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公开(公告)号：US20180220529A1
公开(公告)日：2018-08-02
申请号：US15937692
申请日：2018-03-27
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiroyuki KANBARA
CPC classification number: H05K1/0306 , C03C3/062 , C03C3/089 , C03C4/04 , C03C8/22 , C03C8/24 , C03C14/006 , C03C2214/16 , G03F7/0047 , G03F7/029 , G03F7/031 , G03F7/033 , H01B3/02 , H05K1/03 , H05K3/46 , H05K2201/0104 , H05K2201/017 , H05K2201/068 , H05K2203/1126
Abstract: A photosensitive glass paste contains a photosensitive organic component and an inorganic component containing a glass powder having a high softening point, a glass powder having a low softening point, and a ceramic filler. The ceramic filler has a thermal expansion coefficient of 10×10−6/° C. to 16×10−6/° C., the inorganic component contains 30% to 50% by volume of the ceramic filler, and the inorganic component contains 0.5% to 10% by volume of the glass powder having a low softening point.
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公开(公告)号：US20180199433A1
公开(公告)日：2018-07-12
申请号：US15742190
申请日：2016-08-02
Applicant: Soko Kagaku Co., Ltd. , Asahi Glass Company, Limited
Inventor： Akira HIRANO , Ko AOSAKI
IPC: H05K1/03 , H01L33/62 , H01L33/32 , H05K1/11 , H05K1/09 , H05K3/46 , H05K3/00 , H05K3/40 , H05K3/28
CPC classification number: H05K1/036 , H01L33/32 , H01L33/56 , H01L33/62 , H01L2224/16225 , H05K1/0306 , H05K1/09 , H05K1/111 , H05K3/0044 , H05K3/28 , H05K3/4007 , H05K3/4644 , H05K2201/0104 , H05K2201/015 , H05K2201/10106 , H05K2201/10674 , H05K2203/0228 , H05K2203/0548 , H05K2203/0759
Abstract: To prevent degradation of electrical characteristics caused by a resin filled between electrodes in an ultraviolet light-emitting operation, the present invention provides a base 10 that comprises an insulating base material 11 and two or more metal films 12 and 13 that are formed on one side of the insulating base material 11 and electrically separated from each other. The two or more metal films are formed to include an upper surface and a side wall surface that are covered by gold or a platinum group metal, to be capable of mounting thereon one or more nitride semiconductor light-emitting elements and the like, and to have, as a whole, a predetermined planar view shape including two or more electrode pads. On the one side of the base material 11, along a boundary line between an exposed surface of the base material 11 that is not covered by the metal film 12, 13 and a side wall surface of the metal film 12, 13, at least a first part of the exposed surface of the base material 11 continuous with the boundary line that is sandwiched between two adjacent electrode pads and the side wall surfaces of the metal films 12 and 13 that oppose to each other with the first part interposed therebetween are covered by a fluororesin film 16, and a part of an upper surface of the metal film 12, 13 that composes at least the electrode pad is not covered by the fluororesin film 16.
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公开(公告)号：US09986636B2
公开(公告)日：2018-05-29
申请号：US15476235
申请日：2017-03-31
Applicant: Infineon Technologies AG
Inventor： Joachim Mahler , Ralf Otremba
CPC classification number: H05K1/036 , H05K1/0203 , H05K1/032 , H05K1/0373 , H05K1/115 , H05K3/0014 , H05K3/007 , H05K3/0094 , H05K3/02 , H05K3/105 , H05K3/4038 , H05K3/4626 , H05K2201/0104 , H05K2201/0129 , H05K2201/0215 , H05K2201/0224 , H05K2201/0281 , H05K2203/107 , H05K2203/1136 , Y10T29/49126 , Y10T428/24909
Abstract: A printed circuit board includes an electrically conductive layer and a dielectric layer including a polymer. The polymer includes at least one of a carbon layer structure and a carbon-like layer structure.
