公开(公告)号：US20100309635A1

公开(公告)日：2010-12-09

申请号：US12525957

申请日：2007-11-30

Applicant: Junichi Sasaki ,  Tomoyuki Hino

Inventor： Junichi Sasaki ,  Tomoyuki Hino

IPC: H05K7/20 ,  H01L23/40

CPC classification number: H05K1/0204 ,  H01L23/3677 ,  H01L23/4093 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/32188 ,  H01L2924/00014 ,  H01L2924/01004 ,  H05K2201/09054 ,  H05K2201/10393 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A mounting structure, in which semiconductor package 1 and heat sink 8 for dissipating heat generated from semiconductor package 1 are mounted on mounting board 3. The rear surface of semiconductor package 1 is bonded to the front surface of mounting board 3 facing the rear surface. Heat sink 8 is brought into contact with the rear surface of semiconductor package 1 via through-ole 5 formed on mounting board 3. Semiconductor package 1 and heat sink 8 are pressed to each other by the elastic force of clip 6.

Abstract translation: 其中将用于散发由半导体封装1产生的热量的半导体封装1和散热器8安装在安装板3上的安装结构。半导体封装1的后表面接合到安装板3的面向后表面的前表面。 散热器8通过形成在安装板3上的通孔5与半导体封装1的后表面接触。半导体封装1和散热器8通过夹子6的弹力彼此挤压。

公开(公告)号：US20100210049A1

公开(公告)日：2010-08-19

申请号：US12759699

申请日：2010-04-14

Applicant: Charles W.C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

Inventor： Charles W.C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

IPC: H01L21/50 ,  H01L33/48

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L23/49575 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10969 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting a first adhesive on the base including inserting the post through an opening in the first adhesive, mounting a conductive layer on the base including aligning the post with an aperture in the conductive layer, providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, then flowing a second adhesive into and downward in a gap between the post and the conductive trace, solidifying the second adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 制造半导体芯片组件的方法包括提供柱和基座，将第一粘合剂安装在基座上，包括将柱穿过第一粘合剂中的开口，将导电层安装在基座上，包括使柱与孔对准 导电层，提供导电迹线，其包括焊盘，端子和导电层的选定部分，然后使第二粘合剂在柱和导电迹线之间的间隙中和向下流动，固化第二粘合剂，然后安装 包括柱和基座的散热器上的半导体器件，将半导体器件电连接到导电迹线并将半导体器件热连接到散热器。

公开(公告)号：US20100188848A1

公开(公告)日：2010-07-29

申请号：US12361160

申请日：2009-01-28

Applicant: Been-Yu LIAW

Inventor： Been-Yu LIAW

IPC: F21S4/00 ,  F21V21/00

CPC classification number: F21V29/763 ,  F21S2/005 ,  F21V19/0055 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K1/021 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106

Abstract: An electro-thermal separation light emitting diode light engine module includes a heat dissipater, an illuminating module and a printed circuit board. The illuminating module is provided on the heat dissipater and is provided with at least one contact end. The printed circuit board is transfixed with at least one hole for accepting the illuminating module and is provided with a circuit for electrically connecting the contact end. Therefore, the illuminating module can be cooled directly through the heat dissipater and can be connected electrically by the circuit of the printed circuit board, achieving the practical progressiveness by providing a better heat dissipation effect and reducing cost.

Abstract translation: 电热分离发光二极管光引擎模块包括散热器，照明模块和印刷电路板。 照明模块设置在散热器上并且设置有至少一个接触端。 印刷电路板被固定有用于接受照明模块的至少一个孔，并且设置有用于电连接接触端的电路。 因此，照明模块可以通过散热器直接冷却，并且可以通过印刷电路板的电路电连接，通过提供更好的散热效果并降低成本来实现实际的进步。

公开(公告)号：US20100167438A1

公开(公告)日：2010-07-01

申请号：US12722526

申请日：2010-03-12

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L33/00 ,  H01L21/60 ,  H01L21/50 ,  H01L21/58

CPC classification number: H05K1/0204 ,  F21K9/00 ,  H01L21/486 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a copper layer on the adhesive including aligning the post with an aperture in the copper layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the copper layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal, a silver coating and a copper core that is a selected portion of the copper layer, mounting a semiconductor device on the post, wherein an aluminum heat spreader includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 制造半导体芯片组件的方法包括提供柱和基座，将粘合剂安装在基座上，包括将柱插入粘合剂中的开口中，将铜层安装在粘合剂上，包括使柱与孔中的铜对准 然后使粘合剂在位于柱和铜层之间的孔中的间隙中和向上流动，固化粘合剂，然后提供导电迹线，其包括衬垫，端子，银涂层和铜芯，其是 铜层的选定部分，将半导体器件安装在柱上，其中铝散热器包括柱和基座，将半导体器件电连接到导电迹线并将半导体器件热连接到散热器。

