公开(公告)号：US20240121887A1

公开(公告)日：2024-04-11

申请号：US18477863

申请日：2023-09-29

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Xiaojing Liao

IPC: H05K1/02

CPC classification number: H05K1/024 ,  H05K1/0298 ,  H05K2201/012 ,  H05K2201/10181 ,  H05K2201/10356

Abstract: A package structure includes a protection structure, a circuit board, and a chip. The circuit board includes a first cabling layer, a dielectric layer, and a second cabling layer that are laminated. The protection structure is disposed inside the dielectric layer. The protection structure is configured to electrically connect the first cabling layer to the second cabling layer, and the chip is electrically connected to the first cabling layer or the second cabling layer. When the chip is short-circuited, the protection structure blows first.

公开(公告)号：US11905412B2

公开(公告)日：2024-02-20

申请号：US17600463

申请日：2020-04-03

Applicant: Showa Denko Materials Co., Ltd.

Inventor： Takahiro Taki ,  Takako Ejiri ,  Tetsuro Iwakura ,  Kana Uchimura ,  Toshiki Fujii ,  Yukako Omori ,  Tetsuya Kato ,  Osamu Fujioka

IPC: B32B3/10 ,  C08L79/08 ,  C08J5/24 ,  B32B5/02 ,  B32B15/14 ,  B32B15/20 ,  B32B37/18 ,  C08G73/12 ,  H05K1/03 ,  H01L23/498 ,  H05K1/02

CPC classification number: C08L79/085 ,  B32B5/022 ,  B32B15/14 ,  B32B15/20 ,  B32B37/18 ,  C08G73/128 ,  C08J5/244 ,  C08J5/249 ,  H05K1/0373 ,  B32B2250/40 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/076 ,  B32B2307/204 ,  B32B2307/3065 ,  B32B2307/748 ,  B32B2311/12 ,  B32B2315/085 ,  B32B2457/08 ,  C08J2379/08 ,  C08J2425/04 ,  C08J2471/00 ,  H01L23/49822 ,  H05K1/024 ,  H05K2201/012

Abstract: The present invention relates to a resin composition containing a phosphate ester-based flame retardant (A) having an aromatic hydrocarbon group containing two or more aromatic ring structures and a polyphenylene ether derivative (B) having an ethylenically unsaturated bond-containing group at both ends.

公开(公告)号：US11700886B2

公开(公告)日：2023-07-18

申请号：US16759439

申请日：2018-10-26

Applicant: KT&G CORPORATION

Inventor： Tae Hun Kim ,  Hun Il Lim ,  Jong Sun Park

IPC: A24F15/01 ,  A24F40/46 ,  A24B15/167 ,  A24F40/42 ,  A24F40/90 ,  A24F40/20 ,  A24F40/30 ,  A24D3/17 ,  A24D1/20 ,  A24F40/60 ,  F21V3/00 ,  F21V5/00 ,  G02B19/00 ,  H05B3/54 ,  A24F40/485 ,  A24F40/10 ,  A24F40/44 ,  A24F40/40 ,  A24F40/57 ,  A24F40/65 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  A24F40/50 ,  A24F40/95 ,  A24F40/51 ,  F21Y115/10

CPC classification number: A24F40/42 ,  A24B15/167 ,  A24D1/20 ,  A24D3/17 ,  A24F15/01 ,  A24F40/10 ,  A24F40/20 ,  A24F40/30 ,  A24F40/40 ,  A24F40/44 ,  A24F40/46 ,  A24F40/485 ,  A24F40/50 ,  A24F40/57 ,  A24F40/60 ,  A24F40/65 ,  A24F40/90 ,  A24F40/95 ,  F21V3/00 ,  F21V5/00 ,  G02B19/0009 ,  G02B19/0061 ,  H05B3/54 ,  H05K1/0203 ,  H05K1/0277 ,  H05K1/148 ,  H05K1/181 ,  A24F40/51 ,  F21Y2115/10 ,  H05K2201/012 ,  H05K2201/0154 ,  H05K2201/10219

Abstract: Provided is a heater assembly for aerosol generating devices, the heater assembly including a thermally conductive element that has a cylindrical shape and includes an accommodation space for accommodating a cigarette, a flexible heater that surrounds at least a portion of an outer surface of the thermally conductive element, and an adhesion member that surrounds the flexible heater such that the flexible heater closely adheres to the thermally conductive element.

公开(公告)号：US20190241717A1

公开(公告)日：2019-08-08

申请号：US16318409

申请日：2017-07-19

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Takao TANIGAWA ,  Tetsuroh IRINO ,  Minoru KAKITANI ,  Kouji MORITA

IPC: C08K5/524 ,  C08J5/24 ,  C08K5/372 ,  C08K5/5313 ,  C08K5/523 ,  H05K1/03 ,  H05K1/02

CPC classification number: C08K5/524 ,  B32B5/28 ,  B32B15/08 ,  B32B27/34 ,  C08J5/24 ,  C08J2379/08 ,  C08K3/22 ,  C08K5/372 ,  C08K5/49 ,  C08K5/523 ,  C08K5/5313 ,  C08K2201/019 ,  C08L35/00 ,  H05K1/024 ,  H05K1/03 ,  H05K1/0373 ,  H05K2201/012

Abstract: The present invention relates to a resin composition containing (A) a compound having a maleimide group, a divalent group having at least two imide bonds, and a saturated or unsaturated divalent hydrocarbon group and (B) a halogen-free flame retardant.