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4.发明申请METHOD FOR PRODUCING SUBSTRATE WITH TRANSPARENT ELECTRODE, AND SUBSTRATE WITH TRANSPARENT ELECTRODE 审中-公开用透明电极生产衬底的方法和具有透明电极的衬底公开(公告)号：US20150225837A1
公开(公告)日：2015-08-13
申请号：US14424961
申请日：2013-08-23
Applicant: KANEKA CORPORATION
Inventor： Hironori Hayakawa , Takashi Kuchiyama , Hiroaki Ueda
CPC classification number: C23C14/086 , C23C14/34 , C23C14/5806 , G06F3/041 , H05K1/0274 , H05K1/0306 , H05K1/09 , H05K3/16 , H05K3/22 , H05K3/388 , H05K2201/0104 , H05K2201/0108 , H05K2201/0175 , H05K2201/0179 , H05K2201/0326 , H05K2203/1194
Abstract: A resin substrate with a transparent electrode having a low resistance, and a manufacturing method thereof including: a deposition step wherein a transparent electrode layer of indium tin oxide is formed on a transparent film substrate by a sputtering method, and a crystallization step wherein the transparent electrode layer is crystallized. In the deposition step, a sputtering deposition is performed using a sputtering target containing indium oxide and tin oxide, while a sputtering gas containing argon and oxygen is introduced into a chamber. It is preferable that an effective exhaust rate S, calculated from a rate Q of the sputtering gas introduced into the chamber and a pressure P in the chamber by a formula S (L/second)=1.688×Q (sccm)/P (Pa), is 1,200-5,000 (L/second). It is also preferable that a resistivity of the transparent electrode layer is less than 3×10−4 Ωcm.
Abstract translation: 一种具有低电阻的透明电极的树脂基板及其制造方法，包括：沉积步骤，其中通过溅射法在透明膜基板上形成氧化铟锡的透明电极层，以及结晶步骤，其中透明 电极层结晶。 在沉积步骤中，使用包含氧化铟和氧化锡的溅射靶进行溅射沉积，同时将含有氩和氧的溅射气体引入室中。 优选的是，从引入室中的溅射气体的速率Q和室内的压力P通过公式S（L /秒）= 1.688×Q（sccm）/ P（Pa）计算出的有效排气速度S ）为1,200-5,000（L /秒）。 还优选的是，透明电极层的电阻率小于3×10-4＆OHgr·cm。
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公开(公告)号：US20150053465A1
公开(公告)日：2015-02-26
申请号：US14517672
申请日：2014-10-17
Applicant: Honeywell International Inc.
Inventor： Daniel Youngner , Son Thai Lu , Helen Chanhvongsak , Lisa Lust , Douglas Carlson
CPC classification number: H05K3/4644 , H05K1/028 , H05K1/0298 , H05K1/0393 , H05K1/111 , H05K1/115 , H05K1/167 , H05K3/0058 , H05K3/06 , H05K3/061 , H05K3/24 , H05K3/30 , H05K3/4038 , H05K3/421 , H05K3/4682 , H05K2201/0104 , H05K2201/0154 , H05K2201/0317 , H05K2201/0394 , H05K2203/016 , H05K2203/0165 , H05K2203/0271
Abstract: An approach for making thin flexible circuits. A layer of dielectric may have one or two surfaces coated with metal. The dielectric and the metal may each have a sub-mil thickness. The dielectric may be held in a fixture for fabrication like that of integrated circuits. The metal may be patterned and have components attached. More layers of dielectric and patterned metal may be added to the flexible circuit. Also bond pads and connecting vias may be fabricated in the flexible circuit. The flexible circuit may be cut into a plurality of smaller flexible circuits.
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Patent Agency Ranking
公开(公告)号：US20090223700A1
公开(公告)日：2009-09-10
申请号：US12042897
申请日：2008-03-05
Applicant: Daniel Youngner , Son Thai Lu , Helen Chanhvongsak , Lisa Lust , Doug Carlson
Inventor： Daniel Youngner , Son Thai Lu , Helen Chanhvongsak , Lisa Lust , Doug Carlson
CPC classification number: H05K3/4644 , H05K1/028 , H05K1/0298 , H05K1/0393 , H05K1/111 , H05K1/115 , H05K1/167 , H05K3/0058 , H05K3/06 , H05K3/061 , H05K3/24 , H05K3/30 , H05K3/4038 , H05K3/421 , H05K3/4682 , H05K2201/0104 , H05K2201/0154 , H05K2201/0317 , H05K2201/0394 , H05K2203/016 , H05K2203/0165 , H05K2203/0271
Abstract: An approach for making thin flexible circuits. A layer of dielectric may have one or two surfaces coated with metal. The dielectric and the metal may each have a sub-mil thickness. The dielectric may be held in a fixture for fabrication like that of integrated circuits. The metal may be patterned and have components attached. More layers of dielectric and patterned metal may be added to the flexible circuit. Also bond pads and connecting vias may be fabricated in the flexible circuit. The flexible circuit may be cut into a plurality of smaller flexible circuits.
