公开(公告)号：US20160341368A1

公开(公告)日：2016-11-24

申请号：US15114831

申请日：2015-01-27

Applicant: SHANGHAI SANSI ELECTRONIC ENGINEERING CO., LTD ,  SHANGHAI SANSI SCIENCE AND TECHNOLOGY DEVELOPMENT CO., LTD ,  JIASHAN SANSI PHOTOELECTRIC TECHNOLOGY CO. , LTD

Inventor： Bishou ChEN ,  Li XU ,  Peng WANG ,  Xiaoliang HE ,  Sheng LI ,  Haibo LIU

IPC: F21K9/232 ,  F21V29/74 ,  F21V29/83 ,  F21K9/238 ,  B05D3/02 ,  F21V17/10 ,  F21K9/237 ,  F21V3/02 ,  F21K9/235 ,  F21V19/00 ,  F21V3/04 ,  F21V23/00

CPC classification number: F21K9/232 ,  B05D3/0254 ,  F21K9/20 ,  F21K9/235 ,  F21K9/237 ,  F21K9/238 ,  F21V3/02 ,  F21V3/061 ,  F21V3/10 ,  F21V17/101 ,  F21V19/006 ,  F21V23/00 ,  F21V23/005 ,  F21V29/506 ,  F21V29/74 ,  F21V29/83 ,  F21V29/86 ,  F21Y2113/00 ,  F21Y2115/10 ,  H05K1/0284 ,  H05K1/097 ,  H05K3/0014 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/0999 ,  H05K2201/10106

Abstract: An LED light device and a circuit preparation method thereof are provided. The LED light device includes a base, an LED light unit, and a lamp shade. The LED light-emitting unit and the lamp shade are arranged on the base. The lamp shade covers the LED light-emitting unit inside. The circuit preparation method includes following steps of: providing a base which is a physical entity having a three-dimensional structure on the surface thereof; coating a circuit layer on the base surface through a programmable coating equipment, manual coating or the combined mode, wherein the circuit layer is a liquid or powder coating containing metal materials, and the thickness of the circuit layer is 20 μm or more; baking the base coated with the circuit layer at the high temperature of 100-1,000° C. until the circuit layer is dried; and obtaining a base having a three-dimensional circuit after cooling.

Abstract translation: 提供了一种LED灯装置及其电路制备方法。 LED灯装置包括基座，LED灯单元和灯罩。 LED发光单元和灯罩布置在基座上。 灯罩内置LED发光单元。 电路准备方法包括以下步骤：在其表面上提供具有三维结构的物理实体的基座; 通过可编程涂层设备，手动涂层或组合模式在基底表面上涂覆电路层，其中电路层是含有金属材料的液体或粉末涂层，电路层的厚度为20μm以上; 在100-1,000℃的高温下烘烤涂覆有电路层的基底，直到电路层干燥; 并在冷却后获得具有三维电路的基底。

公开(公告)号：US09504165B2

公开(公告)日：2016-11-22

申请号：US14161122

申请日：2014-01-22

Applicant: LUXSHARE-ICT CO., LTD.

Inventor： Devin Wang

IPC: H05K3/18 ,  H05K3/14 ,  B23K26/36 ,  B23K26/40 ,  H05K3/06

CPC classification number: H05K3/188 ,  B23K26/361 ,  B23K26/362 ,  B23K26/364 ,  B23K26/40 ,  B23K2103/172 ,  B23K2103/50 ,  H05K3/061 ,  H05K3/143 ,  H05K3/146 ,  H05K2201/09018 ,  Y10T29/49155

Abstract: A method of forming conductive traces on insulated substrate includes the steps of providing an insulated substrate; forming a coating layer on a surface of the insulated substrate, dividing the coating layer into traces-forming zones and non-traces-forming zones through laser engraving, and removing areas of the coating layer that are located in the traces-forming zones through laser-vaporizing to expose corresponding portions of the surface of the insulated substrate; forming a metallized layer of conductive traces by performing a metallizing treatment on the exposed portions of the insulated substrate and on the coating layer; and directly stripping off the residual coating layer from the non-traces-forming zones or removing it using an acid, an alkaline or a neutral solution.

