公开(公告)号：US20050165151A1

公开(公告)日：2005-07-28

申请号：US10503491

申请日：2003-02-04

Applicant: Akihiko Fujiwara ,  Koichi Shibayama ,  Hidenobu Deguchi

Inventor： Akihiko Fujiwara ,  Koichi Shibayama ,  Hidenobu Deguchi

IPC: C08K3/00 ,  H05K1/00 ,  H05K1/03 ,  H05K3/46 ,  C08K3/34

CPC classification number: H05K1/0373 ,  C08K3/01 ,  H05K1/0393 ,  H05K3/4626 ,  H05K3/4635 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0358 ,  H05K2201/068

Abstract: A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed circuit board, prepreg and adhesive sheet are provided which exhibit improved physical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. A resin composition containing 100 parts by weight of a thermoplastic resin and 0.1-65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient (α2) of 1.0×10−3 [° C.−1] or below over the temperature range from a temperature 10° C. higher than a glass transition temperature of the resin composition to a temperature 50° C. higher than the glass transition temperature of the resin composition.

Abstract translation: 提供了具有改进的物理性能，尺寸稳定性，耐热性和阻燃性的树脂组合物，基材，片，层压板，含树脂铜箔，覆铜层压板，TAB带，印刷电路板，预浸料和粘合片 ，特别是高温物理性能。 含有100重量份热塑性树脂和0.1-65重量份无机化合物的树脂组合物，该树脂组合物的平均线膨胀系数（α2）为1.0×10 -3 [° 在低于玻璃化转变温度的温度10℃以上的温度范围内，在高于玻璃化转变温度50℃的温度范围内， 树脂组合物。

公开(公告)号：US20050069725A1

公开(公告)日：2005-03-31

申请号：US10744326

申请日：2003-12-23

Applicant: Premakaran Boaz

Inventor： Premakaran Boaz

IPC: B23K35/26 ,  B32B15/01 ,  C22C13/00 ,  H05K3/34

CPC classification number: C22C13/00 ,  B23K35/0238 ,  B23K35/262 ,  C22C12/00 ,  H01L2224/04026 ,  H01L2224/29111 ,  H01L2224/29211 ,  H01L2224/29386 ,  H01L2224/325 ,  H01L2224/83191 ,  H01L2924/00013 ,  H01L2924/09701 ,  H05K3/3463 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/068 ,  Y10T428/12708 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/05442 ,  H01L2924/05342 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: A lead-free solder composition for soldering onto a substrate includes a solder having Tin (Sn) and Silver (Ag); and an additive having a low coefficient of thermal expansion.

Abstract translation: 用于焊接到基板上的无铅焊料组合物包括具有锡（Sn）和银（Ag）的焊料; 和具有低热膨胀系数的添加剂。

公开(公告)号：US20050067739A1

公开(公告)日：2005-03-31

申请号：US10947160

申请日：2004-09-23

Applicant: Minoru Onodera ,  Tatsuya Sunamoto

Inventor： Minoru Onodera ,  Tatsuya Sunamoto

IPC: B29C71/02 ,  B29L7/00 ,  H05K1/00 ,  H05K3/00

CPC classification number: H05K3/0011 ,  B29C71/02 ,  B29K2105/0079 ,  B29L2007/008 ,  H05K1/0393 ,  H05K2201/0141 ,  H05K2201/068 ,  H05K2203/0152 ,  H05K2203/1105

Abstract: A method of making a thermotropic liquid crystal polymer film includes continuously heat treating of the thermotropic liquid crystal polymer film 2 while the latter is jointed to a sheet-like support member 4, and subsequently separating the heat-treated thermotropic liquid crystal polymer film 2 from the support member 4. The continuous heat treatment of the thermotropic liquid crystal polymer film 2 then jointed to the support member 4 is carried out for a predetermined heating time within the range of 5 to 60 seconds at a predetermined heating temperature T° C. equal to or higher than the melting point Tm° C. of the thermotropic liquid crystal polymer film less 15° C. (i.e., Tm−15° C.), but lower than the melting point Tm° C. (thus, Tm−15° C.≦T° C.