Abstract translation: 制造薄柔性电路的方法。 电介质层可以具有涂覆有金属的一个或两个表面。 电介质和金属可以各自具有亚密尔厚度。 电介质可以保持在类似于集成电路的固定装置中。 金属可以被图案化并且具有附接的部件。 电介质和图案化的金属层可以添加到柔性电路中。 还可以在柔性电路中制造接合焊盘和连接通孔。 柔性电路可以被切割成多个较小的柔性电路。
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7.发明公开公开(公告)号：US20240182614A1
公开(公告)日：2024-06-06
申请号：US18282942
申请日：2022-03-22
Inventor： Masashi KODA , Akira IRIFUNE , Mitsuyoshi NISHINO , Hisashi FUJINAGA , Yuuki HIROKAWA
CPC classification number: C08F212/34 , C08J5/244 , C08K3/013 , C08K9/02 , C08K9/06 , H05K1/0373 , C08K2003/222 , C08K3/36 , H05K2201/0104 , H05K2201/0166 , H05K2201/0215
Abstract: A resin composition contains a polyfunctional vinyl aromatic copolymer (A) containing a repeating unit (a) derived from a divinyl aromatic compound and a repeating unit (b) derived from a monovinyl aromatic compound, a curing agent (B), at least one filler (C) selected from the group consisting of a titanate compound filler (C1) and a magnesium oxide filler (C2), and a silica filler (D), in which the content ratio of the high dielectric constant filler (C) to the silica filler (D) is 10:90 to 90:10 as a mass ratio.
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公开(公告)号：US11643525B2
公开(公告)日：2023-05-09
申请号：US17012348
申请日：2020-09-04
Inventor： Jeongsook Ha , Jungwook Kim
CPC classification number: C08L1/04 , C08B15/02 , C08L29/04 , H01G4/015 , H05K1/036 , H05K1/0353 , C08L2203/20 , H05K2201/0104
Abstract: An electronic device with self-recovering properties including a substrate including a polymer composite, a conductive pattern disposed on the substrate, and an electrode disposed on the conductive pattern is provided, and the polymer composite includes a composite of different first and second polymers, the first polymer includes a first functional group capable of forming a hydrogen bond between polymer chains, and the second polymer includes a second functional group capable of forming a hydrogen bond between polymer chains.
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公开(公告)号：US09763322B2
公开(公告)日：2017-09-12
申请号：US15394831
申请日：2016-12-30
Applicant: Industrial Technology Research Institute
Inventor： Chao-Jen Wang , Jia-Chong Ho
CPC classification number: H05K1/0281 , B29C37/0082 , B29C73/02 , B29K2995/0092 , H05K1/0269 , H05K3/22 , H05K3/28 , H05K13/08 , H05K2201/0104 , H05K2203/16
Abstract: A flexible substrate repair structure, a manufacturing method thereof, and an inspection and repair method of a flexible substrate are provided. The flexible substrate repair structure includes a flexible substrate and at least one repair layer. The flexible substrate has a regular recess. The at least one repair layer is located on the flexible substrate and is completely filled in the regular recess. The material of the repair layer includes a polysilazane compound having the unit shown in formula (1) below, wherein Rx, Ry and Rz are respectively hydrogen, a C1 to C10 substituted alkyl group, an unsubstituted alkyl group, an alkenyl group, or an aromatic group.
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公开(公告)号：US20170094787A1
公开(公告)日：2017-03-30
申请号：US15255899
申请日：2016-09-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sung-yong JOO , Jin-hyung LEE
CPC classification number: H05K1/0366 , H05K1/0257 , H05K1/0298 , H05K1/038 , H05K1/09 , H05K1/181 , H05K3/4617 , H05K2201/0104 , H05K2201/0284 , H05K2201/0355 , H05K2203/0278
Abstract: Disclosed is a printed circuit board, to which at least one circuit device is mountable, including a base layer with a plurality of paper layers; a waterproof insulation layer laid on a first surface of the base layer; a copper foil layer laid on a second surface opposite to the first surface of the base layer and printed with a signal line pattern connectable with the at least one circuit device; and an adhesive layer configured to be interposed between the base layer and the copper foil layer that includes an adhesive material for adhering the base layer and the copper foil layer.
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