公开(公告)号：US20180199441A1

公开(公告)日：2018-07-12

申请号：US15402881

申请日：2017-01-10

Applicant: BGT MATERIALS LIMITED

Inventor： KUO-HSIN CHANG ,  JIA-CING CHEN ,  WE-JEI KE ,  JINGYU ZHANG ,  CHUNG-PING LAI

IPC: H05K3/10 ,  H05K1/09 ,  H05K1/03 ,  H05K3/16 ,  H05K3/18

CPC classification number: H05K3/388 ,  H05K1/0346 ,  H05K3/16 ,  H05K3/182 ,  H05K3/188 ,  H05K3/381 ,  H05K2201/0154 ,  H05K2201/0257 ,  H05K2201/0323 ,  H05K2203/107

Abstract: A method of manufacturing a polymer printed circuit board contains steps of: A. providing a material layer consisting of polymer; B. forming circuit pattern on the material layer; C. depositing metal nanoparticles on the LIG of the circuit pattern so as to use as a metal seed; D. pressing the circuit pattern; and E. forming a metal layer on the LIG of the circuit pattern. In the step of B, the circuit pattern includes laser induced graphene, and the laser induced graphene is porous. Thereby, the circuit pattern is adhered on the material layer securely and has outstanding electric conductivity after being pressed in the step D.

公开(公告)号：US20180110127A1

公开(公告)日：2018-04-19

申请号：US15568137

申请日：2016-04-27

Applicant: CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE ,  UNIVERSITE D'AIX MARSEILLE

Inventor： Anne Patricia Blanche ALLONCLE ,  Philippe Christian Maurice DELAPORTE

IPC: H05K3/12

CPC classification number: H05K3/1275 ,  H05K3/025 ,  H05K3/046 ,  H05K3/10 ,  H05K2201/0104 ,  H05K2201/0257 ,  H05K2203/0528 ,  H05K2203/0736 ,  H05K2203/108 ,  H05K2203/128

Abstract: The invention relates to a laser printing method that includes the following steps: (a) the provision of a receiver substrate (4); (b) the provision of a target substrate (5) comprising a transparent substrate (50) one surface of which has a coating has a coating (51) constituted of a solid metal film; (c) the localised irradiation of the said film (51) through the said transparent substrate (50) by means of a first laser (6) in order to reach the melting temperature of the metal in a target zone of the said film which is in liquid form; (d) the irradiation of the said liquid film through the said transparent substrate by means of a second laser on the said target zone defined in the step (c), in order to form a liquid jet in the said target zone and bring about the ejection thereof from the substrate in the form of molten metal; (e) the depositing on the receiver substrate of a molten metal drop over a defined receiving zone, with the said drop solidifying upon cooling.

公开(公告)号：US20170295651A1

公开(公告)日：2017-10-12

申请号：US15512236

申请日：2015-08-31

Applicant: KOMURA-TECH CO., LTD.

Inventor： Masayuki Kanehara ,  Masaaki Urano

IPC: H05K3/12 ,  H05K1/09 ,  B41M1/04

CPC classification number: H05K3/12 ,  B41F3/20 ,  B41F17/14 ,  B41M1/04 ,  B41M1/30 ,  C09D11/52 ,  H05K1/097 ,  H05K3/1275 ,  H05K3/1283 ,  H05K2201/0257 ,  H05K2203/1131

Abstract: An electronic circuit board manufacturing method according to the present disclosure is a method of manufacturing an electronic circuit board including a substrate and an electronic circuit having a predetermined pattern, the electronic circuit being fixed on the substrate and being made from a nanoink composition containing metal particles. The method includes the steps of: causing a printing plate to hold a nanoink composition containing metal particles, the printing plate including an ink holding part formed on a surface thereof and having a predetermined pattern; bringing a surface of the substrate into intimate contact with the printing plate to transfer the nanoink composition held on the ink holding part onto the substrate; and drying the transferred nanoink composition in an environment of 40° C. or below in the atmosphere to fix the nanoink composition after the transfer step, thereby forming an electronic circuit having a predetermined pattern.

公开(公告)号：US20170121548A1

公开(公告)日：2017-05-04

申请号：US14931523

申请日：2015-11-03

Applicant: U.S.A. as Represented by the Administrator of the National Aeronautics and Space Administration

Inventor： Curtis W. Hill

IPC: C09D11/52 ,  H05K3/12 ,  H05K1/09

CPC classification number: C09D11/52 ,  C09D11/033 ,  C09D11/14 ,  H05K1/095 ,  H05K3/12 ,  H05K2201/0257

Abstract: An inked electrical conductor comprises a mixture of silver powder and ethyl cellulose. The silver powder is in a range of approximately 99.0 weight percent of the mixture to approximately 99.5 weight percent of the mixture. The ethyl cellulose is in a range of approximately 0.5 weight percent of the mixture to approximately 1.0 weight percent of the mixture.