Abstract translation: 制造热致液晶聚合物膜的方法包括将热致液晶聚合物膜2连续热处理，同时将其接合到片状支撑构件4，然后将热处理的热致液晶聚合物膜2从 支撑构件4.接着连接到支撑构件4的热致变液晶聚合物膜2的连续热处理在预定的加热温度T℃下在5至60秒的范围内进行预定的加热时间。等于 以上的热致液晶聚合物膜的熔点Tm℃为15℃以下（即Tm-15℃），但低于熔点Tm℃（因此，Tm-15 ℃），从而提高热致液晶聚合物膜的热膨胀系数。

公开(公告)号：US20050040504A1

公开(公告)日：2005-02-24

申请号：US10862337

申请日：2004-06-08

Applicant: Sa-Yoon Kang ,  Dong-Han Kim ,  Ye-Chung Chung

Inventor： Sa-Yoon Kang ,  Dong-Han Kim ,  Ye-Chung Chung

IPC: H01L21/60 ,  G02F1/13 ,  G02F1/1345 ,  H01L23/538 ,  H05K1/11 ,  H05K1/14 ,  H01L23/02

CPC classification number: G02F1/13452 ,  H01L23/5387 ,  H01L2224/16 ,  H01L2924/07811 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/068 ,  H05K2201/10681 ,  H01L2924/00

Abstract: Provided are a flexible film package module and a method of manufacturing the same that can be adapted for manufacture at lower cost and/or to adapt the characteristics of the flexible film package module for specific applications. The lower-cost flexible film package module includes a tape film that combines both a first insulating substrate, typically formed from a higher-cost polyimide material, and a second insulating substrate, typically formed from an insulating material or materials that are less expensive and/or provide modified performance when compared with the first insulating material. Both the first and second substrates will include complementary circuit patterns that will be electrically and physically connected to allow the composite substrate to function as a unitary substrate. The first and second substrates will also include connection regions that may be adapted for connection to printed circuit boards and/or electronic devices such as liquid crystal displays.

Abstract translation: 提供了一种柔性膜封装模块及其制造方法，其可以适于以更低成本制造和/或适应特定应用的柔性膜封装模块的特性。 较低成本的柔性膜封装模块包括一个胶带，其将通常由较高成本的聚酰亚胺材料形成的第一绝缘基板和通常由绝缘材料形成的第二绝缘基板或较便宜的材料和/ 或者与第一绝缘材料相比提供改进的性能。 第一和第二基板都将包括互补的电路图案，其将被电和物理连接，以允许复合基板作为整体基板。 第一和第二基板还将包括可适于连接到印刷电路板和/或诸如液晶显示器的电子设备的连接区域。

公开(公告)号：US20050023032A1

公开(公告)日：2005-02-03

申请号：US10902677

申请日：2004-07-28

Applicant: Shinya Kawai ,  Masanari Kokubu ,  Youji Furukubo

Inventor： Shinya Kawai ,  Masanari Kokubu ,  Youji Furukubo

IPC: B32B7/04 ,  B32B17/04 ,  C03C14/00 ,  H01L23/15 ,  H01L23/498 ,  H05K1/02 ,  H05K1/03 ,  H05K3/46 ,  B32B7/02

CPC classification number: B32B7/04 ,  B32B17/04 ,  B32B17/101 ,  B32B2457/00 ,  C03C14/00 ,  C03C14/004 ,  H01L23/15 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/4614 ,  H05K3/4629 ,  H05K3/4688 ,  H05K2201/068 ,  H05K2203/061 ,  Y10T428/24926 ,  H01L2224/05599

Abstract: A laminated wiring board comprising: a first wiring board forming wiring layers on the upper surface and on the lower surface of a first ceramic insulated substrate; and a second wiring board forming wiring layers on the upper surface and on the lower surface of a second ceramic insulated substrate; the wiring layer on the lower surface of the first wiring board and the wiring layer on the upper surface of the second wiring board being connected together through connecting electrodes; wherein a coefficient α1 of thermal expansion of the first ceramic insulated substrate at 0 to 150° C. and a coefficient α2 of thermal expansion of the second ceramic insulated substrate at 0 to 150° C. are satisfying the following conditions: α1