Abstract translation: 在绝缘基板上形成导电迹线的方法包括提供绝缘基板的步骤; 在绝缘基板的表面上形成涂层，通过激光雕刻将涂层分成痕迹形成区和非痕迹形成区，通过激光去除位于痕迹形成区中的涂层的区域 - 蒸发以暴露绝缘基板的表面的相应部分; 通过对所述绝缘基板的暴露部分和所述涂层进行金属化处理来形成导电迹线的金属化层; 并直接从非痕量形成区剥离残留的涂层，或者使用酸，碱或中性溶液除去残留的涂层。

公开(公告)号：US09426893B2

公开(公告)日：2016-08-23

申请号：US12509435

申请日：2009-07-24

Applicant: Jun-Yao Huang ,  Po-Pin Hung

Inventor： Jun-Yao Huang ,  Po-Pin Hung

IPC: G06F3/045 ,  G06F3/041 ,  H05K3/00 ,  G06F3/044

CPC classification number: H05K3/0058 ,  G06F3/041 ,  G06F3/044 ,  G06F3/045 ,  G06F2203/04103 ,  H05K3/0014 ,  H05K3/0067 ,  H05K2201/0129 ,  H05K2201/09018 ,  H05K2203/068 ,  H05K2203/1105 ,  H05K2203/302 ,  Y10T29/49124

Abstract: A manufacture method and structure of a curved capacitive touch panel is disclosed. A flat flexible printed circuit board (FPCB) with capacitive touch sensing/detecting capability is provided, followed by subjecting the flat FPCB to compressing molding to form a curved FPCB. Subsequently, a curved substrate is provided, wherein an outer curved surface of the curved FPCB is bonded to an inner curved surface of the substrate, thereby forming the curved capacitive touch panel.

Abstract translation: 公开了一种弯曲电容式触摸面板的制造方法和结构。 提供具有电容式触摸感测/检测能力的扁平柔性印刷电路板（FPCB），然后使扁平FPCB压缩成型以形成弯曲的FPCB。 随后，提供弯曲基板，其中弯曲FPCB的外曲面接合到基板的内弯曲表面，从而形成弯曲的电容式触摸面板。

公开(公告)号：US20160198577A1

公开(公告)日：2016-07-07

申请号：US14982038

申请日：2015-12-29

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Esther Anna Wilhelmina Gerarda Janssen ,  Marc Andre De Samber ,  Eric Comelis Egbertus Van Grunsven ,  Egbertus Reinier Jacobs

IPC: H05K3/34 ,  H05K3/46

CPC classification number: H05K3/007 ,  B44C1/1758 ,  F21K9/90 ,  F21Y2107/00 ,  F21Y2115/10 ,  H05K1/0284 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/207 ,  H05K2201/09018 ,  H05K2201/10106 ,  Y02P70/611

Abstract: A liquid immersion transfer process for applying electronics on a 3D object and a system is disclosed. In one embodiment, the process comprises providing a foil on a solid carrier in a foil provision stage, providing electronic wiring and an electronic component to the foil in an electronics provision stage, to provide said electronics, removing the solid carrier and arranging the foil on or in a liquid in a liquid application stage, and transferring the electronics to the 3D object in a transfer stage, as well as a 3D object obtainable by such process.

Abstract translation: 公开了一种用于在3D物体和系统上施加电子装置的浸液转移方法。 在一个实施例中，该方法包括在箔提供阶段在固体载体上提供箔片，在电子设置阶段向箔片提供电子布线和电子部件，以提供所述电子器件，去除固体载体并将箔布置在 或在液体施加阶段中的液体中，并且在传送阶段将电子装置传送到3D对象，以及通过这种处理可获得的3D对象。

公开(公告)号：US09341355B2

公开(公告)日：2016-05-17

申请号：US14015679

申请日：2013-08-30

Applicant: Metrospec Technology, L.L.C.