公开(公告)号：US20190203123A1

公开(公告)日：2019-07-04

申请号：US16009627

申请日：2018-06-15

Applicant: TAIWAN UNION TECHNOLOGY CORPORATION

Inventor： CHIH-WEI LIAO ,  CHANG-CHIEN YANG ,  TSUNG-HSIEN LIN ,  JU-MING HUANG

IPC: C09K21/12 ,  C08K5/5399 ,  C08K5/521 ,  C08K5/5313 ,  C08K3/36 ,  C08J3/24 ,  C08J5/24 ,  H05K1/03 ,  H05K3/02 ,  B32B5/02

CPC classification number: C09K21/12 ,  B32B5/02 ,  B32B2250/02 ,  B32B2260/00 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/536 ,  B32B2457/08 ,  C08J3/24 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/36 ,  C08K5/521 ,  C08K5/5313 ,  C08K5/5399 ,  C08K2201/014 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/012

Abstract: A resin composition is provided. The resin composition comprises the following constituents:(A) an epoxy resin, which has at least two epoxy functional groups per molecule;(B) a reactive flame retardant with (a DOPO functional group) in structure; and(C) a non-reactive phosphorus-containing flame retardant, which is compatible with the other constituents of the resin composition.

公开(公告)号：US10072148B2

公开(公告)日：2018-09-11

申请号：US15813165

申请日：2017-11-15

Applicant: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO. LTD.

Inventor： Rongtao Wang ,  Yu-Te Lin ,  Wenjun Tian ,  Ziqian Ma ,  Wenfeng Lv ,  Ningning Jia

IPC: C08L63/00 ,  B32B15/092 ,  B32B15/20 ,  B32B5/02 ,  B32B15/08 ,  B32B37/06 ,  B32B37/12 ,  C08G59/50 ,  C08G59/54 ,  C08G59/56 ,  C08G59/62 ,  C08L79/02 ,  C08J5/24 ,  H05K1/03 ,  H05K1/09 ,  C09D163/00 ,  C09D179/02 ,  C08K3/32 ,  C08K5/03 ,  C08K5/3415 ,  C08K5/3492 ,  C08K5/49 ,  B32B15/14 ,  C08G59/24

CPC classification number: C08L63/00 ,  B32B5/02 ,  B32B15/092 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/021 ,  B32B2262/101 ,  B32B2307/3065 ,  B32B2457/08 ,  C08G59/245 ,  C08G59/50 ,  C08G59/504 ,  C08G59/54 ,  C08G59/56 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/02 ,  C08J2363/10 ,  C08J2471/10 ,  C08J2479/02 ,  C08L2201/02 ,  C08L2203/206 ,  C08L2205/03 ,  H05K1/0353 ,  H05K1/09 ,  H05K2201/012 ,  C08L79/04

Abstract: The present invention provides a resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) from 10 to 80 parts by weight of benzoxazine resin; (C) from 10 to 50 parts by weight of dicyclopentadiene phenol resin; and (D) from 0.5 to 5 parts by weight of amine hardener; wherein the resin composition is free of diallyl bisphenol A (DABPA).

公开(公告)号：US10053473B2

公开(公告)日：2018-08-21

申请号：US15831506

申请日：2017-12-05

Applicant: International Business Machines Corporation

Inventor： Dylan J. Boday ,  Joseph Kuczynski ,  Robert E. Meyer, III

IPC: C07F7/08 ,  C08K5/5419 ,  C07F7/18 ,  H05K1/03 ,  C08K5/5465 ,  C07F7/10 ,  C08K9/06 ,  C08K3/00 ,  C08K3/016

CPC classification number: C07F7/0878 ,  C07F7/081 ,  C07F7/0889 ,  C07F7/0896 ,  C07F7/10 ,  C07F7/1804 ,  C08K3/016 ,  C08K5/5419 ,  C08K5/5465 ,  C08K9/06 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209

Abstract: A flame retardant filler having brominated silica particles, for example, imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs), connectors, and other articles of manufacture that employ thermosetting plastics or thermoplastics. In this example, brominated silica particles serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant. In an exemplary application, a PCB laminate stack-up includes conductive planes separated from each other by a dielectric material that includes a flame retardant filler comprised of brominated silica particles. In an exemplary method of synthesizing the brominated silica particles, a monomer having a brominated aromatic functional group is reacted with functionalized silica particles (e.g., isocyanate, vinyl, amine, or epoxy functionalized silica particles). Alternatively, a monomer having a brominated aromatic functional group may be reacted with a silane to produce a brominated alkoxysilane monomer, which is then reacted with the surface of silica particles.