Abstract translation: 一种层叠布线板，包括：第一布线板，在第一陶瓷绝缘基板的上表面和下表面上形成布线层; 以及在第二陶瓷绝缘基板的上表面和下表面上形成布线层的第二布线板; 第一布线板的下表面上的布线层和第二布线板的上表面的布线层通过连接电极连接在一起; 其中第一陶瓷绝缘基板在0至150℃的热膨胀系数α1和第二陶瓷绝缘基板在0至150℃的热膨胀系数α2满足以下条件：α1

公开(公告)号：US20040257749A1

公开(公告)日：2004-12-23

申请号：US10862562

申请日：2004-06-08

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Jun Otsuka ,  Manabu Sato ,  Yukihiro Kimura

IPC: H01G004/228

CPC classification number: H01G2/065 ,  H01G4/30 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/50 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19103 ,  H05K1/141 ,  H05K1/162 ,  H05K3/4688 ,  H05K2201/068 ,  H05K2201/10378 ,  H01L2224/05611 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05684

Abstract: A capacitor includes a capacitor main body having a front surface on which a semiconductor device is to be mounted and a rear surface at which the capacitor main body is to be mounted on a first main surface of a circuit substrate, a plurality of internal electrodes disposed within the capacitor main body, and a plurality of via conductors penetrating the capacitor main body between the front surface and the rear surface and electrically connected to the internal electrodes, wherein the capacitor main body has a first dielectric layer located on a side of the capacitor main body closer to the front surface and a second dielectric layer located on a side of the first dielectric layer closer to the rear surface, the second dielectric layer having a higher thermal expansion coefficient and a higher dielectric constant than the first dielectric layer.

Abstract translation: 电容器包括电容器主体，其具有要安装半导体器件的前表面和将电容器主体安装在电路基板的第一主表面上的后表面，多个内部电极设置 电容器主体内的多个通孔导体以及贯穿电容器主体的前表面与背面之间并与内部电极电连接的多个通路导体，其中，电容器主体具有位于电容器侧的第一电介质层 主体靠近前表面，第二电介质层位于第一电介质层的靠近背面的一侧，第二电介质层具有比第一电介质层更高的热膨胀系数和更高的介电常数。

公开(公告)号：US20040198081A1

公开(公告)日：2004-10-07

申请号：US10821715

申请日：2004-04-08

Inventor： Benjamin N. Eldridge ,  Igor Y. Khandros ,  Gaetan L. Mathieu ,  David V. Pedersen

IPC: H01R012/00

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/06744 ,  G01R1/07307 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07371 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01H1/0036 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/6715 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/67288 ,  H01L21/76897 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/11 ,  H01L24/12 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/1134 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/1318 ,  H01L2224/13184 ,  H01L2224/45099 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/3011 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined in masking layers deposited on a surface of a substrate which may be an electronic component such as an active semiconductor device. Each spring contact element has a base end, a contact end, and a central body portion. The contact end is offset in the z-axis (at a different height) and in at least one of the x and y directions from the base end. In this manner a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the substrate. The spring contact elements make temporary (i.e., pressure) or permanent (e.g., joined by soldering or brazing or with a conductive adhesive) connections with terminals of another electronic component to effect electrical connections therebetween. In an exemplary application, the spring contact elements are disposed on a semiconductor devices resident on a semiconductor wafer so that temporary connections can-be made with the semiconductor devices to burn-in and/or test the semiconductor devices.

