金属包覆层压体用粘合剂组合物，其包含：（a）100重量份的平均聚合度为500〜3000，丁缩醛化度为60摩尔％以上的聚乙烯醇缩丁醛，（b）10〜200 每100重量份的聚乙烯醇缩丁醛，环氧化聚丁二烯重量份，数均分子量为1,000至10,000，环氧当量为200至2,000的环氧化聚丁二烯和（c）1至10份 的环氧化聚丁二烯硬化剂，每100重量份环氧化聚丁二烯。

公开(公告)号：US4810321A

公开(公告)日：1989-03-07

申请号：US053871

申请日：1987-05-26

Applicant: Joachim Wank ,  Claus Burkhardt ,  Hans-Wolfgang Schmoranzer

Inventor： Joachim Wank ,  Claus Burkhardt ,  Hans-Wolfgang Schmoranzer

IPC: B29C47/02 ,  B05D7/14 ,  B05D7/26 ,  B29C45/14 ,  B29K69/00 ,  B29K75/00 ,  B32B15/08 ,  B32B15/095 ,  B32B37/15 ,  H05K1/00 ,  H05K3/38 ,  B32B31/00

CPC classification number: B32B37/153 ,  B05D7/14 ,  B32B15/08 ,  H05K3/386 ,  B32B2457/08 ,  H05K1/0284 ,  H05K2201/0129 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/09118 ,  H05K2203/0759 ,  H05K2203/1327

Abstract: Metal-plastic laminates are prepared by coating a metal component with a polyurethane adhesion promoter in dissolved or dispersed form, drying the liquid phase and coating with the melt of a thermoplastic by the extrusion coating process.

Abstract translation: 通过用溶解或分散形式的聚氨酯粘合促进剂涂覆金属组分，干燥液相并通过挤出涂布方法用热塑性塑料的熔体涂覆来制备金属 - 塑料层压材料。

公开(公告)号：US2852421A

公开(公告)日：1958-09-16

申请号：US43523054

申请日：1954-06-08

Applicant: JOHNSON & JOHNSON

Inventor： ALFRED BERGSTEDT MILTON

IPC: B32B15/08 ,  H05K3/38

CPC classification number: H05K3/386 ,  B32B15/08 ,  H05K3/382 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0315 ,  Y10T428/2804 ,  Y10T428/2874 ,  Y10T428/31859

公开(公告)号：US20240101858A1

公开(公告)日：2024-03-28

申请号：US18276546

申请日：2022-01-26

Applicant: MITSUI MINING & SMELTING CO., LTD.

Inventor： Kazuhiro OOSAWA ,  Ayumu TATEOKA ,  Kuniharu OGAWA ,  Haruka MAKINO

IPC: C09D153/02 ,  C08F297/04 ,  C08K5/06 ,  C09D125/12 ,  H05K1/05

CPC classification number: C09D153/025 ,  C08F297/046 ,  C08K5/06 ,  C09D125/12 ,  H05K1/056 ,  C08F2810/20 ,  H05K2201/0355 ,  H05K2201/0358

Abstract: There is provided a resin composition exhibiting excellent dielectric properties, high adhesion to a low-roughness surface, heat resistance, and excellent water-resistant reliability. This resin composition includes an arylene ether compound having a weight average molecular weight of 30000 or higher and a styrenic copolymer having, in its molecule, a reactive unsaturated bond that exhibits reactivity by heat or an ultraviolet ray.

公开(公告)号：US20240049395A1

公开(公告)日：2024-02-08

申请号：US18258556

申请日：2020-12-25

Applicant: Resonac Corporation

Inventor： Masaya TOBA ,  Kazuyuki MITSUKURA ,  Masaki YAMAGUCHI

IPC: H05K1/18 ,  H05K3/02

CPC classification number: H05K1/181 ,  H05K3/022 ,  H05K2201/10553 ,  H05K2201/0358 ,  H05K2203/1377 ,  H05K2201/0209

Abstract: A layered plate including a copper layer having a thickness of 5 μm or less, and a resin layer provided on a surface of the copper layer, in which a water absorption rate of the resin layer is 1% or less after being left in an environment of 130° C. in temperature and 85% in relative humidity for 200 hours.

公开(公告)号：US11891474B2

公开(公告)日：2024-02-06

申请号：US17299719

申请日：2019-12-04

Applicant: TAIYO HOLDINGS CO., LTD.

Inventor： Kazuhisa Yamoto ,  Yoshitomo Aoyama ,  Hidekazu Miyabe

IPC: C08G59/42 ,  C08K3/013 ,  H05K1/03 ,  H05K1/18 ,  H05K3/28 ,  C08K3/36 ,  C08G59/32 ,  C08K5/12 ,  C08K9/06 ,  C08L63/00

CPC classification number: C08G59/42 ,  C08K3/013 ,  H05K1/03 ,  H05K1/188 ,  H05K3/28 ,  H05K2201/0358

Abstract: To provide a curable resin composition, from which a cured product having high heat resistance, a low dielectric loss tangent, high adhesion to a conductor can be obtained. A dry film, a resin-clad copper foil, a cured product, and an electronic component containing the curable resin composition are to be provided. A curable resin composition containing (A) an epoxy resin and (B) a compound having an active ester group is obtained, which has ratio of the total amount of epoxy group(s) in (A) the epoxy resin/the total amount of active ester group(s) in (B) the compound having an active ester group in the composition in the range of 0.2 to 0.6. A dry film, a resin-clad copper foil, a cured product, and an electronic component containing the curable resin composition are also obtained.