公开(公告)号：US20100155768A1

公开(公告)日：2010-06-24

申请号：US12714413

申请日：2010-02-26

Applicant: Charles W.C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

Inventor： Charles W.C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

IPC: H01L33/00

CPC classification number: H01L21/486 ,  H01L21/4882 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L33/483 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15153 ,  H01L2924/16152 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/09745 ,  H05K2201/10106 ,  H01L2224/05599

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post and a base. The semiconductor device extends into a cavity in the post, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The adhesive extends between the post and the conductive trace and between the base and the conductive trace. The conductive trace is located outside the cavity and provides signal routing between a pad and a terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 散热器包括一个柱子和一个底座。 半导体器件延伸到柱中的空腔中，电连接到导电迹线并且热连接到散热器。 柱从基部向上延伸到粘合剂中的开口中，并且基部从柱横向延伸。 粘合剂在柱和导电迹线之间以及基部和导电迹线之间延伸。 导电迹线位于腔体外部，并提供焊盘和端子之间的信号路由。

公开(公告)号：US20100072505A1

公开(公告)日：2010-03-25

申请号：US12235822

申请日：2008-09-23

Applicant: Charles Raymond GINGRICH, III

Inventor： Charles Raymond GINGRICH, III

IPC: H01L33/00 ,  B60Q1/06

CPC classification number: F21V19/0035 ,  F21K9/00 ,  F21V7/0083 ,  F21V17/005 ,  F21V17/12 ,  F21V17/164 ,  F21V19/045 ,  F21V29/503 ,  F21V29/763 ,  F21V29/773 ,  F21V29/83 ,  F21Y2115/10 ,  H01R13/2442 ,  H01R33/7685 ,  H05K1/0204 ,  H05K1/0284 ,  H05K1/183 ,  H05K2201/09054 ,  H05K2201/09118 ,  H05K2201/10106

Abstract: A light-emitting device assembly which can be used in many applications has a contact carrier, at least one light-emitting device, a heat sink and at least one securing member. The contact carrier has a light-emitting device receiving region and resilient contacts which are provided proximate to the light-emitting device receiving region. The at least one light-emitting device has leads which extend therefrom to mechanically and electrically engage the resilient contacts. The heat sink is thermally coupled to the at least one light-emitting device. The at least one securing member extends through the contact carrier and into the heat sink to releasably retain the contact carrier and the at least one light-emitting device in position relative to each other and relative to the heat sink.

Abstract translation: 可用于许多应用中的发光器件组件具有接触载体，至少一个发光器件，散热器和至少一个固定元件。 接触载体具有靠近发光器件接收区域设置的发光器件接收区域和弹性触点。 所述至少一个发光装置具有从其延伸的引线以机械地和电接合弹性触点。 散热器热耦合到至少一个发光器件。 所述至少一个固定构件延伸穿过所述接触载体并进入所述散热器，以将所述接触载体和所述至少一个发光装置可释放地保持在相对于彼此并相对于所述散热器的位置。

公开(公告)号：US20100003787A1

公开(公告)日：2010-01-07

申请号：US12558526

申请日：2009-09-13

Applicant: Chia-Chung Wang ,  Charles W.C. Lin

Inventor： Chia-Chung Wang ,  Charles W.C. Lin

IPC: H01L21/50

CPC classification number: H05K1/0204 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: The present invention provides a method of making a semiconductor chip assembly that includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a substrate on the adhesive including inserting the post into an aperture in the substrate to form a gap in the aperture between the post and the substrate, then flowing the adhesive into and upward in the gap, solidifying the adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader. The substrate includes first and second conductive layers and a dielectric layer therebetween and provides horizontal signal routing between a pad and a terminal at the first conductive layer.