Abstract translation: 弹性接触元件通过将至少一层金属材料沉积到沉积在可以是诸如有源半导体器件的电子部件的基板的表面上的掩模层中限定的开口中来制造。 每个弹簧接触元件具有基端，接触端和中心主体部分。 接触端在z轴（在不同的高度）和从基端到x和y方向中的至少一个偏移。 以这种方式，在基板上以规定的空间关系制造多个弹簧接触元件。 弹簧接触元件使另一个电子元件的端子与其间的电连接暂时（即压力）或永久（例如通过焊接或钎焊或与导电粘合剂连接）连接。 在示例性应用中，弹簧接触元件设置在驻留在半导体晶片上的半导体器件上，使得能够利用半导体器件临时连接来老化和/或测试半导体器件。

公开(公告)号：US20040168824A1

公开(公告)日：2004-09-02

申请号：US10784631

申请日：2004-02-23

Applicant: OLYMPUS CORPORATION

Inventor： Takanori Sekido

IPC: H05K001/03

CPC classification number: H05K1/113 ,  H05K1/0271 ,  H05K3/3436 ,  H05K3/4061 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/068 ,  H05K2201/09781 ,  H05K2201/2009

Abstract: The invention provides a circuit board that includes a flat core plate, a buildup layer having insulation layers and conductor layers alternately stacked on each other, and surface conductor layers provided on the buildup layer. The circuit board further includes deformation-interrupting sections extending through the insulation layers between the conductor layers as electric wires. The deformation-interrupting sections adjust the thermal expansion coefficient of the whole circuit board, and enhance the rigidity of the circuit board. The invention also provides a method for forming the-circuit board.

Abstract translation: 本发明提供一种电路板，其包括平坦的芯板，具有绝缘层的堆积层和彼此交替堆叠的导体层，以及设置在积聚层上的表面导体层。 电路板还包括延伸穿过导体层之间的绝缘层作为电线的变形中断部分。 变形中断部调整整个电路板的热膨胀系数，提高电路板的刚性。 本发明还提供了一种形成电路板的方法。

公开(公告)号：US20040163252A1

公开(公告)日：2004-08-26

申请号：US10692114

申请日：2003-10-23

Applicant: FormFactor, Inc.

Inventor： Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Thomas H. Dozier II ,  William D. Smith

IPC: H01R043/20 ,  H05K001/00 ,  G01R001/00

CPC classification number: H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/49208 ,  Y10T29/49222 ,  H01L2924/00 ,  H01L2224/48

Abstract: An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.

Abstract translation: 一种互连装置和形成互连装置的方法。 接触结构附着在第一基底上或形成在第一基底上。 第一衬底附接到比第一衬底大的第二衬底。 可以将多个这样的第一基板附接到第二基板，以便产生接触结构的阵列。 每个接触结构可以是细长的和弹性的，并且可以包括在涂覆有向接触结构赋予期望的结构特性的材料的芯上。

公开(公告)号：US20040140551A1

公开(公告)日：2004-07-22

申请号：US10725993

申请日：2003-12-03

Inventor： Ryosuke Usui ,  Hideki Mizuhara ,  Yusuke Igarashi ,  Noriaki Kojima ,  Noriaki Sakamoto

IPC: H01L023/04 ,  H01L021/44

CPC classification number: H01L21/6835 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/12042 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H05K1/024 ,  H05K3/205 ,  H05K3/4676 ,  H05K3/4682 ,  H05K2201/068 ,  Y10S428/901 ,  Y10T428/24917 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

Abstract: The present invention provides a low-profile and light-weight semiconductor device having improved product reliability and higher frequency performance. A multi-layer interconnect line structure is disposed just under circuit devices 410a and 410b. An Interlayer insulating film 405 that composes a part of the multi-layer interconnect line structure is formed of a material having a relative dielectric constant within a range from 1.0 to 3.7, and a dielectric loss tangent within a range from 0.0001 to 0.02.

Abstract translation: 本发明提供一种具有改进的产品可靠性和更高频率性能的低轮廓和轻量级的半导体器件。 多层互连线结构被布置在电路器件410a和410b的正下方。 组成多层互连线结构的一部分的层间绝缘膜405由相对介电常数为1.0〜3.7，介电损耗角正切为0.0001〜0.02的材料形成。