公开(公告)号：US20060050489A1

公开(公告)日：2006-03-09

申请号：US11255061

申请日：2005-10-19

Applicant: James Wehrly ,  Mark Wolfe ,  Paul Goodwin

Inventor： James Wehrly ,  Mark Wolfe ,  Paul Goodwin

IPC: H05K1/00

CPC classification number: H05K1/189 ,  H01L25/0652 ,  H01L25/105 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of its major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. A rigid substrate is configured to provide space on one side where the populated flex is disposed while in some embodiments, heat management or cooling structures are arranged on one side of the module to mitigate thermal accumulation in the module.

公开(公告)号：US5900587A

公开(公告)日：1999-05-04

申请号：US768706

申请日：1996-12-18

Applicant: Douglas E. Piper ,  Sam S. Shasteen ,  David C. Howard ,  Clifford L. DeYoung ,  Marvella A. Dickerson ,  William J. Ricket

Inventor： Douglas E. Piper ,  Sam S. Shasteen ,  David C. Howard ,  Clifford L. DeYoung ,  Marvella A. Dickerson ,  William J. Ricket

IPC: H01R12/62 ,  H01R12/77 ,  H01R43/02 ,  H05K1/02 ,  H05K3/36 ,  H01B7/08

CPC classification number: H01R12/62 ,  H01R12/772 ,  H05K3/363 ,  H01R43/0256 ,  H05K1/0219 ,  H05K2201/0394 ,  H05K2201/09445 ,  H05K2201/10356

Abstract: A method and apparatus are disclosed in which a continuous elongated length of multi-conductor flat ribbon cable having a plurality of continuous signal and ground conductors for serially interconnects a plurality of terminal connectors. The signal and ground conductors include signal and ground wires which are disposed along the length of the cable in a predetermined arrangement with insulation material covering the wires. The insulation material is removed at predetermined positions along the length of the cable exposing the signal and ground wires for attachment to the terminal connectors.

Abstract translation: 公开了一种方法和装置，其中连续细长长度的多导体扁平带状电缆具有多个连续信号和接地导体，用于串联多个端子连接器。 信号和接地导体包括沿着电缆的长度以预定布置布置的信号线和接地线，绝缘材料覆盖电线。 沿着电缆长度的预定位置去除绝缘材料，暴露信号和接地线以附接到端子连接器。

公开(公告)号：US5457593A

公开(公告)日：1995-10-10

申请号：US166230

申请日：1993-12-13

Applicant: James A. Glaser ,  Ronald W. Glaser

Inventor： James A. Glaser ,  Ronald W. Glaser

IPC: H01R9/24 ,  H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/22 ,  H02H9/00

CPC classification number: H05K1/0265 ,  H01R9/24 ,  H05K1/0257 ,  H01R9/2441 ,  H04Q2201/12 ,  H05K1/0287 ,  H05K1/18 ,  H05K2201/09363 ,  H05K2201/09445 ,  H05K2201/09609 ,  H05K2201/10287 ,  H05K2201/10325 ,  H05K3/222

Abstract: A protector block assembly for coupling a plurality of surge protectors to multi-line telecommunications cables includes a multi-layer printed circuit, to which has been mounted at least two cable connectors, and a protector block having a plurality of sockets for receiving standard surge protectors. A plurality of pins electrically and physically connects the multi-layer printed circuit board to the sockets on the protector block in a manner that a unique signal path exists between each lead in each connector and one of the sockets on the printed circuit board. The multi-layer printed circuit board includes traces on multiple layers that have a width and a copper content sufficient to carry current surges without breaking down.

Abstract translation: 用于将多个浪涌保护器耦合到多线电信电缆的保护器块组件包括已经安装有至少两个电缆连接器的多层印刷电路，以及具有用于接收标准浪涌保护器的多个插座的保护器块 。 多个引脚将多层印刷电路板电气和物理地连接到保护器块上的插座，使得在每个连接器中的每个引线与印刷电路板上的插座中的一个之间存在唯一的信号路径。 多层印刷电路板包括具有宽度和铜含量的多层迹线，足以承载电流而不破坏。

公开(公告)号：US5427537A

公开(公告)日：1995-06-27

申请号：US369857

申请日：1995-01-06

Applicant: Niko M. Savovic ,  Michael M. Austin ,  Raymond J. Kleinert, III ,  Christian Schneider ,  Robert D. Kreisinger

Inventor： Niko M. Savovic ,  Michael M. Austin ,  Raymond J. Kleinert, III ,  Christian Schneider ,  Robert D. Kreisinger

IPC: H01M2/10 ,  H01M2/20 ,  H01R13/22 ,  H05K1/00 ,  H05K1/11 ,  H05K1/18

CPC classification number: H01M2/20 ,  H01M2/1055 ,  H01R13/22 ,  H05K1/118 ,  H05K1/0393 ,  H05K1/18 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/0999

Abstract: A device (100) having an external contact electrical connection (155) for providing an electrical interface to the device includes a housing member (222) having apertures (235, 335), and a flexible film substrate (270) having an electrically conductive pattern (275). Portions of the electrically conductive pattern defines contact areas (255, 355) for presenting the electrical interface of the device (100). These contact areas (255, 355) are rigidly positioned adjacent to the interior surface (324) of the housing (222) about the apertures (235, 335) such that the contact areas (255) are externally exposed through the aperture (235, 335).