Abstract translation: 本发明提供了一种制造半导体芯片组件的方法，该半导体芯片组件包括提供柱和底座，将粘合剂安装在基座上，包括将柱穿过粘合剂中的开口插入，将基底安装在粘合剂上，包括将柱插入 在基板之间的孔中形成间隙，然后使粘合剂在间隙中向上流动，固化粘合剂，然后将半导体器件安装在包括柱和基座的散热器上， 将半导体器件电连接到衬底并将半导体器件热连接到散热器上。 衬底包括第一和第二导电层以及它们之间的电介质层，并且在第一导电层处提供衬垫和端子之间的水平信号路由。

公开(公告)号：US20090279276A1

公开(公告)日：2009-11-12

申请号：US12436976

申请日：2009-05-07

Applicant: Tadafumi Yoshida ,  Hiroshi Osada ,  Yuji Yagi

Inventor： Tadafumi Yoshida ,  Hiroshi Osada ,  Yuji Yagi

IPC: H05K7/06

CPC classification number: H01L23/367 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/341 ,  H05K2201/09054 ,  H05K2201/09745 ,  H01L2924/00

Abstract: There is provided an electronic component which comprises an insulating member on which an electronic element is mounted, and a thermal diffusion member on which the insulating member is mounted, wherein a thermal expansion coefficient of the insulating member is lower than a thermal expansion coefficient of the thermal diffusion member, and the insulating member is mounted in an embedded manner in a recess formed on a surface of the thermal diffusion member.

Abstract translation: 提供了一种电子部件，其包括安装电子元件的绝缘部件和安装有绝缘部件的热扩散部件，其中绝缘部件的热膨胀系数低于绝缘部件的热膨胀系数 热扩散构件和绝缘构件以嵌入的方式安装在形成在热扩散构件的表面上的凹部中。

公开(公告)号：US20090268434A1

公开(公告)日：2009-10-29

申请号：US12425467

申请日：2009-04-17

Applicant: Junya Mita ,  Yoshinori Momose ,  Akemi Maruyama ,  Shintaro Hama

Inventor： Junya Mita ,  Yoshinori Momose ,  Akemi Maruyama ,  Shintaro Hama

IPC: G02F1/13357 ,  F21V21/00

CPC classification number: G02F1/133603 ,  G02F1/133608 ,  G02F2001/133628 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/182 ,  H05K1/183 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106

Abstract: An illumination system includes a light source unit including a light source and a circuit substrate electrically connected to the light source. The light source is placed in the circuit substrate such that at least part of the light source overlaps the circuit substrate in the thicknesswise direction of the circuit substrate.

Abstract translation: 照明系统包括光源单元，其包括光源和电连接到光源的电路基板。 光源被放置在电路基板中，使得至少部分光源在电路基板的厚度方向上与电路基板重叠。

公开(公告)号：US20090223707A1

公开(公告)日：2009-09-10

申请号：US12041916

申请日：2008-03-04

Applicant: Sampath Komarapalayam Velayudham Karikalan ,  Rezaur Rahman Khan

Inventor： Sampath Komarapalayam Velayudham Karikalan ,  Rezaur Rahman Khan

IPC: H05K1/02 ,  H05K3/20

CPC classification number: H05K1/0224 ,  H05K1/024 ,  H05K1/0245 ,  H05K2201/0191 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09054 ,  H05K2201/0969 ,  H05K2201/09736 ,  H05K2201/09745 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49147

Abstract: Magnetic field distribution and mutual capacitance control for transmission lines are provided. A first circuit board is fabricated by attaching a reference plane layer to a dielectric material layer, and attaching a first trace to the second surface of the dielectric material. A surface profile of the reference plane layer is modified to decrease a resistance of a return current signal path through the reference plane layer, to reduce a magnetic field coupling between the first trace and a second trace. A second circuit board is fabricated by attaching a reference plane layer to a dielectric material layer, attaching a trace to the dielectric material, and forming a solder mask layer on the dielectric material layer over the trace. An effective dielectric constant of the solder mask layer is modified to reduce or increase a mutual capacitance between the first trace and a second trace on the dielectric material.

Abstract translation: 提供传输线的磁场分布和互电容控制。 通过将参考平面层附着到介电材料层并且将第一迹线附接到电介质材料的第二表面来制造第一电路板。 修改参考平面层的表面轮廓以减小通过参考平面层的返回电流信号路径的电阻，以减小第一迹线和第二迹线之间的磁场耦合。 通过将参考平面层附着到电介质材料层，将迹线附着到电介质材料上，以及在迹线上的介电材料层上形成焊料掩模层来制造第二电路板。 修改焊接掩模层的有效介电常数以减小或增加介电材料上的第一迹线和第二迹线之间的互电容。