公开(公告)号：US3079577A

公开(公告)日：1963-02-26

申请号：US75762558

申请日：1958-08-27

Applicant: ROBERT BROWNFIELD

Inventor： ROBERT BROWNFIELD

IPC: H05K3/20 ,  H05K3/30 ,  H05K3/32 ,  H05K3/40

CPC classification number: H05K3/326 ,  H05K3/202 ,  H05K3/306 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/1059

公开(公告)号：US3039177A

公开(公告)日：1962-06-19

申请号：US67484557

申请日：1957-07-29

Applicant: ITT

Inventor： BURDETT RHODES B

IPC: H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K3/20 ,  H05K3/28

CPC classification number: H05K3/0014 ,  H05K1/145 ,  H05K1/189 ,  H05K3/205 ,  H05K3/284 ,  H05K2201/046 ,  H05K2201/052 ,  H05K2201/09118 ,  H05K2201/10651 ,  H05K2203/0152 ,  H05K2203/0376 ,  H05K2203/0726 ,  H05K2203/1105 ,  H05K2203/1316 ,  H05K2203/302 ,  Y10T29/49158 ,  Y10T29/4981 ,  Y10T29/49812

公开(公告)号：US3013913A

公开(公告)日：1961-12-19

申请号：US68121357

申请日：1957-08-30

Applicant: WESTINGHOUSE ELECTRIC CORP

Inventor： CROOP EDWARD J ,  VONDRACEK CHARLES H

IPC: H05K3/10 ,  H05K3/20

CPC classification number: H05K3/102 ,  H05K3/20 ,  H05K2201/09118 ,  H05K2203/0113 ,  Y10T428/256

公开(公告)号：US2988839A

公开(公告)日：1961-06-20

申请号：US59112156

申请日：1956-06-13

Applicant: ROGERS CORP

Inventor： GREENMAN NORMAN L ,  ZAGUSTA JOHN A ,  ANDERSON PAUL L

IPC: H05K3/04 ,  H05K3/10 ,  H05K3/38

CPC classification number: H05K3/386 ,  H05K3/041 ,  H05K3/046 ,  H05K3/107 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2203/0108 ,  H05K2203/025 ,  H05K2203/0522 ,  H05K2203/0528 ,  H05K2203/0557 ,  Y10S29/029 ,  Y10T29/49155 ,  Y10T156/1028 ,  Y10T156/1054 ,  Y10T156/1056 ,  Y10T156/108 ,  Y10T156/1082

公开(公告)号：US2924850A

公开(公告)日：1960-02-16

申请号：US70791558

申请日：1958-01-09

Applicant: WESTERN ELECTRIC CO

Inventor： ARTHUR SCHULTZ FRANK

IPC: B29C45/14 ,  B29C70/74 ,  H01H50/56 ,  H02G3/04 ,  H05K3/00 ,  H05K3/40 ,  H05K7/02

CPC classification number: H05K3/0014 ,  B29C45/14565 ,  B29C70/74 ,  H01H50/56 ,  H01R12/59 ,  H05K3/0097 ,  H05K3/4092 ,  H05K2201/09118 ,  H05K2201/10287 ,  H05K2201/10977

公开(公告)号：US2431393A

公开(公告)日：1947-11-25

申请号：US60510645

申请日：1945-07-14

Applicant: JACOB POSTER

Inventor： FRANKLIN ALBERT W

IPC: E04F11/16 ,  H01J9/30 ,  H05K3/04 ,  H05K3/20 ,  H05K9/00

CPC classification number: E04F11/16 ,  H01J9/30 ,  H05K3/041 ,  H05K3/202 ,  H05K9/0039 ,  H05K2201/09118 ,  H05K2203/0108 ,  Y10S264/76 ,  Y10T29/49016 ,  Y10T29/49861 ,  Y10T29/4998 ,  Y10T156/1054

公开(公告)号：US2317963A

公开(公告)日：1943-04-27

申请号：US38607641

申请日：1941-03-31

Applicant: AMERICAN ABRASIVE METALS COMPA

Inventor： BASHORE HOMER H

IPC: E04F11/16 ,  H01J9/30 ,  H05K3/04 ,  H05K3/20 ,  H05K9/00

CPC classification number: H05K9/0039 ,  E04F11/16 ,  H01J9/30 ,  H05K3/041 ,  H05K3/202 ,  H05K2201/09118 ,  H05K2203/0108 ,  Y10T428/24322 ,  Y10T428/24537 ,  Y10T428/24686

公开(公告)号：US2288735A

公开(公告)日：1942-07-07

申请号：US30346939

申请日：1939-11-08

Applicant: O'CONNELL JOHN J

Inventor： O'CONNELL JOHN J

IPC: E04F11/16 ,  H01J9/30 ,  H05K3/04 ,  H05K3/20 ,  H05K9/00

CPC classification number: E04F11/16 ,  H01J9/30 ,  H05K3/041 ,  H05K3/202 ,  H05K9/0039 ,  H05K2201/09118 ,  H05K2203/0108 ,  Y10T156/1313

公开(公告)号：US11842939B2

公开(公告)日：2023-12-12

申请号：US17330787

申请日：2021-05-26

Applicant: Qorvo US, Inc.

Inventor： Julio C. Costa ,  George Maxim

IPC: H01L23/28 ,  H01L23/36 ,  H01L23/31 ,  H01L23/482 ,  H01L23/495 ,  H01L23/498 ,  H05K1/02

CPC classification number: H01L23/36 ,  H01L23/3128 ,  H01L23/4828 ,  H01L23/498 ,  H01L23/49568 ,  H05K1/021 ,  H05K2201/09118

Abstract: The present disclosure relates to a thermally enhanced package, which includes a carrier, a thinned die over the carrier, a mold compound, and a heat extractor. The thinned die includes a device layer over the carrier and a dielectric layer over the device layer. The mold compound resides over the carrier, surrounds the thinned die, and extends beyond a top surface of the thinned die to define an opening within the mold compound and over the thinned die. The top surface of the thinned die is at a bottom of the opening. At least a portion of the heat extractor is inserted into the opening and in thermal contact with the thinned die. Herein the heat extractor is formed of a metal or an alloy.

公开(公告)号：US11665820B2

公开(公告)日：2023-05-30

申请号：US17536321

申请日：2021-11-29

Applicant: QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD ,  Avary Holding (Shenzhen) Co., Limited.

Inventor： Man-Zhi Peng ,  Rui-Wu Liu ,  Ming-Jaan Ho

IPC: H05K1/16 ,  H05K3/14 ,  H01L23/13 ,  H01L23/60 ,  H01L23/488 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K1/112 ,  H05K3/0014 ,  H05K3/0052 ,  H05K1/119 ,  H05K3/0029 ,  H05K3/0038 ,  H05K2201/09118 ,  H05K2201/09445 ,  H05K2201/09609 ,  H05K2201/09672 ,  H05K2203/0169

Abstract: Disclosure provides an adapter board and a method for making the adapter board, which includes providing a mold in which a plurality of first fixing plates and second fixing plates are provided, providing a plurality of wires sequentially passed through the plurality of first fixing plates and the second fixing plate, injecting a non-conductive material into the cavity to form a body, and cutting the body along both sides of the first fixing plates and the second fixing plates to obtain a plurality of board bodies. The first fixing plates are provided with a plurality of first fixing holes, and the second fixing plates are provided with a plurality of second fixing holes. The board body includes a first surface and a second surface. A plurality of first connection pads are formed on the first surface, and a plurality of second connection pads are formed on the second surface.