Abstract translation: 具有用于向该装置提供电接口的外部接触电连接（155）的装置（100）包括具有孔（235,335）的壳体构件（222）和具有导电图案的柔性膜基底（270） （275）。 导电图案的部分限定用于呈现设备（100）的电接口的接触区域（255,355）。 这些接触区域（255,355）围绕孔（235,335）刚性地定位成邻近壳体（222）的内表面（324），使得接触区域（255）通过孔（235， 335）。

公开(公告)号：US5313416A

公开(公告)日：1994-05-17

申请号：US907041

申请日：1992-07-01

Applicant: Masatoshi Kimura

Inventor： Masatoshi Kimura

IPC: H01L25/00 ,  H01L23/538 ,  H01L25/065 ,  H05K1/11 ,  H05K1/18 ,  H05K5/02 ,  H05K7/14 ,  G11C5/04 ,  G06K19/07

CPC classification number: H05K5/026 ,  H01L23/5387 ,  H01L25/0652 ,  H05K1/189 ,  H01L2924/0002 ,  H05K1/117 ,  H05K1/118 ,  H05K2201/042 ,  H05K2201/0715 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10689

Abstract: A semiconductor memory control device includes a flexible circuit board having a plurality of panels and folded so that the panels are stacked on one another, a plurality of semiconductor elements mounted on the flexible circuit board, and a package enclosing the flexible circuit board and the plurality of semiconductor elements. A method of mounting semiconductor memory control devices in high density includes mounting a plurality of semiconductor elements on a flexible circuit board, forming an internally mounted module by folding the flexible circuit board in panels that are stacked in multiple layers, and enclosing the internally mounted module in a package.

Abstract translation: 半导体存储器控制装置包括具有多个面板并被折叠使得面板彼此堆叠的柔性电路板，安装在柔性电路板上的多个半导体元件以及封装柔性电路板和多个 的半导体元件。 以高密度安装半导体存储器控制装置的方法包括将多个半导体元件安装在柔性电路板上，通过将柔性电路板折叠成层叠在多层的面板中，并将内部安装的模块 在一个包中。

公开(公告)号：US5161986A

公开(公告)日：1992-11-10

申请号：US776818

申请日：1991-10-15

Applicant: Glenn J. Gulbranson ,  Steven J. Young ,  Gerald W. Kenealey

Inventor： Glenn J. Gulbranson ,  Steven J. Young ,  Gerald W. Kenealey

IPC: H01R12/50 ,  H01R12/70 ,  H01R12/71 ,  H01R12/77 ,  H01R12/79 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K3/36 ,  H05K7/14 ,  H05K7/20

CPC classification number: H05K7/1451 ,  H01R12/714 ,  H01R12/79 ,  H01R23/6873 ,  H05K1/118 ,  H01R12/777 ,  H01R23/662 ,  H05K1/0218 ,  H05K1/0237 ,  H05K1/189 ,  H05K2201/044 ,  H05K2201/0715 ,  H05K2201/09445 ,  H05K2201/10189 ,  H05K2201/2009 ,  H05K3/0058 ,  H05K3/3447 ,  H05K3/361 ,  H05K3/4691

Abstract: Circuit apparatus comprises an integral structure of first and second multilayer wiring board portions and a flexible circuit portion. The wiring board portions each have at least circuit trace planes, ground planes and insulator planes. The flexible circuit portion includes at least one signal trace plane and at least one ground plane separated by at least one insulator plane; the singal trace plane of the flexible circuit portion being integral with a signal trace plane of each of the wiring board portions, the ground plane of the flexible circuit portion being integral with a ground plane of each of the wiring board portions, and the insulator plane of the flexible circuit portion being integral with an insulator plane of each of the wiring board portions. Selected ones of a plurality of electric contacts are connected to selected ones of the circuit traces of the circuit trace plane of the flexible circuit portions; others of the contacts being connected to the ground plane. A pin connector is conencted to the plurality of contacts and is arranged to electrically connect selected circuits traces and the ground plane of the flexible circuit portion to an interconnect backpanel, thereby electrically connecting the wiring board portions to the backpanel with minimum inductance.

Abstract translation: 电路装置包括第一和第二多层布线板部分和柔性电路部分的整体结构。 布线板部分至少具有电路迹线平面，接地平面和绝缘体平面。 柔性电路部分包括至少一个信号迹线平面和至少一个由至少一个绝缘体平面隔开的接地平面; 柔性电路部分的单线迹平面与每个布线板部分的信号迹线平面成一体，柔性电路部分的接地平面与每个布线板部分的接地面成一体，绝缘体平面 柔性电路部分与每个接线板部分的绝缘体平面成一体。 多个电触头中的选定的电触点连接到柔性电路部分的电路迹线平面的选择的电路迹线中; 触点的另一些连接到地平面。 引脚连接器被连接到多个触点，并且被布置成将所选择的电路迹线和柔性电路部分的接地平面电连接到互连背板，从而以最小的电感将布线板部分电连接到背板。