Inventor： Wm. Todd Crandell ,  Anthony Mitchell Johnson ,  Tony Stephen Schweitzer ,  H. Vic Holec

IPC: H01L29/18 ,  F21V21/14 ,  B32B33/00 ,  H05K1/18 ,  H05K3/00 ,  F21K99/00 ,  F21V29/70 ,  H05K1/03

CPC classification number: F21V21/14 ,  B32B33/00 ,  B32B2307/206 ,  B32B2307/302 ,  B32B2311/12 ,  B32B2315/085 ,  F21K9/20 ,  F21V29/70 ,  H05K1/0366 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/0097 ,  H05K2201/09018 ,  H05K2201/10106 ,  H05K2203/1545 ,  Y10T156/10 ,  Y10T428/14 ,  Y10T428/26

Abstract: A layered structure for use with a high power light emitting diode system comprises an electrically insulating intermediate layer interconnecting a top layer and a bottom layer. The top layer, the intermediate layer, and the bottom layer form an at least semi-flexible elongate member having a longitudinal axis and a plurality of positions spaced along the longitudinal axis. The at least semi-flexible elongate member is bendable laterally proximate the plurality of positions spaced along the longitudinal axis to a radius of at least 6 inches, twistable relative to its longitudinal axis up to 10 degrees per inch, and bendable to conform to localized heat sink surface flatness variations having a radius of at least 1 inch. The top layer is pre-populated with electrical components for high wattage, the electrical components including at least one high wattage light emitting diode at least 1.0 Watt per 0.8 inch squared.

公开(公告)号：US09320140B2

公开(公告)日：2016-04-19

申请号：US14367778

申请日：2012-12-17

Applicant: NISSHA PRINTING CO., LTD.

Inventor： Fujio Mori ,  Fumiaki Shibayama ,  Hiroko Shimizu ,  Hideki Koide

IPC: H05K1/03 ,  H05K1/02 ,  C03C17/32 ,  G06F3/041 ,  B32B17/06 ,  B32B17/10 ,  B32B37/10 ,  B32B38/10 ,  G02B5/30

CPC classification number: H05K1/0296 ,  B32B17/064 ,  B32B17/10174 ,  B32B37/1027 ,  B32B38/10 ,  C03C17/32 ,  C03C17/34 ,  C03C21/002 ,  C03C2217/94 ,  G02B5/3033 ,  G06F3/041 ,  H05K1/0306 ,  H05K2201/09018 ,  H05K2201/10151

Abstract: A touch sensor with an ornament includes a transparent substrate with a flat center part and a raised outer rim part, and a film substrate based transparent conductive sensor with a transparent conductive film layer attached to the inner face of the transparent substrate. A transparent conductive film layer circuit of the transparent conductive film layer is formed at the flat center part, and a routing circuit for detecting an electric signal from the transparent conductive film layer circuit and a decorative print layer for concealing the routing circuit are formed at the raised outer rim part.

Abstract translation: 具有装饰物的触摸传感器包括具有平坦中心部分和凸起外缘部分的透明基板，以及具有透明导电膜层的薄膜基板透明导电传感器，透明导电膜层附着到透明基板的内表面。 透明导电膜层的透明导电膜层电路形成在平坦中心部分，并且用于检测来自透明导电膜层电路的电信号的布线电路和用于隐藏路由电路的装饰性印刷层形成在 凸起的外缘部分。

公开(公告)号：US09204547B2

公开(公告)日：2015-12-01

申请号：US13864656

申请日：2013-04-17

Applicant: United States of America as Represented by the Secretary of the Army

Inventor： Bruce V. Hughes

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  H05K1/18

CPC classification number: H05K3/107 ,  H05K1/0284 ,  H05K1/119 ,  H05K1/186 ,  H05K3/0014 ,  H05K3/10 ,  H05K3/4682 ,  H05K2201/056 ,  H05K2201/09018 ,  H05K2201/10583 ,  Y10T29/49155

Abstract: A non-planar printed circuit board has an interior surface and an exterior surface. Between the interior surface and exterior surfaces are layers of conductive and dielectric materials. Passive and active electrical components are embedded within the interior and exterior surfaces. A hollow region is defined by the interior surface of the non-planar circuit board. The non-planar printed circuit board is manufactured on a mandrel having a non-planar shape such as, for example, a cylinder or sphere so as to form a hollow, curved non-planar structure.