公开(公告)号：US20180199434A1

公开(公告)日：2018-07-12

申请号：US15812874

申请日：2017-11-14

Applicant: PIONEER CIRCUITS, INC.

Inventor： Dale McKeeby ,  Robert Lee

IPC: H05K1/03 ,  H05K1/02 ,  H05K3/46 ,  H05K1/09 ,  H05K3/28

CPC classification number: H05K1/038 ,  H05K1/0201 ,  H05K1/0281 ,  H05K1/0366 ,  H05K1/0393 ,  H05K1/09 ,  H05K3/285 ,  H05K3/4655 ,  H05K2201/012 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/029 ,  H05K2201/09027 ,  H05K2203/0108 ,  H05K2203/0113

Abstract: Provided herein are embodiments of a PWB circuit construction material, and its use in flexible PWB circuits. The PWB circuit construction material is made up of temperature resistant fabric bonded to a metal substrate using a bonding agent. The temperature resistant material may include synthetic aromatic polyamide fibers. The fabric may be used as a reinforcement for the standard PWB construction materials for flexible PWB circuits and as a standalone piece that is bonded as a hinge at rigid portions of a rigid or rigid-flexible PWB circuit to reduce the thermal effects.

公开(公告)号：US09956742B2

公开(公告)日：2018-05-01

申请号：US14927493

申请日：2015-10-30

Applicant: Jiangsu Yoke Technology Co., Ltd

Inventor： Tung-Ying Hsieh ,  Qi Shen ,  Jung-Che Lu

IPC: C08K3/36 ,  H05K1/02 ,  H05K1/03 ,  B32B5/02 ,  B32B15/14 ,  B32B5/26 ,  B32B15/20 ,  B32B5/22

CPC classification number: B32B5/022 ,  B32B5/02 ,  B32B5/024 ,  B32B5/22 ,  B32B5/26 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/06 ,  B32B2262/08 ,  B32B2262/10 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2307/20 ,  B32B2307/204 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/50 ,  B32B2307/546 ,  B32B2307/558 ,  B32B2307/714 ,  B32B2307/7242 ,  B32B2307/7265 ,  B32B2307/734 ,  B32B2457/00 ,  B32B2457/08 ,  B32B2553/00 ,  C08J5/24 ,  C08J2363/08 ,  C08J2463/00 ,  C08K3/013 ,  C08K3/36 ,  C08K5/5313 ,  H05K1/0373 ,  H05K2201/012 ,  C08L63/00

Abstract: A composite, a high-frequency circuit substrate using the same and method thereof are discussed. The composite includes the following solid components: a DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene 10-oxide) derivative compound of 10-70 wt %, a curing agent of 10-50 wt %, one or more epoxy of 10-90 wt % and an inorganic filling material of 10-40 wt %. The non-halogen low dielectric epoxy composite uses a high-purity DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene 10-oxide) derivative as tiny particles dispersing in the composite. The crosslinking yield of the composite is not reduced, while the heat resistance and flame retardancy are increased. The prepreg and copper foil covered laminate for use in printed circuit board, made from the epoxy composite, has great dielectric property and high glass transition temperature (GTT), satisfying the need of high frequency in electronic signal transmission and high speed in data processing of the industry of copper covered printed circuit board.

公开(公告)号：US20180094002A1

公开(公告)日：2018-04-05

申请号：US15831428

申请日：2017-12-05

Applicant: International Business Machines Corporation

Inventor： Dylan J. Boday ,  Joseph Kuczynski ,  Robert E. Meyer, III

IPC: C07F7/08 ,  C08K5/5419 ,  H05K1/03 ,  C08K9/06 ,  C08K5/5465 ,  C07F7/18 ,  C07F7/10

CPC classification number: C07F7/0878 ,  C07F7/081 ,  C07F7/0889 ,  C07F7/0896 ,  C07F7/10 ,  C07F7/1804 ,  C08K3/016 ,  C08K5/5419 ,  C08K5/5465 ,  C08K9/06 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209

Abstract: A flame retardant filler having brominated silica particles, for example, imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs), connectors, and other articles of manufacture that employ thermosetting plastics or thermoplastics. In this example, brominated silica particles serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant. In an exemplary application, a PCB laminate stack-up includes conductive planes separated from each other by a dielectric material that includes a flame retardant filler comprised of brominated silica particles. In an exemplary method of synthesizing the brominated silica particles, a monomer having a brominated aromatic functional group is reacted with functionalized silica particles (e.g., isocyanate, vinyl, amine, or epoxy functionalized silica particles). Alternatively, a monomer having a brominated aromatic functional group may be reacted with a silane to produce a brominated alkoxysilane monomer, which is then reacted with the surface of silica particles.