公开(公告)号：US09544999B2

公开(公告)日：2017-01-10

申请号：US14918711

申请日：2015-10-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Weonho Shin ,  Yun Sung Woo ,  Daejin Yang ,  Jinyoung Hwang ,  Chan Kwak ,  Hyeon Cheol Park ,  Jae-Young Choi

IPC: H05K1/00 ,  H05K1/09 ,  B82Y30/00

CPC classification number: H05K1/09 ,  B82Y30/00 ,  H05K1/095 ,  H05K2201/0108 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0326

Abstract: A transparent electrode includes: a substrate; an electrically conductive layer disposed on the substrate and including a plurality of nano-sized conductors; and an organic/inorganic composite layer directly disposed on the electrically conductive layer and including a cross-linked polymer and nano-sized inorganic oxide particles, wherein the nano-sized inorganic oxide particles are included in an amount of greater than or equal to about 1 part by weight and less than about 35 parts by weight, relative to 100 parts by weight of the cross-linked polymer. Also an electronic device including the same.

Abstract translation: 透明电极包括：基板; 导电层，其设置在所述基板上并且包括多个纳米尺寸的导体; 以及直接设置在导电层上并包含交联聚合物和纳米级无机氧化物颗粒的有机/无机复合层，其中纳米尺寸无机氧化物颗粒的含量大于或等于约1 相对于100重量份的交联聚合物，重量份小于约35重量份。 也是包括其的电子设备。

公开(公告)号：US20170004978A1

公开(公告)日：2017-01-05

申请号：US11968116

申请日：2007-12-31

Applicant: Chi-won Hwang ,  Yoshihiro Tomita

Inventor： Chi-won Hwang ,  Yoshihiro Tomita

IPC: H01L21/48 ,  H05K3/12 ,  H05K3/40 ,  H01L23/498 ,  H05K3/00

CPC classification number: H01L21/486 ,  C09D11/52 ,  H01L21/4867 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K3/0023 ,  H05K3/0026 ,  H05K3/107 ,  H05K3/1216 ,  H05K3/1258 ,  H05K3/1291 ,  H05K3/4053 ,  H05K3/465 ,  H05K3/4664 ,  H05K2201/0257 ,  H05K2203/1131 ,  H01L2924/00

Abstract: Methods of forming microelectronic device structures are described. Those methods may include forming at least one opening through a build up structure and a photo sensitive material disposed on the build up structure, wherein the build up structure comprises a portion of a package substrate, filling the at least one opening with a metal containing nanopaste, and sintering the metal containing nanopaste to form a bulk property metal structure in the at least one opening.

Abstract translation: 描述形成微电子器件结构的方法。 这些方法可以包括通过建立结构和设置在堆积结构上的感光材料形成至少一个开口，其中堆积结构包括封装衬底的一部分，用含金属纳米糊剂填充至少一个开口 并且在所述至少一个开口中烧结含有金属的纳米糊剂以形成本体特性的金属结构。

公开(公告)号：US20160360612A1

公开(公告)日：2016-12-08

申请号：US15241871

申请日：2016-08-19

Applicant: WASEDA UNIVERSITY

Inventor： Eiji Iwase ,  Tomoya Koshi

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/09 ,  H05K3/22

CPC classification number: H05K1/0283 ,  H05K1/0277 ,  H05K1/03 ,  H05K1/092 ,  H05K1/11 ,  H05K1/118 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/225 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/2009 ,  H05K2203/0723 ,  H05K2203/0776 ,  H05K2203/105 ,  H05K2203/125 ,  H05K2203/173

Abstract: A self-healing wire includes, an electric wire arranged on a substrate, and a hybrid structure in which the electric wire is covered with at least one fluid selected from the group consisting of a fluid having conductive particles dispersed therein and a fluid having metal ions dissolved therein, formed on a healing portion for a crack to be generated in the electric wire. And a stretchable device includes the self-healing wire formed on a stretchable base material and an electric element mounted only on a base material higher in rigidity than the stretchable base material. Even when a crack is generated in the electric wire due to stretching of the substrate having flexibility, the crack is bridged by the conductive particles or a solid metal deposited from the metal ions in the fluid. Thus the self-healing wire and the stretchable device having both high conductivity and high stretchability are provided.

Abstract translation: 自修复线包括布置在基板上的电线，以及混合结构，其中电线被选自由其中分散有导电粒子的流体和具有金属离子的流体组成的组中的至少一种流体覆盖 溶解在其中，形成在用于在电线中产生的裂纹的愈合部分上。 另外，可拉伸装置包括形成在可拉伸基材上的自修复线，以及只安装在刚性高于伸缩性基材的基材上的电气元件。 即使由于具有柔性的基板的拉伸而在电线中产生裂纹，所以裂纹由导电颗粒或从流体中的金属离子沉积的固体金属桥接。 因此，提供了具有高导电性和高拉伸性的自愈线和可拉伸装置。