Abstract translation: 非平面印刷电路板具有内表面和外表面。 在内表面和外表面之间是导电和介电材料层。 被动和主动的电气部件嵌入在内部和外部表面。 中空区域由非平面电路板的内表面限定。 非平面印刷电路板在具有非平面形状，诸如，例如，圆柱形或球形，以便形成中空的，弯曲的非平面结构的心轴来制造。

公开(公告)号：US20150319844A1

公开(公告)日：2015-11-05

申请号：US14695712

申请日：2015-04-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ha Il KIM ,  Dong Gi AN ,  Su Hyun PARK ,  Young Man KIM ,  Jong Hyung KIM ,  Kyung Chul YU

IPC: H05K1/02 ,  H05K3/10 ,  H05K3/30 ,  H05K1/18

CPC classification number: H05K3/4691 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/181 ,  H05K3/10 ,  H05K3/30 ,  H05K2201/05 ,  H05K2201/09018 ,  H05K2201/09127 ,  Y10T29/49126 ,  Y10T29/49131 ,  Y10T29/49156

Abstract: There are provided a rigid flexible printed circuit board and a method of manufacturing the same. The rigid flexible printed circuit board according to an exemplary embodiment of the present disclosure includes: a flexible board including a flexible region, a first rigid region formed at one side of the flexible region, and a second rigid region formed at the other side of the flexible region; a first rigid board formed on the flexible board and formed in the first rigid region and the second rigid region; and a second rigid board formed below the flexible board and formed in the first rigid region.

Abstract translation: 提供了一种刚性柔性印刷电路板及其制造方法。 根据本公开的示例性实施例的刚性柔性印刷电路板包括：柔性板，包括柔性区域，形成在柔性区域的一侧的第一刚性区域和形成在柔性区域的另一侧的第二刚性区域 灵活区域; 形成在所述柔性基板上并形成在所述第一刚性区域和所述第二刚性区域中的第一刚性板; 以及第二刚性板，形成在所述柔性板的下方并形成在所述第一刚性区域中。

公开(公告)号：US20150138023A1

公开(公告)日：2015-05-21

申请号：US14401418

申请日：2013-05-16

Applicant: LG INNOTEK CO., LTD.

Inventor： Soon Young Hyun ,  So Yeon Kim ,  Won Ha Moon ,  Seok Bae ,  Nam Yang Lee ,  Hyung Eui Lee

IPC: H01Q1/24

CPC classification number: H01Q1/243 ,  H01Q1/38 ,  H04M1/026 ,  H05K3/202 ,  H05K3/386 ,  H05K2201/086 ,  H05K2201/09018 ,  H05K2201/10098

Abstract: Provided are an antenna for a communication terminal, and a method of manufacturing the same, the antenna including: a communication terminal case; and a radiator layer formed of a metal material in an inner curved surface part of the communication terminal case.

Abstract translation: 提供一种用于通信终端的天线及其制造方法，所述天线包括：通信终端壳体; 以及由通信端子壳体的内侧曲面部分中的金属材料形成的散热器层。

公开(公告)号：US08993893B2

公开(公告)日：2015-03-31

申请号：US14183558

申请日：2014-02-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Noboru Kato ,  Jun Sasaki ,  Satoshi Ishino

IPC: H05K1/00 ,  H05K1/02

CPC classification number: H05K1/0281 ,  H05K1/024 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/032 ,  H05K1/09 ,  H05K2201/0141 ,  H05K2201/057 ,  H05K2201/0715 ,  H05K2201/09018 ,  H05K2201/09409

Abstract: A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side in a z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. A ground conductor is provided on a negative-direction side in the z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. The state in which the main body is curved so that the signal wire defines an arc is retained by plastic deformation of the ground conductors.

Abstract translation: 保持弯曲状态而不引起电特性波动的多层基板包括：主体，其包括要堆叠并由柔性材料制成的多个绝缘片。 信号线在主体中延伸。 接地导体相对于主体中的信号线在z轴方向的正方向侧设置，并且在从z轴方向看的俯视图中与信号线重叠。 接地导体相对于主体中的信号线在z轴方向的负方向侧设置，并且在从z轴方向观察的俯视图中与信号线重叠。 主体弯曲的状态使得信号线定义为电弧，由接地导体的塑性变形保持。