公开(公告)号：US09408336B1

公开(公告)日：2016-08-02

申请号：US13746993

申请日：2013-01-22

Applicant: De Yu Zang ,  Michael M. Salour ,  James G. Grote

Inventor： De Yu Zang ,  Michael M. Salour ,  James G. Grote

IPC: H05K9/00

CPC classification number: H05K9/0083 ,  C09D5/32 ,  C09D199/00 ,  H05K1/0209 ,  H05K1/0216 ,  H05K3/1283 ,  H05K9/0022 ,  H05K9/009 ,  H05K2201/0257

Abstract: An electromagnetic interference (EMI) shielded device which includes an object to be shielded and an EMI shielding material encompassing the object. The EMI shielding material is made up of, but not limited to a broadband biopolymer or polymer dissolved in organic solvents, and metal and carbon-based nano-powders or nanoparticles. The specific makeup of the shielding material and fabrication procedure of the shielding material is also included herein.

Abstract translation: 一种电磁干扰（EMI）屏蔽装置，其包括被屏蔽的物体和包围物体的EMI屏蔽材料。 EMI屏蔽材料由但不限于溶解在有机溶剂中的宽带生物聚合物或聚合物以及金属和碳基纳米粉末或纳米颗粒构成。 屏蔽材料的具体组成和屏蔽材料的制造过程也包括在本文中。

公开(公告)号：US20160141085A1

公开(公告)日：2016-05-19

申请号：US15006200

申请日：2016-01-26

Applicant: Nokia Technologies Oy

Inventor： Markku T. Heino ,  Reijo K. Lehtiniemi ,  Pekka Martti Tapio lkonen ,  Markku A. Oksanen ,  Eira T. Seppala ,  Maija Pohjakallio ,  Christoffer Johans ,  Jaakko Timonen ,  Robin H.A. Ras

IPC: H01F1/44 ,  B05D3/06

CPC classification number: H01F1/44 ,  B05D3/06 ,  C08J3/24 ,  C08K3/08 ,  C08K3/22 ,  H01F1/28 ,  H01L21/563 ,  H01L23/295 ,  H01L23/552 ,  H01L23/645 ,  H01L24/29 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/83222 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/351 ,  H01Q9/0407 ,  H01Q9/0421 ,  H05K1/0233 ,  H05K3/305 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/086 ,  H05K2201/10371 ,  H05K2201/10689 ,  H05K2203/101 ,  H05K2203/104 ,  H05K2203/1105 ,  Y02P70/613 ,  Y10T428/249986 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/3154 ,  Y10T428/31678 ,  Y10T428/31938 ,  Y10T428/32 ,  H01L2924/00

Abstract: A method includes applying a filler material to at least one component, the filler material including a heat curable matrix and nanoparticles; and applying an electromagnetic field to at least part of the filler material. The nanoparticles have a core capable of being heated by the electromagnetic field to a temperature sufficient to at least partially cure surrounding matrix. Another method involves applying a filler material to at least one component, the filler material including a matrix containing nanoparticles. The nanoparticles have a magnetic property and are present in a concentration sufficient to cause the matrix to flow in response to application of a magnetic field. The method also includes generating a magnetic field so as to guide the matrix into a space to be filled.

Abstract translation: 一种方法包括将填料材料施加到至少一种组分，所述填料材料包括可热固化的基质和纳米颗粒; 以及向所述填充材料的至少一部分施加电磁场。 纳米颗粒具有能够被电磁场加热到足以至少部分固化周围基质的温度的核心。 另一种方法包括将填料材料应用于至少一种组分，填料材料包括含有纳米颗粒的基体。 纳米颗粒具有磁性，并且以足以使基体响应于磁场的应用而流动的浓度存在。 该方法还包括产生磁场以将矩阵引导到要填充的空间中。

公开(公告)号：US09253890B2

公开(公告)日：2016-02-02

申请号：US14080810

申请日：2013-11-15

Applicant: Industrial Technology Research Institute

Inventor： Yu-Pei Chang ,  Ming-Huan Yang ,  Chun-Yi Chiu

IPC: B32B3/02 ,  H05K3/02 ,  G06F3/044 ,  H05K3/20 ,  H05K1/09 ,  B82Y40/00 ,  H05K3/46

CPC classification number: H05K3/02 ,  B82Y40/00 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/097 ,  H05K3/20 ,  H05K3/4685 ,  H05K2201/0108 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/09245 ,  H05K2203/1105 ,  H05K2203/1142 ,  Y10S977/932 ,  Y10T428/24802

Abstract: Provided is a patterned conductive film may include a conductive interconnected nano-structure film. The conductive interconnected nano-structure film may include a first region and a second region adjacent to the first region. A conductivity of the first region may be at least 1000 times a conductivity of the second region.

Abstract translation: 提供了图案化的导电膜可以包括导电互连的纳米结构膜。 导电互连的纳米结构膜可以包括与第一区域相邻的第一区域和第二区域。 第一区域的电导率可以是第二区域的电导率的至少1000倍。